Process for spraying back-adhesive on CMP pad

Abstract

A process for spraying back-adhesive of a CMP pad, includes steps of: horizontally placing an underlayment on middle portions of an upper conveying roller and a lower conveying roller of a hot melt machine for feeding; providing an upper layer glue-coated paper closely attached with an upper surface of the underlayment on the upper conveying roller, providing a lower layer glue-coated paper closely attached with a lower surface of the underlayment on the lower conveying roller; spraying hot melt adhesive on an upper surface of the lower layer glue-coated paper via an ejector nozzle of the hot melt machine; wherein the upper layer glue-coated paper, the underlayment and the lower layer glue-coated paper are transmitted and adhered with each other on the upper conveying roller and the lower conveying roller.

Claims

1. A process for spraying back-adhesive of a chemical mechanical polishing (CMP) pad, comprising steps of: horizontally placing an underlayment on middle portions of an upper conveying roller and a lower conveying roller of a hot melt machine for feeding; providing an upper layer glue-coated paper closely attached with an upper surface of the underlayment on the upper conveying roller, providing a lower layer glue-coated paper closely attached with a lower surface of the underlayment on the lower conveying roller; spraying hot melt adhesive on an upper surface of the lower layer glue-coated paper via an ejector nozzle of the hot melt machine; wherein the upper layer glue-coated paper, the underlayment and the lower layer glue-coated paper are transmitted and adhered with each other on the upper conveying roller and the lower conveying roller.

2. The process as recited in claim 1, wherein a width of the upper layer glue-coated paper and a width of the lower layer glue-coated paper are both greater than a width of the ejector nozzle, and the width of the ejector nozzle is greater than a width of the underlayment.

3. The process as recited in claim 1, wherein a thickness of the hot melt adhesive on the upper surface of the lower layer glue-coated paper is at a range of 0.1-0.15 mm.

4. The process as recited in claim 1, wherein the hot melt adhesive is sprayed at a temperature of from 170 C. to 180 C.

5. The process as recited in claim 1, wherein a spray flow rate of the hot melt adhesive is at a range of 380-400 g/min.

6. The process as recited in claim 1, wherein a spray rate of the hot melt adhesive is at a range of 2.8-3.2 m/min.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The FIGURE is a diagram showing results of an adhesion test of a comparative example 1 and the example 1 of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0016] In order to further understand the present invention, the process and effects of the present invention is illustrated in detail combing with the preferred embodiments of the present invention.

[0017] In the embodiments, the type of the hot melt adhesive machine is JYT110; the hot melt adhesive is M adhesive and the type is 5065HG.

EXAMPLE 1

[0018] (1) Before spraying back adhesive, checking size, thickness and cleanliness of an underlayment, an upper-layer glue-coated paper, a lower-layer glue coated paper; wherein the width of both the upper-layer glue coated paper and the lower-layer glue coated paper is 1.5 m, a thickness of an ejector nozzle is 1 m, a width of the underlayment is 0.8 m;

[0019] (2) setting a temperature of both a cutting head of a coating machine and a melt tank at 175 C.;

[0020] (3) respectively adjusting the upper-layer glue-coated paper of an upper conveying roller and the lower-layer glue-coated paper of a lower conveying roller, so as to coincide the upper-layer glue-coated paper and the lower layer glue-coated paper; adjusting a tension of the upper-layer glue-coated paper and the lower-layer glue-coated paper through an operation interface of the hot melt adhesive machine; wherein an up tension is at a range of 11%-17%; a rear tension is at a range of 28%-35%; furthermore, adjusting a spraying flow of the hot melt adhesive to 390 g/min and a spraying rate of the hot melt adhesive to 3 m/min; and

[0021] (4) checking whether a thickness of a coating layer reaches 0.12 mm, if yes, starting spraying hot melt adhesive.

EXAMPLE 2

[0022] (1) Before spraying back adhesive, checking size, thickness and cleanliness of an underlayment, an upper-layer glue-coated paper, a lower-layer glue coated paper; wherein the width of both the upper-layer glue coated paper and the lower-layer glue coated paper is 1.5 m, a thickness of an ejector nozzle is 1 m, a width of the underlayment is 0.8 m;

[0023] (2) setting a temperature of both a cutting head of a coating machine and a sol tank at 170 C.;

[0024] (3) respectively adjusting the upper-layer glue-coated paper of an upper conveying roller and the lower-layer glue-coated paper of a lower conveying roller, so as to coincide the upper-layer glue-coated paper and the lower layer glue-coated paper;

[0025] adjusting a tension of the upper-layer glue-coated paper and the lower-layer glue-coated paper through an operation interface of the hot melt adhesive machine; wherein an up tension is at a range of 11%-17%; a rear tension is at a range of 28%-35%; furthermore, adjusting a spraying flow of the hot melt adhesive to 380 g/min and a spraying rate of the hot melt adhesive to 3.2 m/min; and

[0026] (4) checking whether a thickness of a coating layer reaches 0.1 mm, if yes, starting spraying hot melt adhesive.

