Composition

Abstract

A suitable combination of a composition for formation of a resin mold with a pattern and a composition for formation of resin to which the pattern is transferred from the resin mold is found.

Claims

1. A method of manufacturing a component, the method comprising: providing a first composition containing a photoinitiator; providing a resin mold with a pattern; curing the first composition to form a film to which a pattern is transferred from the resin mold having the pattern; and separating the film from the resin mold, wherein: when the resin mold's Shore hardness D is from 1 to 50, the film's Shore hardness is between 1 and 100, or when the resin mold's Shore hardness D is from 51 to 60, the film's Shore hardness is between 1 and 60; and the first composition contains at least one compound A represented by chemical formula (1) and a compound B represented by chemical formula (2), ##STR00008## wherein, in formula (1), each of R.sup.1 and R.sup.2 is a hydrogen atom or methyl group; each of R.sup.3 and R.sup.4 represents a substituent including at least one atom selected from the group consisting of hydrogen atom, carbon atom, nitrogen atom, and sulfur atom; and n denotes an integer from 1 to 10, ##STR00009## wherein, in formula (2), each of R.sup.5 and R.sup.6 is a hydrogen atom or methyl group; each of R.sup.7 and R.sup.8 represents a substituent including at least one atom selected from the group consisting of hydrogen atom, carbon atom, nitrogen atom, and sulfur atom; and each of m and r denotes an integer from 1 to 30.

2. The method according to claim 1 wherein the pattern's size is greater than or equal to 50 m.

3. The method according to claim 1 wherein the component is selected from the group consisting of a lens, a waveguide, and a diffuser.

Description

DETAILED DESCRIPTION

(1) Experimental Procedures:

(2) Table 1 shows compositions for the formation of resin mold(s) with a pattern with size of 200 m and for formation of resin to which the pattern is transferred from resin mold and shore hardness. Table 2 shows compositions for formation of resin mold with a pattern with size of 600 m and for formation of resin to which the pattern is transferred from resin mold and shore hardness. The phrase a pattern with size of 200 m typically means that, when a pattern formed by the recess and convex portions, each of the recess portions has a width of 200 m while the phrase a pattern with size of 600 m typically means each of recess portions has a width of 600 m.

(3) Compositions for formation of a resin mold contains constituents A to E while compositions of formation of a resin (pattern-transferred resin) to which the pattern of the resin mold is transferred from the resin mold contains F to M and E.

(4) Constituents A to M are following compounds.

(5) ##STR00007##

(6) TABLE-US-00001 TABLE 1 Compositions for formation of resin mold having a pattern with size of 200 m and for formation of resin (pattern-transferred resin) to which the pattern is transferred from resin mold and Shore hardness. Entry Entry Entry Entry Entry Entry Entry Entry Entry Entry 1 2 3 4 5 6 7 8 9 10 Composition for Constituent A 99.5% 99.5% 99.5% 49.75% 49.75% 49.75% 20.7% 20.7% 20.7% 20.7% formation of resin Constituent B 49.75% 49.75% 49.75% 78.8% 78.8% 78.8% 78.8% mold with a pattern Constituent C Constituent D Constituent E 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% Composition for Constituent F 62.0% 62.0% 62.0% formation of pattern- Constituent G 37.8% 37.8% 37.8% transferred resin Constituent H 49.9% 37.8% 49.9% 37.8% 37.8% Constituent I 49.9% 49.9% Constituent J 62.0% 62.0% 99.8% 89.8% 62.0% Constituent K 10.0% Constituent L Constituent M Constituent E 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% Shore hardness of resin mold with a 28 28 28 48 48 48 58 58 58 58 pattern Shore hardness of pattern-transferred 11 78 70 11 78 70 11 48 56 70 resin Pattern size 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m Presence of damage of resin mold or A A A A A A A A A P pattern-transferred resin Entry Entry Entry Entry Entry Entry Entry Entry Entry 11 12 13 14 15 16 17 18 19 Composition for Constituent A formation of resin Constituent B 99.5% 87.1% 99.5% 99.5% 99.5% 68.4% 68.4% 68.4% 68.4% mold with a pattern Constituent C 12.4% Constituent D 31.1% 31.1% 31.1% 31.1% Constituent E 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% Composition for Constituent F 62.0% 62.0% .sup.62% 62.0% 62.0% 62.0% formation of pattern- Constituent G 37.8% 37.8% 37.8% transferred resin Constituent H Constituent I Constituent J 98.8% 89.8% 98.8% Constituent K 10.0% Constituent L 37.8% Constituent M 37.8% 37.8% Constituent E 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% Shore hardness of resin mold with a 65 69 65 65 65 78 78 78 78 pattern Shore hardness of pattern-transferred 11 11 41 48 56 11 35 41 48 resin Pattern size 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m Presence of damage of resin mold or A A A A P A A A P pattern-transferred resin

