Method of manufacturing an electrode for a surge arrester, electrode and surge arrester
10236094 · 2019-03-19
Assignee
Inventors
- Jiaping Hong (Xiaogan, CN)
- Yu Zhang (Xiaogan, CN)
- Zhipeng Fang (Xiaogan, CN)
- Wolfgang Däumer (Zeuthen, DE)
- Frank Werner (Berlin, DE)
Cpc classification
C25D7/00
CHEMISTRY; METALLURGY
H01T21/00
ELECTRICITY
International classification
B32B15/00
PERFORMING OPERATIONS; TRANSPORTING
C25D7/00
CHEMISTRY; METALLURGY
Abstract
A method for manufacturing of an electrode of a surge arrester, an electrode and a surge arrester are disclosed. In an embodiment, the method includes positioning an electrode body in an electrochemical cell with and an electrolyte solution for a nickel deposition. The electrolyte solution includes at least one or more of magnesium sulphate, sodium sulphate and sodium chloride and electrolytically coating the electrode body with a coating to form the electrode for the surge arrester. The coating has nickel and the electrolyte solution is configured such that a surface of the coating includes a reduced wettability.
Claims
1. An electrode for a surge arrester, comprising: an electrode body; and a coating being electrically conductive, wherein the coating comprises nickel and an additive, wherein the coating has a surface with a reduced wettability, wherein the additive comprises sulphur, which effects the reduced wettability of the surface of the coating for a solder, and wherein the sulphur of the additive is present in the surface of the coating between 0.05 and 0.2 weight percent based on a total weight of the coating.
2. The electrode according to claim 1, wherein the coating is an electrolytically deposited layer.
3. The electrode according to claim 1, wherein the additive further comprises chlorine.
4. The electrode according to claim 3, wherein the chlorine of the additive is present in the surface of the coating between 0.1 and 0.3 weight percent based on a total weight of the coating.
5. The electrode according to claim 1, wherein the solder is a hard solder.
6. The electrode according to claim 1, wherein a contact angle formed by the solder at a temperature of 800 C. on the surface of the coating is greater than a contact angle of the solder formed on a nickel surface not comprising the additive.
7. The electrode according to claim 1, wherein the coating is free of Cu.
8. A surge arrester comprising the electrode according to claim 1.
9. A surge arrester electrode, comprising: an electrode body; and a coating being electrically conductive, wherein the coating comprises nickel and an additive, wherein the coating has a surface with a reduced wettability when the surge arrester electrode is soldered to a surge arrester insulator, wherein the additive comprises sulphur and/or chlorine, wherein, when the additive comprises sulphur, the sulphur is present in the surface of the coating between 0.05 and 0.2 weight percent based on a total weight of the coating, and wherein, when the additive comprises chlorine, the chlorine is present in the surface of the coating between 0.1 and 0.3 weight percent based on a total weight of the coating.
10. The surge arrester electrode according to claim 9, wherein the additive comprises sulphur and chlorine.
11. An electrode for a surge arrester comprising: an electrode body; and a coating being electrically conductive, wherein the coating comprises nickel and an additive, wherein the coating has a surface with a reduced wettability, wherein the additive comprises chlorine, which effects the reduced wettability of the surface of the coating for a solder, and wherein the chlorine of the additive is present in the surface of the coating between 0.1 and 0.3 weight percent based on a total weight of the coating.
12. The electrode according to claim 11, wherein the additive further comprises sulphur.
13. The electrode according to claim 12, wherein the sulphur of the additive is present in the surface of the coating between 0.05 and 0.2 weight percent based on a total weight of the coating.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) Features which are described herein above and below in conjunction with different aspects or embodiments, may also apply for other aspects and embodiments. Further features and advantageous embodiments of the subject-matter of the disclosure will become apparent from the following description of the exemplary embodiment in conjunction with the figures, in which:
(2)
(3)
(4)
(5)
DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS
(6) Like elements, elements of the same kind and identically acting elements may be provided with the same reference numerals in the figures. Additionally, the figures may be not true to scale. Rather, certain features may be depicted in an exaggerated fashion for better illustration of important principles.
