CARRIER STRUCTURE, METHOD FOR PRODUCING A CARRIER STRUCTURE AND DEVICE AND PRINTHEAD FOR CARRYING OUT SUCH A METHOD

Abstract

In an embodiment a carrier structure includes at least one conductor structure configured for electrically contacting electrical components, wherein the conductor structure includes a plurality of conductor bodies, wherein at least some of the conductor bodies are in direct contact with electrically conductive first connectors, and wherein the conductor structure includes the conductor bodies and the first connectors.

Claims

1-17. (canceled)

18. A carrier structure comprising: at least one conductor structure configured for electrically contacting electrical components, wherein the conductor structure comprises a plurality of conductor bodies, wherein at least some of the conductor bodies are in direct contact with electrically conductive first connectors, and wherein the conductor structure comprises the conductor bodies and the first connectors.

19. The carrier structure of claim 18, further comprising a plurality of insulating bodies, wherein at least some of the insulating bodies are in direct contact with electrically insulating second connectors, and wherein the insulating bodies, together with second connectors, form an electrically insulating base body of the carrier structure.

20. The carrier structure of claim 19, wherein the conductor bodies and/or the insulating bodies are spherical and are arranged at least in part in a densest possible sphere packing configuration or in a manner of a densest possible sphere packing configuration.

21. The carrier structure of claim 18, further comprising at least one cavity, in which electrical components are arrangeable.

22. The carrier structure of claim 18, further comprising gaps located between the conductor bodies are filled with the first connectors.

23. A method for producing a carrier structure, the method comprising: providing a base carrier; applying first spherical elements and second spherical elements, wherein each first spherical element has a conductor body and a first connector as a sheath, wherein each second spherical element has an insulating body and a second connector as a sheath, wherein each first spherical element is arranged adjacent to at least one further first spherical element, and wherein each second spherical element is arranged adjacent to at least one further second spherical element; and connecting the first spherical elements and the second spherical elements to the carrier structure, wherein the conductor bodies, together with the first connectors, form at least one conductor structure of the carrier structure, and wherein the insulating bodies, together with the second connectors, form at least one base body of the carrier structure.

24. The method of claim 23, wherein each first spherical element is arranged in direct contact with another first spherical element, and wherein each second spherical element is arranged in direct contact with another second spherical element.

25. The method of claim 23, further comprising completely filling gaps between the conductor bodies and/or the insulating bodies during connection of the spherical elements.

26. The method of claim 23, further comprising applying a first adhesive agent layer to the base carrier before applying the first spherical elements.

27. The method of claim 26, wherein n layers of spherical elements are applied to the base carrier, wherein, before an n-th layer of spherical elements is applied, an n-th adhesive agent layer is applied to an (n?1)-th layer of spherical elements, and wherein n is a natural number greater than 1.

28. A device comprising: a downtube and a sphere outlet, wherein the downtube has an inside diameter which is at most 1.9 times as large as a diameter of a spherical element, the spherical element being the first spherical element or the second spherical element; and a feed mechanism configured for feeding the spherical element from the downtube to the sphere outlet, wherein the device is configured for performing the method of claim 23.

29. The device of claim 28, wherein the feed mechanism has a blocking element between the downtube and the sphere outlet, wherein the blocking element is configured such that in a first state, it at least partially closes the downtube thereby making it impossible for the spherical element to be guided from the downtube to the sphere outlet, and in a second state, an interior of the downtube is free from the blocking element thereby enabling the spherical element to be guided through the downtube to the sphere outlet.

30. The device of claim 29, wherein the blocking element comprises: a rotatably mounted perforated disk, a bimetallic strip with a heating element, a piezoelectric element with a voltage source, or an expansion element with a heating element.

31. The device of claim 28, further comprising: an intermediate piece arranged between the downtube and the sphere outlet, wherein a main direction of an extent of the intermediate piece is transverse to a main direction of extent of the downtube, wherein a pulse generator is arranged at a first end of the intermediate piece, wherein the sphere outlet is arranged at a second end of the intermediate piece, the end being opposite the first end, wherein the downtube is arranged at a central opening between the first end and the second end of the intermediate piece, wherein the device is configured such that the downtube feeds the spherical element to the intermediate piece through the central opening, and wherein the spherical element is conveyable to the sphere outlet by the pulse generator.

32. The device of claim 31, wherein the pulse generator comprises a liquid container having a flexible diaphragm and a heating element, wherein the diaphragm is arranged at the first end of the intermediate piece, and wherein the pulse generator is configured to transmit a pulse to a spherical element in the intermediate piece via the diaphragm by heating a liquid in the liquid container.

