Abstract
A component carrier and a method for manufacturing a component carrier are described. The component carrier has a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures. At least a part of the component carrier is formed as a three-dimensionally printed structure.
Claims
1. A component carrier, comprising: a carrier body having a plurality of electrically conductive layer structures and/or electrically isolating layer structures; wherein at least a part of the component carrier is formed as a three-dimensionally printed structure.
2. The component carrier according to claim 1, wherein the three-dimensionally printed structure is formed according any one of the following embodiments: the three-dimensionally printed structure is formed in the interior and/or at a surface of the carrier body; the three-dimensionally printed structure is formed along a stacking direction of the plurality of layer structures, the three-dimensionally printed structure is formed perpendicular to a stacking direction of the plurality of layer structures; the three-dimensionally printed structure has different cross-sectional areas in a stacking direction of the plurality of layer structures and/or perpendicular to a stacking direction of the plurality of layer structures.
3. The component carrier according to claim 1, wherein the component carrier has a surrounding component carrier region and a surrounded component carrier region, which is surrounded by the surrounding component carrier region, wherein at least a part of the surrounding component carrier region and/or of the surrounded component carrier region is formable as a further three-dimensionally printed structure.
4. The component carrier according to claim 1, wherein the three-dimensionally printed structure is formed according any one of the following embodiments: the three-dimensionally printed structure forms at least partially the electrically conductive layer structures and/or the electrically isolating layer structures; the three-dimensionally printed structure is formed as a rigid and/or flexible structure.
5. The component carrier according to claim 1, wherein the component carrier is formed according any one of the following embodiments: the carrier body has a recess, wherein the three-dimensionally printed structure is printed within the recess; at least a part of the carrier body is encapsulated by the three-dimensionally printed structure as an encapsulation, wherein the encapsulation is a steel and/or titanium encapsulation.
6. The component carrier according to claim 1, wherein the three-dimensionally printed structure is formed according any one of the following embodiments: the three-dimensionally printed structure is formed at least partially as an electrically conducting connection element selected from the group consisting of a terminal pad, a pin, a female connector, a micro-pin, an, in particular annular, sliding contact, and/or a spring contact; the three-dimensionally printed structure is formed as a damping element; the three-dimensionally printed structure is formed as a mechanical connection element selected from the group consisting of a threaded bush, a snap-action connection, a hook and loop connection, a slide fastener connection, a guiding rail, and/or a guiding pin; the three-dimensionally printed structure is a heat conducting structure; the three-dimensionally printed structure has at least one material component, which is selected from the group consisting of copper, aluminum, steel, titanium, metal alloy, plastic material, and photoresist; the three-dimensionally printed structure is an antenna structure; the three-dimensionally printed structure is formed as a reinforcement structure of the electrically conductive layer structures and/or of the electrically isolating layer structures; the three-dimensionally printed structure forms a surface of the carrier body, wherein areas of the surface differ in respect of their hardness, roughness and/or elasticity.
7. The component carrier according to claim 6, wherein a soldering depot is depositable on the conducting connection element; wherein the mechanical connection element is configured to form a releasable connection; wherein the antenna structure is formed such that the antenna structure is printable directly on and/or in the carrier body; wherein at least a region of the three-dimensionally printed structure is formed of steel and/or titanium; wherein the three-dimensionally printed structure forms at least a part of a component.
8. The component carrier according to claim 1, wherein the component carrier is further embodied according any one of the following embodiments: the component carrier further has: an electronic component, surface-mounted at and/or embedded in at least one of the plurality of the electrically conductive layer structures and/or of the electrically isolating layer structures; the three-dimensionally printed structure is formed such that a further three-dimensionally printed structure is printable thereon; a further part of the component carrier is formed as a further three-dimensionally printed structure, wherein the three-dimensionally printed structure and the further three-dimensionally printed structure consist of different materials.
9. The component carrier according to claim 8, wherein the electronic component is selected from a group, which consists of an electrically non-conductive and/or electrically conductive inlay, a heat transmission unit, a directed lighting element, an energy generation unit, an active electronic component, a passive electronic component, an electronic chip, a data storage device, a filter device, an integrated circuit, a signal processing component, a power management component, an optoelectronic converter, a voltage converter, a cryptographic component, a transmission and/or receiving unit, an electromechanical converter, an actuator, a micro-electromechanical system, a micro-processor, a capacitance, a resistance, an inductance, an accumulator, a switch, a camera, an antenna, a magnetic element, a further component carrier, and a logic chip; wherein the three-dimensionally printed structure has a higher heat conductivity and/or current conductivity than the further three-dimensionally printed structure; wherein the three-dimensionally printed structure and/or the further three-dimensionally printed structure are formed of aluminum; wherein the three-dimensionally printed structure and the further three-dimensionally printed structure are formed on top of each other for forming a bi-metal element.