(7)
(8) The first electrode body 1 and the second electrode body 2 are, preferably, made of Cu or predominantly comprise copper. Preferably, the electrode bodies have a copper surface However, said electrode bodies may also comprise further electrode materials such as a nickel/iron (NiFe) alloy or compound.
(9) The first electrode body 1 and the second electrode body 2 are arranged symmetrically in
(10) The surge arrester 100 further comprises an ignition aid 7 encompassing two parts arranged at the insulators 4 and at each lateral side of the gap 3. The ignition aid 7 may be arranged on or at the insulators 4 such that the gap 3 is arranged between said ignition aid or said parts. Between the first electrode body 1 and the second electrode body 2, as well as between the insulators 4, or as the case may be, the ignition aid 7, a gas may be arranged which may be electrically dischargeable by a current pulse or current load, caused by a lightning strike e.g., during an operation of the surge arrester 100. The gas or filling gas may comprise hydrogen (H.sub.2). In the case, wherein the first and second electrode bodies 1, 2 are made of a NiFe alloy, the H.sub.2 of the filling gas poses disadvantages as it may be absorbed by the NiFe electrodes and said electrodes may degenerate by said absorption.
(11) However, in the case that the first and the second electrode 1, 2 are made of copper, hydrogen is, preferably, applied as a filling or discharge gas as copper hardly absorbs hydrogen. Alternatively, nitrogen may be applied as a filling gas, wherein a larger arc or discharge voltage may be obtained during an operation of the surge arrester 100.
(12) The arrester 100 further comprises a cavity 9. The first and the second electrode bodies 1, 2 and the insulators 4 define the cavity 9. The surge arrester 100 or the cavity 9 of the surge arrester 100 is, expediently, filled with a gas 8. Said cavity 9 is further preferably sealed and/or configured to be gas-proof.
(13) The presented surge arrester 100 is, preferably, designed for an overvoltage or surge current protection of telecommunication devices against lightning strikes. The surge current capacity of the surge arrester may, thereby, be adjusted to a current of 4 kA and a wave form of 10/350 s. The first value of said specification may relate to the slope or increase duration of a DC current, while the second value (350 s) of said specification may relate to the half-life duration or half value period of the respective surge current pulse caused by the lightning strike.
(14) Preferably, the surge arrester 100 is provisioned for a protection of devices against DC currents.
(15) The ignition aid 7 may, particularly, ease or accelerate the process of gas discharging by a distortion of the respective electric field. Further, the average of the arc voltage or of the distribution of said voltage may be reduced by the provision of the ignition aid.
(16) The generation of heat or heat development during the described surge current loads on the surge arrester 100 may cause the electrode material of the mentioned electrode bodies 1, 2 to melt or evaporate. Such an evaporation can cause shortcuts in the surge arrester 100 and/or the narrowing of the gap 3. Thereby, the protection level of the surge arrester 100 may be increased due to the evaporation of electrode material, wherein the ignition aid 7 and/or the insulators 4 may be coated by said electrode material.
(17)
(18) The insulator 4 comprises a solder 5. The solder 5 may be a solder layer. In
(19) Prior to the soldering, the electrode bodies 1, 2 are preferably, coated with the coating 6. The coating 6 comprises nickel. Preferably, the coating 6 is a nickel coating. Preferably, the coating 6 is, further, a dark nickel coating.
(20) The electrode bodies 1, 2 are, preferably, electrolytically coated with the coating by means of an electrochemical cell (not explicitly shown) and an electrolyte solution (not explicitly shown) which is suitable or allows for a nickel deposition. Said coating process is, preferably, a special wet chemical electrolytic process.