(7) TABLE-US-00002 TABLE 2 Compositions for formation of resin mold having a pattern with size of 600 m and for formation resin (pattern-transferred resin) to which the pattern is transferred and Shore hardness Entry Entry Entry Entry Entry Entry Entry Entry 20 21 22 23 24 25 26 27 Composition for Constituent A 99.5% 99.5% 99.5% 49.75% 49.75% 49.75% 20.7% 20.7% formation of resin Constituent B 49.75% 49.75% 49.75% 78.8% 78.8% mold with a pattern Constituent C Constituent D Constituent E 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% Composition for Constituent F 62.0% 62.0% 62.0% formation of pattern- Constituent G 37.8% 37.8% 37.8% transferred resin Constituent H 49.9% 37.8% 49.9% 37.8% Constituent I 49.9% 49.9% Constituent J 62.0% 62.0% 99.8% Constituent K Constituent L Constituent M Constituent E 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% Shore hardness of resin mold with a 28 28 28 48 48 48 58 58 pattern Shore hardness of pattern-transferred 11 78 70 11 78 70 11 48 resin Pattern size 600 m 600 m 600 m 600 m 600 m 600 m 600 m 600 m Presence of damage of resin mold or A A A A A A A A pattern-transferred resin Entry Entry Entry Entry Entry Entry Entry Entry 28 29 30 31 32 33 34 35 Composition for Constituent A 20.7% formation of resin Constituent B 78.8% 99.5% 87.1% 99.5% 99.5% 68.4% 68.4% 68.4% mold with a pattern Constituent C 12.4% Constituent D 31.1% 31.1% 31.1% Constituent E 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% Composition for Constituent F 62.0% 62.0% .sup.62% 62.0% 62.0% 62.0% formation of pattern- Constituent G 37.8% 37.8% 37.8% transferred resin Constituent H Constituent I Constituent J 89.8% 98.8% Constituent K 10.0% Constituent L 37.8% Constituent M 37.8% 37.8% Constituent E 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% Shore hardness of resin mold with a 58 65 69 65 65 78 78 78 pattern Shore hardness of pattern-transferred 56 11 11 41 48 11 35 41 resin Pattern size 600 m 600 m 600 m 600 m 600 m 600 m 600 m 600 m Presence of damage of resin mold or P A A A P A A P pattern-transferred resin

(8) If damage or a deficit is found for resin mold or pattern-transferred resin when pattern-transferred resin is separated from resin mold, or if pattern-transferred resin cannot be separated from resin mold, the combination of compositions is designated as P as shown in Tables 1 and 2. If damage or deficit is not found in either of the resin mold and the pattern-transferred resin when pattern-transferred resin is separated from resin mold, the combination of compositions is designated as A as shown in Tables 1 and 2.

(9) Blends of the Shore hardness of resin molds and the Shore hardness of pattern-transferred resin observed. As shown in Tables 1 and 2, when the Shore hardness of a resin mold formed from the composition for formation of resin mold with the pattern ranges from 1 to 50 and the Shore hardness of a pattern-transferred resin ranges from 1 to 100, damage is not found for either the resin mold or the pattern-transferred resin when the pattern-transferred resin is separated from the resin mold.