10. The component carrier according to claim 1, wherein the three-dimensionally printed structure is formed according any one of the following embodiments: the three-dimensionally printed structure is formed as at least as one of a group consisting of an active or passive electronic component, a resistor, a capacitor, an inductor, an electrical contact, a breaking cut-out, an USB contact, and a QFN contact; the three-dimensionally printed structure is formed as at least one of a group consisting of a sensor, an actuator, a magnetic sensor, EMC (electromagnetic compatibility) shielding, and a micro-electromechanical system, the three-dimensionally printed structure is formed as at least one element, which is selected from a group consisting of an optical element, a light detector, a light emitter, a lens, a micro-lens, a waveguide; the three-dimensionally printed structure is formed as at least one element, which is selected from a group consisting of a microphone, a loudspeaker and a Helmholtz horn.
11. The component carrier according to claim 1, wherein the component carrier is further embodied according any one of the following embodiments: at least one of the plurality of electrically conductive layer structures has at least one of the group, which consists of copper, aluminum, nickel, silver, gold, palladium and wolfram, wherein one of the mentioned materials is optionally coated with graphene; at least one of the plurality of electrically isolating layer structures has at least one of the group, which consists of resin, reinforced or non-reinforced resin, epoxy resin, bismaleimide-triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivatives, glass, prepreg material, polyimide, polyamide, liquid crystalline polymer, epoxy-based composition film, polytetrafluoroethylene, a ceramic, and a metal oxide.
12. The component carrier according to claim 1, wherein the component carrier is further embodied according any one of the following embodiments: the component carrier is formed as a board; the component carrier is configured as one of the group, which consists of a conductor board and a substrate; the component carrier is configured as a lamination-type component carrier.
13. A method for manufacturing a component carrier, the method comprising: connecting a plurality of electrically conductive layer structures and/or electrically isolating layer structures for forming a carrier body; and forming at least a part of the component carrier as a three-dimensionally printed structure by three-dimensional printing.
14. The method according to claim 13, wherein the three-dimensional printing further comprises: introducing a printable material in a manufacturing device, melting the printable material in the manufacturing device, and supplying the melted printable material on and/or in the carrier body for forming at least one layer of at least a part of the three-dimensionally printed structure.
15. The method according to claim 13, wherein the three-dimensional printing further comprises: depositing a printable material on and/or in the carrier body, and solidifying the deposited printable material for forming at least one layer of at least a part of the three-dimensionally printed structure.
16. The method according to claim 15, wherein through the method at least one of the following embodiments is implemented: the three-dimensionally printed structure is formed by at least one of a group, which consists of selective laser melting, selective laser sintering, and electron beam melting; prior to the solidifying of the printable material, the printable material is melted by a thermal treatment device; the printable material is deposited by a material supply jet nozzle; the carrier body is provided in a material bed, before the printable material is supplied to the carrier body.
17. The method according to claim 16, further comprising: moving the material supply jet nozzle for forming a further layer of the at least a part of the three-dimensionally printed structure.
18. The method according to claim 16, further comprising: moving the carrier body for forming a further layer of the at least a part of the three-dimensionally printed structure.
19. The method according to claim 13, further comprising: arranging the carrier body in a container, providing a solidifiable fluid material in the container, solidifying the fluid material by a treatment device on and/or in the carrier body for forming at least one layer of at least a part of the three-dimensionally printed structure.
20. The method according to claim 19, further comprising: moving the carrier body for forming a further layer of the at least a part of the three-dimensionally printed structure.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0071] In the following, embodiment examples are described with reference to the appended drawings for a further explanation and a better understanding of the present invention.
[0072] FIG. 1 shows a component carrier according to an exemplary embodiment of the invention.
[0073] FIG. 2 shows a component carrier having an encapsulation according to an exemplary embodiment of the invention.
[0074] FIG. 3 shows a component carrier having a surrounding component carrier region and a surrounded component carrier region according to an exemplary embodiment of the invention.
[0075] FIG. 4 shows a component carrier having connection elements according to an exemplary embodiment of the invention.
[0076] FIG. 5 shows a connection element at a component carrier according to an exemplary embodiment of the invention.
[0077] FIG. 6 shows a sliding contact at a component carrier according to an exemplary embodiment of the invention.
[0078] FIG. 7 shows a cross-section through a sliding contact at a component carrier according to an exemplary embodiment of the invention.
[0079] FIG. 8 shows a further cross-section through a sliding contact at a component carrier according to an exemplary embodiment of the invention.
