Forming sacrificial structures using phase-change materials that sublimate
10245820 ยท 2019-04-02
Assignee
Inventors
Cpc classification
B29C64/106
PERFORMING OPERATIONS; TRANSPORTING
B29C64/118
PERFORMING OPERATIONS; TRANSPORTING
B29C64/112
PERFORMING OPERATIONS; TRANSPORTING
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
B29K2075/00
PERFORMING OPERATIONS; TRANSPORTING
B29C64/40
PERFORMING OPERATIONS; TRANSPORTING
International classification
B29C33/44
PERFORMING OPERATIONS; TRANSPORTING
B33Y10/00
PERFORMING OPERATIONS; TRANSPORTING
B29C64/40
PERFORMING OPERATIONS; TRANSPORTING
B29C64/118
PERFORMING OPERATIONS; TRANSPORTING
B29C64/112
PERFORMING OPERATIONS; TRANSPORTING
B29C64/124
PERFORMING OPERATIONS; TRANSPORTING
B29C64/106
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A structure can include a first layer of a polymer material and a second layer of the polymer material on the first layer, the first and second layers of the polymer material defining a hollow space that was formed by way of a temporary sacrificial structure that was made of a sublimable material.
Claims
1. A method, comprising: depositing a first layer of a polymer material; depositing a first amount of sublimable material on the first layer of the polymer material to form a first sacrificial structure, wherein the sublimable material includes cyclododecane; depositing a second layer of the polymer material on the first amount of sublimable material and first layer of the polymer material; and removing the sublimable material to form a channel defined by the first and second layers of the polymer material.
2. The method of claim 1, wherein the removing includes performing sublimation.
3. The method of claim 2, wherein the sublimation includes heating at a certain temperature and at a certain pressure.
4. The method of claim 3, wherein the certain pressure is approximately 1 millitorr.
5. The method of claim 3, wherein the certain temperature is less than 160 degrees Celsius.
6. The method of claim 5, wherein the certain temperature is approximately 55 degrees Celsius.
7. A method, comprising: depositing a first layer of a polymer material; depositing a first amount of sublimable material on the first layer of the polymer material to form a first sacrificial structure; depositing a second layer of the polymer material on the first amount of sublimable material and first layer of the polymer material; removing the first amount of sublimable material to form a first hollow space defined by the first and second layers of the polymer material; depositing a second amount of sublimable material on the first layer of the polymer material to form a second sacrificial structure; depositing a third layer of the polymer material on the second amount of sublimable material and first layer of the polymer material; and removing the sublimable material to form a second hollow space defined by the first and third layers of the polymer material.
8. A method, comprising: depositing a first layer of a polymer material; depositing a first amount of sublimable material on the first layer of the polymer material to form a first sacrificial structure; depositing a second layer of the polymer material on the first amount of sublimable material and first layer of the polymer material; removing the first amount of sublimable material to form a first hollow space defined by the first and second layers of the polymer material; depositing a second amount of sublimable material on the second layer of the polymer material to form a second sacrificial structure; depositing a third layer of the polymer material on the second amount of sublimable material and second layer of the polymer material; and removing the second amount of sublimable material to form a second hollow space defined by the second and third layers of the polymer material.
9. The method of claim 7, wherein removing either or both of the first and second amounts of sublimable material includes performing sublimation.
10. The method of claim 9, wherein the sublimation includes heating at a certain temperature and at a certain pressure.
11. The method of claim 10, wherein the certain pressure is approximately 1 millitorr.
12. The method of claim 10, wherein the certain temperature is less than 160 degrees Celsius.
13. The method of claim 7, wherein either or both of the first and second amounts of sublimable material includes cyclododecane.
14. The method of claim 7, wherein removing either or both of the first and second amounts of sublimable material includes performing sublimation.
15. The method of claim 14, wherein the sublimation includes heating at a certain temperature and at a certain pressure.
16. The method of claim 15, wherein the certain pressure is approximately 1 millitorr.
17. The method of claim 15, wherein the certain temperature is less than 160 degrees Celsius.
18. The method of claim 8, wherein either or both of the first and second amounts of sublimable material includes cyclododecane.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1)
(2)
(3)
(4)
(5)
(6)
DETAILED DESCRIPTION
(7) Embodiments of the disclosed technology generally pertain to the use of a sacrificial material that can be removed by sublimation, accelerated by heat and/or a low pressure environment. Such embodiments generally do not rely on the use of solvents to wash off the sacrificial materials, thus simplifying the removal process as compared to the decomposition of polymers that requires high temperature burning, for example.
(8) Certain embodiments of the disclosed technology generally include the use of materials that can be sublimated at low temperature (e.g., less than 160 degrees Celsius) as the sacrificial structures. Use of such materials may advantageously avoid the use of a solvent or high temperature decomposition during the removal process. Phase-change material may be deposited as a liquid, and the liquid state may fill in empty spaces and subsequently solidify to enable temporary planarization.
(9) Certain embodiments of the disclosed technology may include the use of cyclododecane, which is a hydrocarbon having a melting point around 58-60 degrees Celsius and high vapor pressure that allows sublimation thereof at low temperature. The phase-change material may be heated to its liquid state for deposition, and then solidify upon contacting a surface below its melting point.
(10) As cyclododecane has high vapor pressure (e.g., approximately 10 Pa), it may typically be sublimated at room temperature, though generally at slow rate. In certain embodiments, material removal may be accelerated by heating the structure in a low vacuum oven (e.g., 1 millitorr or mTorr) at a certain temperature (e.g., approximately 55 degrees Celsius). In such embodiments, the sacrificial cyclododecane may be sublimated within minutes, depending on the volume of materials.
(11)
(12)
(13)
(14)
(15) The entire structure illustrated by
(16) The sacrificial ink used in the example illustrated by
(17)
(18)
(19) At 602, a first layer of a polymer material, such as the ultraviolet (UV)-curable polymer material 102 illustrated by
(20) At 604, a sublimable material, such as the sacrificial material 204 illustrated by
(21) At 606, a second layer of the polymer material, such as the UV-curable polymer material 306 illustrated by
(22) At 608, the sublimable material may be removed, e.g., by a sublimation process, to form a hollow space, such as the channel 408 illustrated by
(23) Materials having different vapor pressure may be chosen to form sacrificial structures that are sequentially removed. For example, if a certain structural part is to be released before another, the first part may be patterned by a sacrificial material having a certain vapor pressure and the second part to be released may be patterned using a sacrificial material having a vapor pressure that is lower than that of the first sacrificial material.
(24) In addition to patterning a sacrificial material in a layer-by-layer manner, the material may also be deposited into a well structure in order to fill in the empty space and hence provide temporary structural support.
(25) It will be appreciated that several of the above-disclosed and other features and functions, or alternatives thereof, may be desirably combined into many other different systems or applications. Also that various presently unforeseen or unanticipated alternatives, modifications, variations, or improvements therein may be subsequently made by those skilled in the art which are also intended to be encompassed by the following claims.