MEMS DUAL SUBSTRATE SWITCH WITH MAGNETIC ACTUATION

Abstract

Systems and methods for forming a magnetostatic MEMS switch include forming a movable beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A shunt bar on the movable plate may close the switch when lowered onto the contacts. The switch may generally be closed, with the shunt bar resting on the contacts. However, a magnetically permeable material may also be inlaid into the movable plate. The switch may then be opened by placing either a permanent magnet or an electromagnet in proximity to the switch.

Claims

1. A method for manufacturing and using a magnetic MEMS switch, comprising: forming a movable plate on a first substrate, wherein the movable plate is coupled to the first substrate by a plurality of restoring springs; forming at least two electrical contacts on a second substrate; and forming an area of permeable magnetic material on at least one of the first and the second substrates; coupling the first substrate to the second substrate with an adhesive bond that seals the magnetic MEMS switch.

2. The method of claim 1, further comprising applying a source of magnetic flux to the magnetic MEMS switch.

3. The method of claim 2, wherein the source of magnetic flux is at least one of a permanent magnet and an electromagnet.

4. The method of claim 1, further comprising: forming electrical vias through a thickness of the second substrate and electrically coupled to the two electrical contact; and forming a shunt bar on the movable plate, which is dimensioned to span the contacts.

5. The method of claim 1, wherein forming the permeable magnetic material comprises: forming at least one void; depositing a seed layer in the at least one void; depositing a magnetic material onto the seed layer; and planarizing a surface including the magnetic material.

6. The method of claim 1, wherein depositing the magnetic material onto the seed layer comprises plating nickel iron onto the seed layer, wherein the magnetic material guides magnetic flux from an electromagnet separate from the magnetic MEMS switch.

7. The method of claim 1, wherein coupling the first substrate to the second substrate with an adhesive bond comprises: depositing a first metal on the first substrate; and depositing a second metal on the second substrate; and coupling the first substrate to the second substrate by heating the first substrate and the second substrate to at least a melting point of at least one of the first metal and the second metal, sealing the first and second substrates with an alloy of the first and second metals.

8. The method of claim 2, wherein applying a source of magnetic flux comprises disposing a source of magnetic flux adjacent to the magnetic MEMS switch, wherein the magnetic MEMS switch is configured to either open or close the two electrical contacts by attracting the permeable magnetic material, when the source of magnetic flux is applied.

9. The method of claim 8, further comprising: applying a current to the electromagnet disposed above the movable plate formed on the first substrate; opening an electrical connection between the two electrical contacts by raising the movable plate and shunt bar toward the electromagnet in response to the applied current.

10. The method of claim 8, wherein forming the movable plate on the first substrate comprises: etching an outline of the movable plate in a device layer of the silicon-on-insulator substrate; releasing the movable plate from a handle layer of the silicon-on-insulator substrate by etching an oxide layer between the device layer and the handle layer.

11. A magnetic MEMS switch, comprising: a movable plate formed on a first substrate, wherein the movable plate is coupled to the first substrate by a plurality of restoring springs; at least two electrical contacts formed on a second substrate; at least one permeable magnetic feature inlaid into at least one of the first and the second substrates; and a seal which couples the first substrate to the second substrate, and seals the MEMS switch, such that the MEMS switch operated by disposing a source of magnetic field gradient in a vicinity of the magnetic MEMS switch, wherein the gradient is sufficient to move the movable plate and open or close the switch.

12. The magnetic MEMS switch of claim 11, further comprising: a shunt bar disposed on the movable plate, and dimensioned to span the two contacts, and a source of magnetic flux disposed adjacent to the magnetic MEMS switch, wherein the source of magnetic flux is configured to either open or close the two electrical contacts by attracting the permeable magnetic material toward the source of magnetic flux.

13. The magnetic MEMS switch of claim 12, wherein the source of flux is disposed above the first substrate or below the second substrate, and comprises at least one of an electromagnet and a permanent magnet:

14. The magnetic MEMS switch of claim 11, wherein the at least one magnetic feature are two magnetic features disposed laterally adjacent to and on either side of the electrical contact on the second substrate.

15. The magnetic MEMS switch of claim 12, wherein the source of magnetic flux comprises: a permanent magnet disposed above the first substrate or below the second substrate.

16. The magnetic MEMS switch of claim 11, wherein the magnetic feature is at least one of a permanent magnetic material and a permeable magnetic material.

17. The magnetic MEMS switch of claim 11, wherein the at least one magnetic feature are two magnetic fluxguides disposed laterally adjacent to and substantially symmetrically about a center of the movable plate on the first substrate.

18. The magnetic MEMS switch of claim 11, wherein the movable plate is formed from the device layer of the silicon-on-insulator substrate, and affixed to the handle wafer of the silicon-on-insulator substrate by the oxide layer.

19. The magnetic MEMS switch of claim 11, wherein the movable plate further comprises a shunt bar which electrically connects two electrical contacts formed on the second substrate when the magnetic MEMS switch is closed, wherein the shunt bar is electrically isolated from other portions of the movable plate.

