NIOBIUM TITANIUM NITRIDE THIN FILM COATINGS FOR FAR-INFARED ABSORPTION AND FILTERING
20190086269 ยท 2019-03-21
Inventors
- Ari D. Brown (Ellicott City, MD, US)
- EDWARD J. WOLLACK (CLARKSVILLE, MD, US)
- Kevin H. Miller (Washington, DC, US)
Cpc classification
C01G23/002
CHEMISTRY; METALLURGY
G01J5/0853
PHYSICS
C01G33/006
CHEMISTRY; METALLURGY
G01J5/20
PHYSICS
International classification
G01J5/20
PHYSICS
Abstract
The disclosed subject matter relates to an infrared detector including a dielectric detector membrane and a NbTiN absorber coating disposed thereon, the latter being a low stress, high resistivity film or coating useful at extremely low temperatures.
Claims
1. An infrared detector, comprising: a. a detector membrane including a dielectric material, the detector membrane having an inner surface and an outer surface, the outer surface receiving incoming infrared radiation; and b. an absorber coating disposed on the outer surface of the dielectric material, the absorber coating having an optical impedance of about 200-500 /sq, a thickness of at least about 30 nm and a superconducting transition temperature (Tc) greater than or equal to about 9.2 K.
2. The infrared detector of claim 1 wherein the dielectric membrane material is Si or silicon nitride.
3. The infrared detector of claim 1 wherein the dielectric membrane is Si.
4. The infrared detector of claim 1 wherein the absorber coating is NbTiN.
5. The infrared detector of claim 4 wherein the thickness of the absorber is about 100 nm.
6. The infrared detector of claim 1, further including a. a resonant cavity adjacent the inner surface of the detector membrane; b. a reflective back short disposed opposite to the inner surface of the detector membrane with the resonant cavity in between; and c. a thermistor disposed on the inner surface of the detector membrane.
7. The infrared detector of claim 6 wherein the thermistor is molybdenum/gold (Mo/Au) transition edge sensor.
8. The infrared detector of claim 6 wherein the reflective back short is disposed on a solid substrate.
9. The infrared detector of claim 1 wherein the absorber coating has a superconducting transition temperature (Tc) greater than or equal to about 9.2 K.
10. An infrared detector, comprising: a. a detector membrane including a dielectric material, the detector membrane having an inner surface and an outer surface, the outer surface receiving incoming infrared radiation; b. an absorber coating disposed on the outer surface of the dielectric material, the absorber coating comprising NbTiN and having an optical impedance of about 200-500 /sq, a thickness of at least about 30 nm and a superconducting transition temperature (Tc) greater than or equal to about 9.2 K; c. a resonant cavity adjacent the inner surface of the detector membrane; d. a reflective back short disposed opposite to the inner surface of the detector membrane with the resonant cavity there between; and e. a thermistor disposed on the inner surface of the detector membrane.
11. The infrared detector of claim 10 wherein the dielectric material is Si or silicon nitride.
12. The infrared detector of claim 10 wherein the dielectric material is Si.
13. The infrared detector of claim 10 wherein the thermistor is molybdenum/gold (Mo/Au) transition edge sensor.
14. The infrared detector of claim 10 wherein the reflective back short is disposed on a solid substrate.
15. A method of sputter depositing NbTiN to form a NbTiN coating on a substrate: a. providing a substrate that is rotating around a central axis, the central axis substantially perpendicular to the surface of the substrate; b. sputter depositing Nb from an Nb sputtering source in a first direction toward the substrate, the Nb sputtering source positioned such that the first direction is at an oblique angle to the central axis; and c. sputter depositing Ti from a Ti sputtering source in a second direction toward the substrate, the second direction being different from the first direction and the Ti sputtering source positioned such that the second direction is at an oblique angle to the central axis and on a side of the central axis substantially opposite to the first direction.
16. The method of claim 15, wherein the substrate is substantially planar is shape.
17. The method of claim 15, wherein the substrate includes an infrared detector membrane.
18. The method of claim 15, wherein the substrate wherein the substrate is a dielectric material.
19. The method of claim 15, further including the steps of sputter depositing Nb and sputter depositing Ti simultaneously in a nitrogen atmosphere.
