Method for Producing Optoelectronic Semiconductor Chips, and Optoelectronic Semiconductor Chip

Abstract

In an embodiment a method for producing optoelectronic semiconductor chips includes A) growing an AlInGaAsP semiconductor layer sequence on a growth substrate along a growth direction, wherein the semiconductor layer sequence includes an active zone for radiation generation, and wherein the active zone is composed of a plurality of alternating quantum well layers and barrier layers, B) generating a structured masking layer, C) regionally intermixing the quantum well layers and the barrier layers by applying an intermixing auxiliary through openings of the masking layer into the active zone in at least one intermixing region and D) singulating the semiconductor layer sequence into sub-regions for the semiconductor chips, wherein the barrier layers in A) are grown from [(Al.sub.xGa.sub.1-x).sub.yIn.sub.1-y].sub.zP.sub.1-z with x≥0.5, and wherein the quantum well layers are grown in A) from [(Al.sub.aGa.sub.1-a).sub.bIn.sub.1-b].sub.cP.sub.1-c with o<a≤0.2.

Claims

1.-16. (canceled)

17. A method for producing optoelectronic semiconductor chips, the method comprising: A) growing an AlInGaAsP semiconductor layer sequence on a growth substrate along a growth direction, wherein the semiconductor layer sequence comprises an active zone for radiation generation, and wherein the active zone is composed of a plurality of alternating quantum well layers and barrier layers; B) generating a structured masking layer; C) regionally intermixing the quantum well layers and the barrier layers by applying an intermixing auxiliary through openings of the masking layer into the active zone in at least one intermixing region; and D) singulating the semiconductor layer sequence into sub-regions for the semiconductor chips, wherein the barrier layers in A) are grown from [(Al.sub.xGa.sub.1-x).sub.yIn.sub.1-y].sub.zP.sub.1-z with x≥0.5, wherein the quantum well layers are grown in A) from [(Al.sub.aGa.sub.1-a).sub.bIn.sub.1-b].sub.cP.sub.1-c with 0<a≤0.2, and wherein the method is performed in the cited order.

18. The method according to claim 17, wherein the masking layer is formed by a p-contact layer of the semiconductor layer sequence, wherein the p-contact layer is completely penetrated by the openings in B), wherein the p-contact layer comprises Al.sub.vGa.sub.1-vAs with v≤0.35, wherein intermixing in C) is performed along the growth direction completely through the active zone, wherein singulating in D) occurs only in the at least one intermixing region, wherein 0.47≤y≤0.53 as well as 0.47≤z≤0.53, and wherein 0.47≤b≤0.53 as well as 0.47≤c≤0.53.

19. The method according to claim 18, wherein the active zone is located between a first semiconductor region and a second semiconductor region and the p-contact layer is a sub-layer of the second semiconductor region which is located furthest away from the active zone after A), and wherein the openings extend at least 50 nm through the p-contact layer in a direction towards the active zone into a remaining second semiconductor region and terminate at a distance of at least 200 nm from the active zone.

20. The method according to claim 17, wherein the finished semiconductor chips are light-emitting diode chips, and wherein in D) each sub-region for the semiconductor chips comprises an average edge length of at most 100 μm.

21. The method according to claim 17, wherein, after D), the at least one intermixing region extends in a direction perpendicular to the growth direction at least 0.1 μm and at most 0.5 μm into the active zone.

22. The method according to claim 17, wherein the at least one intermixing region extends parallel to the growth direction completely through the semiconductor layer sequence.

23. The method according to claim 17, wherein between 3 and 30, inclusive, of the quantum well layers are present after A), wherein each quantum well layer comprises a thickness between 2 nm and 15 nm, inclusive, wherein each barrier layer comprises a thickness between 3 nm and 25 nm, inclusive, and wherein an emission wavelength of maximum intensity of the active zone is between 590 nm and 655 nm, inclusive.

24. The method according to claim 17, wherein, after A) and before C), at least some of the barrier layers comprise different aluminum contents, wherein, after A) and before C) within the respective barrier layer, the respective aluminum content is constant, and wherein a minimum and a maximum aluminum content of the barrier layers in the active zone differ by at least a factor of 1.1 and by at most a factor of 1.7.