[0080] FIG. 9 shows a component carrier having an encapsulation according to an exemplary embodiment of the invention.
[0081] FIG. 10 shows another view of the component carrier having the encapsulation according to an exemplary embodiment of the invention.
[0082] FIG. 11 shows a component carrier having aluminum layers according to an exemplary embodiment of the invention.
[0083] FIG. 12 shows a component carrier having 3D printed in aluminum layers according to an exemplary embodiment of the invention.
[0084] FIG. 13 shows another view of the component carrier having 3D printed in aluminum layers according to an exemplary embodiment of the invention.
[0085] FIG. 14 shows a component carrier having damping elements according to an exemplary embodiment of the invention.
[0086] FIG. 15 shows a component carrier having connection elements according to an exemplary embodiment of the invention.
[0087] FIG. 16 shows a component carrier having a reinforcement structure and/or a heat-conducting structure according to an exemplary embodiment of the invention.
[0088] FIG. 17 shows a three-dimensional printing method according to an exemplary embodiment of the invention.
[0089] FIG. 18 shows a component carrier having different three-dimensionally printed structures according to an exemplary embodiment of the invention.
[0090] FIG. 19 shows a component carrier having 3D printed glass fibres according to an exemplary embodiment of the invention.
[0091] FIG. 20 shows a component carrier having a threaded bush according to an exemplary embodiment of the invention.
[0092] FIG. 21 shows a component carrier having a threaded bush and a fixing element according to an exemplary embodiment of the invention.
[0093] FIG. 22 shows a component carrier having a three-dimensionally printed structure and a further three-dimensionally printed structure according to an exemplary embodiment of the invention.
[0094] FIG. 23 shows a component carrier having an optical element according to an exemplary embodiment of the invention.
[0095] FIG. 24 shows a component carrier having a bridge according to an exemplary embodiment of the invention.
[0096] FIG. 25 shows a component carrier having a bridge according to a further exemplary embodiment of the invention.
[0097] FIG. 26 shows a component carrier having a waveguide according to an exemplary embodiment of the invention.
[0098] FIG. 27 shows a component carrier having a three-dimensionally printed structure formed as at least a part of a component.
DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS
[0099] Same or similar components in different figures are provided with same reference numerals. The representations in the figures are schematically presented.
[0100] In the following and with reference to FIG. 1, a component carrier 100 is described, wherein the component carrier 100 may have a carrier body 101. The carrier body 101 may have a plurality of electrically conductive layer structures 104 and/or electrically isolating layer structures 103. At least a part of the component carrier 100 may be formed as a three-dimensionally printed structure. Thus, the three-dimensionally printed structure can form at least partially the electrically conductive layer structures 104 and/or the electrically isolating layer structures 103. The three-dimensionally printed structure can be formed in the interior and/or at a surface of the carrier body 101. In FIG. 1, the three-dimensionally printed structure can be embodied as an electrically conducting layer structure 104 on the surface of the carrier body 101. Furthermore, the three-dimensionally printed structure can be the electrically conducting layer structure 104 in the interior of the electrically isolating layer structures 103. The three-dimensionally printed structure may be formed along a stacking direction R of the plurality of layer structures. As can be recognized in FIG. 1, the inner electrically conducting layer structures 104 may be formed on an electrically isolating layer structure 103. Furthermore, a lowermost layer may be formed again of a layer of electrically conducting layer structures 104, such that the carrier body 101 may consist of stacked layer structures 103, 104. Furthermore, the three-dimensionally printed structure can be formed perpendicular to a stacking direction R of the plurality of layer structures. If the three-dimensionally printed structure is the electrically conducting layer structure 104, then may extend in FIG. 1 at the same time along a stacking direction R and perpendicular to the stacking direction R of the plurality of layer structures 103, 104. As can be recognized in FIG. 1, the three-dimensionally printed structure as the electrically conducting layer structure 104 may have different cross-sectional areas, in particular in a stacking direction R of the plurality of layer structures and/or perpendicular to a stacking direction R of the plurality of layer structures. The electrically conductive layer structure (as a 3D printed structure) may further have tapering cross-sections along a stacking direction.
[0101] The component carrier 100 may further have at least one component 105, in particular an electronic component 105, which may be surface-mounted on and/or embedded in at least one of the plurality of electrically conductive layer structures 104 and/or the electrically isolating layer structures 103. The component 105 may be arranged directly on the carrier body 101 or may be fixed on the carrier body 101 by connection elements 106. In FIG. 1, the components 105 may be arranged on the carrier body 101.