(21) The electrode bodies 1, 2, may act as a cathode during the electrolytic deposition of the coating on the electrode bodies 1, 2.
(22) For the electrolytic deposition, the electrolyte solution, preferably, comprises at least one or more of magnesium sulphate such as MgSO.sub.4 with 7 parts H.sub.2O, sodium sulphate such as NaSO.sub.4 and/or sodium chloride (NaCl). Preferably, the electrolyte solution further comprises nickel sulphate hexahydrate such as NiSO.sub.4*6H.sub.2O and boric acid such as H.sub.3BO.sub.3. The nickel sulphate hexahydrate is, preferably, present at a concentration of or of about 230 g/l, while the boric acid is, preferably, present at a concentration of 40 g/l.
(23) The coating 6 is, preferably, chosen or deposited such that the surface (not explicitly indicated) of the coating 6 comprises a lower wettability for the solder 5 as compared to nickel or a reference nickel surface, preferably at a temperature at which the electrodes are soldered to the insulator 4 during a fabrication or manufacturing of the surge arrester 100.
(24) Preferably, the surfaces of the electrode bodies 1, 2 are made of copper.
(25) The coating is, expediently, electrically conductive, comprises metallic electrical properties and comprises, in addition to nickel, an additive which may comprise sulphur and chlorine. The lowering of the wettability of the surface of the coating for the solder may be achieved by the presence of the additive and/or the provision of the dark nickel for the coating of the respective electrode.
(26) The sulphur for the additive is, preferably, present in the surface of the coating between 0.05 and 0.2 weight percent. On the other hand, the chlorine in the additive is, preferably, present in the surface of the coating between 0.1 and 0.3 weight percent. Said percentages may be rendered by means of an element analysis, e.g. x-ray fluorescence. In this regard, the term in the surface may indicate that said elements are detectable in the coating (or a surface thereof) up or down to a thickness corresponding to the characteristic active sampling or detection thickness of said element analysis.
(27) Preferably, the surface of the coating comprises a lower free electron density as compared to a nickel or reference nickel surface.
(28) Preferably, the contact angle formed by the solder at a temperature of 800 C. or at that temperature at which the electrode is soldered to the insulator 4, on the surface of the coating 6, is greater than the contact angle of the solder formed on a nickel surface not comprising the additive and/or not being a dark nickel surface.
(29) Preferably, the coating is, furthermore, free of copper. Thereby, it may be avoided that the copper of the electrode melts or evaporates as a consequence of a lightning strike or a surge current or the respective thermal load. Nickel, on the other hand, does not evaporate that easily due to the greater melting point of nickel as compared to copper. The surface roughness of the coating may further be greater or smaller than the surface roughness of the reference nickel surface not comprising the additive and/or not being a dark nickel surface, for example. The coating may further comprise a thickness between 5 and 20 m, preferably between 6 and 10 m. The surface of the coating 6 may further be configured such that the wettability of the coating 6 or its surface for the solder 5 is reduced or lower than the reference nickel surface. The surface of the coating 6 thereby, preferably, inherently emerges by the above-mentioned electrolytic method.
(30) The coating 6, particularly the embodiment as dark nickel coating effects the reduced wettability of the solder 5 on the coating during the mentioned soldering such that said solder 5 does not flow or run towards a region of the gap 3 and the surge arrester 100 becomes leaky, e.g. at the lateral sides of the surge arrester 100, where the insulator 4 contacts the electrodes, respectively. Instead, as the viscosity or wettability of the solder 5 on the coating 6 is kept moderate and the advantages of a fairly high capability for surge currents or thermal loads can be exploited by the surge arrester 100.
(31)
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(33) The scope of protection is not limited to the examples given herein above. The invention is embodied in each novel characteristic and each combination of characteristics, which particularly includes every combination of any features which are stated in the claims, even if this feature or this combination of features is not explicitly stated in the claims or in the examples.