Thermally stable polycrystalline diamond with enhanced attachment joint
10240398 ยท 2019-03-26
Assignee
Inventors
Cpc classification
C04B2237/127
CHEMISTRY; METALLURGY
C04B2237/60
CHEMISTRY; METALLURGY
B23K1/0008
PERFORMING OPERATIONS; TRANSPORTING
C04B2237/72
CHEMISTRY; METALLURGY
B23K35/36
PERFORMING OPERATIONS; TRANSPORTING
E21B10/567
FIXED CONSTRUCTIONS
B23K1/19
PERFORMING OPERATIONS; TRANSPORTING
International classification
E21B10/567
FIXED CONSTRUCTIONS
B23K1/00
PERFORMING OPERATIONS; TRANSPORTING
B23K1/19
PERFORMING OPERATIONS; TRANSPORTING
B23K35/36
PERFORMING OPERATIONS; TRANSPORTING
Abstract
The present disclosure relates to an industrial device, such as a drill bit including a thermally stable polycrystalline diamond (TSP) table coupled to a substrate via an attachment joint, with at least one attachment material located in the attachment joint. At least one of the attachment materials includes a metal or metal alloy and an additive material having a hardness higher than the metal or metal alloy or a coefficient of thermal expansion lower than that of the metal or metal alloy.
Claims
1. A thermally stable polycrystalline diamond (TSP) element comprising a TSP table coupled to a substrate at an attachment joint positioned adjacent to the TSP table and adjacent to the substrate, the attachment joint including at least one composite attachment material comprising a metal or metal alloy and further including a steel additive material having a coefficient of thermal expansion (CTE) lower than that of the metal or metal alloy.
2. The TSP element of claim 1, wherein the composite attachment material comprises a braze alloy.
3. The TSP element of claim 2, wherein the braze alloy comprises an active braze alloy.
4. The TSP element of claim 1, further comprising at least one additional attachment material.
5. The TSP element of claim 4, wherein the at least one additional attachment material comprises at least one additional composite attachment material.
6. The TSP element of claim 4, wherein at least one of the composite attachment material and at least one of the additional attachment material both comprise a braze alloy.
7. The TSP element of claim 4, wherein the at least one of the composite attachment material and at least one of the additional attachment material together comprise an active braze alloy positioned adjacent to the TSP table and a non-active braze alloy positioned adjacent to the substrate.
8. The TSP element of claim 1, wherein the additive material further has a hardness greater than that of the metal or metal alloy.
9. The TSP element of claim 1, wherein the TSP element is located in an earth-boring drill bit.
10. A thermally stable polycrystalline diamond (TSP) element comprising a TSP table coupled to a substrate at an attachment joint positioned adjacent to the TSP table and adjacent to the substrate, the attachment joint including at least one composite attachment material including a metal or metal alloy and further including a steel additive material having a hardness greater than that of the metal or metal alloy.
11. The TSP element of claim 10, wherein the composite attachment material comprises a braze alloy.
12. The TSP element of claim 11, wherein the braze alloy comprises an active braze alloy.
13. The TSP element of claim 10, further comprising at least one additional attachment material.
14. The TSP element of claim 13, wherein the at least one additional attachment material comprises at least one additional composite attachment material.
15. The TSP element of claim 13, wherein at least one of the composite attachment material and at least one of the additional attachment material both comprise a braze alloy.
16. The TSP element of claim 13, wherein the at least one of the composite attachment material and at least one of the additional attachment material together comprise an active braze alloy positioned adjacent to the TSP table and a non-active braze alloy positioned adjacent to the substrate.
17. The TSP element of claim 10, wherein the TSP element is located in an earth-boring drill bit.
18. A method of manufacturing a thermally stable polycrystalline diamond (TSP) element comprising forming an attachment joint between a TSP table and a substrate and positioned adjacent to the TSP table and adjacent to the substrate, the attachment joint including at least one composite attachment material comprising an active braze alloy, wherein the attachment joint comprises a carbide layer formed on the surface of the TSP table by the active braze alloy and the at least one composite attachment material comprising a metal or metal alloy and further including a steel additive material having a coefficient of thermal expansion (CTE) lower than that of the metal or metal alloy or an additive material having a hardness greater than that of the metal or metal alloy.
19. The method of claim 18, wherein forming an attachment joint comprises heating the active braze alloy to a temperature at which the active braze alloy reacts with carbon on an adjacent surface of the TSP table.
