Method for automated monitoring of a soldering process, soldering device with monitoring device

Abstract

A method for heating a substrate (12) and/or an electronic component (14) arranged on the substrate (12) for desoldering and/or soldering the component (14) by a soldering device (10) with an energy dissipation (E), a device position (P), and/or a device acceleration (a). The soldering device (10) heats a soldering point (20) on the substrate (12) and/or on the component (14) by heat conduction, heat radiation, and/or heat convection, and has a first energy dissipation (E), a first device position (P.sub.x,y,z), and/or a first device acceleration (a.sub.x,y,z). The soldering device (10) moves towards and/or away from the soldering point (20), has a second energy dissipation (E), a second device position (P.sub.x,y,z), and/or a second device acceleration (a.sub.x,y,z). The state of the soldering point (20), the substrate (12), and/or the component (14) depends on time series of the energy dissipation (E), the device position (P.sub.x,y,z), and/or the device acceleration (a.sub.x,y,z).

Claims

1. A method for heating a substrate (12) and/or an electronic component (14) arranged on the substrate (12) for desoldering and/or soldering the component (14), in a manual soldering process, by a soldering device (10) with an energy dissipation (E) and with a device position (P.sub.x,y,z) and/or with a device acceleration (a.sub.x,y,z), wherein the soldering device (10) in a soldering state (130), in which the soldering device (10) heats a soldering point (20) at the substrate (12) and/or at the component (14) by heat conduction and/or by heat radiation and/or by heat convection, has a first energy dissipation (E) and a first device position (P.sub.x,y,z) and/or a first device acceleration (a.sub.x,y,z), wherein the soldering device (10) in a handling state (120), in which the soldering device (10) is moved towards and/or away from the soldering point (20), has a second energy dissipation (E) and a second device position (P.sub.x,y,z) and/or a second device acceleration (a.sub.x,y,z), characterized in that a state of the soldering point (20) and/or of the substrate (12) and/or of the component (14) is determined depending on a time series of the energy dissipation (E) and a time series of the device position (P.sub.x,y,z) and/or a time series of the device acceleration (a.sub.x,y,z).

2. The method according to claim 1, wherein the solder state (130) is determined in that there is a high first energy dissipation (E) and/or a defined first device position (P.sub.x,y,z) and/or a low first device acceleration (a.sub.x,y,z).

3. The method according to claim 1, wherein the handling state (120) is determined in that there is a low second energy dissipation (E) and/or an undefined second device position (.sub.x,y,zP) and/or a high second device acceleration (a.sub.x,y,z).

4. The method according to claim 1, wherein the energy dissipation (E) is determined depending on a device voltage, a device current, a device power and/or an output level of the soldering device (10) and/or depending on a temperature of the soldering device (10) and/or of the soldering point (20) and/or of the substrate (12) and/or of the component (14).

5. The method according to claim 1, wherein the amount of energy introduced into the soldering point (20) and/or into the substrate (12) and/or into the component (14) is determined depending on the time series of the energy dissipation (E), and on the introduced energy time series of the soldering state (130).

6. The method according to claim 5, wherein the state of the soldering point (20) and/or of the substrate (12) and/or of the component (14) is determined depending on the amount of energy introduced into the soldering point (20) and/or into the substrate (12) and/or into the component (14) and/or a time series of the amount of energy introduced into the soldering point (20) and/or into the substrate (12) and/or into the component (14).

7. The method according to claim 1, wherein the state of the soldering point (20) and/or of the substrate (12) and/or of the component (14) is displayed to a user (1) in real time.

8. The method according claim 1, wherein a time series of the energy dissipation (E) and/or of the device position (P.sub.x,y,z) and/or of the device acceleration (a.sub.x,y,z) is detected as a single soldering process with a movement profile, and at least one detected soldering process can be assigned to a soldering profile of a user (1).

9. The method according to claim 1, wherein the assignment of the soldering state (130) and/or of the handling state (120) and/or of the state of the soldering point (20) and/or of the substrate (12) and/or of the component (14) is done by classifying the stored time series of the energy dissipation (E) and/or of the device position (P.sub.x,y,z) and/or of the device acceleration (a.sub.x,y,z) by means of statistical classification algorithms.

