METHOD AND APPARATUS FOR POSITIONING HEATING ELEMENTS

Abstract

An underlayment system is provided that includes a plurality of bosses that emanate form a common base member. The bosses and bases preferably include an opening therethrough that will allow for subsequent layers of adhesive to interact and bond to each other. The bosses are also spaced in such a way to help secure a wire snugly therebetween.

Claims

1-20. (canceled)

21. An underlayment that is adapted to receive and secure at least one heating element of a radiant heating assembly, the underlayment comprising: a base; and a plurality of bosses extending from the base, wherein the plurality of bosses are configured in an array, and wherein each boss of the plurality of bosses comprises: an inner wall extending from the base; an outer wall extending from the base and surrounding the inner wall; and an upper surface extending between the outer wall and the inner wall at a height above the base so as to form a hollow volume between the inner wall and the outer wall, wherein the upper surface comprises a hole that exposes the hollow volume.

22. The underlayment of claim 21, wherein the upper surface comprises a plurality of holes that expose the hollow volume.

23. The underlayment of claim 21, wherein the outer wall is curved in a vertical plane.

24. The underlayment of claim 23, wherein the outer wall comprises an outer diameter.

25. The underlayment of claim 21, wherein the base and the plurality of bosses are formed of polypropylene.

26. The underlayment of claim 25, wherein the base and the plurality of bosses are molded.

27. The underlayment of claim 21, wherein the hole allows water to flow through the underlayment.

28. The underlayment of claim 21, wherein the upper surface of each of the plurality of bosses is substantially parallel with the base and separated from the base by a height substantially corresponding to a height of the inner wall and a height of the outer wall.

29. The underlayment of claim 28, wherein the height of the inner wall is substantially equal to the height of the outer wall.

30. The underlayment of claim 21, wherein the hole allows an adhesive to pass between a top of the upper surface and the hollow volume.

31. The underlayment of claim 21, wherein the hollow volume is substantially ring shaped.

32. An flooring system, comprising: an underlayment, comprising: a base; and a plurality of bosses extending from the base, wherein the plurality of bosses are configured in an array, and wherein each boss of the plurality of bosses comprises: an inner wall extending from the base; an outer wall extending from the base and surrounding the inner wall; an upper surface extending between the outer wall and the inner wall at a height above the base so as to form a hollow volume between the inner wall and the outer wall; and an opening that provides a pathway to the hollow volume through the upper surface; and an adhesive that at least partially fills the hollow volume, wherein the opening facilitates a curing of the adhesive that at least partially fills the hollow volume.

33. The flooring system of claim 32, wherein the upper surface comprises a plurality of openings that expose the hollow volume and facilitate the curing of the adhesive that at least partially fills the hollow volume.

34. The flooring system of claim 32, further comprising a heating element in contact with the outer wall.

35. The flooring system of claim 32, further comprising an anti-fracture membrane in contact with a bottom side of the base.

36. The flooring system of claim 32, wherein the outer wall is curved in a vertical plane and comprises an outer diameter.

37. The flooring system of claim 32, wherein the upper surface of each of the plurality of bosses is substantially parallel with the base and separated from the base by a height substantially corresponding to a height of the inner wall and a height of the outer wall.

38. The flooring system of claim 32, wherein the hollow volume is substantially ring shaped.

39. A flooring system, comprising: an underlayment, comprising: a base; and a plurality of bosses extending from the base, wherein the plurality of bosses are configured in an array, and wherein each boss of the plurality of bosses comprises: an inner wall extending from the base; an outer wall extending from the base and surrounding the inner wall; and an upper surface extending between the outer wall and the inner wall at a height above the base so as to form a hollow enclosure between the inner wall and the outer wall, wherein the upper surface comprises a hole that exposes the hollow enclosure; and an anti-fracture membrane adjacent to a bottom surface of the base.

40. The flooring system of claim 39, wherein the anti-fracture membrane is formed of a woven substrate and wherein the underlayment is formed of a polymer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and together with the general description of the invention given above and the detailed description of the drawings given below, serve to explain the principles of these inventions.