[0102] In the following and with reference to FIG. 2, a component carrier 100 is illustrated, wherein at least a part of the carrier body 101 may be at least partially encapsulated by the three-dimensionally printed structure as an encapsulation 207. The carrier body 101 may have at least one side, which may be free from the encapsulation 207. At the side, which is free from the encapsulation 207, electrically conducting layer structures 104 may be arranged. These electrically conducting layer structures 104 may be free from the encapsulation in order to possibly establish electrical contacts to corresponding other components. The encapsulation 207 may have a U-shape. Other shapes of the encapsulation 207 may also be possible, such as an oval or a rounded shape. The encapsulation 207 may be adapted accordingly to the shape of the component carrier 100. Furthermore, the encapsulation can have different cross-sections both along a stacking direction and also perpendicular to a stacking direction, in order to possibly cope with different requirements. If the encapsulation is to be protected from outer influences, such as from strong loads, then a thicker cross-section may be used than for an encapsulation 207 for light loads (or wears). The encapsulation 207 can be a steel and/or a titanium encapsulation.
[0103] According to FIG. 2, at least one of the plurality of layer structures 103, 104 can be formed as three-dimensionally printed structure, wherein a further three-dimensionally printed structure may be printable thereon. In FIG. 2, the encapsulation 207 may be printed as a further three-dimensionally printed structure on the three-dimensionally printed structure of the copper layer 102 and/or at least one of the plurality of layer structures 103, 104.
[0104] In the following and with reference to FIG. 3, a component carrier 100 is illustrated, which may have a surrounding component carrier region 101b and a surrounded component carrier region 101a, which may be surrounded by the surrounding component carrier region 101b, wherein in particular at least a part of the surrounding component carrier region 101b and/or of the surrounded component carrier region 101a may be formable as a further three-dimensionally printed structure. In other words, the component carrier 100 can have two regions of carrier bodies 101a, 101b, wherein a first region of the carrier body 101a may be an inner region and a second region of the carrier body 101b may be an outer region, which may surround the inner region of the carrier body 101a. The second region of the carrier body 101b (or the surrounding component carrier region 101b) may have a recess 330, within which the first region of the carrier body 101a may be formed. In particular, the first region of the carrier body 101a may be printed three-dimensionally within the recess 330. On the other hand, it may also be possible that the component carrier 100 may be printed three-dimensionally in a recess 330 of a further component carrier 300. In this case, thus, two different component carriers 100, 300 may be present, which can be manufactured by 3D printing methods.
[0105] In the following and with reference to FIG. 4, a component carrier 100 is illustrated, in which the three-dimensionally printed structure may be formed at least partially as an electrically conducting connection element 408, 409, 410, in particular as a terminal pad 410, a pin 408, a female connector, a micro-pin 408. A plurality of pins 408 may be arranged on the carrier body 101, which pins 408 may represent electrical contacts for components 105. Furthermore, terminal pads 410 and/or solder pads may be arranged on the carrier body, on which pads components 105 can be fixed directly and/or on which pins or other electrical conductors can be fixed, in order to possibly connect the carrier body 101 to further electrical elements (such as for example electrical components or electrical devices).
[0106] In the following and with reference to FIG. 5, a component carrier 100 is illustrated, on the carrier body 101 of which a pin 408 may have been printed three-dimensionally, wherein a solder depot 510 may have been printed on the pin 408 as a further three-dimensionally printed structure. The pin 408 can thus be provided at the same time with a corresponding solder depot 510. Also other electrical contacts, such as for example contacts or solder pads as shown in FIG. 4, can be printed thereon with a solder depot 510.
[0107] In the following and with reference to FIG. 6, the three-dimensionally printed structure may be formed at least partially as an electrically conducting connection element, as a, in particular annular, sliding contact 612. The sliding contact 612 may establish electrical connections between moved parts, whereby for example a current collector may slide over a metal surface and may tap the electrical energy. By the use of a 3D printed material for the sliding contact 612, materials, in particular metals and/or metal alloys, can be used, which may be resistant against chemical, mechanical, and thermal loads. As a function of which layer thickness is selected for the sliding contact 612, the latter may be less susceptible to a mechanical wear at a high layer thickness than sliding contacts having a low layer thickness. Sliding contacts 612 having a high layer thickness therefore also may have a longer lifetime.
[0108] In the following and with reference to FIG. 7, a cross-section of a sliding contact 612 is illustrated. The sliding contact 612 may consist of a material combination of three different materials, i.e. material A 713, material B 714 and material C 715. Material A 713 may represent a stable metal alloy against wear of friction and may be formed as a carrier ring for the sliding contact 612. Material B 714 may be gold, which may be applied galvanically on material C 715 or may be printed by 3D printing on material C 715. Hereby, material B 714 may serve as a tap for the electrical signal, wherein gold may have a good electrical conductance value, whereby the signal transmission may be improved. Material C 715 may be a carrier metal for the gold material, material C 715 can for example be copper. In a sliding contact 612 having such a construction, the mechanical load may rest primarily on material A 714, such that a low pressure (and a low wear of friction) may act on material B 714, such that material B 714 may have a longer lifetime. Other materials and/or other metal alloys can also be used.
