MEMS piston-tube based capacitive accelerometer
10241129 ยท 2019-03-26
Inventors
Cpc classification
B81B2203/053
PERFORMING OPERATIONS; TRANSPORTING
B81B3/0086
PERFORMING OPERATIONS; TRANSPORTING
G01P2015/0837
PHYSICS
International classification
Abstract
A novel high resolution, low noise MEMS capacitive accelerometer is disclosed. The accelerometer utilizes a piston-tube electrode configuration that enables the use of a wide area for the electrodes. Therefore, a high capacitive sensitivity is achieved. The accelerometer consists of two structures: upper and lower. The lower structure contains a plurality of fixed electrodes that are attached to the base and have a piston-style shape (teeth). Those pistons form the sensing electrodes of the accelerometer. The upper structure contains a plurality of moving electrodes that have a tube-style shape (through holes), and they are attached to a substrate via restoring mechanical springs. The proof mass of the accelerometer is distributed around these tubes to reduce squeeze thin film damping in the system. The accelerometer is able to sense linear acceleration along the z-axis and/or the angular acceleration about the in-plane axes (x and y).
Claims
1. A MEMS capacitive accelerometer, comprising: a. a first base plate having a top surface and a thickness; b. an array of spaced apart teeth electrodes constructed in the thickness of said base plate; c. each said tooth electrode having a shape, a length, a height, and a thickness; d. said array of teeth being grouped in one or multiple sub-arrays of teeth each comprising one or more teeth, wherein the teeth in each sub-array of teeth being electrically connected to each other and electrically isolated from other sub-arrays of teeth; e. each sub-array of teeth being electrically addressable, whereby each sub-array of teeth forms a sensing electrode of said accelerometer; f. a second plate attached to said base plate and having a structure sized to fit on said base plate, said second plate having a fixed peripheral structure and a moving central structure, whereby the fixed structure being attached to the base plate and the moving central structure forms a proof mass of said accelerometer; g. an array of spaced apart openings constructed in the thickness of said moving structure said second plate; h. said array of openings sized and designed to receive and interdigitate with said array of teeth, and said array of openings with each said opening having a length, a width and a height, whereby said array of openings forms a moving electrode of said accelerometer; i. a plurality of spring means supports and holds said moving structure of said second plate wherein said openings are aligned with respect to said array of teeth and to return the said moving structure to its initial position in the absence of external acceleration, each said spring having a length, a thickness, and a height, whereby the teeth of the base plate penetrate into the openings of the top plate in response to linear acceleration along an out-of-plane axis (z-axis), or/and rotational acceleration about an in-plane axes (x and y) being measured by means of capacitance change detection that is formed between the teeth and the openings.
2. The MEMS capacitive accelerometer of claim 1, wherein said array of teeth electrodes being arc shaped and being radially co-centric with a predefined radial spacing.
3. The MEMS capacitive accelerometer of claim 1, wherein said array of teeth electrodes being substantially rectangular, circular, triangular, trapezoidal, pentagonal, or hexagonal shaped, and each said sub-array of teeth being aligned linearly along their length and forming several linear rows in each said sub-array.
4. The MEMS capacitive accelerometer of claim 1, wherein said array of teeth electrodes being substantially rectangular, circular, triangular, trapezoidal, pentagonal, or hexagonal shaped, and each said sub-array of teeth being aligned radially along their length and forming several curved rows in each said sub-array.
5. The MEMS capacitive accelerometer of claims 3 and 4, wherein said sensing tooth electrodes and moving electrode (openings) form four capacitors.
6. The MEMS capacitive accelerometer of claim 1, wherein the proof mass is partially solid (lumped) at the center of the said moving structure of said second plate, and surrounded by an array of openings.
7. The MEMS capacitive accelerometer of claim 1, wherein said springs being long springs having high ratio of a longitudinal stiffness to a transverse stiffness to allow for a large travel range of the proof mass.
8. The MEMS capacitive accelerometer of claim 1, wherein said springs being extended radially inwards.
9. The MEMS capacitive accelerometer of claim 1, wherein said springs having the same thickness as the height of the opening, whereby eliminating the fabrication step needed for etching the second plate to soften the springs, thereby simplifying the fabrication process.