(10) If the pattern size is 200 as shown in Table 1, when the Shore hardness of a resin mold formed from the composition for formation of resin mold with the pattern ranges from 51 to 60 and the Shore hardness of a pattern-transferred resin ranges from 1 to 60, damage is not found for either the resin mold or the pattern-transferred resin when the pattern-transferred resin is separated from the resin mold.

(11) If the pattern size is 200 as shown in Table 1, when the Shore hardness of a resin mold formed from the composition for formation of resin mold with the pattern ranges from 61 to 75 and the Shore hardness of a pattern-transferred resin ranges from 1 to 55, damage is not found for either the resin mold or the pattern-transferred resin when the pattern-transferred resin is separated from the resin mold.

(12) If the pattern size is 200 as shown in Table 1, when the Shore hardness of a resin mold formed from the composition for formation of resin mold with the pattern ranges from 76 to 100 and the Shore hardness of a pattern-transferred resin ranges from 1 to 45, damage is not found for either the resin mold or the pattern-transferred resin when the pattern-transferred resin is separated from the resin mold.

(13) If the pattern size is 600 as shown in Table 2, when the Shore hardness of a resin mold formed from the composition for formation of resin mold with the pattern ranges from 1 to 50 and the Shore hardness of a pattern-transferred resin ranges from 1 to 100, damage is not found for either the resin mold or the pattern-transferred resin when the pattern-transferred resin is separated from the resin mold.

(14) If the pattern size is 600 m, as shown in Table 2, if the Shore hardness of a resin mold formed from the composition for formation of resin mold with the pattern ranges from 51 to 60 and the Shore hardness of a pattern-transferred resin ranges from 1 to 50, then damage is not found for either the resin mold or the pattern-transferred resin when the pattern-transferred resin is separated from the resin mold.

(15) If the pattern size is 600 m, as shown in Table 2, if the Shore hardness of a resin mold formed from the composition for formation of resin mold with the pattern ranges from 61 to 75 and the Shore hardness of a pattern-transferred resin ranges from 1 to 45, then damage is not found for either the resin mold or the pattern-transferred resin when the pattern-transferred resin is separated from the resin mold.

(16) If the pattern size is 600 m, as shown in Table 2, if the Shore hardness of a resin mold formed from the composition for formation of resin mold with the pattern ranges from 76 to 100 and the Shore hardness of a pattern-transferred resin ranges from 1 to 40, then damage is not found for either the resin mold or the pattern-transferred resin when the pattern-transferred resin is separated from the resin mold.

(17) TABLE-US-00003 TABLE 3 Compositions for formation of resin mold having a pattern with size of 200 m and for formation of resin to which the pattern is transferred (pattern-transferred resin) and Shore hardness, reaction percentages of resin mold and pattern-transferred resin Entry Entry Entry Entry Entry Entry Entry Entry Entry Entry 36 37 38 39 40 41 42 43 44 45 Composition for Constituent A 49.75% 49.75% 20.7% 20.7% formation of resin Constituent B 49.75% 49.75% 78.8% 78.8% 99.5% 99.5% 68.4% 68.4% 68.4% 68.4% mold with a pattern Constituent C Constituent D 31.1% 31.1% 31.1% 31.1% Constituent E 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% Composition for Constituent F 62.0% 62.0% formation of pattern- Constituent G transferred resin Constituent H 49.9% 49.9% 37.8% 37.8% Constituent I 49.9% 49.9% Constituent J 62.0% 62.0% 89.8% 89.8% 98.8% 98.8% Constituent K 10.0% 10.0% Constituent L Constituent M 37.8% 37.8% Constituent E 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% Exposure time of resin mold 1200 10 1200 10 1200 10 1200 10 1200 10 Reaction percentage of resin mold .sup.80% .sup.46% .sup.76% .sup.43% .sup.68% .sup.40% .sup.65% .sup.38% .sup.65% .sup.38% Shore hardness of resin mold 48 12 58 15 65 22 78 40 78 40 Exposure time of pattern-transferred 400 400 400 400 400 400 400 400 400 400 resin Reaction percentage of pattern- .sup.63% .sup.63% .sup.70% .sup.70% .sup.78% .sup.78% .sup.82% .sup.82% .sup.75% .sup.75% transferred resin Shore hardness of pattern- 78 78 70 70 56 56 41 41 48 48 transferred resin Pattern size 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m Presence of damage of resin mold or A P P P P P A P P P pattern-transferred resin

(18) As shown in Entries 37, 39, 41, 43 and 45, if the reaction percentages of resin molds are less than 50%, damages arise in resin molds or pattern-transferred resins.