25. The method according to claim 17, wherein at least some of the barrier layers comprise different thicknesses, and wherein a minimum thickness and a maximum thickness of the barrier layers in the active zone differ by at least a factor 1.5 and by at most a factor 6.

26. The method according to claim 17, wherein the quantum well layers after A) and before C) are the same, and wherein the barrier layers in the active zone are arranged asymmetrically with respect to a thickness variation and/or an aluminum content variation at least after A) until before C).

27. The method according to claim 17, wherein the intermixing auxiliary is zinc.

28. The method according to claim 27, wherein the intermixing auxiliary is applied in C) by a vapor phase deposition in form of diethylzinc and/or dimethylzinc.

29. The method according to claim 17, further comprising, after D), in E), applying a passivation layer to a cut through intermixing regions.

30. The method according to claim 17, further comprising removing the growth substrate after C).

31. An optoelectronic semiconductor chip comprising: an AlInGaAsP semiconductor layer sequence, wherein the semiconductor layer sequence comprises an active zone configured to generate radiation, the active zone being composed of a plurality of alternating quantum well layers and barrier layers, wherein the semiconductor layer sequence comprises a structured masking layer, wherein the quantum well layers and the barrier layers are regionally intermixed in the active zone in an intermixing region and an intermixing auxiliary is present in the intermixing region, and wherein the barrier layers outside the intermixing region comprise [(Al.sub.xGa.sub.1-x).sub.yIn.sub.1-y].sub.zP.sub.1-z with x≥0.5, and the quantum well layers outside the intermixing region comprise [(Al.sub.aGa.sub.1-a).sub.bIn.sub.1-b].sub.cP.sub.1-c with 0<a≤0.2.

32. The optoelectronic semiconductor chip according to claim 31, wherein the optoelectronic semiconductor chip is a light emitting diode chip with an emission wavelength of maximum intensity between 560 nm and 670 nm, inclusive, with an average edge length of at most 50 μm, and wherein the intermixing region extends in a direction perpendicular to a growth direction of the semiconductor layer sequence at least 0.1 μm and at most 0.5 μm into the active zone.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In the following, a method described herein and an optoelectronic semiconductor chip described herein are explained in more detail with reference to the drawing by means of exemplary embodiments. Identical reference signs specify identical elements in the individual figures. However, no scale references are shown, rather individual elements may be shown exaggeratedly large for better understanding.

[0057] FIGS. 1-5 show schematic sectional views of method steps of an exemplary embodiment of a production process for optoelectronic semiconductor chips described herein;

[0058] FIGS. 6 and 7 show schematic sectional views of method steps of an exemplary embodiment of a production process described herein for optoelectronic semiconductor chips described herein;

[0059] FIG. 8 shows a schematic sectional view of a method step of an exemplary embodiment of a production process for optoelectronic semiconductor chips described herein;

[0060] FIG. 9 shows a schematic top view of a method step of an exemplary embodiment of a production process for optoelectronic semiconductor chips described here;

[0061] FIG. 10 shows a schematic illustration of a progression of an aluminum content in a modification of a semiconductor chip; and

[0062] FIGS. 11-14 show schematic illustrations of aluminum gradients for exemplary embodiments of optoelectronic semiconductor chip described herein.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

[0063] FIGS. 1 to 5 illustrate an exemplary embodiment of a production process for optoelectronic semiconductor chips 1. According to FIG. 1, a semiconductor layer sequence 3 is epitaxially grown along a growth direction G on a growth substrate 2.

[0064] The semiconductor layer sequence 3 comprises a first semiconductor region 31, for example an n-doped region, directly on the growth substrate 2. In the figures, the first semiconductor region 31 is drawn as only one layer in each case. Deviating from this, the first semiconductor region 31 may be composed of several sub-layers. In particular, the first semiconductor region 31 towards the growth substrate 2 comprises an undrawn buffer layer and/or an undrawn n-contact layer.

[0065] In the direction away from the growth substrate 2, the first semiconductor region 31 is followed by an active zone 33 for generating radiation. The active zone 33 includes a plurality of quantum well layers 61 and barrier layers 62 arranged alternately. In particular, orange or red light is generated in the active zone 33 during operation of the finished semiconductor chips 1.