10. The MEMS capacitive accelerometer of claim 1, wherein a plurality of said pistons are extended upward such that their top surfaces are at the same plane with top surface of said second plate.
11. The MEMS capacitive accelerometer of claim 10, wherein said accelerometer measures the linear acceleration along two directions of the out-of-plane axis.
Description
BRIEF DESCRIPTION OF DRAWINGS
(1) Embodiments herein will hereinafter be described in conjunction with the appended drawings provided to illustrate and not to limit the scope of the claims, wherein like designations denote like elements, and in which:
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DETAILED DESCRIPTION OF THE INVENTION
(20) An embodiment of the MEMS capacitive accelerometer is illustrated in
(21) The pistons could form one or multiple sensing electrodes (preferably four), and they protrude vertically towards the upper structure and extend horizontally along the two in-plane axes (x and y). Each sensing electrode is electrically isolated form other sensing electrodes by utilizing the Buried Oxide (BOX) layer 130 of an SOI wafer or any other dielectric layer. The pistons within each single group (sensing electrode) are electrically connected to each other via a small thickness (height) layer 140 forming a single capacitor with the moving (common) electrode in the upper structure. It will be readily clear to the one with ordinary skills in the art that this layer 140, shown in
(22) The tubes 210 form the moving electrode, which is a common electrode that in conjunction with the lower sensing electrodes 110 111 112 113 make up the capacitors. The mass of the tubes is considered the proof mass of the accelerometer. The tubes are rectangular through holes, and they are vertically aligned with the pistons (sensing electrodes). The cross-section of the tubes is larger than that of the pistons so that the pistons penetrate along the tubes during the acceleration. In other words, a horizontal gap 224 between the outer sides of the pistons and inner sides of the tubes exist, refer to the cross sectional view in
(23) When an external linear acceleration 510, please refer to
(24) When an external angular acceleration 520, refer to
(25) The configuration of the springs holding the moving structure could be designed in many ways as it will be clearly apparent to the one who is skilled in the art. One may use suspension springs that extend radially to support the tubes. Another preferred configuration of springs is that the springs extend along the peripheral of the tubes' plate. This configuration of the springs has a number of advantages. First, it allows springs to be largely long (leads to having a high ratio consisting of the longitudinal stiffness to the transverse stiffness as the longitudinal stiffness of the beams is inversely proportional to the length and the transverse stiffness is inversely proportional to the length cube). This high value of the ratio pushes the lateral instability limit further; hence the pull-in voltage value is larger. This is a very important advantage when the accelerometer is operating in the closed loop mode because a large electrostatic force can be generated to keep the mass in the rest position by applying voltages below the pull-in voltage; hence, a wide dynamic range of the accelerometer could be achieved. The second advantage is that it provides a wide room for the electrodes to be multiplied as opposed to the spring configuration in which the springs are extending radially leading to shrinkage of the area of the tubes. Finally, the springs could have the same thickness as that of the tubes, meaning that the fabrication step needed for etching the upper structure to soften the spring could be eliminated, which simplifies the fabrication process.
(26) In another embodiment of the current invention, one may design the proof mass of the accelerometer such that it is partially lumped (solid) by removing some of the tubes at the center of the accelerometer. This lumped part 600, shown in
(27) The preferred embodiment of the accelerometer illustrated in
(28) To overcome the limitations of the unidirectional accelerometer, another embodiment of the accelerometer that provides a bidirectional measurement of the vibration/acceleration is described. The bidirectional accelerometer, shown in
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(30) These values of the capacitances C.sub.Ep (maximum) and C.sub.Lp (minimum) at the rest position of the proof mass are considered as parasitic or rest capacitances. Hence, reference capacitors are connected in parallel with these capacitances, C.sub.Ep and C.sub.Lp, in the read-out circuit of the accelerometer to eliminate their effect.