(19) As shown in Entries 38, 40 and 44, if the reaction percentages of resin molds are greater than 50%, presence of absence of damages in resin molds or pattern-transferred resins depends on blends of the Shore hardness of resin molds and pattern-transferred resin as explained above.

(20) TABLE-US-00004 TABLE 4 Compositions for formation of resin mold having a pattern with size of 600 m and for formation of resin to which the pattern is transferred (pattern-transferred resin) and Shore hardness, reaction percentages of resin mold and pattern-transferred resin Entry Entry Entry Entry Entry Entry Entry 46 47 48 49 50 51 52 Composition for Constituent A 49.75% 49.75% 20.7% 20.7% 20.7% 20.7% formation of resin Constituent B 49.75% 49.75% 78.8% 78.8% 78.8% 78.8% 87.1% mold with a pattern Constituent C 12.4% Constituent D Constituent E 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% Composition for Constituent F 62.0% 62.0% 62.0% formation of pattern- Constituent G 37.8% 37.8% 37.8% transferred resin Constituent H Constituent I Constituent J 99.8% 99.8% 89.8% 89.8% Constituent K 10.0% 10.0% Constituent L Constituent M Constituent E 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% Exposure time of resin mold 1200 10 1200 10 1200 10 1200 Reaction percentage of resin mold .sup.80% .sup.46% .sup.76% .sup.43% .sup.76% .sup.43% .sup.70% Shore hardness of resin mold 48 12 58 15 58 15 69 Exposure time of pattern-transferred 400 400 400 400 400 400 400 resin Reaction percentage of pattern- .sup.88% .sup.88% .sup.75% .sup.75% .sup.78% .sup.78% .sup.88% transferred resin Shore hardness of pattern- 11 11 48 48 56 56 11 transferred resin Pattern size 600 m 600 m 600 m 600 m 600 m 600 m 600 m Presence of damage of resin mold or A P A P P P A pattern-transferred resin Entry Entry Entry Entry Entry Entry Entry 53 54 55 56 57 58 59 Composition for Constituent A Formation of resin Constituent B 87.1% 99.5% 99.5% 68.4% 68.4% 68.4% 68.4% mold with a pattern Constituent C 12.4% Constituent D 31.1% 31.1% 31.1% 31.1% Constituent E 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% Composition for Constituent F 62.0% 62.0% 62.0% 62.0% 62.0% Formation of pattern- Constituent G 37.8% transferred resin Constituent H Constituent I Constituent J 98.8% 98.8% Constituent K Constituent L 37.8% 37.8% Constituent M 37.8% 37.8% Constituent E 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% Exposure time of resin mold 10 1200 10 1200 10 1200 10 Reaction percentage of resin mold .sup.45% .sup.68% .sup.40% .sup.65% .sup.38% .sup.65% .sup.38% Shore hardness of resin mold 25 65 22 78 40 78 40 Exposure time of pattern-transferred 400 400 400 400 400 400 400 resin Reaction percentage of pattern- .sup.88% .sup.75% .sup.75% .sup.82% .sup.82% .sup.82% .sup.82% transferred resin Shore hardness of pattern- 11 48 48 35 35 41 41 transferred resin Pattern size 600 m 600 m 600 m 600 m 600 m 600 m 600 m Presence of damage of resin mold or P P P A P P P pattern-transferred resin

(21) As shown in Entries 47, 49, 51, 53 and 55, 57 and 59, if the reaction percentages of resin molds are lower than 50%, damages arise in resin molds or pattern-transferred resins.

