SYSTEM AND METHOD FOR FORCED AIR COOLING OF ELECTRICAL DEVICE

Abstract

An invention relates to a field of electrical engineering, in particular to various cabinet-type electronic devices of a general purpose with an equipment airflow cooling, conducted by virtue of a forced ventilation, and can be used in construction of various electrical devices, particularly of electric motor control stations. A claimed invention essence lies in a fact that the forced air cooling system of the power and low-current components of the electrical device contains an air heat exchanger, the power electronic components, as well as coolers, being in a thermal contact with the low-current electronic components, configured to be cooled with the single flow of previously cleaned extraneous air directed from a top of the enclosure to its bottom part. The coolers are spaced along a length of an air channel of the electronic device, forming a mixing zone of heated and cool air.

Claims

1. A system of a forced air cooling of power and low-current components of an electrical device, characterized by a presence of at least two independent cooling circuits, and containing an air channel and at least one heat exchanger, placed in a single enclosure, connected to at least one sealed compartment, protected from a contact with an outside ambient, as well as coolers, arranged within the air channel in a way of a directed air flow, distinctive in that the air heat exchanger, the power electronic components, as well as the coolers being in thermal contact with the low-current electronic components, are configured to be cooled with a single flow of previously cleaned extraneous air directed from a top of the enclosure to its bottom part, while the coolers are arranged along a length of the air channel of the electronic device, forming a mixing zone of heated and cool air, providing that a bypass air channel, supplying the cool air into the mixing zone, is arranged above at least one cooler.

2. The system of the forced air cooling of the electrical device according to claim 1, wherein the bypass air channel is arranged within the air channel of the electrical device and is configured to control an air flow motion by partial closing of an inlet opening with a regulating gate.

3. The system of the forced air cooling of the electrical device according to claim 1, wherein the mixing zone of the air flows is arranged within a space located between the coolers with a partial use of their internal volume.

4. The system of the forced air cooling of the electrical device according to claim 1, wherein the power electronic components are represented as at least one inductance coil with a closed core, containing a solenoid, cooled by the directed air flow, concentrated in the air channels, formed between polymer casings and coils of the solenoid.

5. A system of a forced air cooling of power and low-current components of an electrical device, characterized by a presence of at least two independent cooling circuits, and containing an air channel and at least one heat exchanger, placed in a single enclosure, connected to at least one sealed compartment, protected from a contact with an outside ambient, as well as coolers, arranged within the air channel in a way of a directed air flow, distinctive in that low-current electronic components are advantageously located in the sealed compartment and include at least one thermoelectric device capable of a moisture removal from a sealed compartment of the electrical device, that contains cooled and heated surfaces, while the heated surface is configured in thermal contact with a cooler placed inside of the air channel in the way of the directed air flow.

6. A method of a forced air cooling of an electronic device, comprising performing at least one of cooling circuits sealed from an adjacent circuit and protected from contact with an outside ambient; conducting a cooling air circulation in a sealed circuit in a closed cycle within at least one sealed compartment; cooling the air in the sealed circuit by means of an air heat exchanger, connected to the sealed compartment and installed in the adjacent cooling circuit; performing a thermal contact of the heat exchanger, as well as power electronic components and coolers with low-current electronic components; cooling the heat exchanger, the power electronic components and the coolers with a single flow of previously cleaned extraneous air directed from a top of an enclosure to its bottom part; directing the air flow through the coolers spaced along a length of an air channel of the electronic device, into a mixing zone of heated and cool air; supplying the cool air into the mixing zone by means of a bypass air channel, installed above at least one cooler.

7. The method of the forced air cooling of the electrical device according to claim 6, wherein the sealed cooling circuit is capable of a moisture removal and is formed of at least one sealed compartment with the low-current electronic components placed therein predominantly, as well as of at least one air heat exchanger and an air channels system.

8. The method of the forced air cooling of the electrical device according to claim 7, wherein the moisture removal from the sealed cooling circuit is performed by means of at least one thermoelectric device, containing cooled and heated surfaces, while the heated surface is installed in a thermal contact with the cooler placed inside of the air channel in the way of a directed air flow.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0022] An essence of the claimed invention is explained, but is not limited to the following drawings:

[0023] FIG. 1 shows a layout of the electronic device compartments;

[0024] FIG. 2 shows the thermoelectric device of moisture removal;

[0025] FIG. 3 shows the inductance coil;

[0026] FIG. 4 shows the air channel of the forced air cooling system;

[0027] FIG. 5 shows a chart of the air flows motion.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0028] The claimed invention can be embodied as the system and the method of the forced air cooling of the cabinet-type electrical device, comprising enclosure 1 (FIG. 1), containing the power and low-current electronic components, installed both directly inside of the enclosure and on the surface of coolers (radiators) 2, 3, placed in a way of the directed air flow, mostly within air channel 4, equipped with blowing fan 5.

[0029] According to the described embodiment, the forced air cooling system involves a presence of at least two independent cooling circuits 6, 7. While at least one of said cooling circuits 6 is configured sealed from adjacent cooling circuit 7 and protected from the outside ambient contact. Sealed cooling circuit 6 contains predominantly low-current electronic components 8, enclosed within sealed compartment 9, as well as at least one air heat exchanger 10, connected to the said sealed compartment by means of air channels system 11. Also cooling circuit 6 is capable to remove the moisture, that can condensate out of air while sharp variations in temperature occur by means of thermoelectric device 12 (FIG. 2), containing cooling 13 and heated 14 surfaces, while the heated surface is configured in the thermal contact with cooler 15, placed inside of air channel 4 in a way of the directed air flow.

