PPTC MATERIAL WITH MIXED CONDUCTIVE FILLER COMPOSITION

Abstract

A polymeric positive temperature coefficient (PPTC) device including a PPTC body, a first electrode disposed on a first side of the PPTC body, and a second electrode disposed on a second side of the PPTC body, wherein the PPTC body is formed of a PPTC material that includes a maximum of 65% by volume of a conductive filler, wherein 10%-39% by volume of the PPTC material is a conductive ceramic filler and wherein the rest of the conductive filler includes at least one of carbon and a metallic filler.

Claims

1. A polymeric positive temperature coefficient (PPTC) device, comprising: a PPTC body; a first electrode disposed on a first side of the PPTC body; and a second electrode disposed on a second side of the PPTC body; wherein the PPTC body is formed of a PPTC material that includes a maximum of 65% by volume of a conductive filler, wherein 10%-39% by volume of the PPTC material is a conductive ceramic filler and wherein the rest of the conductive filler includes at least one of carbon and a metallic filler.

2. The PPTC device of claim 1, wherein the conductive filler is formed of particles having a median diameter of 50 nanometers to 20 micrometers.

3. The PPTC device of claim 1, wherein the PPTC material exhibits a hold current density of between 0.05 to 0.4 A/mm.sup.2.

4. The PPTC device of claim 1, wherein the PPTC material includes at least one of a polyvinylidene fluoride (PVDF) polymer, an ethylene vinyl acetate (EVA) polymer, a high-density polyethylene (HDPE) polymer, an ethylene tetrafluoroethylene (ETFE) polymer, and a perfluoroalkoxy (PFA).

5. The PPTC device of claim 1, wherein at least one of the first electrode and the second electrode is formed of copper foil.

6. The PPTC device of claim 5, wherein the copper foil is plated with nickel.

7. A polymeric positive temperature coefficient (PPTC) material comprising: a polymer matrix; and a conductive filler; wherein the PPTC material includes a maximum of 65% by volume of the conductive filler, wherein 10%-39% by volume of the PPTC material is a conductive ceramic filler and wherein the rest of the conductive filler includes at least one of carbon and a metallic filler.

8. The PPTC material of claim 7, wherein the conductive filler is formed of particles having a median diameter of 50 nanometers to 20 micrometers.

9. The PPTC material of claim 7, wherein the PPTC material exhibits a hold current density of between 0.05 to 0.4 A/mm.sup.2.

10. The PPTC material of claim 7, wherein the polymer matrix includes at least one of a polyvinylidene fluoride (PVDF) polymer, an ethylene vinyl acetate (EVA) polymer, a high-density polyethylene (HDPE) polymer, an ethylene tetrafluoroethylene (ETFE) polymer, and a perfluoroalkoxy (PFA).

11. A polymeric positive temperature coefficient (PPTC) device, comprising: a PPTC body; first and second metallic foil layers disposed on opposing sides of the PPTC body, respectively, and extending from first and second metallic traces at opposing ends of the PPTC body, respectively, wherein the first metallic foil layer extends toward, but does not contact, the second metallic trace, and wherein the second metallic foil layer extends toward, but does not contact, the first metallic trace; electrically insulating insulation layers covering the first and second metallic foil layers; and metallic electrodes disposed on the insulation layers in electrical contact with the metallic traces; wherein the PPTC body is formed of a PPTC material that includes a maximum of 65% by volume of a conductive filler, wherein 10%-39% by volume of the PPTC material is a conductive ceramic filler and wherein the rest of the conductive filler includes at least one of carbon and a metallic filler.

12. The PPTC device of claim 11, wherein the conductive filler is formed of particles having a median diameter of 50 nanometers to 20 micrometers.

13. The PPTC device of claim 11, wherein the PPTC material exhibits a hold current density of between 0.05 to 0.4 A/mm2.

14. The PPTC device of claim 11, wherein the PPTC material includes at least one of a polyvinylidene fluoride (PVDF) polymer, an ethylene vinyl acetate (EVA) polymer, a high-density polyethylene (HDPE) polymer, an ethylene tetrafluoroethylene (ETFE) polymer, and a perfluoroalkoxy (PFA).