[0021] FIG. 1 is a perspective view of an underlayment layer of one embodiment of the present invention;

[0022] FIG. 2 is a top plan view of FIG. 1;

[0023] FIG. 3 is a partial top plan view of FIG. 2 showing wires positioned between adjacent bosses;

[0024] FIG. 4 is a front elevation view of FIG. 3;

[0025] FIG. 5 is a partial cross-sectional view of FIG. 2;

[0026] FIG. 6 is a partial cross-sectional view of a flooring system of one embodiment of the present invention;

[0027] FIG. 7 is a top plan view of a boss and base of another embodiment of the present invention;

[0028] FIG. 8 is a top plan view of a boss and base of another embodiment of the present invention;

[0029] FIG. 9 is a cross-sectional view of a boss and base of another embodiment of the present invention; and

[0030] FIG. 10 is a front elevation view of FIG. 9 subsequent to forming thereof.

[0031] To assist in the understanding of the present invention the following list of components and associated numbering found in the drawings is provided herein:

TABLE-US-00001 # Components 2 Underlayment layer 6 Base 10 Boss 14 Outer surface 18 Inner surface 22 Upper surface 26 Hole 30 Outer diameter 34 Inner diameter 38 Opening 42 Opening 46 Wire 50 Flooring system 54 Sub floor 56 Adhesive 58 Channel 60 Anti-fracture membrane 62 Adhesive 66 Flooring member 70 Grout 74 Wall 78 Lip

[0032] It should be understood that the drawings are not necessarily to scale. In certain instances, details that are not necessary for an understanding of the invention or that render other details difficult to perceive may have been omitted. It should be understood, of course, that the invention is not necessarily limited to the particular embodiments illustrated herein.

DETAILED DESCRIPTION

[0033] Referring now to FIGS. 1-5, an underlayment layer 2 of one embodiment of the present invention is shown that includes a system of interconnected bases 6 and bosses 10. That is, preferably, each base 6 includes a boss 10 extending therefrom. Each boss 10 includes an outer surface 14 and an inner surface 18 and an upper surface 22. In some embodiments the upper surface 22 includes a plurality of holes 26. The bases 6 are generally circular and the bosses 10 are generally cylindrical. The bases 6 also include an outer diameter 30 and inner diameter 34. Again, a plurality of base/boss combinations are interconnected to form the underlayment layer 2.

[0034] The bosses 10 of one embodiment of the present invention are between about 1/16 inches wide. The spacing between individual bosses 10 is between about 1 inch to 1.5 inches. One skilled in the art, however, will appreciate that the boss sizes and spacing therebetween may be altered to accommodate different sizes of heating elements. That is, the concepts as shown herein may be freely scalable to accommodate any heating element. The bosses of some embodiments of the present invention extend at least about 3/16 inches from the base. The boss/base combinations are interconnected and include an opening 38 therebetween to help to facilitate bonding and curing of adhesives positioned above and below the underlayment layer 2. The bases may also include an opening 42 position within the inner surface 18 of each boss 10 to facilitate adhesive bonding as well.

[0035] Referring now specifically to FIGS. 3-5, the interaction between a wire 46, i.e. a heating element and the bosses 10 is shown. Here, the bosses 10 possess a frustoconical or semispherical outer surface, wherein the diameter of a lower portion of the outer surface 14 is less than the diameter of the upper portion thereof. In some embodiments of the present invention the lower diameter is about ? inches. This configuration allows for the wire 46 to fit snugly between adjacent bosses 10. The wire 46 may be slid between the bosses 10 parallel to the base 6. Preferably, however, the wire 46 is forced downwardly between two bosses 10.

[0036] Preferably, the bases 6 and bosses 10 are made of fiber polyethylene, polystyrene or polypropylene and are blow molded, thermally extruded, vacuum and/or pressure formed, and thermally molded. The bosses 10 are of such a material not to deform a temperatures as high as 104 degrees F. and preferably withstand temperatures of about 120 degrees F.

[0037] Referring now specifically to FIG. 5, a cross sectional view of a plurality of bosses 10 is shown. Here, the bosses 10 are hollow or at least partially hollow to allow a volume of air to reside therein. The air helps maintain the temperature of the floor as air is an excellent insulator to heat. One of skill in the art will appreciate that the bosses may be filled with any heat conducting or heat insulating material without departing from the scope of the invention. Some embodiments of the present invention include an upper surface 22 having a plurality of holes that provide an entrance into the internal volume of the boss 10. The boss 10 may also include a plurality of holes in the bottom portion thereof to allow for adhesive to communicate through the body of the boss 10.