[0066] Along the growth direction G, the active zone 33 is followed by a second semiconductor region 32. The second semiconductor region 32 is, for example, p-doped. As the uppermost layer farthest from the growth substrate 2, the second semiconductor region 32 comprises a p-contact layer 34. Thus, a remaining second semiconductor region 35 is located between the p-contact layer 34 and the active zone 33.

[0067] The semiconductor layer sequence 3 is based on the material system AlGaInAsP. Thereby, the quantum well layers are preferably made of [(Al.sub.aGa.sub.1-a).sub.bIn.sub.1-b].sub.cP.sub.1-c with 0.1≤a≤0.3, depending on the wavelength to be generated. The barrier layers are composed of [(Al.sub.xGa.sub.1-x).sub.yIn.sub.1-y].sub.zP.sub.1-z with x≥0.6, in particular x≥0.8. Thus, the barrier layers comprise a relatively high aluminum content x. In particular, the p-contact layer 34 is made of Al.sub.vGa.sub.1-vAs with v≤0.2. For the parameters b, c, y and z, it is particularly that these parameters are around 0.5, specifically at 0.51 and 0.49, respectively. For example, the active zone 33 comprises between and including 5 and 15 of the quantum well layers 62.

[0068] In the method step of FIG. 2, it is shown that a plurality of openings 50 are created through the p-contact layer 34. The openings 50 extend into the remaining second semiconductor region 35. For example, a depth of the openings 50 is between 50 nm and 200 nm, inclusive. A distance between the openings 50 and the active zone 33 is preferably at least 300 nm. The remaining second semiconductor region 35 comprises, for example, a thickness between 300 nm and 600 nm, inclusive. A thickness of the p-contact layer 34 is, for example, between 5 nm and 20 nm, inclusive.

[0069] Thus, the p-contact layer 34 simultaneously serves as a masking layer 5 for a subsequent process step, see FIG. 3. Optionally, in the steps of FIGS. 2 and 3, a further masking layer, for example a photoresist layer, which is not shown, is applied next to the openings on the p-contact layer 34. However, such a further masking layer, with which the openings 50 are created in the p-contact layer 34, can also be removed before the method step of FIG. 3.

[0070] In FIG. 3, it is illustrated that a gaseous precursor 56 is introduced to the semiconductor layer sequence 3. The precursor 56 is, for example, DMZn or DEZn. Thus, zinc is provided via the precursor 56 as an intermixing auxiliary 55. As an alternative to providing it from the gas phase, a solid layer for the intermixing auxiliary 55 can also be deposited, for example a zinc layer a few nm thick.

[0071] Preferably at an elevated temperature of, for example, about 550° C., the intermixing auxiliary 55 diffuses into the semiconductor layer sequence 3. In this case, the AlGaAs p-contact layer 34 is nontransmissive to the intermixing auxiliary 55.

[0072] Thus, intermixing regions 51 in which the intermixing auxiliary 55 is present are formed at the openings 50, respectively. In the intermixing regions 51, intermixing of the materials of the barrier layers 62 and the quantum well layers 61 occurs. This is illustrated further below in connection with FIGS. 11 to 14.

[0073] The intermixing regions 51 extend, for example, to at least 0.2 μm or 0.5 μm below the p-contact layer 34. The same may apply to all other exemplary embodiments.

[0074] In the method step shown in FIG. 4, it is illustrated that the semiconductor layer sequence 3 is separated in the region of the openings 50 to form sub-regions 39 for the semiconductor chips 1. This singulation is carried out, for example, by means of etching. Thus, singulation trenches 8 are formed between the sub-regions 39. Deviating from the illustration in FIG. 4, the singulation trenches 8 can also extend into the growth substrate 2. An edge length of the sub-regions 39, seen in top view, is preferably small and lies below 100 μm or 50 μm.

[0075] The singulation trenches 8 are each located in the region of the intermixing regions 51. The singulation trenches 8 result in sidewalls of the semiconductor layer sequence 3 which, according to FIG. 4, are each formed only partially by the intermixing regions 51. In the direction towards the growth substrate 2, the intermixing regions 51 start at a side of the p-contact layer 34 facing the active zone 33. Preferably, the intermixing regions 51 extend under the p-contact layer 34 as drawn.