10. A soldering device (10) for heating a substrate (12) and/or an electronic component (14) arranged on the substrate (12) for desoldering and/or soldering the component (14) in a manual soldering process, with an energy dissipation (E) and a device position (P.sub.x,y,z) and/or a device acceleration (a.sub.x,y,z), wherein the soldering device (10) in a soldering state (130), in which the soldering device (10) heats a soldering point (20) on the substrate (12) and/or on the component (14) by heat conduction and/or by heat radiation and/or by heat convection, has a first energy dissipation (E) and a first device position (P.sub.x,y,z) and/or a first device acceleration (a.sub.x,y,z), wherein the soldering device (10) in a handling state (120), in which the soldering device (10) is moved towards and/or away from the soldering point (20) has a second energy dissipation (E) and/or a second device position (P.sub.x,y,z) and/or a second device acceleration (a.sub.x,y,z), wherein the soldering device (10) additionally has a monitoring device (30) for monitoring a state of the soldering point (20) and/or of the substrate (12) and/or of the component (14), and wherein the monitoring device (30) is set up to determine the state of the soldering point (20) and/or of the substrate (12) and/or of the component (14) depending on a time series of the energy dissipation (E) and/or a time series of the device position (P.sub.x,y,z) and/or a time series of the device acceleration (a.sub.x,y,z).

11. The soldering device (10) according to claim 10, wherein the soldering device (10) comprises at least one state sensor (32) generating a state signal for detecting the energy dissipation (E) of the soldering device (10) and at least one position sensor (36) generating a position signal for detecting the device position (P.sub.x,y,z) of the soldering device (10) and/or at least one sensor (34) generating an acceleration signal for detecting the device acceleration (A.sub.x,y,z) of the soldering device (10).

12. The soldering device (10) according to claim 11, wherein the at least one state sensor (32) is configured to detect a device voltage, a device current, a device power and/or an actuating variable of the soldering device (10) and/or to detect a temperature of the soldering device (10) and/or of the soldering point (20) and/or of the substrate (12) and/or of the component (14).

13. The soldering device (10) according to claim 10, wherein the monitoring device (30) is further configured to receive, store, and/or process the state signal and/or the position signal and/or the acceleration signal, and determine the state of the soldering point (20) and/or of the substrate (12) and/or of the component (14) depending on a time series of the state signal and/or a time series of the position signal and/or a time series of the acceleration signal.

14. The soldering device (10) according to claim 10, wherein the monitoring device (30) is further configured to assign detected soldering processes to a soldering profile of a user (1).

15. The soldering device (10) according to claim 10, wherein the soldering device (10) comprises a user interface (40), in particular an LED display, for displaying the state of the soldering point (20) and/or of the substrate (12) and/or of the component (14), in particular in real time, and wherein in particular the monitoring device (30) is further configured to control the user interface (40) to display the state of the soldering point (20) and/or of the substrate (12) and/or of the component (14).

16. The soldering device (10) according to claim 10, wherein the soldering device (10) comprises a control and/or regulation device (50) which is configured in such a way as to control and/or to regulate the energy dissipation (E) of the soldering device (10) depending on the time series of the energy dissipation (E) and/or the time series of the device position (P.sub.x,y,z) and/or the time series of the device acceleration (a.sub.x,y,z).

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0041] FIG. 1 shows a block diagram of a method according to the invention;

[0042] FIG. 2a shows a schematic plan view of a use of the soldering device according to the invention, wherein the soldering device is in the handling state;

[0043] FIG. 2b shows a schematic side view of the use according to FIG. 2a;

[0044] FIG. 3a shows a schematic plan view of a use of the soldering device according to the invention, wherein the soldering device is in the soldering state;

[0045] FIG. 3b shows a schematic side view of the use according to FIG. 3a;

[0046] FIG. 4 shows a soldering device according to the invention; and

[0047] FIG. 5 shows a soldering system according to the invention.

DETAILED DESCRIPTION

[0048] In the following description and in the figures, identical reference signs are in each case used for identical or corresponding features.

[0049] According to FIG. 1, the soldering device 10 can have, inter alia, an idle state 110, a handling state 120, and a soldering state 130. FIGS. 2a and 2b show the soldering device in the handling state 120 and FIGS. 3a and 3b show it in the soldering state 130.

[0050] FIGS. 2a to 3b show a soldering device 10 according to the invention, in particular a soldering iron, for heating a substrate 12 and an electronic component 14 arranged on the substrate 12, in particular for desoldering and/or soldering the component 14 in a manual soldering process. In preparation for the soldering process, the component 14 is placed onto the substrate 12. For this purpose, the substrate 12 has contact points 16 which correspond to pins 18 arranged on the component 14. To connect the substrate 12 to the component 14, the pins 18 are first inserted into the contact points 16, the contact points 16 preferably being formed as through-holes. When the components 14 are placed on the substrate 12, they must be aligned in the exact position so that the respective pins 18 of the component 14 come into contact with the corresponding contact points 16 of the substrate 12.

[0051] The substrate 12 and the electronic components 14 are connected to one another with soldering points 20. To produce a soldering point 20, the substrate 12 and/or the component 14 and/or a supplied solder material (not shown) is heated. For this purpose, the soldering device 10 has a preferably replaceable soldering tip 22 with a heating head 24. The soldering device 10, in particular the soldering tip 22, provides the heating power required to melt the solder material. In this state, the soldering device is in the soldering state 130.

