ENCAPSULATION FILM

Abstract

The present application relates to an encapsulating film, a reliability assessment therefor, an organic electronic apparatus comprising the encapsulating film, and a method for producing an organic electronic apparatus which has used the encapsulating film, and provides: a reliability assessment method which can predict the reliability of the encapsulating film before same is applied to the organic electronic apparatus, the encapsulating film blocking moisture or oxygen from the outside entering the organic electronic apparatus; and the encapsulating film which can block moisture with high reliability.

Claims

1. A reliability evaluation method of an encapsulation film comprising a metal layer, and an encapsulation layer formed on the metal layer and comprising a moisture adsorbent, wherein the encapsulation film has a specular reflectance R, according to Equation 1 below to the encapsulation layer at a wavelength of 550 nm, of 6.5 or less:
R=SCI?SCE(Equation 1) wherein the Equation 1, SCI is a total reflectance including normal reflection measured according to ASTM E1164-12E1, and SCE is a reflectance excluding normal reflection measured according to ASTM E1164-12E1.

2. The reliability evaluation method according to claim 1, wherein the encapsulation layer has a thickness in a range of 15 ?m to 70 ?m.

3. The reliability evaluation method according to claim 1, wherein the metal layer has a thickness in a range of 20 ?m to 150 ?m.

4. The reliability evaluation method according to claim 1, wherein the encapsulation layer comprises an encapsulation resin, and said encapsulation resin comprises an acrylic resin, an epoxy resin, a silicone resin, a fluorine resin, a styrene resin, a polyolefin resin, a thermoplastic elastomer, a polyoxyalkylene resin, a polyester resin, a polyvinyl chloride resin, a polycarbonate resin, a polyphenylene sulfide resin, a polyamide resin or a mixture thereof.

5. The reliability evaluation method according to claim 4, wherein the encapsulation resin has a refractive index in a range of 1.3 to 1.6.

6. The reliability evaluation method according to claim 1, wherein the moisture adsorbent is a moisture-reactive adsorbent.

7. The reliability evaluation method according to claim 1, wherein the moisture adsorbent has an average diameter in a range of 0.5 ?m to 5 ?m.

8. The reliability evaluation method according to claim 1, wherein the moisture adsorbent has a refractive index in a range of 1.6 to 2.5.

9. The reliability evaluation method according to claim 4, wherein the moisture adsorbent is comprised in an amount of 5 to 100 parts by weight, relative to 100 parts by weight of the encapsulation resin.

10. The reliability evaluation method according to claim 1, wherein the moisture adsorbent is one or more selected from the group consisting of P.sub.2O.sub.5, Li.sub.2O, Na.sub.2O, BaO, CaO, MgO, Li.sub.2SO.sub.4, Na.sub.2SO.sub.4, CaSO.sub.4, MgSO.sub.4, CoSO.sub.4, Ga.sub.2(SO.sub.4).sub.3, Ti(SO.sub.4).sub.2, NiSO.sub.4, CaCl.sub.2, MgCl.sub.2, SrCl.sub.2, YCl.sub.3, CuCl.sub.2, CsF, TaF.sub.5, NbF.sub.5, LiBr, CaBr.sub.2, CeBr.sub.3, SeBr.sub.4, VBr.sub.3, MgBr.sub.2, BaI.sub.2, MgI.sub.2, Ba(ClO.sub.4).sub.2 and Mg(ClO.sub.4).sub.2.

11. The reliability evaluation method according to claim 1, wherein the metal layer has a total reflectance SCI including normal reflection measured according to ASTM E1164-12E1 in a range of 50% to 80%.

12. The reliability evaluation method according to claim 1, wherein the metal layer has a reflectance SCE excluding normal reflection measured according to ASTM E1164-12E1 in a range of 5% to 35%.

13. The reliability evaluation method according to claim 1, wherein the metal layer comprises any one of a metal, a metal oxide, a metal nitride, a metal carbide, a metal oxynitride, a metal oxyboride, and a combination thereof.

14. The reliability evaluation method according to claim 1, wherein the metal layer comprises any one of aluminum, copper, nickel, silicon oxide, aluminum oxide, titanium oxide, indium oxide, tin oxide, indium tin oxide, tantalum oxide, zirconium oxide, niobium oxide, and a combination thereof.

15. An encapsulation film comprising a metal layer, and an encapsulation layer formed on said metal layer and comprising a moisture adsorbent, and having a specular reflectance R, according to Equation 1 below to the encapsulation layer formed on said metal layer at a wavelength of 550 nm, of 6.5 or less:
R=SCI?SCE(Equation 1) wherein the Equation 1, SCI is a total reflectance including normal reflection measured according to ASTM E1164-12E1, and SCE is a reflectance excluding normal reflection measured according to ASTM E1164-12E1.

16. An organic electronic device comprising a substrate; an organic electronic element formed on the substrate; and the encapsulation film according to claim 15 for encapsulating said organic electronic element.

17. A method of manufacturing an organic electronic device comprising steps of applying the encapsulation film according to claim 15 to a substrate, on which an organic electronic element is formed, to cover said organic electronic element; and curing said encapsulation film.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0077] FIG. 1 is a cross-sectional view showing an encapsulation film according to one example of the present invention.