20. The magnetic MEMS switch of claim 11, further comprising: a metal alloy which bonds the first substrate to the second substrate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Various exemplary details are described with reference to the accompanying drawings, which however, should not be taken to limit the invention to the specific embodiments shown but are for explanation and understanding only.

[0023] FIG. 1 is an illustrative conceptual view of a prior art dual substrate MEMS device;

[0024] FIG. 2 an illustrative conceptual view of a first embodiment of a dual substrate magnetically actuated MEMS device which is normally closed,

[0025] FIG. 3 an illustrative conceptual view of a another embodiment of a dual substrate magnetically actuated MEMS device, with an electromagnetic source of flux, normally closed;

[0026] FIG. 4 an illustrative conceptual view of another embodiment of a dual substrate MEMS magnetically actuated device with a permanent magnet as the source of magnetic flux;

[0027] FIG. 5 is a cross sectional view of another embodiment of the dual substrate magnetically actuated MEMS device in a normally open configuration;

[0028] FIG. 6 shows a more detailed cross sectional view of the dual substrate magnetically actuated MEMS device with supporting structures;

[0029] FIG. 7 shows another embodiment of the dual substrate magnetically actuated MEMS device using large secondary flux guide structures in a normally closed configuration;

[0030] FIG. 8 shows another embodiment of the dual substrate magnetically actuated MEMS device using large secondary flux guide structures in a normally open configuration;

[0031] FIGS. 9-14 is describe a process which may be used to fabricate the device shown in FIG. 7, the normally closed switch. FIG. 9 shows the starting substrate; FIG. 10 shows the cavities for the permeable material inlay; FIG. 11 shows the secondary permeable material inlaid and the primary flux guides also formed; FIG. 12 shows the shunt bar formed; FIG. 13 shows the bondline formed on the plate substrate; FIG. 14 shows the completed switch with the plate substrate bonded to the via substrate;

[0032] FIGS. 15-22 is describe a process which may be used to fabricate the device shown in FIG. 8, a normally open swtich. FIG. 15 shows the starting substrate for FIG. 8 with cavities for the permeable material inlay and the vias; FIG. 16 shows the permeable material filling the cavities; FIG. 17 shows the plated and planarized vias; FIG. 18 shows the conductive pads deposited over top; FIG. 19 shows the spacer formed on the via substrate; FIG. 20 shows the switch wafer bonded to the via substrate; FIG. 21 shows the dual substrate assembly with the backside of the vias substrate ground down to expose the through wafer vias; FIG. 22 shows the completed switch with the plate substrate bonded to the via substrate;

[0033] It should be understood that the drawings are not necessarily to scale, and that like numbers maybe may refer to like features.

DETAILED DESCRIPTION

[0034] We describe here a MEMS switch that can address the problems described above. This switch can be fabricated in process similar to that of the Dual Substrate MEMS Switch (U.S. Pat. No. 7,893,798 B2), incorporated by reference in its entirety. However, there are at least two distinct differences: [0035] 1) Currently the sum of bond line thicknesses of the via wafer and the switch wafer are controlled so that after bond, the contact spacing is roughly 1 micrometer. In the new embodiment the sum of the thicknesses will be reduced by roughly 1.5 micrometers. Thus after bond, the contacts will be closed and loaded by the 0.5 micrometer over-travel. Springs of the appropriate force constant can provide the requisite load of 100-300 microNewtons. [0036] 2) A layer of magnetically permeable material or a layer of permanent magnet material is deposited on the movable plate or in the surrounding substrate material. When the device is exposed to an externally generated magnetic field gradient, the beam is pulled in the direction of increasing field strength. This external magnetic field can be provided by a very small permanent magnet, and thus no electrical power is required, or it can be provided by an external electromagnet

[0037] The following discussion presents a plurality of exemplary embodiments of the novel photolithographically fabricated dual substrate MEMS magnetic switch. The following reference numbers are used in the accompanying figures to refer to the following:

[0038] 100, 101, 102, 103, 104 exemplary embodiments

[0039] 2000 plate substrate

[0040] 200 plate substrate material

[0041] 3000 via substrate

[0042] 300 via substrate material

[0043] 124, 126 filled through substrate vias

[0044] 232, 234 external contact pads

[0045] 240 movable plate

[0046] 260 shunt bar on movable plate

[0047] 250 source of magnetic flux

[0048] 265 coil for electromagnet

[0049] 220, 222 primary fluxguides

[0050] 224, 226 contact pads

[0051] 10, 12 secondary flux guides

[0052] 224, 226 electrical vias

[0053] 1150 dielectric standoff

[0054] 1400 bondline

[0055] 2400 raised feature in bondline

[0056] FIG. 1 shows a prior art electrostatic MEMS plate switch using dual substrates. In this device, the movable plate 140 is formed on a first SOI substrate 100 and the fixed contacts may be formed on a second silicon substrate 200. When the first substrate 100 is bonded to the second substrate 200, the switch is formed.

[0057] The movable plate 140 may have an electrical shunt bar 160 formed thereon, wherein the electrical shunt bar 160 may provide an electrical connection between two contacts 122, 124 of the switch, when the switch is actuated. These contacts may be fixed, and may be formed on a second substrate 300. In addition to the contacts 122, 124 there may also be an electrostatic actuating plate 132, 134, formed on the second substrate. When a voltage is applied between the movable plate 140 and the electrostatic actuating plates 132, 134, the movable plate 140 is drawn toward the second substrate, until the shunt bar spans the contacts, thus closing the switch.

