Apparatus, Systems and Methods for Cleaning and Polishing Accessories

Abstract

The present invention relates to accessories. Specifically, the present invention relates to cleaning accessories such as jewelry that have small crevices, impressions, engravings, or other fine details that are difficult to reach and clean. Even more specifically, the present invention relates to polishing and drying the cleaned accessories by using an allotment of polishing compound and/or steam.

Claims

1. An accessory sanitizing, polishing, cleaning, rinsing and drying apparatus, the apparatus comprising: a tank capable of holding water, steam, and an amount of polishing compound therein; a first line configured to withdraw steam from the tank; a second line configured to withdraw an amount of water and polishing compound from the tank; a mixing valve connected to the first line and the second line, wherein the mixing valve mixes the amount of water and polishing compound withdrawn from the tank via the second line with the steam withdrawn via the first line forming a steam and polishing compound mixture; and a nozzle configured to expel the steam and polishing compound mixture.

2. The apparatus of claim 1 further comprising a first solenoid valve connected to the line that controls the flow of steam through the line.

3. The apparatus of claim 1 wherein the second line has a terminal end disposed adjacent the bottom of the tank 1.

4. The apparatus of claim 4 wherein the terminal end of the second line comprises a screen.

5. The apparatus of claim 1 further comprising a pressure gauge that indicates the pressure of the water tank.

6. The apparatus of claim 1 further comprising controls for regulating the temperature and the pressure.

7. The apparatus of claim 1 further comprising: a twisted element within the nozzle configured to induce a cyclonic rotation in the steam and polishing compound mixture as the steam and polishing compound mixture is expelled from the nozzle.

8. An accessory sanitizing, polishing, cleaning, rinsing and drying system, the system comprising: an accessory cleaning and polishing apparatus, the apparatus comprising a tank capable of holding water, steam, and an amount of polishing compound therein; a first line configured to withdraw steam from the tank; a second line configured to withdraw an amount of water and polishing compound from the tank; a mixing valve connected to the first line and the second line, wherein the mixing valve mixes the amount of water and polishing compound withdrawn from the tank via the second line with the steam withdrawn via the first line forming a steam and polishing compound mixture; and a nozzle configured to expel the steam and polishing compound mixture; an accessory holder disposed on the outside of the apparatus and beneath the nozzle, wherein the accessory holder is capable of suspending an accessory for cleaning and polishing the same.

9. The system of claim 8 further comprising an accessory disposed in the accessory holder.

10. The system of claim 8 further comprising controls for manually setting the temperature and the pressure.

11. The system of claim 8 further comprising a first solenoid valve connected to the first line that controls the flow of steam through the first line.

12. The system of claim 8 further comprising a second solenoid valve connected to the first line that controls the flow of the water and polishing compound through the first line from the second line via the mixing valve.

13. The system of claim 8 further comprising an obstruction disposed within the first line.

14. The system of claim 13 wherein the obstruction is disposed 1.5 inches in from the first end of the first line.

15. An accessory sanitizing, polishing, cleaning, rinsing, and drying method, the method comprising the steps of: providing an accessory cleaning and polishing apparatus, the apparatus comprising: a tank capable of holding water, steam, and an amount of polishing compound therein; a first line configured to withdraw steam from the tank; a second line configured to withdraw an amount of water and polishing compound from the tank; a mixing valve connected to the first line and the second line, wherein the mixing valve mixes the amount of water and polishing compound withdrawn from the tank via the second line with the steam withdrawn via the first line forming a steam and polishing compound mixture; and a nozzle configured to expel the steam and polishing compound mixture; drawing an amount of steam from the tank via the first line; drawing an amount of water and polishing compound from the tank via the second line; mixing the amount of water and polishing compound with the steam forming a steam and polishing compound mixture; and expelling the steam and polishing compound mixture through the nozzle.

16. The method of claim 15 further comprising the steps of: heating the water tank to a first temperature; and activating the first solenoid valve to introduce steam into the first line.

17. The method of claim 16 further comprising the steps of: activating the mixing valve to introduce the water and the polishing compound to the steam.

18. The method of claim 15 further comprising the steps of: pressurizing the water tank to a first pressure; activating a first solenoid valve to introduce steam into the first line; and activating a second solenoid valve to introduce the water and the polishing compound into the first line from the second line via the mixing valve.

19. The method of claim 15 further comprising the steps of: providing a release valve extending from the water tank outside of the accessory cleaning and polishing apparatus; opening the release valve; and starting a flow of water therefrom.

20. The method of claim 15 further comprising the steps of: providing a safety valve extending from the first line to outside of the accessory cleaning and polishing apparatus; and opening the safety valve to release excess pressure.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The drawing figures depict one or more implementations in accord with the present concepts, by way of example only, not by way of limitations. In the figures, like reference numerals refer to the same or similar elements.

[0019] FIG. 1 illustrates a schematic of a cleaning and polishing apparatus in an embodiment of the present invention.