20. The method of claim 18, further comprising forming the attachment joint via both at least one composite attachment material and at least one additional attachment material.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) A more complete understanding of the present embodiments and advantages thereof may be acquired by referring to the following description taken in conjunction with the accompanying drawings, which show particular embodiments of the current disclosure, in which like numbers refer to similar components, and in which:
(2)
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(5)
DETAILED DESCRIPTION
(6) The present disclosure relates to an attachment joint for attachment of a TSP table to a substrate to form a TSP element. It also relates to a TSP element, such as TSP cutter containing such an attachment joint as well as an industrial device, such as an earth-boring drill bit, containing such as a TSP element.
(7) In order to make PCD more thermally stable, a designer of a drill bit may leach out some of the catalyst (e.g. a material containing a Group VIII metal, such as cobalt) used in the formation of the PCD. If the entire PCD table or substantially all of it has been leached, the table may then be a TSP table. A TSP table may include some residual catalyst, but in some embodiments it contains no more than 70% of the catalyst originally found in the PCD table. In another embodiment, the TSP may be thermally stable at temperatures of at least 750 C., or even 900 C. at atmospheric pressure.
(8) The TSP table may, however, be difficult to attach to other materials, such as a substrate or the bit body of an earth-boring drill bit. For example, poor wetting may interfere with attachment using traditional brazing processes. Additionally, because of the low coefficient of thermal expansion of diamond as compared to most brazing materials, substrates, and bit body materials, even after attachment the joint may fail due to stresses from different rates of thermal expansion. Furthermore, the attachment joint may fail if it is not sufficiently strong, not sufficiently erosion resistant, and not sufficiently stiff enough due to extreme loading and temperature conditions encountered during use, such as downhole when the TSP element is located in a earth-boring drill bit.
(9) The current disclosure relates to an attachment joint containing material having a low coefficient of thermal expansion (CTE) in order to control residual stresses from differing CTEs between the TSP and the substrate. The attachment joint may also preserve or exhibit improvements in joint strength, stiffness and may further exhibit improved erosion resistance. Although braze alloys are used to illustrate the improved attachment joint herein, similar improvements may be achieved by applying similar principles and materials to welding or soldering materials used in an attachment joint.
(10) According to one embodiment of the disclosure, the attachment joint may be a braze joint and may include an active braze alloy. An active braze alloy may be one that readily forms a carbide in the presence of carbon. Such an alloy may exhibit improved abilities to overcome the low wettability of diamond in the TSP table and to otherwise facilitate bonding of the brazing material to the TSP as compared to non-active braze alloys.
(11) Components of the active braze alloy may react with carbon on at least one surface of a TSP table to form a layer of carbide which may then be brazed with a different braze alloy, such as a non-active or more common braze alloy. Active braze alloys may include alloys that include elements such as titanium, vanadium, chromium, and manganese. More common, non-active braze alloys may include elements such silver, copper, nickel, gold, zinc, cobalt, iron, or palladium. In order to effectively bond the TSP body to the substrate, the attachment process typically takes place at an appropriate temperature. For example, with brazing, the braze process typically occurs at temperatures below 1,100-1,200 C., the graphitization point of TSP under controlled atmospheres. The braze process also typically occurs at a temperature at which the braze alloy is sufficiently molten and, in the case of active braze alloys, at which reaction with carbon on the surface of the TSP table may occur.
(12) The current disclosure further relates to managing the residual stresses in the attachment joint due to differences in CTEs. For example, the diamond table and the carbide formed by the active braze may expand at different rates. As an additional example, thermal expansion rates may differ between the TSP body and the attachment material, as well as between the attachment material and the carbide. These three different materials, expanding at different rates, may create high stress on the surface of the TSP body bonded to the substrate, as well as the attachment joint itself. The current disclosure relates to managing differing CTE-related stresses by modifying the CTE of the attachment joint. In many situations, a composite CTE value may be calculated for a given composition of alloys. Often, the calculation may be done by using the rule of mixtures. By adding a material with low CTE to a braze alloy with relatively high CTE, the CTE value of the composite may be reduced. TABLE 1 below provides a listing of typical linear CTE values for TSP, tungsten carbide (a typical substrate used to form a TSP element), and some example braze alloys.
(13) TABLE-US-00001 TABLE 1 Material CTE Thermally stable polycrystalline diamond 1.0 10.sup.6/ C. Tungsten Carbide 3.5 10.sup.6/ C. Tungsten 4.5 10.sup.6/ C. Cemented Tungsten Carbide 5.0 10.sup.6/ C. Steel 11 10.sup.6/ C. Cobalt 12 10.sup.6/ C. Nickel 13 10.sup.6/ C. Gold 14 10.sup.6/ C. Copper 17 10.sup.6/ C. Silver 18 10.sup.6/ C. Titanium 8.6 10.sup.6/ C. Vanadium 8.4 10.sup.6/ C. Chromium 4.9 10.sup.6/ C.