[0052] Before, during and after the production of a soldering point 20, the soldering device 10 can be removed from the soldering point 20. This is done both at the beginning and at the end of the production of a soldering point 20, as well as during production for control purposes and for readjustment. In this state, the soldering device 10 is in the handling state 120.

[0053] When the soldering device 10 is not in use, the soldering device 10 is in an idle state 110.

[0054] In particular during manual production of soldering points 20 by means of a soldering device 10, in particular a soldering hand tool, a quality control of the soldering points 20 is absolutely necessary due to the greatly varying abilities of a user 1. For this purpose, with an

[0055] AOI the prior art provides a control mechanism following production. It is also disadvantageous to use an AOI during production, since the user is continuously being recorded by a camera system. An essential parameter in the evaluation of a soldering point 20 is the energy introduced into the soldering point 20. However, in a manual soldering process it is challenging to determine whether the soldering device 10 is in an idle state 110, a handling state 120, or a soldering state 130.

[0056] The block diagram shows which parameters of the soldering device 10 are to be monitored in order to determine an idle state 110, a handling state 120, and a soldering state 130 of the soldering device 10. The parameters are an energy dissipation E and a device position P.sub.x,y,z and a device acceleration a.sub.x,y,z of the soldering device. The energy dissipation E is the heating power over time, which is transferred from the soldering device 10 to the environment or to the soldering point 20 and/or the substrate 12 and/or the electronic component 14 by heat conduction and/or heat radiation and/or heat convection. The device position P.sub.x,y,z is an X, Y, and Z coordinate and/or an angle ?, ?, and ? of the soldering device. The device acceleration a.sub.x,y,z is an acceleration along an X, Y, and Z axis, and/or an angular acceleration a, b, and c of the soldering device. A time series represents a series of temporally ordered variables or values of a parameter.

[0057] The soldering device 10 is initially in idle state 110. In this case, the soldering device 10 is in standby mode, e.g., on a work table (not shown). Subsequently, according to FIGS. 2a and 2b, in a handling state 120 the soldering device 10 is grasped by a user 1 and is moved in space. The soldering device 10 is switched on in such a way that heating power is provided to heat the soldering point 20. For the soldering, the soldering device 10 comes into contact with the soldering point 20 as shown in FIGS. 3a and 3b, and is in the soldering state 130.

[0058] The energy dissipation E, the device position P and the device acceleration A.sub.x,y,z differ depending on whether the soldering device is in the idle state 110, the held state 120, or the soldering state 130.

[0059] In the soldering state 130, the soldering device 10 has a first energy dissipation E, a first device position P.sub.x,y,z and a first device acceleration A.sub.x,y,z. In addition to the block of the soldering state 130, a time series of the first energy dissipation E, the first device position P.sub.x,y,z, and the first device acceleration a.sub.x,y,z is shown. In the soldering state 130, the first energy dissipation E is at a high level, as there is heat conduction due to the contact between the soldering device 10 and the soldering point 20. Furthermore, the first device position P.sub.x,y,z and the first device acceleration a.sub.x,y,z have a small fluctuation range, as the soldering device 10 is held steady by the user 1 through contact at a defined point. It is also conceivable for the first device position P.sub.x,y,z to be already known beforehand if the soldering point 20 is at a defined position.

[0060] In the handling state 120, the soldering device 10 has a second energy dissipation E, a second device position P.sub.x,y,z and a second device acceleration a.sub.x,y,z. In addition to the block of the soldering state 120, a time series of the second energy dissipation E, of the second device position P.sub.x,y,z, and of the second device acceleration a.sub.x,y,z is shown. In the handling state 120, the second energy dissipation E has a medium level, because only heat convection is present, due to the surrounding atmosphere. Furthermore, the second device position P.sub.x,y,z and the second device acceleration a.sub.x,y,z exhibit a high fluctuation range, since holding the device in space is accompanied by movement at the soldering device 10.

[0061] In the idle state 110, the soldering device 10 has a third energy dissipation E, a third device position P.sub.x,y,z, and a third device acceleration a.sub.x,y,z. In addition to the block of the idle state 110, a time series of the third energy dissipation E, of the third device position P.sub.x,y,z, and of the third device acceleration a.sub.x,y,z is shown. In the handling state 120, the third energy dissipation E has a low level, because the soldering device is in standby mode. Furthermore, the third device position P.sub.x,y,z and the third device acceleration a exhibit a low fluctuation range, since laying the manual device down is not accompanied by movement by the user 1. It is also conceivable for the third device position P.sub.x,y,z of the idle state 110 to be defined.

[0062] It is conceivable to use the energy dissipation E, the device position P.sub.x,y,z, and the device acceleration a.sub.x,y,z to evaluate the soldering state. It is alternatively conceivable to use either the device position P.sub.x,y,z or the device acceleration a.sub.x,y,z in addition to the energy dissipation E.