[0020] FIG. 2 illustrates a schematic of a cleaning and polishing apparatus in an alternate embodiment of the present invention.

DETAILED DESCRIPTION

[0021] The present invention relates to accessories. Specifically, the present invention relates to cleaning accessories such as jewelry that have small crevices, impressions, engravings, or other fine details that are difficult to reach and clean. Even more specifically, the present invention relates to polishing and drying the cleaned accessories by using an allotment of polishing compound and/or steam.

[0022] Now referring to the figures, wherein like numerals refer to like parts, FIG. 1 illustrates a cleaning and polishing apparatus 30. The cleaning and polishing apparatus 30 may be a self-contained unit as shown in FIG. 1. A water/cleaning compound tank 1 may be disposed at a location inside the cleaning and polishing apparatus 30. The tank 1 may be filled by using a funnel 5 and opening a fill valve 4. Once tank 1 is filled, the funnel 5 may be removed and the fill valve 4 may be closed. Of course, additional filling methods known to one skilled in the art may be used such as using a cup, having a direct line of water, using a hose, or other known filling technique. The tank 1 may have a blowout preventer 3 disposed between the fill valve 4 and the water tank 1 to prevent air, water, and/or steam from being expelled from the fill valve 4.

[0023] The tank 1 may be able to hold an amount of water and cleaning compound 14. Preferably, the water may not exceed a maximum water level 21. To make sure no water exceeds the maximum water level 21, a release valve 19 may be provided. The release valve 19 may be operated manually, mechanically by opening at a determined water level or pressure, or electronically by monitoring the water level 21 with electronic sensors. The release valve 19 may be opened and may allow air and/or water to flow therethrough. Consequently, the release valve 19 may allow any water in excess of the maximum water level 21 to flow out of the release valve 19. The release valve 19 may be closed thereafter.

[0024] The tank 1 may be heated by a heating band 18 that may be disposed around the tank 1. As the water within the tank 1 is heated, steam may form within the tank 1. The tank 1 may be heated at the request of a user through an input switch 15. A thermostat 16 may regulate the temperature of the tank 1 once the input switch 15 has been engaged. The temperature may be locked so that a user may not increase the temperature above safe levels. A specific temperature may be set by a factory skilled technician when the cleaning and polishing apparatus 30 is manufactured, when the cleaning and polishing apparatus 30 is repaired, of the like.

[0025] The thermostat 16 may have an electrical connection 17 to the heating band 18 such that the heating band 18 heats to the temperature set by the thermostat 16. The heating band 18 may stay on until the thermostat 16 is lowered or the cleaning and polishing apparatus 30 is turned off. Alternatively, the heating band 18 may turn off automatically after a period of time. The heating band 18 may further fluctuate in temperature so long as the temperature of the water is maintained at the temperature set by the thermostat 16. Alternatively, the cleaning and polishing apparatus 30 may be programed to heat to a pre-determined temperature or to a pre-determined pressure. Of course, other methods of heating the tank 1 may be utilized without departing from the scope of the present invention.

[0026] As the tank 1 is heated, the water therein may boil and form water vapor or steam. As a result, the pressure in the tank 1 may rise. The pressure may be predetermined by a qualified technician when manufactured, such as at a few atmospheres or within a range such as 60-80 pounds per square inch. Of course, higher or lower pressures may be used and higher or lower certified tanks may be used to accommodate said higher or lower pressures. The pressure inside the tank 1 may be displayed on a gauge 10, disposed on the outside of the cleaning and polishing apparatus 30. If the pressure exceeds a pressure limit on the tank 1 or a pre-determined pressure limit, a safety valve 11 may release the excess pressure until the desired pressure is maintained. Of course the safety valve 11 may release excess pressure in alternative scenarios, such as mechanical or electrical malfunction, so as to protect the user and the cleaning and polishing device 30.

[0027] The tank 1 may further hold an amount of compound mixed with the water, generally at the bottom of tank 1. The compound may be a cleaning solution, a polishing solution, or similar enhancing compound known to one skilled in the art. The compound may be similarly filled within the tank 1 using the funnel 5 and opening the fill valve 4. The tank 1 may be emptied by opening fill valve 4 and flipping the cleaning and polishing apparatus 30 upside down and removing the liquid therein. The tank 1 may be refilled after prolonged use of the cleaning and polishing apparatus 30.

[0028] Water and compound may be mixed together within tank 1 and withdrawn from the tank 1 via line 20, which may withdraw the water and compound mixture from the bottom of the tank 1. Therefore, the line 20 may have a terminal end and opening at or near the bottom of the tank 1 so as to ensure that a robust mixture of compound and water is withdrawn through the line 20. Preferably, the terminal end of the line 20 may terminate a short distance from the bottom of the tank 1, specifically about ½″ from the bottom of the tank 1, although the distance should not be limited as described herein. Disposed on the terminal end opening of the line 20 may be a screen 14 or other like element that allows water and polishing compound to flow therethrough, but blocks larger polishing compound pieces or impurities that may be contained within the tank 1. Steam may be generated within the tank 1, as described above, and withdrawn from the tank 1 via line 9, specifically via opening 23 at or near the top of the tank 1.