[0109] In the following and with reference to FIG. 8, a cross-section of a sliding contact 612 is illustrated. This sliding contact 612 may have a high layer thickness, whereby the layer thickness of the sliding contact 612 can be adjusted effectively and directly by the three-dimensional printing.
[0110] In the following and with reference to FIG. 9, a component carrier 100 is illustrated, which may have an encapsulation 207. An electrically conducting layer 104, which may be formed as a conductive path, may be arranged in the carrier body 104 of the component carrier 100. The encapsulation 207 may surround at least one side of the component carrier 100, and may further consist of steel or titanium. As a function of the application range, other materials can be used for the encapsulation 207. If the encapsulation 207 serves as a surface protection of the carrier body 101, for example a hard material, such as steel, may be of advantage.
[0111] In the following and with reference to FIG. 10, a component carrier 100 which may have a three-dimensional structure as an encapsulation 207 is illustrated in another view. A cross-section B through the component carrier 100 of FIG. 9 is shown. The encapsulation 207 may be formed on a surface of the carrier body 101, such that the encapsulation 207 can serve as a surface protection. The electrically conducting structure 104, which may be protected from outer influences by the encapsulation 207, may be arranged under the encapsulation. The carrier body 101 can consist of a multi-layer conductor board or also of a single layer conductor board. The three-dimensionally printed structure thus may form a surface of the carrier body, wherein regions of the surface can differ in respect of their hardness, roughness and/or elasticity. As a function of which material is used in the three-dimensional structure (encapsulation 207), it can have different properties. Thus, for example, an encapsulation 207 made of titanium may be harder and thus more resistant against mechanical influences than an encapsulation 207 made of steel. A corresponding roughened surface of the three-dimensional structure (the encapsulation 207) can guarantee a higher heat dissipation than a smooth surface.
[0112] If for example a plastic material is used for the encapsulation 207, this can serve a flexible conductor board as a surface protection, and can simultaneously guarantee the flexibility of the flexible conductor board. In particular, one and the same surface can have different regions, which may have for example different roughnesses. Thereby, a region of the surface of the three-dimensional structure (encapsulation 207), which may be arranged over an electrically conducting layer structure 104, can have a higher roughness than surrounding regions of the surface of the three-dimensional structure (the encapsulation 207), in order to possibly dissipate produced heat from the electrically conducting layer structure 104 by a high roughness. Furthermore, the surface of the three-dimensionally printed structure (the encapsulation 207) can have another material over the electrically conducting layer structure, in order to possibly protect the structures lying thereunder better from outer mechanical influences. For example, at least a region of the three-dimensionally printed structure can be formed of steel and/or titanium.
[0113] In the following and with reference to FIG. 11, a component carrier 100 is illustrated, which may have aluminum layers 1116 on at least a part of the carrier body 101. In particular, in FIG. 11, three regions of the carrier body 101 may be covered by aluminum layers 1116. The aluminum layer 1116 may be printed directly on the carrier body 101. The different aluminum layers 1116 can have different layer thicknesses, such that each aluminum layer 1116 may have another thickness. The aluminum layer 1116 can be applied at each position on/in the carrier body 101.
[0114] In the following and with reference to FIG. 12, a component carrier 100 which may have three aluminum layers 1116 is illustrated, wherein the aluminum layers may be each covered with a copper layer 102. Both the aluminum layer 1116 and also the copper layer 102 can be manufactured by the 3D printing. Because aluminum may be difficult to solder, it may be of advantage, if conducting layers, such as the copper layers 102, are printed directly on the aluminum. The copper layer 102 can have different shapes, such as a rectangular shape for forming a battery terminal, or also a round shape for forming a pin for electronic components. Furthermore, the copper layer 102 can cover the aluminum layer 1116 completely, in order to possibly provide large-area electrically conducting contacts.
[0115] In the following and with reference to FIG. 13, the component carrier 100 may have three aluminum layers 1116 and copper layers 102 applied thereon is illustrated in a side view. It can be seen that two of the three aluminum layers 1116 may not be covered completely by the copper layer 102, whereas one may be completely covered by the copper layer 102.