[0063] On the basis of the time series of the soldering state 130 and the time series of the first energy dissipation E, it can be determined how much energy was supplied to the soldering point 20. If the energy supplied to the soldering point 20 exceeds a critical upper limit, the soldering point 20 can be evaluated as defective. The user 1 can also be warned if a critical upper soldering point limit is about to be exceeded. Consequently, the quality of the soldering point 20 can be evaluated in real time and feedback on the quality of the soldering point 20 and/or a warning in the event of excessive heat can also be provided to the user 1. Such feedback can also be provided about the state of the substrate 12 and of the component 14.

[0064] In order to carry out the method according to the invention, the soldering device 10 has a monitoring device 30 for monitoring the state of the soldering point 20 and/or of the substrate 12 and/or of the component 14. The monitoring device 30 receives a state signal for the energy dissipation E of the soldering device 10 from a state sensor 32 arranged in the soldering device 10. The monitoring device 30 also receives an acceleration signal for the acceleration a.sub.x,y,z of the soldering device 10 from an acceleration sensor 34 arranged in the soldering device 10. The monitoring device 30 additionally or alternatively receives a position signal about the position P.sub.x,y,z of the soldering device 10 from a position sensor 36 arranged in the soldering device 10.

[0065] The monitoring device 30 is set up to receive, store, and process the state signal and/or the acceleration signal and/or the position signal in such a way that the idle state 110, the handling state 120, and the soldering state 130, as well as the energy introduced into the soldering point 20, are detected.

[0066] Furthermore, the soldering device 10 has an integrated user interface 40 for displaying the state of the soldering point 20 and/or of the substrate 12 and/or of the component 14. The user interface 40 preferably has an LED display in green, yellow, and red. Using the user interface 40, the monitoring device 30 can give the user 1 feedback about the process, in particular about the soldering point 20.

[0067] The monitoring device 30 is further set up to detect, by means of a 6-dimensional acceleration sensor 34 during the soldering state 130, an angle ? enclosed by the soldering device 10 and the soldering point 20, in particular a soldering device axis 11 of the soldering device 10 and the pin 18 or the soldering device axis 11 of the soldering device 10 and the substrate 12, and to display it on the user interface 40. It is also conceivable for the user 1 to receive a signal from the user interface to correct the angle ?.

[0068] In addition to the monitoring device 30, the soldering device can also have an integrated control and regulation device 50. The control and/or regulation device 50 is set up in such a way as to control and/or to regulate the energy dissipation E of the soldering device 10 depending on the time series of the energy dissipation E and/or the time series of the device position P.sub.x,y,z and/or the time series of the device acceleration a.sub.x,y,z. If a critical upper limit of the energy supplied to the soldering point 20 has been exceeded and the soldering device 10 is still located at the soldering point 20, the heating power can for example be throttled down by the control and regulation device 50. If a high energy dissipation E and a high device acceleration a.sub.x,y,z are detected, the heating power can for example also be throttled down by the control and regulation device 50 in order to avoid a faulty soldering point.

[0069] In order to further improve the prediction of the soldering state 130 and/or the classification of the soldering point 20, the soldering device also has a processor and memory unit 60, wherein this 60 stores and manages a database with soldering profiles and/or with movement profiles of the users 1. Based on the soldering profiles and/or movement profiles, a more targeted prediction can be made about the soldering state 130 and the quality of the soldering point 20. It is conceivable that the classification regarding the soldering condition and the state of the soldering point, as well as the provision of a soldering profile, could be carried out using artificial intelligence.

[0070] Furthermore, FIG. 5 shows a soldering system 100 according to the invention with a soldering device 10 and with a base housing 102, wherein the soldering system 100 can in particular be designed as a soldering station. The soldering device 10 is connected to the base housing via a line 104. Here the soldering device 10 has a position sensor 36 and/or an acceleration sensor 34. The state sensor 32, the monitoring device 30, and the user interface 40 and/or the control and regulation device 50 and/or the processor and memory unit 60 are provided in the base housing 102.

[0071] Persons skilled in the art will understand that the structures and methods specifically described herein and illustrated in the accompanying figures are non-limiting exemplary aspects, and that the description, disclosure, and figures should be construed merely as exemplary of aspects. It is to be understood, therefore, that the present disclosure is not limited to the precise aspects described, and that various other changes and modifications may be affected by one skilled in the art without departing from the scope or spirit of the disclosure. Additionally, it is envisioned that the elements and features illustrated or described in connection with one exemplary aspect may be combined with the elements and features of another without departing from the scope of the present disclosure, and that such modifications and variations are also intended to be included within the scope of the present disclosure. Indeed, any combination of any of the presently disclosed elements and features is within the scope of the present disclosure. Accordingly, the subject matter of the present disclosure is not to be limited by what has been particularly shown and described.