33. The device of claim 31, wherein the pulse generator comprises a liquid container having a nozzle, a first heating element and a second heating element, wherein the nozzle is arranged at the first end of the intermediate piece, wherein the first heating element is configured to direct a liquid droplet through the nozzle into the intermediate piece, and wherein the second heating element is configured to vaporize the liquid droplet and to expand a forming gas bubble.

34. A printhead comprising: a plurality of devices, each device being the device of claim 28, wherein sphere outlets of the devices are arranged at nodes of a regular grid.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0060] In the drawings:

[0061] FIGS. 1A to 1E show schematic sectional views of various stages of one exemplary embodiment of a method for producing a carrier structure;

[0062] FIG. 2 shows a schematic sectional view of a carrier structure described here according to one exemplary embodiment;

[0063] FIGS. 3A and 3B show schematic sectional views of optional method steps of a method for producing a carrier structure according to further exemplary embodiments;

[0064] FIG. 4 shows a schematic sectional view of a carrier structure described here according to one exemplary embodiment, with an electrical component;

[0065] FIGS. 5A and 5B show schematic sectional views of first and second spherical elements which are used in a method described here;

[0066] FIGS. 6A to 7B show detail views of arrangements of spherical elements of the kind used in the method described here;

[0067] FIGS. 8A to 10C show schematic sectional views of a device for carrying out a method described here according to several exemplary embodiments; and

[0068] FIG. 11 shows a plan view of a printhead described here according to one exemplary embodiment.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

[0069] In the method according to the exemplary embodiment in FIGS. 1A to 1E, a base carrier 31 is prepared. An adhesive agent layer 321 is applied to the base carrier 31 (FIG. 1A). The base carrier 31 is formed by a ceramic, a silicone or Teflon, for example. The adhesive agent layer 321 comprises a flux, for example.

[0070] First spherical elements 16 and second spherical elements 17 are applied to the base carrier 31 by means of a printhead 200, which comprises a device 100 for applying the spherical elements 16, 17 (FIG. 1B). The first spherical elements 16 and the second spherical elements 17 are each of spherical design. In particular, the first and second spherical elements 16, 17 have the same diameter. The diameter is 30 ?m, for example.

[0071] Each first spherical element 16 has a conductor body 11 and a first connecting means 12 as a sheath for the conductor body 11, see also FIG. 5A. The conductor body 11 and the first connecting means 12 are formed by an electrically conductive material. The conductor body 11 is of spherical design, for example. The conductor body 11 has a diameter of 20 ?m, for example. The first connecting means 12 has a thickness of 5 ?m, for example, on the conductor body 11. The conductor body 11 comprises one of the following metals, for example: nickel, iron, tin, aluminum, tungsten. The first connecting means 12 is formed by tin, for example, or comprises a solder material containing tin, e.g. an SnCu solder.

[0072] The second spherical elements 17 are, for example, each formed by an insulating body 13 with a sheath consisting of the second connecting means 14 applied to the insulating body 13, see also FIG. 5B. The insulating body 13 is, for example, of spherical design and has a diameter of 20 ?m. The second connecting means 14 has a thickness on the insulating body of 5 ?m, for example. The insulating body 17 and the second connecting means 14 are formed by an electrically insulating material, for example. The insulating body 17 comprises, for example, a ceramic, such as Al.sub.2O.sub.3, AlN, SiC or a glass, such as SiO.sub.2 or a plastics material. The second connecting means 14 is formed by a thermoplastic or a thermoset, for example.

[0073] In the method step illustrated in FIG. 1B, the first spherical elements 16 and the second spherical elements 17 are applied to the base body 31 by means of the device 100. In this process, the printhead 200 moves over the base carrier 31 and places spherical elements 16, 17 at predetermined points. In this process, the first spherical elements 16 are arranged in such a way that each first spherical element 16 is arranged directly adjacent to a further spherical element 16. The second spherical elements 17 are arranged in such a way that each spherical element 17 is in direct contact with a further spherical element 17. The adhesive agent layer 321 is used to ensure that the spherical elements 16, 17 remain in their position on the base carrier 31.

[0074] In a further step of the method, a further layer of spherical elements 16, 17 is arranged on a first layer of spherical elements 16, 17 (FIG. 1C). A second adhesive agent layer 322 is arranged between the first layer of spherical elements 16, 17 and the second layer of spherical elements 16, 17. The second adhesive agent layer 322 prevents shifting of positions of the spherical elements 16, 17 in the second layer. The spherical elements 16, 17 are arranged in a densest possible sphere packing configuration or in the manner of a densest possible packing configuration.