[0038] Referring now to FIG. 6, a cross-sectional view of a flooring system 50 of one embodiment of the present invention is shown. In one embodiment of the present invention, a sub floor 54, for example, plywood, is present with an adhesive 56 applied thereon. The adhesive as used herein includes thin set or modified thin set, where thin set is capable of curing in the absence of oxygen or air and modified thin set is incapable of curing in the absence of oxygen or air (e.g., due to the inclusion of polymers in a modified thin set).

[0039] The underlayment layer 2 is placed on top of the adhesive 56 and firmly secured thereto, preferably via an anti-fracture membrane 60. More specifically, embodiments of the present invention contemplate providing an anti-fracture membrane (or similar type of membrane or material) in the form of a woven substrate or layer that is removably attached to the underside of the underlayment layer 2 (perhaps by an adhesive or by a lamination-type process whereby the underlayment layer 2 is heated up and the anti-fracture member 60 is pressed there against to create a physical bond between the anti-fracture membrane 60 and the underlayment layer 2).

[0040] Some embodiments of the present invention include an underlayment layer 2 with a roughened bottom surface that allows for the adhesive to securely adhere thereto. Other embodiments include an integrated or otherwise associated wire, woven, or plastic mesh, preferably in the form of the anti-fracture membrane 60, to help facilitate the bond between the adhesive 56 and the underlayment layer 2. Although an anti-fracture membrane 60 is described herein as a layer of wire, woven, and/or plastic mesh, one skilled in the art will appreciate that the anti-fracture membrane 60 may include any type of material or combination of materials in any type of format that is capable of facilitating a physical connection between the underlayment layer 2 and the adhesive 56 and/or isolating cracks in the sub floor by displacing mechanical stresses across a broader area of the underlayment layer 2.

[0041] A plurality of wires 46 or one wire 46 laid in a serpentine path is placed within the channels 58 between bosses 10. Although one wire 46 is shown positioned between the bosses 10, one skilled in the art will appreciate that a single wire may be placed between bosses 10 in a zig-zag or serpentine configuration. Alternatively, a plurality of wires may be placed on the underlayment layer 2 in a preferred configuration, usually depending upon the desired heating.

[0042] After the wires 46 are placed in the predetermined location, another layer of adhesive 62 is applied atop the underlayment layer 2. The second adhesive 62 layer will necessarily fill the spaces between the bosses 10 and will fill the internal space of each boss 10 and interact with the first layer of adhesive 58 to form a cohesive structure. The second adhesive layer 62 may reside over the top surface 22 of the bosses 10 as well or may be flush with the bosses 10. Adhesive 62 is associated with a plurality of flooring members 66, such as tile, stone, brick, pavers, slate, concrete, or wood with grout 70 positioned therebetween.

[0043] Referring now to FIG. 7, a plan view of another embodiment of a boss/base is shown. Here, the boss does not have a smooth outer surface 14 but one that is faceted to engage the wires. The faceted outer surface has the advantage of being easier to mold. Other advantages include crack isolation and/or a more secure retention of heating elements.

[0044] Referring now to FIG. 8, another embodiment of the invention is shown that employs a boss 10 generally without an upper surface. This boss 10 is simply an outer wall 74 that engages the wires. The boss may have an opening 42 therethrough to facilitate interaction between subsequent layers of adhesive.

[0045] Referring now to FIGS. 9 and 10, yet another embodiment of the present invention is shown that includes a lip 78. More specifically, these bosses 10 are similar to those shown in FIGS. 1-6 that include openings 42 in the base 6 and the upper surface 22 of the boss 10. As can be appreciated, the outer surface 14 of the boss 10 has a frustoconical or semispherical shape. The lip 78 is associated with the upper surface 22 of the boss and extends upwardly therefrom. Subsequently to forming the boss, the lip 78 is made to protrude gradually from the upper surface 22. The lip 78 is preferably selectively deflectable to help facilitate insertion of a wire 46 between adjacent bosses. The lip 78 then helps maintain the wire 46 between adjacent bosses 10. One skilled in the art will appreciate that the lip 78 may be replaced by at least one tab positioned between adjacent bosses without departing from the scope o the invention.

[0046] While various embodiments of the present invention have been described in detail, it is apparent that modifications and alterations of those embodiments will occur to those skilled in the art. However, it is to be expressly understood that such modifications and alterations are within the scope and spirit of the present invention, as set forth in the following claims.