[0058] It should be understood that the designation of first, second, upper and lower are arbitrary, that is, the plate may also be formed on an upper substrate and the contacts may be formed on a lower substrate. The terms wafer and substrate are used interchangeably herein, to refer to a supporting member, generally flat and circular, often of a semiconductor material such as silicon, as is well known in the art. As used herein, the term fluxguide should be understood to mean a generally planar quantity of permeable material, which is capable of collecting and concentrating lines of flux generated by a source of magnetic flux. A permeable material is given its usual definition, as a material with a magnetic permeability of at least 500.

[0059] Accordingly, in the absence of such an applied voltage, the plate is retracted from the contacts by a set of restoring springs, thereby opening the switch. That is, if the voltage is not applied, the movable plate 160 is raised by the restoring springs such that there is no longer an electrical connection between the two contacts 122, 124, and the switch is normally open.

[0060] As is often the case with such switches, a voltage of 50-100V is needed to generate a force of approximately 100 microNewtons, which overcomes the support spring restoring force and stores energy in these springs so the switch can be opened when the voltage is turned off. More generally, MEMS switches that rely on electrostatic forces to close the switch generally require a power supply or battery to drive the high voltage or high current to generate this force. On many applications, a power source is not available or practical.

[0061] The switch described here uses a similar dual substrate architecture yet is not electrostatic in nature. Instead, the switch described here uses magnetic forces to actuate the switch. The magnetic MEMS switch may either be configured as a normally open switch, or it may be configured as a normally closed switch. The magnetic MEMS switch uses a source of magnetic flux such as a permanent magnet or an electromagnet, to open and close the switch. Several embodiments of the magnetic MEMS switch are described below.

[0062] Exemplary Embodiments with Primary Fluxguides

[0063] In the following discussion, reference number 200 refers to the substrate material used to create the movable plate structure 2000. The completed movable plate structure along with supporting features such as metallization pads, deposited and patterned materials, etc. is referred to as plate substrate or plate structure 2000. Similarly, reference number 300 refers to the substrate material used to create the via structure 3000. The completed via structure along with supporting features such as metallization pads, deposited and patterned materials, etc. is referred to as via substrate or via structure 3000.

[0064] FIG. 2 illustrates the magnetic MEMS switch in a cross sectional view. Once again, there may be a movable plate 240 formed on a first substrate 200, The movable plate 240 may also have at least one electrical shunt bar 260, which is dimensioned to provide an electrical connection between two contacts 226 and 224 of a switch. These contacts may be fixed, and may be formed on a second substrate 3000. Like the prior art device, the magnetic MEMS switch may also have two fixed electrical contacts 226 and 224 pads disposed over a metal through silicon via (TSV) 126 and 124.

[0065] The MEMS switch in this instance, may be a magnetically actuated device. In this case, the movable plate 240 may have a magnetically permeable material 220 and 222, inlaid into, or deposited on, the movable plate structure 240. For ease of fabrication, the permeable material may be disposed on the inner surface of the movable plate 240, wherein the term inner surface refers to the surface closest to the fixed contacts 226 and 224 on the assembled device. Fabrication of the permeable structures 220 and 222 will be described further below. These permeable features disposed on the movable plate 240 are referred to as primary fluxguides, and depicted in FIGS. 2-6. These flux guides are distinct from secondary flux guides which may be larger and inlaid into the substrate material itself. The secondary fluxguides are illustrated in FIGS. 7 and 8.

[0066] As mentioned, a movable suspended plate 240 may be disposed above the fixed adjacent contact electrodes 226 and 224. These contact electrodes may be in electrical communication with two through substrate vias (TSVs) 126 and 124. There may a similar conducting bonding pad on the exterior of the switch, for electrical attachment to other devices and equipment.

[0067] As before, a movable plate 240 with at least one electrical shunt bar 260 is formed on a first substrate 200. A pair of fixed contacts 226 and 224 is disposed on the second substrate After forming these structures, the two substrates are bonded together to form the switch.

[0068] In the quiescent state, the movable plate may rest on the contacts 226 and 224, such that a conductive path exists between contacts 226 and 224. In other words, in the quiescent state, the switch is closed.

[0069] A source of magnetic flux 250 may be disposed over the top of the first substrate 200. The flux will have a gradient associated with it. As is well known from magnetostatics, a permeable material will be drawn into an area with diverging (or converging) lines of flux. Accordingly, upon activation of the electromagnet, the permeable material will concentrate flux into the region and be pulled into areas of high flux gradient. The movable plate will thereby be drawn up and off of the electrical contacts 226 and 224 and towards the electromagnet.

[0070] The electromagnet may be the source of flux and may be activated by applying a current to a solenoidal coil 250 wrapped around a permeably magnetic core 265. The coil may create a field with field lines flowing along the axis of the coil, which is amplified by the permeable magnetic material in the core. The field lines exit and diverge at the north pole of the electromagnet, enter and converge at the south pole.