[0116] In the following and with reference to FIG. 14, the three-dimensionally printed structure may be formed at least partially as an electrically conducting connection element, in particular a spring contact. The spring contact can be printed directly on the carrier body 101. In FIG. 14, two different springs 1417a, 1417b are illustrated, which may differ in their shape. The springs 1417a, 1417b may serve as flexible electrical contacts, such that movements at the contacts 1417a, 1417b and/or at the component carrier 101 can be intercepted, and the spring contacts 1417a, 1417b may not be impaired in their signal transmission by the movement. Furthermore, the three-dimensionally printed structure can be formed as a damping element, in particular as a spring 1417a, 1417b, wherein the damping element 1417a, 1417b may not be electrically conducting, but may serve only as an element for receiving mechanical vibrations.
[0117] In the following and with reference to FIG. 15, the three-dimensionally printed structure is illustrated as a mechanical connection element 1521, 1522, 1523, 1524, which may be formed in particular as a snap connection 1523, a hook and loop connection 1522, a slide fastener connection 1521, a guide rail and/or a guide pin 1524. The mechanical connection element 1521, 1522, 1523, 1524 may be configured to form a releasable connection. All the connection elements 1521, 1522, 1523, 1524 mentioned above can be configured to provide electrically conducting connections. The hook and loop connection 1522 can for example be used to attach the carrier body 101 to corresponding hook and loop connections on textile elements. By the snap connection 1523 (or also a clamping connection), the component carrier 100 can be fixed from a side to a further component carrier 300. The mechanical connection elements 1521, 1522, 1523, 1524 can be used to connect the component carrier 100 to a further component carrier 300, such that possibly at least mechanical and/or electrical connections can be established between two different component carriers 100, 300. The mechanical connection elements 1521, 1522, 1523, 1524 can further be used to connect the component carrier 100 to another device, to possibly fix it to a module, to possibly connect it to an electronic component, or to possibly introduce this in a housing and to possibly fix it releasably.
[0118] In the following and with reference to FIG. 16, the three-dimensionally printed structure is illustrated as a reinforcement structure 1625, in particular a reinforcement structure of the electrically conducting layer structures and/or of the electrically isolating layer structures. Or it is illustrated as a heat-conducting structure 1629. A component 105, which may be surrounded by the heat-conducting structure 1629, may be arranged on the carrier body 101. The heat-conducting structure 1629 may surround the component 105 at at least one side. It may also be possible that the heat-conducting structure 1629 may surround the component 105 completely. By the heat-conducting structure 1629, heat, which may be generated by the component 105, may be dissipated, such that the component 105 may be prevented from an overheating and thus from damages. The heat-dissipating structure 1629 can be printed directly on the carrier body 101 or also in the carrier body 101. Also the copper layer 102 can serve as a heat-dissipating structure, on which copper layer 102 components can be applied (printed) thereon. The heat-dissipating structure 1629 can have different shapes. In FIG. 16, the heat-dissipating structure 1629 may have a rectangular shape, an oval or round shape may also be possible. Furthermore, the carrier body 101 may have a recess 330. A three-dimensionally printed reinforcement 1625 may be deposited at at least one side of the recess 330 on the surface of the carrier body. The reinforcement 1625 may increase the stability of the recess 330. The reinforcement 1625 can also be arranged around the component 105, in order to thus possibly protect the component 105 from impacts on at least one side. The reinforcement 1625 in FIG. 16 may have a rectangular shape, other shapes (round, oval, trapezoid-shape) may also be applicable.
[0119] In the following and with reference to FIG. 17, a method for manufacturing a component carrier 100 is illustrated, wherein at least a part of the component carrier 100 may be formed as a three-dimensionally printed structure. A further component carrier 300 is illustrated, wherein the further component carrier 300 can be produced by the same manufacturing method. The component carrier 100 may be printed directly on and/or in the further component carrier 300. The further component carrier 300 may provide a surface, on/in which the component carrier 100 may be formed by 3D printing. The further component carrier 300 may have a recess 330, in which the component carrier 100 can be printed. A processing device such as a printing head 1727 (which can also be a material supply jet nozzle) may have a printable material 1728. The printable material 1728 may be output by the printing head 1727, such that it can possibly form a three-dimensionally printed structure of the component carrier 100. Thus, the component carrier 100 may be printed three-dimensionally on and/or in the further component carrier 300, thereby using the printable material 1728. Furthermore, a treatment device 1734, such as a laser device, can be provided, which may emit a laser beam for treating the printable material 1728. The printable material 1728, such as e.g. a powdery material, can thereby be melted or sintered, in order to possibly form a solidified three-dimensionally printed structure. It may also be possible that the printing head 1727 may function as an extruder, such that the melted printable material 1728 may be output at a desired position, wherein the printable material 1728 can harden by itself.