[0078] FIG. 2 is a cross-sectional view showing an organic electronic device according to one example of the present invention.

[0079] FIG. 3 is a view showing a reflectance measuring method according to one example of the present invention.

DESCRIPTION OF REFERENCE NUMERALS

[0080] 1: encapsulation film [0081] 11, 33: encapsulation layer [0082] 12, 34: metal layer [0083] 3: organic electronic device, [0084] 31: substrate [0085] 32: organic electronic element

DETAILED DESCRIPTION OF THE INVENTION

[0086] Hereinafter, the present application will be described in detail with reference to Examples and Comparative Examples, but the scope of the present application is not limited by Examples as set forth below.

Example 1

[0087] Preparation of Encapsulation Layer Solution

[0088] In toluene containing 0.3 wt % of a dispersant, CaO (particle diameter of about 1 ?m) as a moisture adsorbent was dispersed at 50 wt % to prepare 20 g of a dispersion. 50 g of butyl rubber (BR068, EXXON) as an encapsulation resin, 24 g of a hydrogenated hydrocarbon resin (Eastotac H-100L) as a tackifier, 15 g of 2-(2-ethoxyethoxy)ethyl acrylate as a monofunctional acrylate, 10 g of trimethylolpropane triacrylate as a multifunctional active energy ray polymerizable compound and 1 g of 2,2-dimethoxy-1,2-diphenylethane-1-one (Irgacure 651, Ciba) as a radical initiator were introduced into a mixing vessel, diluted with toluene to a solid content of about 15 wt %, and then mixed with the dispersion to prepare a final coating solution such that the moisture adsorbent was in an amount of 20 parts by weight relative to 100 parts by weight of the encapsulation resin.

[0089] Production of Encapsulation Film

[0090] The prepared encapsulation layer solution was coated on the release surface of a release PET and dried in an oven at 100? C. for 15 minutes to form an encapsulation layer having a thickness of 50 ?m, and this layer was laminated with the aluminum film to produce an encapsulation film. Physical properties are measured for a sample irradiating the produced film with ultraviolet at 2 J/cm.sup.2. The reflectance is measured with the release PET removed.

Example 2

[0091] An encapsulation film was prepared in the same manner as in Example 1, except that the moisture adsorbent content in the encapsulation layer was increased by 1.5 times on the basis of weight as compared with Example 1.

Example 3

[0092] An encapsulation film was prepared in the same manner as in Example 1, except that the moisture adsorbent content in the encapsulation layer was increased by two times on the basis of weight as compared with Example 1.

Example 4

[0093] An encapsulation film was prepared in the same manner as in Example 1, except that the moisture adsorbent content in the encapsulation layer was increased by three times on the basis of weight as compared with Example 1.

Example 5

[0094] The encapsulation film prepared in Example 2 was exposed at a temperature of 25? C. and a relative humidity of 50% for 8 hours.

Comparative Example 1

[0095] An encapsulation film was prepared in the same manner as in Example 1, except that no moisture adsorbent was added.

Comparative Example 2

[0096] An encapsulation film was prepared in the same manner as in Example 1, except that the moisture adsorbent content in the encapsulation layer was reduced by ? times on the basis of weight as compared with Example 1.

Comparative Example 3

[0097] The encapsulation film prepared in Example 2 was exposed at a temperature of 25? C. and a relative humidity of 50% for 24 hours.

Experimental Example 1Measurement of Reflectance R

[0098] The release PET of the encapsulation film prepared in Examples and Comparative Examples was removed, and the specular reflectance according to Equation 1 below was measured by irradiating the encapsulation layer with light having a wavelength of 550 nm. Specifically, SCI and SCE are measured according to ASTM E1164-12E1 using CM2006d from Konika Minolta (measuring conditions: a set value of M/I+E, a set value of UV 100%, D65 light source, an observing visual field of 10?). Here, a white calibration of the measuring equipment is carried out before starting the measurement. After placing the sample encapsulation film on a flat surface, the measurement is carried out by closely contacting the opening of the measuring instrument to the sample. The measurement is carried out 5 times per sample with changing measuring positions to adopt the average value.

R=SCI?SCE(Equation 1)

Experimental Example 2Evaluation of Element Stability

[0099] After removing the release PET of the encapsulation film prepared in Examples and Comparative Examples and applying the encapsulation layer of the encapsulation film to an organic electronic element having a 6 mm bezel to cover the element, the element was exposed at a temperature of 85? C. and a relative humidity of 85% for 850 hours to test the element stability. The results were classified into pass when the element deterioration did not progress and bad when the element deterioration progressed.

TABLE-US-00001 TABLE 1 SCI SCE R Element Stability Example 1 40.13 34.28 5.85 pass Example 2 39.86 34.15 5.71 pass Example 3 38.35 32.76 5.59 pass Example 4 37.81 32.42 5.39 pass Example 5 40.05 34.24 5.81 pass Comparative Example 1 52.03 20.52 31.51 bad Comparative Example 2 45.69 38.52 7.17 bad Comparative Example 3 43.37 36.75 6.62 bad