20. The method of claim 15, wherein the sputter depositing Nb and sputter depositing Ti are performed at a maximum rate of 1.54 /sec. for forming the resulting NbTiN coating.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0008] These and other features, aspects, and advantages of the present invention will become better understood when the following detailed description is read with reference to the accompanying drawings in which like characters represent like parts throughout the drawings, wherein:
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[0020] The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
DETAILED DESCRIPTION
[0021] Embodiments and coatings of the present disclosure optically couple light to a bolometric detector, including a superconducting bolometer detector, the coatings suspended on an ultra-thin dielectric membrane, used to detect infrared radiation, for example far infrared radiation. Embodiments of the present disclosure can be used in and for the development of THz imagers, as well. The coatings may also filter out low frequency spectral components, which may be undesirable and would increase the photon-limited noise of the detector.
[0022] In one embodiment, the coatings, for example, niobium titanium nitride (NbTiN) thin film coatings, are fabricated on dielectric substrates (also referred to as membranes) using a specialized reactive sputtering co-deposition process. Two different sputtering sources are used, in which one source contains a niobium sputtering target and the other contains a titanium sputtering target. The niobium and titanium are deposited in a well-controlled manner in a nitrogen-rich environment.
[0023] In order to use the coatings, for example, niobium titanium nitride (NbTiN) coatings, preferably NbTiN thin film coatings, the coatings need to be deposited on one side of a detector membrane, a dielectric material, for example, an ultra-thin silicon membrane (on which there is a bolometric detector like a transition edge sensor located on the opposite side of the membrane) and have a well-defined optical impedance required for a specific application. In some embodiments, in order to achieve an optical efficiency above 90%, the NbTiN coatings may have an optical impedance between 251 and 566 /sq and be optically coupled to a quarter wave backshort.
[0024] Alternate embodiments could include depositing the coatings of the present disclosure, for example, NbTiN coatings, on dielectric layers other than Si. For example, some embodiments could include NbTiN coatings deposited on silicon nitride absorber coatings have been shown to satisfy the optical impedance requirements for a bolometric detector operating in the 28-110 micron spectral band.
[0025] Coatings of the present disclosure, including, preferably embodiments having a NbTiN thin film coating, advantageously may possess low intrinsic stress, which makes them mechanically compatible for integration on ultra-thin dielectric membranes and possess the optical impedance required for a high optical efficiency. The coatings can be fabricated in a reproducible manner and have a superconducting transition temperature of around 10.7 K, preferably greater than 9.2 K, which enables them to filter and reject incident radiation below 660 GHz.
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[0027] Another embodiment includes depositing NbTiN films using sputtering co-deposition of Nb and Ti in an N2-rich atmosphere, at room temperature with an applied RF bias to a detector membrane. The film stoichiometry was changed by changing the power applied to the Nb sputtering target, which ranged from 110 to 470 W. The deposition rate maximum was about 1.54 /sec. in order to minimize impurities in the absorber coating due to outgassing.
[0028] By way of example, suitable sputtering equipment may include sputtering equipment made by AJA, of which model Phase II-J may be used. A reactive plasma carrier gas mixture comprising a combination of a noble gas and a reactive gas species may be used with the process taking place at pressures of less than about 10 mTorr, preferable less than about 4 mTorr. The reactive gas species can be nitrogen or oxygen, preferably nitrogen and the noble gas can be xenon, argon, or helium, preferably argon. The total partial pressure of other, residual gasses, which might include water vapor, carbon dioxide, hydrogen, or oxygen should be less than 110.sup.8 Torr.
[0029] Sputtered coatings can be applied using the embodiment illustrated in
[0030] Sputtered coatings can also be applied using the embodiment illustrated in
[0031] The embodiment of
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[0033] The goal is to produce a coating with an optical impedance of about 200-500 /s.sub.q at cryogenic temperature, a thickness of about 100 nm and a superconducting transition temperature (Tc) greater than 9.2 K. Table 1 includes optical impedance data (/sq) for the coating layers described above in
TABLE-US-00001 TABLE 1 Room Room Temperature Temperature Optical Optical impedance impedance Transmittance Deposition (50 icm) (500 icm) Substrate Superstrate Curve Time [s] [/sq] [/sq] Composition Composition 400 700 220 130 Silicon (001) None 402 500 260 170 Silicon (001) None 404 100 700 520 Silicon (001) None 406 500 210 160 Silicon None Dioxide 408 500 270 170 Silicon Silicon Dioxide Dioxide 410 300 350 260 Silicon (001) None 412 400 300 200 Silicon (001) None 414 500 270 180 Silicon (001) None
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[0040] This written description uses examples as part of the disclosure, including the best mode, and also to enable any person skilled in the art to practice the disclosed implementations, including making and using any devices or systems and performing any incorporated methods. The patentable scope is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.