[0075] FIG. 1D illustrates a stage of the method in which four layers of spherical elements 16, 17 have been applied to the base carrier 31. For this purpose, the step illustrated in FIG. 1C was repeated several times.

[0076] In a further step of the method, the spherical elements 16, 17 are connected to one another (FIG. 1E). Connection is accomplished, in particular, by melting the first and second connecting means 12, 14. In this process, the arrangement of the first and second spherical elements 16, 17 is, for example heated to a temperature of between 200? C. and 300? C., inclusive. For example, an epoxy adhesive as a second connecting means 14 can be combined with an SnCu solder as a first connecting means 12. The epoxy adhesive cures at 120?C, for example, and the SnCu solder melts at 250? ? C., for example. Connection then takes place at 250? C., for example. The epoxy adhesive then cures at 250? C., although 120? C. would be sufficient for curing.

[0077] The connection of the spherical elements 16, 17 produces a carrier structure 1. The carrier structure 1 comprises a conductor structure 2, which is formed by the conductor bodies 11 together with the first connecting means 12, and a base body 3, which is formed by the insulating bodies 13 together with the second connecting means 14. By means of the connection of the spherical elements 16, 17, cavities between the spherical elements 16, 17 are filled with the first and second connecting means 12, 14. In this process, gaps 15 are completely filled, for example, see also FIGS. 6A and 6B, or partially filled, see also FIGS. 7A and 7B. Owing to the filling of the gaps, the carrier structure 1 has a smaller volume than the arrangement of the first and second spherical elements 16, 17. A height of the arrangement consisting of the spherical elements 16, 17 above the base carrier 31 is reduced by 10% to 25%, for example.

[0078] In the exemplary embodiment of the carrier structure 1 according to FIG. 2, the conductor bodies 11 have been at least partially combined with the first connecting means 12 in order to increase a melting point of the carrier structure 1. For example, the melting point of the carrier structure 1 is increased to at least 500? C. In particular, the carrier structure 1 of FIG. 2 forms a lead frame.

[0079] The method stages in FIGS. 3A and 3B illustrate method steps which can be carried out on a carrier structure 1 according to FIG. 1E or 2. On the carrier structure 1 in FIG. 2, for example, further first and second spherical elements 16, 17 are arranged (FIG. 3A). The arrangement of the spherical elements takes place in a manner similar to that explained in connection with FIG. 1C. The spherical elements 16, 17 are arranged in such a way that a cavity 4 is formed. An electrical component 10 is arranged in the cavity 4. The electrical component 10 is, for example, an optoelectronic semiconductor chip for generating or detecting electromagnetic radiation, an integrated circuit, a resistor or a capacitor.

[0080] After the arrangement of the electronic component 10, the spherical elements 16, 17 that have been arranged on the carrier structure 1 in FIG. 2 are connected to one another (FIG. 3B). The conductor structures 2 and the base body 3 are thereby extended, and a carrier structure 1 is produced. The electrical component 10 is arranged in the cavity 4 in the carrier structure 1. On a side of the electrical component 10 facing the base carrier 31, said component has a first electrical contact surface 10a, which is connected in an electrically conductive manner to a conductor structure 2 of the carrier structure 1. Here, the first connecting means 12 serves as a solder material. Via the first and second connecting means 12, 14, the electrical component 10 is connected materially to the carrier structure 1.

[0081] In the exemplary embodiment of FIG. 4, the carrier structure 1 has a conductor structure 2 which extends completely through the base body 3 and which, in contrast to the carrier structure 1 in FIG. 3B, extends on a main side of the carrier structure 1, which main side faces away from the base carrier 31. This conductor structure 2 is connected in an electrically conductive manner to a second electrical contact surface 10b of the electrical component 10. In other respects, the statements made in relation to the carrier structure 1 in FIG. 3B apply analogously to the carrier structure in FIG. 4.

[0082] FIGS. 8A to 8C illustrate a device for carrying out the method according to a first exemplary embodiment and the mode of operation of said method. The device 100 comprises a downtube 101. A spherical element 16, 17 can be fed to a sphere outlet 102 through the downtube 101. Here, an inside diameter of the downtube 101 is at most 20% greater than a diameter of a spherical element 16, 17.

[0083] An intermediate piece 103 is arranged between the downtube 101 and the sphere outlet 102. A main direction of extent of the intermediate piece 103 is perpendicular to a main direction of extent of the downtube 101.

