Lighting device with built-in RF antenna

Abstract

A lighting device, such as a replacement lighting device, comprising a light source (LS), e.g. LEDs, for producing light along an optical axis (OA). A heat sink (HS) made of a material with an electrical resistivity being less than 0.01 Ωm, e.g. a metallic heat sink being a part of the housing, transports heat away from the light source (LS). A Radio Frequency (RF) communication circuit (CC) connected to an antenna (A) serves to enable RF signal communication, e.g. to control the device via a remote control. Metallic components, including the heat sink (HS), having an extension larger than 1/10 of a wavelength of the RF signal are arranged below a virtual plane (VP) drawn orthogonal to the optical axis (OA) and going through the antenna (A). Hereby a compact device can be obtained, and still a satisfying RF radiation pattern can be obtained. The antenna can be a wire antenna or a PCB antenna, e.g. a PIFA or a IFA type antenna. In a special embodiment the antenna is formed on a ring-shaped PCB with a central hole allowing passage of light from the light source. Preferably, the antenna is positioned at least 2 mm in front of the heat sink (HS).

Claims

1. A lighting device, comprising a light source comprising one or more light-emitting diodes configured for generating light along an optical axis, a heat sink comprising a metal with an electrical resistivity being less than 0.01 Ωm. and configured for removing heat produced by the light source, the heat sink forming at least a portion of an outer enclosure, a RF communication circuit, and a first antenna connected to the RF communication circuit for communicating RF control signals and arranged within the outer enclosure, wherein the lighting device comprises one or more metallic components having an extension larger than at least 1/10 of a wavelength of the RF control signals and arranged below a virtual plane drawn orthogonal to the optical axis and going through the first antenna.

2. .[.Lighting.]. .Iadd.The lighting .Iaddend.device according to claim 1, wherein the metallic components are arranged at least 4 mm below the virtual plane drawn orthogonal to the optical axis and going through the .Iadd.first .Iaddend.antenna.

3. .[.Lighting.]. .Iadd.The lighting .Iaddend.device according to claim 1, wherein the .Iadd.first .Iaddend.antenna is arranged at least 2 mm in front of the heat sink.

4. .[.Lighting.]. .Iadd.The lighting .Iaddend.device according to claim 1, wherein the first antenna comprises a radiating part substantially extending in one single plane being substantially perpendicular to the optical axis.

5. .[.Lighting.]. .Iadd.The lighting .Iaddend.device according to claim 1, wherein the first antenna is a wire antenna.

6. .[.Lighting.]. .Iadd.The lighting .Iaddend.device according to claim 1, further comprising a first printed circuit board, wherein the first antenna is one of an IFA antenna, a PIFA antenna, a Yagi antenna, and a loop antenna and is disposed on the first printed circuit board.

7. .[.Lighting.]. .Iadd.The lighting .Iaddend.device according to claim 6, further comprising a second printed circuit board substantially perpendicular to the first printed circuit board and the optical axis, wherein the first antenna is disposed on an end part of the first circuit board arranged for being received in an opening of the second printed circuit board.

8. .[.Lighting.]. .Iadd.The lighting .Iaddend.device according to claim 6, wherein the RF communication circuit is disposed on the first printed circuit board, such as the RF communication circuit being disposed on one side of the first printed circuit board, while the first antenna is disposed on an opposite side of the first printed circuit board.

9. .[.Lighting.]. .Iadd.The lighting .Iaddend.device according to claim 6, wherein the first printed circuit board has an opening, and is positioned in relation to the light source such that light can pass from the light source out of the enclosure through the opening in the first printed circuit board, such as the first printed circuit board being substantially ring-shaped.

10. .[.Lighting.]. .Iadd.The lighting .Iaddend.device according to claim 1, further comprising a second antenna, wherein the first and second antennas are oriented so as to radiate RF signals in different directions, the first and second antennas being different types of antennas.

11. .[.Lighting.]. .Iadd.The lighting .Iaddend.device according to claim 1, comprising a control circuit arranged to control a function of the lighting device in accordance with data received in an RF signal received via the .[.RF.]. .Iadd.first .Iaddend.antenna and the RF communication circuit.

.Iadd.12. The lighting device of claim 1, wherein all metallic components having an extension larger than 1/10 of a wavelength of the RF control signals are arranged below the virtual plane. .Iaddend.

.Iadd.13. The lighting device of claim 1, wherein the heat sink is a polymeric material with a conductive filling material. .Iaddend.