[0029] Thus, the water and compound may be mixed in tank 1 and then mixed together with the steam from tank 1 without requiring separation of the compound and the steam in separate tanks. A mixing valve 8 may be disposed near the outside of the cleaning and polishing apparatus 30 so a user may control the same. The mixing valve 8 may draw and control a flow of a mixture of water and compound that may be disposed at the bottom of tank 1, thereby mixing the water and compound mixture with steam drawn into line 9 via a solenoid valve 7, solenoid valve 6, or combination of solenoid valve 7 and solenoid valve 6, or other valve. Therefore, the water and compound mixture from the bottom of tank 1 may be mixed with the steam generated within the top of the tank 1 to form a steam and compound mixture that is expelled from the cleaning and polishing apparatus 30 via nozzle 22, which may be used to clean an accessory 37, which may preferably be an item of jewelry.

[0030] The mixing valve 8 may control the amount of water and compound mixture may be added to the steam drawn from the tank 1 to increase or decrease the amount of compound that may be utilized to clean the accessory 37. The introduction of steam into line 9 from the water tank 1 may force the steam, water, and compound 14 to exit line 9 through the nozzle 22, where an accessory 37 is to be polished and cleaned. As steam enters line 9 through opening 23, the water in tank 1 may be superheated to create more steam and maintain the pressure in the water tank 1. The compound solenoid valve 7, or other alternate valve and steam solenoid valve 6, or other alternate valve may be turned off and may prevent anything from reaching nozzle 22. The compound solenoid valve 7, or other alternate valve and steam solenoid valve 6, or other alternate valve may alternately be turned on and off automatically at a predetermined pressure, time, or other indicator known to one skilled in the art, or may be turned on and off manually by a user. Alternatively, the mixing valve 8 may bypass solenoid valve 7 (as illustrated in FIG. 2, wherein the solenoid valve 7 is not shown) and wherein the mixing valve output connects to line 9 just upstream of solenoid valve 6. In such a configuration, the mixing valve 8 is used to adjust the compound/water mixture added to the steam through line 9, and solenoid valve 6 may be used to open to allow the flow of the compound/water mixture and steam combination, and close when desired to prevent the flow of the steam and compound/water mixture combination.

[0031] At the opening 23 within tank 1 of line 9, an obstruction may be present that increases the pressure, and thereby the flow, of the steam. The increased pressure of the steam within line 9 due to the obstruction may ultimately increase the flow of the steam, water, and/or compound 14 that is expelled from line 9 via the nozzle 22. The obstruction may be disposed anywhere between the steam solenoid valve 6 and the opening 23 in the line 9 that maximizes the efficiency of the cleaning and polishing apparatus. In one embodiment, as shown in FIG. 1, the obstruction may be at a location furthest from the steam solenoid valve 6. In a preferred embodiment, the obstruction may be located 1.5 inches in from the opening 23.

[0032] The nozzle 22 may be tapered into a cone such that the combination is expelled at a high velocity. Moreover, the nozzle may further include an flat, twisted element, such as a flat piece of metal that is deformed and twisted into a spiral pattern and held adjacent or within the nozzle 22, thereby inducing a cyclonic steam and compound flow from the nozzle 22. The accessory 37 may be held beneath nozzle 22 with a holding tool or alternatively the accessory 37 may be held in a basket or tray or other accessory holder 35 disposed beneath the nozzle 22. In one embodiment, a user may clean and polish the accessory 37 by placing it beneath the nozzle 22. The user may select a combination of steam and compound 14 using mixing valve 8. The temperature and the pressure may automatically adjust to factory set values upon a user engaging the input switch 15. These factory set values may be determined by a skilled technician during manufacturing, during repair, or the like. Once the cleaning and polishing apparatus 30 has enough pressure, a quantity of steam, water, and compound 14 may enter into line 9. The resulting combination in line 9 may be expelled from the nozzle 22 and may clean and polish the accessory. Alternatively, the cleaning and polishing apparatus 30 may expel only steam, such as when the compound is completely diluted. Steam may flow through line 9 without any compound 14 and may be expelled from nozzle 22. The steam-only flow may rinse and dry the accessory, leaving it shiny, clean, and like new. Of course, a user may use the mixing valve 8 to prevent water from entering the compound tank 2. This may allow a user to encompass the accessory with a less diluted compound 14 if desired.

[0033] It should be noted that various changes and modifications to the presently preferred embodiments described herein will be apparent to those skilled in the art. Such changes and modifications may be made without departing from the spirit and scope of the present invention and without diminishing its attendant advantages. Further, references throughout the specification to “the invention” are nonlimiting, and it should be noted that claim limitations presented herein are not meant to describe the invention as a whole. Moreover, the invention illustratively disclosed herein suitably may be practiced in the absence of any element which is not specifically disclosed herein.