[0071] Another embodiment of the magnetic MEMS switch 101 is shown conceptually in FIG. 3. In this case again, the movable plate may have a magnetically permeable material 220 and 222, inlaid into the movable plate structure 240, as primary fluxguides.

[0072] The movable suspended plate 240 may be disposed above the fixed adjacent contact electrodes 226 and 224. These contact electrodes may be in electrical communication with two through substrate vias (TSVs) 126 and 124. There may be a conducting bonding pad on the exterior of the switch, for electrical attachment to other devices and equipment.

[0073] A first substrate 200 supports the movable plate 240 with at least one electrical shunt bar 260. As before, a permeable material 220, 222 is deposited adjacent the shunt bar. A pair of fixed contacts 226 and 224 is disposed on the second substrate 300. After forming these structures, the two substrates are bonded together to form the switch.

[0074] In the quiescent state, the movable plate may rest on the contacts 226 and 224, such that a conductive path exists between contacts 226 and 224. In other words, in the quiescent state, the switch is closed

[0075] A source of magnetic flux 250 may be disposed over the top of the first substrate 200. The flux will have a gradient associated with it. As is well known from magnetostatics, a permeable material will be drawn into an area having a gradient in the flux field, that is, into areas where the flux line are diverging or converging. Accordingly, upon activation of the electromagnet, the movable plate will be drawn up and off of the electrical contacts 226 and 224 and towards the electromagnet, because of the presence of the permeable material 220 and 222.

[0076] The electromagnet may be the source of flux and may be activated by applying a current to a solenoidal coil 250 wrapped around a permeable magnetic core 265. However, in this embodiment, the source of flux is rotated 90 degrees such that a magnetic pole is in closest proximity to the movable plate 240. That is, lines of flux will be emitted from the north end of the electromagnet and return in the far field to the southern end. Such an orientation may have a larger field gradient and thus be more effective in producing the flux gradient for interacting with the permeable material 222, 220. The source of flux, electromagnet 250, may be oriented such that the field lines exit the north pole closest to the switch wafer 2000 and reenter the south pole further away from the switch wafer 2000. It should be understood that this orientation is arbitrary, and the source may also be oriented with its south pole closest to the switch wafer 2000.

[0077] Another embodiment of the magnetic MEMS switch 102 is shown conceptually in FIG. 4. In this case again, the movable plate may have a magnetically permeable material 220 and 222, inlaid into or deposited on, the movable plate structure 240.

[0078] The movable suspended plate 240 may be disposed above the fixed adjacent contact electrodes 226 and 224. These contact electrodes may be in electrical communication with two through substrate vias (TSVs) 126 and 124. There may be conducting bonding pads 232 and 234 on the exterior of the switch, for electrical attachment to other devices and equipment.

[0079] As before, a first substrate 200 supports the movable plate 240 with at least one electrical shunt bar 260. A permeable material 220, 222 is deposited adjacent the shunt bar. A pair of fixed contacts 226 and 224 is disposed on the second substrate 300. After forming these structures, the two substrates are bonded together to form the switch.

[0080] These structures together define the plate substrate 2000 and the via substrate 3000. After forming these structures, the two substrates 2000 and 3000 are bonded together to form the switch.

[0081] In the quiescent state, the movable plate 240 may rest on the contacts 226 and 224, such that a conductive path exists between contacts 226 and 224. In other words, in the quiescent state, the switch is closed.

[0082] A source of magnetic flux may be disposed over the top of the first substrate 2000. The flux will have a gradient associated with it. As is well known from magnetostatics, a permeable material will be drawn into an area with diverging (or converging) lines of flux. Accordingly, upon activation of the electromagnet, the movable plate will be drawn up and off of the electrical contacts 226 and 224 and towards the electromagnet.

[0083] A permanent magnet may be the source of flux. That is, lines of flux will be emitted from the north end of the permanent magnet and return in the far field to the southern end. Such an orientation may have a larger field gradient and thus by more effective in producing the flux gradient for interacting with the permeable material 222, 220. The source of flux, here a permanent magnet 250 may be oriented such that the field lines exit the north pole closest to the switch wafer 2000 and reenter the south pole further away from the switch wafer 2000. It should be understood that this orientation is arbitrary, and the source may also be oriented with its south pole closest to the switch wafer 2000. The permanent magnet may be, for example, a cobalt alloy such as iron-chromium-cobalt, or an AlNiCo, CoPtCr, ceramic or rare earth magnetic material.

[0084] Another embodiment of the magnetic MEMS switch is shown conceptually in FIG. 5. In this case again, the movable plate may have a magnetically permeable material 220 and 222, inlaid into, or deposited on, the movable plate structure 240.

[0085] The movable suspended plate 240 may be disposed above the fixed adjacent contact electrodes 226 and 224. These contact electrodes may be in electrical communication with two through substrate vias (TSVs) 126 and 124. There may be conducting bonding pads 232 and 234 on the exterior of the switch, for electrical attachment to other devices and equipment.

[0086] As before, a first substrate 200 on which the movable plate 240 with at least one electrical shunt bar 260 is formed. A pair of fixed contact 226 and 224 is disposed on the second substrate 300.