.Iadd.14. The lighting device of claim 13, wherein the conductive filling material is metal. .Iaddend.

.Iadd.15. The lighting device of claim 1, wherein the one or more light-emitting diodes include a set of red, green, and blue colored light-emitting diodes. .Iaddend.

.Iadd.16. The lighting device of claim 1, further comprising a collimator. .Iaddend.

.Iadd.17. The lighting device of claim 16, wherein the collimator is made of metal and has a transparent front cap. .Iaddend.

.Iadd.18. The lighting device of claim 1, further comprising a first PCB and a second PCB, wherein: the second PCB is arranged substantially perpendicular to the optical axis, the second PCB having an opening; and the first antenna is disposed on an end part of the first PCB and the end part is positioned in the opening of the second PCB. .Iaddend.

.Iadd.19. The lighting device of claim 18, wherein the RF communication circuit is disposed on the first PCB. .Iaddend.

.Iadd.20. The lighting device of claim 19, further comprising a matching circuit connected between the first antenna and the RF communication circuit. .Iaddend.

.Iadd.21. The lighting device of claim 18, wherein all metallic components having an extension larger than 1/10 of a wavelength of the RF control signals are arranged below the virtual plane. .Iaddend.

.Iadd.22. The lighting device of claim 1, further comprising a driver circuit positioned inside the outer enclosure, the driver circuit including a mains voltage power converter, a driver for the one or more light-emitting diodes, and an additional supply for a control chip. .Iaddend.

.Iadd.23. The lighting device of claim 22, wherein the heat sink is a polymeric material with a conductive filling material. .Iaddend.

.Iadd.24. The lighting device of claim 1, further comprising the first antenna having a microprocessor and a matching circuit serving to match for minimal noise figure and maximum power transfer, wherein the first antenna is disposed on a PCB. .Iaddend.

.Iadd.25. The lighting device of claim 1, wherein the one or more metallic components includes the heat sink. .Iaddend.

Description

BRIEF DESCRIPTION OF THE FIGURES

(1) The present invention will now be explained, by way of example only, with reference to the accompanying Figures, in which

(2) FIGS. 1-5 illustrate sketches of different lighting device embodiments,

(3) FIG. 6 illustrates an example of a dual antenna disposed on a ring PCB,

(4) FIG. 7 illustrates three examples of connecting two antennas to a transceiver circuit,

(5) FIGS. 8-9, show photos of an example of a PCB antenna,

(6) FIG. 10 shows a sketch of a specific ring-shaped PCB antenna, and

(7) FIG. 11 shows a photo of a lighting device embodiment and the two ring-shaped PCBs contained therein.

DETAILED DESCRIPTION OF EMBODIMENTS

(8) FIG. 1 illustrates a simple sketch of a section through a lighting device embodiment with an outer enclosure ENC in the form of an upper and a lower part, wherein the lower part is a metal housing HS and the upper part UEP is a non-metallic material, e.g. a polymeric material. The metal housing HS serves as heat sink to transport heat away from the light source LS positioned within the enclosure ENC. The light source LS generates light along an optical axis OA, and the light escapes the outer enclosure ENC through a transparent or translucent part of the upper enclosure part UEP. An RF antenna A in the form of a wire antenna is indicated with black color, and the antenna A is connected to an RF communication circuit CC placed within the outer enclosure ENC. As seen, the antenna A is positioned in the upper enclosure part UEP, i.e. above the metal housing HS. The antenna is placed with a distanced between the metal housing HS and a plane through a plane extended by the antenna A, a plane perpendicular to the optical axis OA. Preferably, the antenna A and RF communication circuit CC can receive a wireless RF control signal from a remote control, e.g. in the frequency range 1-3 GHz, such as around 2.4 GHz. Hereby the lighting device can receive data which can be used to control various parameters related to the light generated by the device, e.g. switch on/off the light source LS. It is appreciated that other frequency ranges may be used, e.g. a band in the 60 GHz range, e.g. combined with the antenna A being a Yagi antenna or an array phased antenna. Antenna diversity is also possible.