15. The PPTC device of claim 11, wherein at least one of the first metallic foil layer and the second metallic foil layer is formed of copper foil.

16. The PPTC device of claim 15, wherein the copper foil is plated with nickel.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0009] FIG. 1A and FIG. 1B illustrate a PPTC device according to embodiments of the present disclosure;

[0010] FIG. 2 illustrates a detailed cross-sectional view of the PPTC device shown in FIG. 1A showing a percolation network in the PPTC material of the PPTC device including two different types of conductive filler;

[0011] FIG. 3 illustrates exemplary resistance behavior for a PPTC material according to embodiments of the present disclosure;

[0012] FIG. 4 illustrates a PPTC device according to embodiments of the present disclosure; and

[0013] FIGS. 5A and 5B illustrate PPTC devices according to various additional embodiments of the present disclosure.

DESCRIPTION OF EMBODIMENTS

[0014] The present embodiments will now be described more fully hereinafter with reference to the accompanying drawings, in which exemplary embodiments are shown. The embodiments are not to be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey their scope to those skilled in the art. In the drawings, like numbers refer to like elements throughout.

[0015] In the following description and/or claims, the terms on, overlying, disposed on, and over may be used in the following description and claims. On, overlying, disposed on, and over may be used to indicate that two or more elements are in direct physical contact with one another. Also, the terms on, overlying, disposed on, and over, may mean that two or more elements are not in direct contact with one another. For example, over may mean that one element is above another element while not contacting one another and may have another element or elements in between the two elements. Furthermore, the term and/or may mean and, it may mean or, it may mean exclusive-or, it may mean one, it may mean some, but not all, it may mean neither, and/or it may mean both, although the scope of the claimed subject matter is not limited in this respect.

[0016] In various embodiments, novel device structures and materials are provided for forming a PPTC device, where the PPTC device includes a PPTC material having that includes at least two different types of conductive fillers. In one example, a PPTC material in accordance with the present disclosure includes a maximum of 65% by volume of a conductive filler, wherein 10-39% by volume of the PPTC material is a conductive ceramic filler and wherein the rest of the conductive filler includes at least one of carbon and a metallic filler.

[0017] In various embodiments, a PPTC device may be constructed as shown in FIG. 1A and FIG. 1B. FIG. 1A illustrates a side cross-sectional view of a PPTC device 100, where a PPTC body 104 is disposed between a first electrode 102 and a second electrode 106 that are arranged on a first side and a second side of the PPTC body 104, respectively. FIG. 1B illustrates a configuration of the PPTC device 100 after a first terminal 108 is joined to the first electrode 102 and a second terminal 110 is joined to the second electrode 106. The first terminal 108 may be joined to the first electrode 102 (e.g., by soldering, welding, etc.) to form a first interface 112, and the second terminal 110 may be joined to second electrode 106 to form a second interface 114.

[0018] According to embodiments of the present disclosure, the PPTC body 104 may be formed from of a PPTC material having a relatively low percolation threshold as further detailed below. The first electrode 102 and the second electrode 106 may be formed of known metals, such as a copper foil. In some embodiments, the copper foil may be nickel plated. The first terminal 108 and the second terminal 110 may also be formed of known materials, such as copper or brass. The embodiments are not limited in this context.

[0019] In some embodiments of the present disclosure, the PPTC body 104 may be formed of a composite PPTC material that includes a polymer matrix and a conductive filler. The polymer matrix may be, or may include, a semi-crystalline polymer such as a polyvinylidene fluoride (PVDF) polymer, an ethylene vinyl acetate (EVA) polymer, a high-density polyethylene (HDPE) polymer, an ethylene tetrafluoroethylene (ETFE) polymer, or a perfluoroalkoxy (PFA) polymer. The embodiments are not limited in this context.

[0020] According to some embodiments of the present disclosure, the conductive filler of the PPTC material defines a maximum of 65% by volume of the PPTC material, wherein 10%-39% by volume of the PPTC includes one or more conductive ceramic materials. Such materials may include, but are not limited to, titanium carbide, tungsten carbide, vanadium carbide, zirconium carbide, niobium carbide tantalum carbide, molybdenum carbide, titanium boride, vanadium boride, zirconium boride, niobium boride, molybdenum boride, hafnium boride, or mixtures thereof. The remainder of the conductive filler (i.e., 0-55% by volume of the PPTC material) may include at least one of carbon and a metallic filler, wherein exemplary metallic fillers include, but are not limited to, nickel, tungsten, copper, and copper alloy.