[0087] As before, a first substrate 200 supports the movable plate 240 with at least one electrical shunt bar 260. A permeable material 220, 222 is deposited adjacent the shunt bar. A pair of fixed contacts 226 and 224 is disposed on the second substrate 300. After forming these structures, the two substrates are bonded together to form the switch.

[0088] Here again, reference number 200 refers to the substrate material used to create the movable plate structure 2000. The completed movable plate structure along with supporting features such as metallization pads, deposited and patterned materials, etc. is referred to as plate substrate or plate structure 2000. Similarly, reference number 300 refers to the substrate material used to create the via structure 3000. The completed via structure along with supporting features such as metallization pads, deposited and patterned materials, etc. is referred to as via substrate or via structure 3000. After forming these structures, the two substrates 2000 and 3000 are bonded together to form the switch.

[0089] In the quiescent state, the movable plate may be held above the contacts 226 and 224, by a restoring spring, when the magnetic flux is not present. As such, no conductive path exists between contacts 226 and 224. In other words, in the quiescent state, the switch is open. Accordingly, this is a normally open switch. The switch may be closed by positioning a source of magnetic flux below the switch 103 as shown.

[0090] A source of magnetic flux may be disposed below the second substrate 3000. The flux will have a gradient associated with it. As is well known from magnetostatics, a permeable material will be drawn into an area with diverging (or converging) lines of flux. Accordingly, upon activation of the electromagnet, the movable plate will be pulled down to the electrical contacts 226 and 224 and towards the electromagnet, thereby closing the switch.

[0091] Accordingly, a normally open switch rather than a normally closed swtich may be made by placing the source of flux 250 on the other side pf the swtich wafer 2000, and adjusting the parameters, dimensions and placements accordingly.

[0092] As before, either a permanent magnet or an electromagnet may be the source of flux. If an electromagnet, the magnet may be activated by applying a current to a solenoidal coil 250 wrapped around a permeably magnetic core 265. Like the other embodiments, the source of magnetic flux may be oriented vertically or horizontally. If oriented vertically, the source of flux may have either its north pole or its south pole closest to the switch.

[0093] The discussion now turns to methods for fabrication of magnetic MEMS switches shown in FIGS. 2-5.

[0094] Fabrication

[0095] The dual substrate magnetic MEMS device may be fabricated as follows, and the structure is shown in detail in FIG. 6. Beginning with the plate substrate 2000, an insulating layer of dielectric material 1020, such as SiO.sub.2 may be grown or deposited on the silicon surfaces. Alternatively, the SiO.sub.2 layer may exist as the insulating layer 1020 on a silicon-on-insulator (SOI) substrate 2000. The dielectric layer 1020 may then be etched away beneath and around the movable plate 240, using a hydrofluoric acid liquid etchant, for example. The liquid etch may remove the silicon dioxide dielectric layer 1020 in all areas where the movable plate 240 is to be formed. The liquid etch may be timed, to avoid etching areas that are required to affix the spring beams of the movable plate 240, which will be formed later, to the handle layer 1030. Additional details as to the dry and liquid etching procedure used in this method may be found in U.S. patent application Ser. No. 11/359,558 (Attorney Docket No. IMT-SOI Release), filed Feb. 23, 2006, now U.S. Pat. No. 7,785,913 issued Aug. 13, 2010 and incorporated by reference in its entirety.

[0096] The next step in the exemplary method is the formation of the dielectric pad 1150 as depicted in FIG. 4. Pad structure 1150 forms an electrical isolation barrier between the shunt bar 260 and the movable plate 240, and other standoffs may form a dielectric barrier preventing the corners of the movable plate 240 from touching high elevation points on the via substrate 3000. The applied magnetic force may draw the movable plate 240 towards the electrical contacts 222 and 224, closing the contacts and closing the switch.

[0097] The dielectric structure 1150 may be silicon dioxide, which may be sputter-deposited over the surface of the device layer 1010 of the SOI plate substrate 2000. The silicon dioxide layer may be deposited to a depth of, for example, about 300 nm. The 300 nm layer of silicon dioxide may then be covered with photoresist which is then patterned. The silicon dioxide layer is then etched to form insulating structure 1150. The photoresist is then removed from the surface of the device layer 1010 of the SOI plate substrate 2000. Because the photoresist patterning techniques are well known in the art, they are not explicitly depicted or described in further detail.

[0098] In the next step, a conductive material is deposited and patterned to form the shunt bar 260 and a portion of what may form the hermetic seal. If the seal is to be hermetic, the seal may include a metal alloy formed from melting a first metal into a second metal, and forming an alloy of the two metals which may block the transmission of gases. In preparation of forming the seal, a perimeter of the first metal material 1400 may be formed around the movable plate 240. The conductive material may actually be a multilayer comprising first a thin layer of chromium (Cr) for adhesion to the silicon and/or silicon dioxide surfaces. The Cr layer may be from about 5 nm to about 20 nm in thickness. The Cr layer may be followed by a thicker layer about 300 nm to about 700 nm of gold (Au), as the conductive metallization layer. Preferably, the Cr layer is about 15 nm thick, and the gold layer is about 600 nm thick. Another thin layer of molybdenum may also be used between the chromium and the gold to prevent diffusion of the chromium into the gold, which might otherwise raise the resistivity of the gold.