(31) When an external acceleration 930, refer to
(32) When an external acceleration 960, refer to
(33) Another configuration for capacitance measurement by the read-out circuit is achieved by electrically connecting the extended pistons (C.sub.Ep) to the lower pistons (C.sub.Lp) to form a single capacitance, i.e C.sub.total=C.sub.Ep+C.sub.Lp. A reference capacitor has the value of the parasitic capacitance of C.sub.Ep and C.sub.Lp (C.sub.total at rest position) is connected in parallel with the accelerometer total capacitance C.sub.total to an op amp circuit. When an acceleration 960 is applied upwards along the positive direction of the out-of-plane axis (z-axis), the distance between the lower structure and moving structure of the accelerometer reduces, hence the overall accelerometer capacitance (C.sub.total) increases almost linearly (the increase is only in C.sub.Lp while the change of C.sub.Ep is zero), and the output voltage of the op amp is positive as C.sub.total is greater than C.sub.ref. When the acceleration is applied downward 930, the moving structure of the accelerometer moves away from the lower structure, hence the capacitance of the accelerometer decreases almost linearly (the decrease is only in C.sub.Ep while the change of C.sub.Lp is zero); the output of the op amp is negative as the accelerometer capacitance (C.sub.total) becomes less than C.sub.ref.
(34) Such bidirectional accelerometer has the ability to measure the linear acceleration in two directions along the z-axis; however, it has less capacitive sensitivity when compared to the unidirectional accelerometer (the sensitivity is reduced by half as half of the pistons are used to measure the acceleration on each side).
(35) It will be also readily apparent to one who is skilled in the art that the shape of the pistons (teeth) and the corresponding tubes in the present invention could be designed in different geometrical shapes. They could be rectangular as shown in the embodiments illustrated in the present invention, or square-shaped, circular, pentagonal, hexagonal or trapezoidal. The configuration of the springs will then be arranged accordingly such that the longitudinal direction of the springs (the direction that corresponds to the largest stiffness of the springs) is normal to the parallel plate capacitance between the inner sides of the tubes and the outer sides of the pistons (to avoid the lateral instability). And the transverse (sensitive) direction is parallel to the axis of the acceleration needed to be measured.
REFERENCES
(36) [1] B. V. Amini, R. Abdolvand, and F. Ayazi, Sub-micro-gravity capacitive SOI microaccelerometers, Dig. Tech. Pap. Int. Conf. Solid State Sensors Actuators Microsystems, TRANSDUCERS '05, vol. 1, pp. 515-518, 2005. [2] D. Zhao, A Low-Noise CMOS Interface for Capacitive Microaccelerometers, Georgia Institute of Technology, 2009. [3] B. V. Amini and F. Ayazi, Micro-gravity capacitive silicon-on-insulator accelerometers, J. Micromechanics Microengineering, vol. 15, pp. 2113-2120, 2005. [4] M. A. ERM, MEMS Accelerometers and Gyroscopes for Inertial Measurement Units, MIDDLE EAST TECHNICAL UNIVERSITY, 2004. [5] N. Yazdi, F. Ayazi, K. Najafi, and S. Member, Micromachined Inertial Sensors, vol. 86, no. 8, 1998. [6] L. San and V. Foronda, Automotive Events Detection using MEMS Accelerometers, Universitat Politcnica de Catalunya. [7] J. Bernstein, R. Miller, W. Kelley, and P. Ward, Low-noise MEMS vibration sensor for geophysical applications, J. Microelectromechanical Syst., vol. 8, no. 4, pp. 433-438, 1999. [8] H. Kulah, J. C. J. Chae, and K. Najafi, Noise analysis and characterization of a sigma-delta capacitive silicon microaccelerometer, TRANSDUCERS '03. 12th Int. Conf. Solid-State Sensors, Actuators Microsystems. Dig. Tech. Pap. (Cat. No. 03TH8664), vol. 1, no. 2, pp. 352-361, 2003. [9] M. F. Pantano, L. Pagnotta, and S. Nigro, A numerical study of squeeze-film damping in MEMS-based structures including rarefaction effects, Ital. Res. smart Mater. MEMS, vol. 23, pp. 103-113, 2013. [10] C. Acar and A. Shkel, MEMS Vibratory Gyroscopes: Structural Approaches to Improve Robustness. 2009, p. 104.