[0120] In the following and with reference to FIG. 18, the three-dimensionally printed structure 1831, 1832, 1833 is illustrated in different variations. On the one hand, the three-dimensionally printed structure 1831 may be formed as a terminal pad (or also solder pad). On the other hand, the three-dimensionally printed structure 1832 may be formed as a pin. Furthermore, the three-dimensionally printed structure 1833 may be formed as a conducting and/or non-conducting reinforcement structure. The three-dimensionally printed structure may have at least one material component, which may be selected from the group, which consists of copper, aluminum, steel, titanium, metal alloy, plastic material and photoresist. The terminal pads 1831 and/or pins 1832 may preferably be printed from copper. The reinforcement structure 1833 can be formed of steel or titanium, in order to possibly reinforce regions of the flexible component carrier 100. The three-dimensionally printed structure can also form the electrically isolating layer structure 103, such that the component carrier 100 can be produced almost completely with all elements by a 3D printing method. Furthermore, the three-dimensionally printed structure 1833 can be printed photoresist, which may enclose components, which are to be protected during an etching method. The three-dimensionally printed structure may further also form the copper layer 102 which can function as the electrically conducting layer and/or as the heat-dissipating layer.
[0121] In the following and with reference to FIG. 19, the three-dimensionally printed structure is illustrated as an antenna structure 1942. The antenna structure 1942 may be formed such that the antenna structure 1942 may be printable directly on and/or in the carrier body 101. Herein, the antenna structure can be printed on the carrier body 101 with different thicknesses, as a function of a desired receiving and/or transmission strength of the antenna structure 1942. The antenna structure 1942 may be coupled to a component 105, such that the component 105 can serve as a transmitter and/or receiver of antenna signals. Furthermore, the component 105 can be formed as a sensor for measuring frequencies. In this instance, the antenna structure 1942 may be coupled with components 105, which may be arranged on and/or in the carrier body 101. Furthermore, the three-dimensionally printed structure may be formed as a reinforcement structure, in particular as a glass fibre 1940. The glass fibres 1940 may serve to establish stiff regions on a flexible carrier body 101. The glass fibres 1940 can be arranged both directly on (i.e. over) components 105 and also directly on the carrier body 101, in order to possibly stiffen electrically conductingly and/or possibly electrically isolatingly layer structures at least partially.
[0122] In the following and with reference to FIG. 20, a three-dimensionally printed structure is illustrated as a mechanical connection element, in particular as a threaded bush 106. The threaded bush 106b can be provided with a thread or can be used without a thread 106a. The mechanical connection element 106a, 106b may be printed directly on at least one of the plurality of layer structures of the carrier body 101.
[0123] In the following and with reference to FIG. 21, the three-dimensionally printed structure is illustrated as a mechanical connection element 106a, 106b, in particular as a threaded bush 106, wherein the mechanical connection element 106a, 106b may connect the component carrier 100 with a further component carrier 300 by a fixing means 2141. The mechanical connection element 106a, 106b can connect the component carrier 100 also to other devices or to a housing. Screws, or also bolts, can be used as fixing means 2141.
[0124] In the following and with reference to FIG. 22, a further three-dimensional structure 2253 may be formed as a further part of the component carrier, wherein the three-dimensional structure 2252 and the further three-dimensional structure 2253 may consist of different materials. In particular, the three-dimensional structure 2252 and the further three-dimensional structure 2253 may consist of materials having different heat conductivity and/or current conductivity. Furthermore, the one three-dimensionally printed structure 2252 may have a higher heat conductivity and/or current conductivity than the further three-dimensional structure 2253. The different heat conductivity of the three-dimensionally printed structures 2252, 2253 is indicated in FIG. 22 with arrows 2251. The current conductivity is represented by an electrical signal 2250 running through the three-dimensionally printed structures 2252, 2253. Both the heat 2251 and also the strength of the electrical signal 2250 may be different in the corresponding three-dimensionally printed structures 2252, 2253. Furthermore, the three-dimensionally printed structure and/or the further three-dimensionally printed structure can be formed of electrically conducting materials, in particular aluminum and copper. Aluminum may have a heat conductivity smaller than the heat conductivity of copper, such that a three-dimensionally printed structure of aluminum/copper may be a good heat conductor but [may electrically conduct] worse than only copper, and likewise also a good electrical conductor. If the three-dimensionally printed structure 2252 and the further three-dimensionally printed structure 2253 are formed over each other, they may form a bi-metal element.
[0125] In the following and with reference to FIG. 23, the three-dimensionally printed structure may be formed as at least one element, which may be selected from the group which consists of an optical element, a light detector, a light emitter, a lens 2360, a micro-lens. A recess 330 may be generated in the carrier body 101, within which recess the three-dimensionally printed lens 2360 may be arranged. The lens 2360 may be arranged above a component 105, wherein the component 105 may be arranged within a recess 330, preferably at the bottom. The component 105 can be a light emitter or a light detector, which may emit or detect corresponding light waves through the lens 2360. Furthermore, the lens 2360 can have at least one piezo crystal 2361, which may serve for focusing the lens 2360.