[0099] Each of the Cr and Au layers may be sputter-deposited using, for example, an ion beam deposition chamber (IBD). The conductive material may be deposited in the region corresponding to the shunt bar 260, and also the regions which will correspond to the bond line 1400 between the plate substrate 2000 and the via substrate 3000 of the dual substrate magnetic MEMS plate switch 100-103. This bond line area 1400 of metallization will form, along with a layer of indium, a seal which will hermetically seal the plate substrate 2000 with the via substrate 3000, as will be described further below.

[0100] While a Cr/Au multilayer is disclosed as being usable for the metallization layer of the shunt bar 260, it should be understood that this multilayer is exemplary only, and that any other choice of conductive materials or multilayers having suitable electronic transport properties may be used in place of the Cr/Au multilayer disclosed here. For example, other materials, such as titanium (Ti) may be used as an adhesion layer between the Si and the Au. Other exotic materials, such as ruthenium (Ru) or palladium (Pd) can be deposited on top of the Au to improve the switch contact properties, etc. However, the choice described above may be advantageous in that it can also participate in the sealing of the device through the alloy bond, as will be described more fully below.

[0101] The primary permeable features 220 and 222 may be formed by depositing and patterning a seed layer over portions of the substrate 200. A permeable materal such as nickel-iron permalloy, may then be plated onto the patterned areas. For the embodiments described below (FIGS. 7 and 8) having secondary flux guides, cavities may be etched into the substrate, a seed layer deposited conformally, and nickel iron then plated into the cavities. The plated substrate may then be planarized to remove any area proud of the remaining surface.

[0102] To form the movable plate 240 and restoring springs, the surface of the device layer 1010 of the SOI plate substrate 2000 is covered with photoresist which is patterned with the design of the movable plate and springs. The movable plate outline is the etched into the surface of the device layer by, for example, deep reactive ion etching (DRIE). Since the underlying dielectric layer 1020 has already been etched away, there are no stiction issues arising from the liquid etchant, and the movable plate is free to move upon its formation by DRIE. As before, since the photoresist deposition and patterning techniques are well known, they are not further described here.

[0103] Turning now to the via substrate 3000, another metallization region may be deposited over the substrate 3000, as shown in FIGS. 6 and 7. This metallization layer may form the bond ring 2400. In one exemplary embodiment, the metallization layer may actually be a multilayer of Cr/Au, the same multilayer as was used for the metallization layer 1400 on the plate substrate 2000 of the dual substrate magnetic MEMS plate switch 100. The metallization multilayer may have similar thicknesses and may be deposited using a similar process as that used to deposit metallization layer 1400 on substrate 2000. The metallization layer may also serve as a seed layer for the deposition of a metal solder bonding material, as described in the incorporated '798 patent. Layer 2200 may be a native insulating layer of SiO.sub.2 that forms around the silicon substrate 3000. Two more external (to the switch) electrical pads 232 and 234 may be connected to through substrate vias 126 and 124 within the device 100.

[0104] Each of the Cr and Au layers may be sputter-deposited using, for example, an ion beam deposition chamber (IBD). The conductive material may be deposited in the region corresponding to the contacts 226 and 224, and also the regions which will correspond to the bond line 2400 between the plate substrate 2000 and the via substrate 3000 of the dual substrate magnetic MEMS plate switch 100. This bond line area 1400 and 2400 of metallization may form, along with a layer of indium, a seal which will hermetically seal the plate substrate 2000 with the via substrate 3000. Alternatively, a thermocompression bonding technique may make use of two gold layers 1400 and 2400.

[0105] Finally, to form the switch, SOI plate substrate 2000 is pressed against the via substrate 3000 and the substrates are bonded together in a wafer bonding chamber for example. The adhesive may be the previously mentioned thermocompression bond, metal alloy bond, or a glass frit bond for example. At bonding, the substrate-to-substrate separation may be determined by a standoff 2400 in the bondline, as was shown in FIG. 6.

[0106] Exemplary Embodiments with Secondary Fluxguides

[0107] FIGS. 7 and 8 shows alternative embodiments of the magnetic MEMS switch, which use additional permeable magnetic features as fluxguides (secondary fluxguides) to improve the efficiency of the device. The secondary fluxguides may be larger and thicker, and disposed in the body of the substrates rather than near the switch contacts. The secondary fluxguides may serve to deliver more flux to the primary fluxguides, because they operate over larger lateral distances and are thicker. Together, these fluxguides may make an efficient magnetic structure with sufficient force to obtain good contact between the shunt bar 260 and the contacts 224 and 226.

[0108] As is well known from magnetostatics, permeable magnetic material can be used to guide, or concentrate, lines of magnetic flux in a particular location in space. Because of the very low reluctance, permeable materials tend to gather magnetic flux lines to themselves, thus concentrating them in a particular location. FIG. 7 shows an embodiment of the magnetostatic switch, which uses additional permeable magnetic features to focus flux in the vicinity of the movable plate 240.