[0076] Also illustrated in FIG. 4 is that a plurality of second electrodes 42 are applied to the p-contact layer 34 as well as that a passivation layer 7 is formed. Masking layers for generating the second electrode 42 and/or for generating the passivation layer 7 are not drawn.

[0077] In FIG. 5, it is further illustrated as an option that the growth substrate is removed from the sub-regions. A first electrode 41 is attached to the first semiconductor region 31. The passivation layer 7 is largely removed from the second electrode 42. Thus, the semiconductor chip 1 is preferably a light emitting diode chip for generating red light.

[0078] The electrodes 41, 42 are only schematically indicated in FIG. 5. The electrodes 41, 42, which comprise at least a metal and/or a transparent conductive oxide, are designed, for example, as described in FIG. 3 and in paragraphs 59 to 62 of the document US 2012/0248494 A1. The disclosure content of this document, in particular FIG. 3 and paragraphs 59 to 62, is incorporated by reference.

[0079] FIGS. 6 and 7 show a further production process, wherein only some method steps are illustrated. The remaining method steps can be carried out in the same way as in FIGS. 1 to 5.

[0080] According to FIG. 6, the intermixing auxiliary 55 is applied through the openings 5o and the intermixing regions 51 are created. Thereby, a separate masking layer 5, which is not a sub-layer of the semiconductor layer sequence 3, is used. For example, the masking layer 5 is a hard mask, for example of silicon nitride or of silicon dioxide. With this, the intermixing regions 51 may extend to the masking layer 5.

[0081] Furthermore, it is shown in FIG. 6 that the intermixing regions 51 completely penetrate the semiconductor layer sequence 3 and thus extend to the growth substrate 2. A corresponding design of the intermixing regions 51 is also possible in the method of FIGS. 1 to 5.

[0082] According to FIG. 7, the singulation trenches 8 are created which extend at least as far as the growth substrate 2. Thus, sidewalls of the semiconductor layer sequence 3 and thus of the singulation trenches 8 can be completely formed by the intermixing regions 51 in regions below the masking layer 5.

[0083] It is possible that the masking layer 5 also serves as a mask for creating the singulation trenches 8. That is, the singulation trenches 8 and the openings 5o may extend congruently with one another as seen in top view, in deviation from the illustration in FIGS. 1 to 5. Corresponding singulation trenches 8 may alternatively also be used in the method as illustrated in connection with FIGS. 1 to 5.

[0084] In the method of FIG. 8, it is illustrated that again the p-contact layer 34 serves as masking layer 5. In this case, too, the singulation trenches 8 and the openings 50 are arranged congruently as seen in top view. However, it is not absolutely necessary that the intermixing regions 51 affected by singulation still extend to the growth substrate 2 after singulation. For example, the intermixing regions 51 extend only into regions up to the growth substrate 2 that are subsequently removed by the singulation. A corresponding arrangement is also possible in the methods of FIGS. 1 to 5 and FIGS. 6 and 7.

[0085] In FIG. 9, a schematic top view of the semiconductor layer sequence 3 after singulation is shown, in particular as shown in the methods of FIGS. 6 and 7 as well as in the method of FIG. 8. That is, the singulation trenches 8 and the openings 50 run congruently. A corresponding structure with singulation trenches 8 narrower than the openings 50 can be used in the same way.

[0086] The intermixing regions 51 each run all around the sub-regions 39 of the semiconductor layer sequence 3 in a closed path. The sub-regions 39 for the semiconductor chips 1 are each approximately square or also rectangular in shape. Edge lengths of the sub-regions 39 are below 100 μm. A distance between adjacent sub-regions 39 and thus a width of the openings 50 and the singulation trenches 8 is preferably relatively small and is, for example, at most 10% or 5% or 2% of an average edge length of the sub-regions 39. In particular, the openings 50 and/or the singulation trenches 8 have a width of at most 5 μm or 3 μm or 1 μm and/or of at least 0.5 μm or 1 μm. In other words, the sub-regions 39 are arranged densely packed on the growth substrate 2, so that for diffusion of the intermixing auxiliary 55 comparatively little space remains.