[0021] An exemplary PPTC material in accordance with the present disclosure may include 39% conductive ceramic filler by volume and 10% metallic filler by volume. Another exemplary PPTC material in accordance with the present disclosure may include 10% conductive ceramic filler by volume and 39% metallic filler by volume. Another exemplary PPTC material in accordance with the present disclosure may include 10% conductive ceramic filler by volume, 25% carbon by volume, and 25% metallic filler by volume.

[0022] In various embodiments, the median diameter of the particles of conductive filler in the PPTC material may be in a range of about 50 nanometers to 20 micrometers. It has been found that using conductive ceramic particles of such relatively small size can achieve a given resistivity in a PPTC material using a smaller quantity of conductive filler by volume relative to particles of larger size that are traditionally used in conventional PPTC materials. The cost and weight of the PPTC material of the present disclosure may therefore be lower than those of traditional PPTC devices while achieving similar operational characteristics such as resistivity and trip temperature.

[0023] Turning now to FIG. 2, there is shown a detailed cross-sectional view of the PPTC device 100 shown in FIG. 1A illustrating particles of the conductive filler of the PPTC material, which may include a conductive ceramic filler and at least one additional conductive filler, which may be carbon or a metallic filler.

[0024] Turning now to FIG. 3 there is shown a graph plotting the resistance behavior as a function of temperature of a PPTC device, arranged according to embodiments of the disclosure. In this example, the conductive filler of the PPTC material in the PPTC device includes 18% by volume tungsten carbide and 35% by volume carbon black, wherein the polymer of the PPTC material is ETFE. As shown, an abrupt increase in resistance takes place at 210-220 C. Accordingly, the PPTC material of FIG. 3 may be deemed to exhibit a trip temperature of about 215 C.

[0025] The hold current density of the PPTC materials of the present disclosure may be designed to exhibit a value between 0.05 to 0.4 A/mm.sup.2 by appropriate choice of volume fraction of conductive filler and type of conductive filler, where hold current density is calculated as a ratio of the hold current of a PPTC material at 25 C. to the area of the PPTC through which current travels between opposing electrodes.

[0026] The configuration of a PPTC device may vary according to different embodiments of the present disclosure. FIG. 4 presents a top plan view of a PPTC device 400, shown as radial lead PPTC device, including a bottom lead 404 and a top lead 406, attached to opposite surfaces of a PPTC body 402. The PPTC body 402 may have first and second electrodes (not separately shown) attached to the top surface and bottom surface thereof, respectively, as generally described above. The PPTC device 400 may be encapsulated by an encapsulant layer 410, such as an epoxy. The PPTC body 402 may be formed of a PPTC material formulated generally as described above.

[0027] FIG. 5A and FIG. 5B depict side cross-sectional views of embodiments of a single-layer surface mount PPTC device 500 and a double-layer surface mount PPTC device 600, respectively, according to exemplary embodiments of the present disclosure. These devices may include PPTC bodies 502, and first and second metallic foil layers 504a, 504b disposed on opposing sides of the PPTC bodies 502 and extending longitudinally from first and second metallic traces 506a, 506b at opposing longitudinal ends of the PPTC bodies 502, wherein the first metallic foil layers 504 extend toward, but does not contact, the second metallic traces 506b, and wherein the second metallic foil layers 504b extend toward, but does not contact, the first metallic traces 506a. The devices may further include electrically insulating insulation layers 510 covering the metallic foil layers 504a, 504b, and metallic electrodes 512 disposed on the outermost insulation layers 510 in electrical contact with the metallic traces 506a, 506b. In these devices, the PPTC bodies may be formed of a PPTC material formulated generally as described above.

[0028] While the present embodiments have been disclosed with reference to certain embodiments, numerous modifications, alterations and changes to the described embodiments are possible while not departing from the sphere and scope of the present disclosure, as defined in the appended claims. Accordingly, the present embodiments are not to be limited to the described embodiments, and may have the full scope defined by the language of the following claims, and equivalents thereof.