(9) FIG. 2 illustrates a sketch of a section through retrofit spot lamp with a GU 10 standard power connector PCN. A benefit of this construction is also that the power electronics part DRV is shielded from the RF part by metal in between. If there is a coupling, the packet error rate will increase due to modulation of the power supply switching frequency on the transceiver circuit. The light source LS includes a set of LEDs, e.g. Red, Green, Blue, colored LEDs. The outer enclosure has a back part BP in the form of a plastics, where the power connector PCN penetrates the outer enclosure. A middle part of the outer enclosure is in form of a metal housing HS with a rib outer structure and connected to the heat sink so as to effectively transport heat from the light source LS. E.g. the metal housing HS is formed by aluminium. The upper part of the outer enclosure is in the form of a plastic front cap FC.

(10) Inside the outer enclosure, a driver circuit DRV is positioned. The driver circuit preferably includes a mains voltage power converter, a driver for the LED light source LS and an additional supply for the control chip. The LEDs LS are positioned on a Printed Circuit Board PCB which also holds control circuit components. A hollow hexagonal mixing tube MT with a reflective and electrically conductive material at its inner surface serves to guide light from the light source LS to a plastic collimator CLM. A diffuser DFF is inbetween the collimator and the mixing tube for additional colour nixing.

(11) In the upper part of the device an RF antenna A is positioned. The antenna A is disposed on a ring-shaped PCB which allows the collimator CLM and thus light from the light source LS to pass through the opening inside the ring-shape. In one version, the antenna A is in the form of an IFA antenna, and an RF transceiver chip, a microprocessor, and a matching circuit serving to match for minimal noise figure and maximum power transfer, e.g. 50Ω matching, are mounted on the same PCB as the antenna A. The dashed line VP indicates a virtual plane through the antenna A. As seen, major metal objects which are disturbing to wireless RF signals reaching or leaving the antenna A, such as the metal housing HS, is located below the virtual plane VP through the antenna. Even small metal objects, e.g. solder material etc. in relation to the circuits mounted on the antenna PCB, are placed below the virtual plane VP through the antenna, since preferably such circuits are mounted on the lower side of the PCB, while the antenna elements are disposed on an upper side of the PCB.

(12) FIG. 3 illustrates a lighting device embodiment differing only from the one in FIG. 2 with respect to the antenna A. In FIG. 3, the illustrated antenna A is a PIFA antenna disposed on a ring-shaped PCB. All description relating to the antenna A from FIG. 2 holds as well for the antenna A of FIG. 3.

(13) FIG. 4 illustrates yet another LED based retrofit spot lamp. This embodiment is similar to the one from FIG. 3 except that the collimator CLM is made of metal and has a transparent front cap. The collimator CLM thus forms a significant metal component since it has a significant size compared to typical RF signal wavelengths, and thus the collimator CLM will significantly influence the RF signal properties of the antenna A in case its metal parts are not placed below the virtual plane VP through the antenna A.

(14) FIG. 5 illustrates a still further lighting device embodiment in the form of a retrofit LED based spot lamp. This embodiment has the same antenna A as the on in FIG. 2, i.e. an IFA antenna. A disposed on a ring-shaped PCB. However, it differs with respect to optical elements, since in this embodiment, a frosted bulb BLB forms the upper part of the outer enclosure of the lighting device. Further, the power connector PCN is in the form on E27 socket.

(15) FIG. 6 illustrates the two opposite sides (to the left: top view, to the right: bottom view) of an example of a ring-shaped PCB1 with antenna elements in the form of electrically conducting paths disposed thereon, and a through-going circular hole H in the centre, i.e. the same type of antenna as described for FIGS. 2-5. In the embodiment of FIG. 6 two antennas A1, A2 are located at opposite parts but on the same side of the PCB1. The two antennas A1, A2 are both in the form of PIFA antennas each having a radiating element and a feed-point AFP, and they are electrically connected to one common ground plane GPL. To the right, on the opposite side of the PCB1, the antennas A1, A2 are connected via the feed-points AFP to respective matching circuits MC1, MC2. The first matching circuit MC1 is connected to a balun BL via a phase matching transmission line MTL providing an approximately 180° phase shift between the antenna A1, A2, while the matching circuits MC1, MC2 are identical. The balm BL is finally connected to a chip CP which is placed on an extension of the PCB1. E.g. this chip CP is a TI CC2430 chip including a transceiver and a microprocessor housed in one chip.

(16) The two antennas A1, A2 provide a smaller sensitivity for interference between direct and reflected RF waves and for the polarization dependence of the antenna signal. An advantage of substantially ring-shaped PCB1 with an extension for the chip CP is that while light can penetrate in the centre hole H, cooling the light source by air convection is possible between the housing of the lighting device and outside the PCB1. Thus, it is preferred that the ring-shape of the PCB1 has a dimension smaller than an inner diameter of the housing so as to allow air convection for cooling.