[0030] Also air heat exchanger 10 and the power electronic components are arranged in the way of the flow of previously cleaned extraneous air, directed from the top of the enclosure to its bottom part. According to the described embodiment the power electronic components are represented as at least one inductance coil 16. The mentioned coil, that is shown on FIG. 3 in details, contains solenoid 17, cooled by the directed air flow, concentrated in air channels 18, formed between polymer casings 19, 20 and coils of the solenoid by means of eliminating any motion of the said air flow via the core of the coil.

[0031] Air heat exchanger 10, placed in the way of the directed air flow, predominantly is made of a set of hollow tube elements, that also provide advanced air purification from mechanical impurities. Providing that according to the claimed embodiment of the invention the air cooling system is equipped with sand and dust protection device 21 (FIG. 1).

[0032] According to the claimed embodiment air channel 4 of the electrical device constitutes a part of cooling circuit 7. The specified air channel is executed as a vertical ventilation duct, separating the compartments of the electrical device, containing a chamber with coolers 2, 3, as well as cooler 15 of thermoelectrical device 12 for moisture removal.

[0033] Air channel 4 is shown on FIG. 4 in details. According to the described embodiment of the invention coolers 2, 3 are spaced along the length of air channel 4 of the electronic device, forming mixing zone 22 of heated 23 and cool 24 air flows, providing that bypass air channel 25 of the cool air supply to mixing zone 22 is arranged above at least one cooler 2. Bypass air channel 25 is arranged within air channel 4 of the electrical device and is configured to control the air flow motion by partial closing of the inlet opening with regulating gate 26. Also according to the preferred embodiment air flows mixing zone 22 is arranged within the space located between the coolers with the partial use of their internal volume. Such a performance allows to increase an efficiency of the cooling system and reduce the dimensions of the air channel

[0034] The method based on exploiting the abovementioned system of the forced air cooling of the electrical device comprises performing at least one of cooling circuits sealed 6 from adjacent circuit 7 and protected from contact with the outside ambient; conducting the cooling air circulation in sealed circuit 6 in the closed cycle within at least one sealed compartment 9; cooling the air in sealed circuit 6 by means of air heat exchanger 10, connected to the sealed compartment and installed in adjacent cooling circuit 7; performing the thermal contact of heat exchanger 9, as well as the power electronic components and coolers with low-current electronic components; cooling heat exchanger 9, the power electronic components and the coolers with the single flow of previously cleaned extraneous air directed from the top of the enclosure to its bottom part; arranging coolers 2, 3 along the length of air channel 4 of the electronic device, while forming zone 22 of mixing heated 23 and cool 24 air flows; supplying the cool air into the mixing zone by means of bypass air channel 25, installed above at least one cooler 2; configuring sealed cooling circuit 6 to perform the moisture removal; forming sealed cooling circuit 6 of at least one sealed compartment 9 with low-current electronic components 8 placed therein predominantly, as well as of at least one air heat exchanger 10 and air channels system 11.

[0035] The claimed system of the forced air cooling operates as follows.

[0036] The chart of the air flow motion is shown on FIG. 5. Air from the outside ambient is being drawn into unsealed cooling circuit 7 (marked with a heavy line) under an influence of blowing fan 5 through sand and dust protection device 21. The insertion air passes around the hollow tube elements of air heat exchanger 10, while obtaining the advanced purification, and afterwards gets into air channel 4, providing a passage of the cooling air through coolers 2, 3, 15, as well as cooled power electronic components 16.

[0037] The cooling air is supplied into air channel 4 under the influence of blowing fan 5 (as shown on FIG. 4), where it comes on the first cooler 2, providing that a part of the cool air gets into bypass air channel 25, through which it passes to enter mixing zone 22 of cool 24 and heated 23 air. After passing air flows mixing zone 22 the cooled air gets into cooler 3, following in the way of the air flow motion, and in being drawn out through openings 27, located in the bottom part of the enclosure of the electronic device.

[0038] Simultaneously the cooling of the electronic components, arranged within sealed compartment 9, is conducted by means of a continuous circulation of the cooling air within the closed cooling circuit by virtue of at least one recirculating fan 28. The cooling air flow is supplied onto units with the electrical equipment, after passing of which the heated air gets into air heat exchanger 10, that is being cooled by means of insertion extraneous air 5. The cooled air is used repeatedly for cooling the electronic components of at least one sealed compartment after passing the heat exchanger.

[0039] Providing that the moisture removal is performed in course of the continuous air circulation within closed circuit 6 by means of thermoelectric device 12. The condensed moisture is removed out of the enclosure of the electrical device without the sealing loss, involving a use of at least one partly permeable drainage element 29, by means of which the moisture is drawn outside and its ingress into the enclosure of the electrical device is prevented. The moisture condensed on the surface of the thermoelectrical device is directed into an inlet of drainage element 29, providing that at least one drainage element is installed in the bottom part of the enclosure and aligned vertically with moisture removal element 30, placed above the drainage element and connected with the thermoelectrical device.

[0040] The implementation of the claimed invention is instrumental for the mentioned technical result, providing simplifying the design of the cooling system, reducing dimensions of the electrical device and increasing efficiency of the cooling system of both power and low-current electronic components by means of a single directed air flow. Also the implementation of the described system and method of the forced air cooling leads to increase in efficiency of the air dehumidification of the sealed enclosure of the electric device, providing the moisture removal without the sealing loss.

[0041] The claimed invention provides various options and alternative forms of embodiment. A particular embodiment is disclosed in a description and illustrated by means of the given graphic materials. The described system and method are not limited by the particular disclosed form and may encompass all possible embodiments, equivalents and alternatives, within the limits of essential features disclosed in the claim.