[0087] In FIG. 10 an illustration of a modification 10 of a semiconductor chip is shown. A ratio of an aluminum content to a sum of the aluminum content and a gallium content, specified as a percentage, is plotted over the growth direction G. The left-hand part of the figure refers to a semiconductor chip. The left part of the figure refers to a non-mixed region 52 of the active zone 33, whereas the right part of the figure refers to the intermixing region 51 of the active zone 33. The same illustration is also used in FIGS. 11 to 14.

[0088] The barrier layers 62 comprise a relatively low aluminum content. This results in a comparatively flat course of the aluminum content in the intermixing regions 51 after intermixing and thus a comparatively small increase in a band gap compared to the quantum well layers 61. This makes it relatively difficult to reduce recombination losses of charge carriers at the sidewalls of the sub-regions 39 and thus of the semiconductor chips 1. In conventional LEDs, such edge effects hardly play a role, since an edge line plays only a minor role relative to the total area of an active zone. In the μLEDs described herein, on the other hand, due to the small edge length of the sub-region 39, corresponding effects on the sidewalls are a potentially significant loss channel.

[0089] In FIG. 11 an illustration of the aluminum content for an exemplary embodiment of semiconductor chip 1 is shown. The barrier layers 62 comprise a significantly higher aluminum content of about 85% than in FIG. 10. This results in a significantly higher bandgap in the intermixing region 51 between the quantum well layers 61 in the unmixed region 52 and the intermixed structure in the intermixing region 51.

[0090] According to FIG. 11, all quantum well layers 51 and barrier layers 62 have the same growth and are thus present unchanged along the growth direction G in the immiscible region 52. In contrast, the barrier layers 62 according to FIGS. 12 to 14 each comprise at least one gradient with respect to thickness and/or material composition.

[0091] Thus, according to FIG. 12, the barrier layers 62 are designed along the growth direction G with a decreasing aluminum content. According to FIG. 13, the aluminum content of the barrier layers 62 is constant along the growth direction G, but a thickness of the barrier layers 62 decreases. FIG. 14 is a combination of the designs of FIGS. 12 and 13, such that along the growth direction G both the aluminum content decreases and a thickness of the barrier layers decreases.

[0092] In each of FIGS. 11 to 14, five quantum well layers 61 are shown only for simplicity of illustration. In each case, more or less than the quantum well layers shown may be present in the active zone 33.

[0093] The barrier layers 62 of FIGS. 12 to 14 are arranged asymmetrically in the active zone 33, so that the active zone 33 does not comprise a plane of symmetry with respect to which the barrier layers 62 are mirror-symmetrically configured. Alternatively, symmetrical sequences of barrier layers 62 are also possible, so that, for example, analogous to FIG. 12, an aluminum content of the barrier layers 62 first increases along the growth direction G and then decreases to the same extent. The same applies to embodiments according to FIGS. 13 and 14.

[0094] Likewise, in deviation from the illustration of FIGS. 12 to 14, it is possible in each case for the growth direction G to run from right to left rather than from left to right. Furthermore, asymmetrical combinations of increasing and decreasing aluminum content and increasing and decreasing layer thickness and corresponding combinations thereof are possible in each case. This means that asymmetrically distributed barrier layers 62 with first increasing and then decreasing aluminum content or with first decreasing and then increasing aluminum content, as seen along the growth direction G, can be present. The same applies with regard to the thicknesses, compare FIG. 13, or for the combination of thickness variation and aluminum content variation, compare FIG. 14.

[0095] The components shown in the figures preferably follow each other directly in the sequence indicated, unless otherwise indicated. Layers not touching in the figures are preferably spaced apart. Insofar as lines are drawn parallel to one another, the corresponding surfaces are preferably likewise aligned parallel to one another. Likewise, the relative positions of the drawn components to each other are correctly reproduced in the figures, unless otherwise indicated.

[0096] The invention described herein is not limited by the description based on the exemplary embodiments. Rather, the invention encompasses any new feature as well as any combination of features, which particularly includes any combination of features in the patent claims, even if that feature or combination itself is not explicitly specified in the patent claims or exemplary embodiments.