[0109] In this embodiment 100 shown in FIG. 7, two permeable features, 10 and 12, may be inlaid or deposited in the substrate 2000. The procedure for forming these features is similar to that described above with respect to the other permeable magnetic materials. The dimensions of these features, 10, maybe on the order of 10 to 100 microns in length and at least 10 m in thickness. Once again, the purpose of these permeable features 10, 12 is to concentrate the lines of flux emanating from the magnet disposed above the substrate 2000 or below substrate 3000, as shown in FIG. 7, in the vicinity of the primary permeable features to 222 and 220, which are disposed on the movable plate 240.

[0110] When a source of magnetic flux 250 is active, such as a permanent magnet, or an electromagnet is energized, flux emanatng from the poles of the source 250 are gathered by the permeable features 10, in the vicinity of the movable plate 240. The presence of the fluxguides thus tends to draw the movable plate 240 towards the permeable features 10, 12, and magnet 250. If the shunt bar 240 is disposed against the contacts to 222 and 224, raising of this shunt bar would result in the opening of the contacts, that is, the opening of the switch shown in FIG. 7.

[0111] FIG. 8 shows another embodiment of the magnetic MEMS switch 100. In FIG. 8, the additional secondary flux guides, 10, 12 a permeable magnetic material is again inlaid or deposited on the via substrate 3000. This magnetic material 10, 12 may be formed in the same way as magnetic material 10 from FIG. 7. The presence of these permeable features 10, 12 is to draw and concentrate lines of flux emanating from a magnetic source, to the vicinity of the movable plate 240. Accordingly, in the quiescent position, the movable plate 240 is suspended above the electrical contacts 224 and 226. Upon activating the source of flux, or positioning it near the MEMS switch, with this magnetic flux source 250 disposed below this via substrate 3000, is to lower the shunt bar across the two electrical contacts, thus closing the switch.

[0112] Fabrication

[0113] FIGS. 9-14, described below, outline a fabrication procedure which may be used to make the magnetic dual substrate MEMS switch, which operates as a normally closed switch. Accordingly FIGS. 9-14 describe a fabrication method for forming the switch shown in FIG. 7.

[0114] The first step may begin in FIG. 9 with the substrate 200. Substrate 200 may be a silicon-on-insulator (SOI) substrate, which includes a thick handle layer, a thinner dielectric layer, and another thin device layer of silicon. Such composite substrates are well known in the art. Beginning with the substrate 200 shown in FIG. 9, the starting SOI substrate is shown.

[0115] In FIG. 10, on the upper surface of substrate 200, the cavities that will accommodate the permeable magnetic materials 10, 12 are formed, adjacent to the region that will become the movable plate 240. The permeable material may be electroplated using a seed layer, for example, as is known in the art. In FIG. 11. The primary permeable features 220 and 222 are deposited on the movable plate 240. As shown in FIG. 12, the shunt bar 260 is formed, along with the metal bondline, which as described above, may use a similar material. A dielectric material 1150 which will isolate the shunt bar from the remainder of conductive material of substrate 2000 may also be deposited.

[0116] In FIG. 13, the outline of the movable plate 240 is formed in the device layer of the substrate 2000. The movable plate 240 may be formed by deep reactive ion etching the device layer of The SOI substrate. In FIG. 14, the switch wafer 2000 which was just fabricated 200 is bonded to a via wafer 3000 using the bonding process described above, for example. That is, the two substrates may be bonded together using, for example, a metal alloy or thermocompression bond.

[0117] We now turn to the normally open embodiments shown in FIG. 8, and describe below a fabrication procedure for forming this structure. This procedure is illustrated by FIGS. 15-22, and described below. In FIG. 15, a bare silicon substrate 300 maybe photolithographically patterned with features that will form the permeable magnetic material 10, 12, as well as the through substrate vias 15. These features may be formed by deep reactive ion etching into the body of the substrate in FIG. 15. Aa SiO2 layer is then generally thermally grown over the entirety of the substrate 300. In Fig. and 16, the permeable magnetic material is electroplated into the voids 10, 12 formed in the silicon substrate in FIG. 15. This material may be electroplated in a seed layer, and perhaps using a conformally deposited and patterned seed layer. The top surface of substrate 300 may then be planarized using, for example, chemical mechanical polishing. The situation is as shown in FIG. 16.

[0118] The through substrate vias 124, 126 may also be electroplated with a conductive material such as copper or gold shown in FIG. 17. The top surface may once again be abraded or polished.

[0119] In FIG. 18, a conductive material 35 may be deposited and patterned, which will form the contacts 232 and 234 and the bond line, 1400. This material may be, for example, gold, copper, or aluminum.

[0120] In FIG. 19, a conductive spacer 35 may be deposited over the bondline feature 1400 which was formed in the previous step. The spacer may determine the separation between the two substrates which will be bonded in the subsequent steps.

[0121] The bonding step is shown in FIG. 20. In this bonding step, a switch wafer 2000 is bonded to the via wafer 3000 which was formed with the permeable features 10, 12, as described above. The bonding procedure may be similar, or identical, to that described above with respect to the preceding dual substrate magnetic MEMS switch illustrations.