[0084] The sphere outlet 102 is arranged at a second end 105 of the intermediate piece 103. A pulse generator 130 is arranged at a first end 104 of the intermediate piece 103, which is situated opposite the second end 102. Via a central opening 106, which is arranged between the first end 104 and the second end 105, spherical elements 16, 17 are fed from the downtube 101 to the intermediate piece 103 during the operation of the device 100. In this process, the spherical elements 16, 17 are fed singly to the intermediate piece.

[0085] The pulse generator 130 has a liquid container 131 containing a liquid. A diaphragm 132 is arranged between the liquid container 131 and the first end 104. The pulse generator 130 furthermore comprises a heating element 133. The liquid container is preferably gastight, thus preventing any liquid from escaping from the liquid container.

[0086] During operation of the device 100 as intended, a spherical element 16, 17 passes from the downtube into the intermediate piece 103 (FIG. 8A).

[0087] The heating element 133 is configured to heat the liquid in the liquid container 131. As a result of the heating of the liquid in the liquid container 131, the liquid expands, and the flexible diaphragm 132 is stretched (FIG. 8B). Owing to the deformation of the diaphragm 132, a pulse is transmitted to the spherical element 16, 17 in the intermediate piece 103.

[0088] By means of the transmission of the pulse from the diaphragm 132 to the spherical element 16, 17, the spherical element 16, 17 in the intermediate piece 103 is guided to the sphere outlet 102 (FIG. 8C).

[0089] By heating the heating element 133, it is accordingly possible to place a spherical element 16, 17 at a desired point on the base carrier 31, see also FIG. 1B.

[0090] The device 100 according to FIGS. 9A to 9C differs from the device according to FIGS. 8A to 8C in that the pulse generator 130 comprises two heating elements 133, 134 and a nozzle 135. In operation as intended, the first heating element 133 heats a liquid in the liquid container 131, as a result of which a liquid droplet 136 passes through the nozzle 135 into the intermediate piece 103 (FIG. 9A).

[0091] A second heating element 134, situated opposite the nozzle 135, in the region of the first end 104 is configured to vaporize the liquid droplet 136. During this process, a gas bubble 137 forms (FIG. 9B).

[0092] As a result of further heating by means of the second heating element 134, the gas bubble 137 expands and transmits a pulse to a spherical element 16, 17, which is situated in the intermediate piece 103 (FIG. 9C). This pulse transmission guides the spherical element 16, 17 to the sphere outlet 102.

[0093] FIGS. 10A to 10C illustrate a device 100 which comprises a blocking element 120. The blocking element 120 is arranged partially in a downtube 101 and closes the downtube 101 at least partially toward the sphere outlet 102. The blocking element 120 comprises a bimetallic strip 122 with a first metal 122a and a second metal 122b. The first metal 122a and the second metal 122b differ in respect of their coefficient of thermal expansion. A heating element 123 is arranged on the second metal 122b.

[0094] In a first state of the blocking element 120, the bimetallic strip 122 closes the downtube at least partially toward the sphere outlet (FIG. 10A). In the first state, the bimetallic strip does not have any curvature or deformation, and is straight.

[0095] In a second state, the bimetallic strip is deformed and does not extend into the downtube 101 (FIG. 10B). The downtube 101 is thus free from the blocking element 120. In the second state, spherical elements 16, 17 can pass through the downtube and reach the sphere outlet 102. The deformation of the bimetallic strip is achieved, in particular, by heating of the heating element 123.

[0096] By cooling the bimetallic strip 122 it is possible to bring the bimetallic strip 122 back into the first state, whereby the downtube is once again blocked for spherical elements 16, 17 (FIG. 10C).

[0097] By heating with the heating element 123, it is thus possible to open and close the sphere outlet 102 selectively for spherical elements 16, 17. It is thus possible to place spherical elements 16, 17 in a targeted manner on the base carrier 31, see also FIG. 1B.

[0098] FIG. 11 illustrates a printhead 200 in a plan view of the base carrier 31 (not depicted in FIG. 11). The printhead 200 has a multiplicity of devices 100 according to FIGS. 8A to 8C. The sphere outlets 102 of the device 100 are arranged at the nodal points of a regular rectangular grid. The devices 100 can each be operated individually and independently of one another. By means of the printhead 200, it is possible to arrange a multiplicity of first and second spherical elements 16, 17 in parallel on the base carrier 31, see also FIG. 1C. Rapid and low cost production of a carrier structure 1 is thus possible.

[0099] The description with reference to the exemplary embodiments does not limit the invention to these embodiments. On the contrary, the invention includes any novel feature and combination of features, including, in particular, any combination of features in the patent claims, even if said feature or said combination is itself not specified explicitly in the patent claims or exemplary embodiments.