(17) FIG. 7 illustrates three diagrams a, b and c showing different ways of connecting either one antenna A1 or two antennas A1, A2 to a transceiver circuit TRC via a matching circuit MC. GND denotes electrical ground. In versions a and b a balun is interconnected between the matching circuit MC and the transceiver circuit TRC. Version b is the one illustrates for the ring-shaped dual antenna A1, A2 in FIG. 6. In version b the phase shift will influence the directional antenna sensitivity. When shifting the phase the natural dip in the (IFA) antenna sensitivity can be suppressed by phase shifting the antenna signals where the mechanical antenna orientation is e.g. 90°.

(18) FIGS. 8 and 9 illustrate an antenna configuration suitable for Compact Flourescent (CFL) based light sources. The antenna in this case shown in FIG. 9 is very close to the electronics of the driver, and could be inside the fixture where the CFL light source is installed. FIG. 8 shows first and second PCBs PCB1, PCB2 next to each other, while FIG. 9 shows the two PCBs PCB1, PCB2 in an assembled state, namely with an end part of PCB1 inserted in a central slid or slot in PCB2. An antenna A is disposed on the end part of PCB1 piercing through PCB2. When installed in a lighting device, the antenna A preferably projects outwards and thus protruding in front of large metallic components. In this case the metal enclosure does not react as an absorber. PCB2 has a generally circular shape and is thus suited to fit a circular housing. PCB1 preferably comprises a transceiver chip connected to the antenna A. The central outward projecting antenna A is suited together with a light source in the form of a curved CFL tube. More PCBs with antennas may be mounted in more holes or slots in PCB2, in case a plurality of antennas are desired.

(19) FIG. 10 illustrates a specific ring-shaped PCB antenna with two antenna elements and a transceiver chip suited for Zigbee and WLAN communication. Dimensions indicated on the sketch are in mm. In a specific LED based lighting device embodiment the antenna is tuned to a frequency of 2.405 GHz.

(20) FIG. 11 illustrates a lighting device with a ribbed alu housing serving as heat sink inside the housing an LED based light source is positioned. The two ring-shaped PCBs shown outside the device are fitted in the plastic front cap and connected together with a connecting socket providing a distance between the two PCBs. The upper one is the antenna PCB. The illustrated embodiment has been tested with respect to RF radiation pattern, and its directional performance was satisfying, e.g. >−10 dB antenna gain over large solid angle >27π. Furthermore, a return loss of less than 10 dB and an SWR of less than 2:1 over the whole ISM band (2400-2483.5 MHz) were measured.

(21) To summarize, the invention provides a lighting device, such as a replacement lighting device, comprising a light source LS. e.g. LEDs, for producing light along an optical axis OA. A heat sink HS made of a material with an electrical resistivity being less than 0.01 Ωm, e.g. a metallic heat sink part of the housing, transports heat away from the light source LS. A Radio Frequency RF communication circuit CC connected to an an antenna (A) serves to enable RF signal communication, e.g. to control the device via a remote control. Metallic components, including the heat sink (HS), having an extension larger than 1/10 of a wavelength of the RF signal are arranged below a virtual plane (VP) drawn orthogonal to the optical axis (OA) and going through the antenna (A). Hereby a compact device can be obtained, and still a satisfying RF radiation pattern can he obtained. The antenna can be a wire antenna or a PCB antenna, e.g. a PIFA or a IFA type antenna. In a special embodiment the antenna is formed on a ring-shaped PCB with a central hole allowing passage of light from the light source. Preferably, the antenna is positioned at least 2 mm in front of the metallic heat sink (HS).

(22) Although the present invention has been described in connection with the specified embodiments, it is not intended to be limited to the specific form set forth herein. Rather, the scope of the present invention is limited only by the accompanying claims. In the claims, the term “comprising” does not exclude the presence of other elements or steps. Additionally, although individual features may be included in different claims, these may possibly be advantageously combined, and the inclusion in different claims does not imply that a combination of features is not feasible and/or advantageous. In addition, singular references do not exclude a plurality. Thus, references to “a”, “an”, “first”, “second” etc. do not preclude a plurality. Furthermore, reference signs in the claims shall not be construed as limiting the scope.