[0122] In FIG. 21, the obverse side of the via wafer 3000 may be ground down to reveal the through substrate vias 132, 134 formed previously. The grinding may remove all of the silicon material from the blind holes which were formed earlier, rendering these features continuous through the substrate material.

[0123] In FIG. 22 The external contact metallurgy 45 is deposited on the outside of the switch. This metallurgy may form the bonding pads which will be used to attach electrical leads. These pads may couple the MEMS magnetic dual substrate switch to, for example, to a printed circuit board. The bonding pad and these metallic features are shown as 45 in FIG. 22.

[0124] Some exemplary dimensions are:The pPrimary permeable feature may be about 0.1-2.0 microns thick, 10-50 microns wide. The secondary permeable features may be about 10-50 microns thick and 50-300 microns wide. Other exemplary dimensions for other structures may be found in the incorporated '691 and '798 patents.

[0125] A method for manufacturing an magnetic MEMS switch is disclosed. It may include forming a movable plate on a first substrate, wherein the movable plate is coupled to the first substrate by a plurality of restoring springs, forming at least two electrical contacts on a second substrate, forming an area of permeable magnetic material on at least one of the first and the second substrates and coupling the first substrate to the second substrate with a seal that seals the MEMS switch. The magnetic material may be at least one of a permanent magnetic material and a permeable magnetic material. The permanent magnetic material comprises a cobalt alloy and the permeable magnetic material comprises a NiFe alloy. The method may further include forming electrical vias through a thickness of the second substrate, wherein forming the electrical vias comprises forming at least one blind hole on a front side of the second substrate, forming a seed layer in the at least one blind hole, depositing a conductive material onto the seed layer, and removing material from a rear side of the second substrate to remove a dead-end wall of the at least one blind hole.

[0126] Depositing a conductive material onto the seed layer may comprise plating copper onto the seed layer, and coupling the first substrate to the second substrate with a hermetic seal may comprise depositing a first metal on the first substrate, depositing a second metal on the second substrate, and coupling the first substrate to the second substrate by heating the first substrate and the second substrate to at least a melting point of at least one of the first metal and the second metal.

[0127] The first substrate may be a silicon-on-insulator substrate, and the second substrate may be at least one of a silicon wafer, a silicon-on-insulator substrate, and a glass wafer.

[0128] Forming the movable plate on the first substrate may include etching an outline of the movable plate in a device layer of the silicon-on-insulator substrate, releasing the movable plate from a handle wafer of the silicon-on-insulator substrate by etching an oxide layer between the device layer and the handle wafer.

[0129] A magnetic MEMS switch is also disclosed, and may include a movable plate formed on a first substrate, wherein the movable plate is coupled to the first substrate by a plurality of restoring springs, and wherein the movable plate has a magnetic material inlaid therein, at least one electrical contact formed on a second substrate, and a hermetic seal which couples the first substrate to the second substrate, and seals the MEMS switch, such that the MEMS switch operated by disposing a source of magnetic field gradient in a vicinity of the magnetic MEMS switch, wherein the gradient is sufficient to move the movable plate and open or close the switch.

[0130] The first substrate may be a silicon-on-insulator substrate including a device layer, a handle wafer and an insulating oxide layer between the device layer and the handle wafer, and the second substrate is at least one of a silicon substrate, a silicon-on-insulator substrate and a glass substrate. The switch may also include an electromagnet disposed above the first substrate or below the second substrate, and a magnetic plate formed on the second substrate. It may also include a permanent magnet disposed above the first substrate or below the second substrate. The magnetic material may be at least one of a permanent magnetic material and a permeable magnetic material. The permanent magnetic material may be a cobalt alloy and the permeable magnetic material may be a NiFe alloy.

[0131] The movable plate is formed from the device layer of the silicon-on-insulator substrate, and affixed to the handle wafer of the silicon-on-insulator substrate by the oxide layer. The movable plate further may comprise a shunt bar which electrically connects two electrical contacts formed on the second substrate when the magnetic MEMS switch is closed, wherein the shunt bar is electrically isolated from other portions of the movable plate.

[0132] A method of operating the magnetic MEMS switch is also disclosed and may include applying a current to the electromagnet disposed above the movable plate formed on the first substrate, opening an electrical connection between the two electrical contacts by raising the movable plate and shunt bar toward the electromagnet in response to the applied current. The method may further comprise applying an input signal to one of the contacts formed on the second substrate, and obtaining an output signal from the other electrical contact formed on the second substrate.

[0133] While various details have been described in conjunction with the exemplary implementations outlined above, various alternatives, modifications, variations, improvements, and/or substantial equivalents, whether known or that are or may be presently unforeseen, may become apparent upon reviewing the foregoing disclosure. For example, while the disclosure describes a number of fabrication steps and exemplary thicknesses for the layers included in the MEMS switch, it should be understood that these details are exemplary only, and that the systems and methods disclosed here may be applied to any number of alternative MEMS or non-MEMS devices. Furthermore, although the embodiment described herein pertains primarily to an electrical switch, it should be understood that various other devices may be used with the systems and methods described herein, including actuators and valves, for example. Accordingly, the exemplary implementations set forth above, are intended to be illustrative, not limiting.