[0126] In the following and with reference to FIG. 24, the three-dimensionally printed structure is illustrated as an electrical contact 2471, in particular as an USB contact and/or a QFN contact. The electrical contact 2471 can be arranged at a side of the component carrier 100, such that e.g. a contact to the electrical contact (USB contact) 2471 can be established easily by a USB stick. Furthermore, the three-dimensionally printed structure can form the component 105, which component 105 may be in particular an active or a passive construction element (or component). Furthermore, the three-dimensionally printed structure may be formed as a breaking cut-out 2470. The breaking cut-out may connect for example two different component carriers 100 and 300 with each other and can separate them as needed. The breaking cut-out 2470a can be attached at a surface of the component carrier 100, 300. Furthermore, the breaking cut-out 2470b can also be formed on at least one of the plurality of layer structures of the respective component carriers 100, 300. The breaking cut-out 2470 can be an electrically conducting layer structure of the component carrier 100, 300, such that an electrically conducting connection can possibly be established.
[0127] Furthermore, the three-dimensionally printed structure can be formed as a rigid and/or a flexible structure, such that the breaking cut-out 2470 may be either rigid and thus may be too easy to break, or the breaking cut-out 2470 may have a certain flexibility and may break only at a particular load.
[0128] In the following and with reference to FIG. 25, a component carrier 100 is illustrated, wherein the three-dimensionally printed structure may be a breaking cut-out 2470. The breaking cut-out 2470 may connect two components 105a and 105b on one and the same component carrier 100. The breaking cut-out can function as an electrical conductor, which, as a safety function, may break for example at a too high voltage or at a too high current.
[0129] In the following and with reference to FIG. 26, the three-dimensionally printed structure is illustrated as a waveguide 2680. The waveguide 2680 can be printed directly on and/or in the component carrier 100. At least one component 105 may be arranged at the waveguide 2680, in a preferred manner, a plurality of components 105 may be arranged. The components 105 may serve as sensors (detectors) in order to possibly detect or also to possibly monitor, for example, the course or the intensity of the light waves within the guide.
[0130] In the following and with reference to FIG. 27, a component carrier is illustrated, wherein the three-dimensionally printed structure may form at least a part 2790a, 2790b of a component 105. The three-dimensionally printed structure can be printed directly on the component, and thus may form a part of the component 2790a. The three-dimensionally printed structure can serve for heat dissipation, e.g. as a heat sink having fins. Furthermore, the three-dimensionally printed structure can be formed as a part of a component 2790b, which may connect the component 105 with the carrier body 101, in order to thus possibly form electrically conducting structures for signal transmission. Furthermore, the three-dimensionally printed structure can also form the component 105 completely.
[0131] Supplementarily, it is to be noted that comprising (or having) does not exclude other elements or steps, and that a or an does not exclude a plurality. Furthermore, it is noted that features or steps, which are described with reference to one of the embodiment examples described above, can also be used in combination with other features or steps of other embodiment examples described above.
LIST OF REFERENCE NUMERALS
[0132] 100, 300 component carrier [0133] 101, 301 carrier body [0134] 102 copper layer [0135] 103 electrically isolating layer [0136] 104 electrically conducting layer [0137] 105 component [0138] 106 connection element [0139] 207 encapsulation [0140] 330 recess [0141] 408 pins [0142] 409 contacts [0143] 410 terminal pads [0144] 511 solder depot [0145] 612 sliding contact [0146] 713 material A [0147] 714 material B [0148] 715 material C [0149] 1116 aluminum layer [0150] 1417 damping element [0151] 1521 slide fastener elements [0152] 1522 hook and loop elements [0153] 1523 clamping elements [0154] 1524 anchor elements [0155] 1625 reinforcement [0156] 1629 heat-conducting structure [0157] 1727 printing head [0158] 1728 printable material [0159] 1734 treatment device [0160] 1831, 1832, 1833 three-dimensionally printed structure [0161] 1940 glass fibre [0162] 1942 antenna structure [0163] 2141 fixing element [0164] 2250 electrical signal [0165] 2251 heat [0166] 2252 three-dimensionally printed structure [0167] 2253 further three-dimensionally printed structure [0168] 2360 lens [0169] 2361 piezo crystal [0170] 2470 bridge [0171] 2471 electrical contact [0172] 2680 waveguide [0173] 2790 part of a component [0174] R stacking direction