(14) In some embodiments, an attachment material (e.g., a braze alloy) may include an additive material with a low CTE, such as tungsten, tungsten carbide, diamond grit, steel, or another material with a CTE lower than the CTE of the metal or metal alloy. In the case of a braze alloy, such additive materials may be added to a braze paste or powder prior to brazing. Such additive materials may be added to either an active braze alloy, another braze alloy, or both. Such additive materials may further increase hardness or toughness of the attachment independently of any effects on CTE or other effects. As compared to other attachment materials and also independent of any effects on CTE or other effects alloys, an attachment joint containing a these additive materials may exhibit increased shear strength, increased maximum temperature joint can withstand, increased abrasion resistance, or increased stiffness, causing the diamond table to be more resistant to fracture under heavy loading.
(15) During attachment, the attachment material may melt, cementing the additive material and forming the attachment joint between the TSP table and the substrate. For example, if a silver braze alloy powder and tungsten powder are combined prior to brazing, the overall CTE of the attachment joint maybe reduced from 1810.sup.6/ C. to 1010.sup.6/ C. if they are mixed at a 40/60 ratio (a reduction of 44%), as described below in FORMULA 1.
(0.40*1810.sup.6/ C.)+(0.60*4.510.sup.6/ C.)=1010.sup.6/ C.FORMULA 1
(16) One embodiment of an attachment joint is shown in
(17) The composite attachment material may be used to form an attachment joint 30 with greater resistance to stresses resulting from differing thermal expansion as well as other advantages as described in more detail herein.
(18) In some embodiments, attachment joint 30 may include a primary attachment layer 35 and a secondary attachment layer 40. In the embodiment shown in
(19) A composite attachment material may improve attachment joint 30 in a variety of ways. For example, when attachment joint 30 begins to erode, a gap may form between TSP table 20 and substrate 50. Because diamond is relatively brittle, it benefits from support to prevent flexing or fracturing of the TSP table under heavy loading. Adding harder materials (e.g., tungsten, tungsten carbide, diamond grit, etc.) to the attachment material may increase erosion resistance and minimize loss of support.
(20) The brittleness of diamond also affects the desired stiffness of attachment joint 30. Relatively minor deflection (e.g., less than 0.001 inches) under load may cause the diamond to fracture at the interface with attachment joint 30. Attachment joint 30 may deflect due to compression (e.g., elastic deflection) under heavy loading or compression as the joint loses its mechanical properties under elevated temperature. Adding harder materials (e.g., tungsten, tungsten carbide, diamond grit, etc.) to the attachment material may increase the modulus of elasticity of attachment joint 30, increasing stiffness and minimizing deflection. Thus, resistance of the TSP element to TSP table fracture may be increased in this manner as well.
(21) An enlarged view of an embodiment using an active braze alloy is provided in
(22) A TSP element containing an attachment joint as described herein may be incorporated into an industrial device, such as an earth-boring drill bit, as illustrated in
(23) For the embodiment shown in
(24) Drilling action associated with drill bit 60 may occur as bit body 70 is rotated relative to the bottom (not expressly shown) of a wellbore in response to rotation of an associated drill string (not expressly shown). At least some cutters 80 disposed on associated blades 200 may contact adjacent portions of a downhole formation (not expressly shown) drilling. These cutters 80 may be oriented such that the TSP table contacts the formation. The inside diameter of an associated wellbore may be generally defined by a combined outside diameter or gage diameter determined at least in part by respective gage portions 220 of blades 200.
(25) TSP elements may also be attached to other portions of drill bit 60 (not expressly shown), such a high-wear areas, including those near nozzles, in junk slots, or in dampening or depth of cut control regions.
(26) Furthermore, in some embodiments, a TSP table may be attached directly to a drill bit 60 without the use of an intervening substrate. In such instances, an attachment joint 30 using an attachment material as described herein may be employed. The location on the bit body at which such a TSP table may be attached may be formed from bit body material or a different material, such as a substrate material pre-set in the bit body.
(27) Although only exemplary embodiments of the invention are specifically described above, it will be appreciated that modifications and variations of these examples are possible without departing from the spirit and intended scope of the invention. For instance, the proper placement and orientation of TSP elements or a TSP table on other industrial devices may be determined by reference to the drill bit example.