EXAMPLE 3

[0027] (1) Before spraying back adhesive, checking size, thickness and cleanliness of an underlayment, an upper-layer glue-coated paper, a lower-layer glue coated paper; wherein the width of both the upper-layer glue coated paper and the lower-layer glue coated paper is 1.5 m, a thickness of an ejector nozzle is 1 m, a width of the underlayment is 0.8 m;

[0028] (2) setting a temperature of both a cutting head of a coating machine and a sol tank at 170 C.;

[0029] (3) respectively adjusting the upper-layer glue-coated paper of an upper conveying roller and the lower-layer glue-coated paper of a lower conveying roller, so as to coincide the upper-layer glue-coated paper and the lower layer glue-coated paper; adjusting a tension of the upper-layer glue-coated paper and the lower-layer glue-coated paper through an operation interface of the hot melt adhesive machine; wherein an up tension is at a range of 11%-17%; a rear tension is at a range of 28%-35%; furthermore, adjusting a spraying flow of the hot melt adhesive to 400 g/min and a spraying rate of the hot melt adhesive to 2.8 m/min; and

[0030] (4) checking whether a thickness of a coating layer reaches 0.15 mm, if yes, starting spraying hot melt adhesive.

COMPARATIVE EXAMPLE

[0031] (1) Before spraying back adhesive, checking size, thickness and cleanliness of an underlayment, an upper-layer glue-coated paper, a lower-layer glue coated paper; wherein the width of both the upper-layer glue coated paper and the lower-layer glue coated paper is 1.5 m, a thickness of an ejector nozzle is 1 m, a width of the underlayment is 0.8 m;

[0032] (2) setting a temperature of both a cutting head of a coating machine and a sol tank at 175 C.;

[0033] (3) respectively adjusting the upper-layer glue-coated paper of an upper conveying roller and the lower-layer glue-coated paper of a lower conveying roller, so as to coincide the upper-layer glue-coated paper and the lower layer glue-coated paper; adjusting a tension of the upper-layer glue-coated paper and the lower-layer glue-coated paper through an operation interface of the hot melt adhesive machine; wherein an up tension is at a range of 11%-17%; a rear tension is at a range of 28%-35%; furthermore, adjusting a spraying flow of the hot melt adhesive to 390 g/min and a spraying rate of the hot melt adhesive to 3 m/min; and

[0034] (4) checking whether a thickness of a coating layer reaches 0.12 mm, if yes, starting spraying hot melt adhesive.

[0035] 1. Viscosity Test

[0036] Experimental method: peel strength test by 180 degrees.

[0037] Experimental equipment: intelligent electronic tensile testing machine.

[0038] Experimental materials: products of Comparative Example 1 and Example 1 were randomly selected and divided into five groups.

[0039] Experimental procedure: take a sample to be tested with a size of about 2030 cm; punch to sample the sample to be tested by a punch, and use a 12512.7 mm mold for sampling, 2 or 3 sampling strips are punched in each group; the separate the sampling strips from the underlayment and back adhesive to ensure that at least 5cm of the sampling strip is not torn away; open a software of TESTERPRO system to be connected with a tensile machine, confirm a sensor 200 Kg is connected, click the peeling option on the main interface, which is a standard method, set a force sensor to 200Kg in the configuration, other conditions unchanged, the peeling speed is 200 mm/min, respectively clamp the two ends of pre-separated sampling strips at two ends of a clamp, and adjust the position of the clamp to make the sampling strip straight; click all clear and click start, when the sampling strip is completely peeled off, the tension machine automatically stops and the clamp returns to a starting position. Record a maximum value, a minimum value and an average value at this time; record a model and a batch number of the back adhesive tested and a width of the sampling strip, wherein the width of the sampling strip is 12.7; click report-internal report-exporting excel-logging data. The results are shown in Table 1 and the FIGURE. Table 1 shows the results of the adhesion test of the Comparative example 1 and the Example 1. [0040] ADirectly adhering M glue with a model number of 5065HG on an underlayment Q [0041] BSparying hot melt adhesive on the underlayment Q and then adhering M glue

TABLE-US-00001 A Maxi- B mum Minimum Average Maximum Minimum Average force force force force force force First 0.8927 0.6480 0.7490 1.7302 1.3988 1.5985 group 1.0550 0.7605 0.9348 1.5821 1.2161 1.3985 0.7686 0.5175 0.6226 1.5685 1.3039 1.4384 Second 0.9620 0.6661 0.7765 2.4065 1.3416 1.8100 group 0.9159 0.5258 0.7857 1.9449 1.5666 1.7736 Third 0.8435 0.5973 0.7133 2.7183 1.3216 1.8375 group 0.8005 0.4899 0.6867 2.2309 1.1937 1.6852 2.4030 1.8305 2.1203 Fourth 0.7789 0.4561 0.6235 2.2668 1.8450 2.0102 group 1.1207 0.4840 0.8082 2.1523 1.5955 1.8307 2.7071 1.5950 1.9291 Fifth 1.0289 0.8124 0.9078 2.2785 1.7153 1.9310 group 0.9095 0.7027 0.7955 2.5378 1.8320 2.1296 2.5332 1.6853 2.1131

[0042] According to the data in the Table 1 and the FIGURE, the viscosity between the underlayment and the back adhesive of products obtained by hot melt adhesive spraying is apparently stronger than products obtained by directly adhering.

[0043] 2. Terminal Test on Machine

[0044] The product produced in the Example 1 is made into a polishing pad to be tested on the terminal. The test results show that the polishing process is norma and there is no problems of water seepage or degumming.

[0045] One skilled in the art will understand that the embodiment of the present invention as shown in the drawings and described above is exemplary only and not intended to be limiting.

[0046] It will thus be seen that the objects of the present invention have been fully and effectively accomplished. Its embodiments have been shown and described for the purposes of illustrating the functional and structural principles of the present invention and is subject to change without departure from such principles. Therefore, this invention includes all modifications encompassed within the spirit and scope of the following claims.