(22) As shown in Entries 50, 54 and 58, if the reaction percentages of resin molds are higher than 50%, presence of absence of damages in resin molds or pattern-transferred resins depends on blends of the Shore hardness of resin molds and pattern-transferred resin as explained above.

(23) TABLE-US-00005 TABLE 5 Compositions for formation of resin mold having a pattern with size of 600 m and for formation of resin to which the pattern is transferred (pattern-transferred resin) and Shore hardness, reaction percentages of resin mold and pattern-transferred resin Entry Entry Entry Entry Entry Entry Entry Entry Entry Entry Entry 60 61 62 63 64 65 66 67 68 69 70 Composition for Constituent A 99.5% 99.5% 49.75% 49.75% 20.7% 20.7% 20.7% 20.7% 20.7% 20.7% formation of resin Constituent B 49.75% 49.75% 78.8% 78.8% 78.8% 78.8% 78.8% 78.8% 99.5% mold with a pattern Constituent C Constituent D Constituent E 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% Composition for Constituent F 62.0% 62.0% 62.0% 62.0% 62.0% formation of pattern- Constituent G 37.8% 37.8% 37.8% 37.8% 37.8% transferred resin Constituent H 49.9% 49.9% 37.8% 37.8% Constituent I 49.9% 49.9% Constituent J 89.8% 89.8% 62.0% 62.0% Constituent K 10.0% 10.0% Constituent L Constituent M Constituent E 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% Exposure time of resin mold 1200 1200 1200 1200 1200 1200 1200 1200 1200 1200 1200 Reaction percentage of resin mold .sup.85% .sup.85% .sup.80% .sup.80% .sup.76% .sup.76% .sup.76% .sup.76% .sup.76% .sup.76% .sup.68% Shore hardness of resin mold 28 28 48 48 58 58 58 58 58 58 65 Exposure time of pattern-transferred 400 10 400 10 400 10 400 10 400 10 400 resin Reaction percentage of pattern- .sup.88% .sup.45% .sup.63% .sup.42% .sup.88% .sup.45% .sup.78% .sup.46% .sup.70% .sup.45% .sup.88% transferred resin Shore hardness of pattern- 11 5 78 51 11 5 56 25 70 40 11 transferred resin Pattern size 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m Presence of damage of resin mold or A P A P A P A P P P A pattern-transferred resin Entry Entry Entry Entry Entry Entry Entry Entry Entry Entry Entry 71 72 73 74 75 76 77 78 79 80 81 Composition for Constituent A formation of resin Constituent B 99.5% 99.5% 99.5% 99.5% 99.5% 68.4% 68.4% 68.4% 68.4% 68.4% 68.4% mold with a pattern Constituent C Constituent D 31.1% 31.1% 31.1% 31.1% 31.1% 31.1% Constituent E 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% Composition for Constituent F 62.0% 62.0% 62.0% 62.0% 62.0% formation of pattern- Constituent G 37.8% 37.8% 37.8% transferred resin Constituent H Constituent I Constituent J 98.8% 98.8% 89.8% 89.8% 98.8% 98.8% Constituent K 10.0% 10.0% Constituent L Constituent M 37.8% 37.8% Constituent E 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% Exposure time of resin mold 1200 1200 1200 1200 1200 1200 1200 1200 1200 1200 1200 Reaction percentage of resin mold .sup.68% .sup.68% .sup.68% .sup.68% .sup.68% .sup.65% .sup.65% .sup.65% .sup.65% .sup.65% .sup.65% Shore hardness of resin mold 65 65 65 65 65 78 78 78 78 78 78 Exposure time of pattern-transferred 10 400 10 400 10 400 10 400 10 400 10 resin Reaction percentage of pattern- .sup.45% .sup.75% .sup.38% .sup.78% .sup.46% .sup.88% .sup.45% .sup.82% .sup.42% .sup.75% .sup.38% transferred resin Shore hardness of pattern- 5 48 20 56 25 11 5 41 22 48 20 transferred resin Pattern size 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m 200 m Presence of damage of resin mold or P A P P P A P A P P P pattern-transferred resin

(24) As shown in Entries 61, 63, 65, 67, 69, 71, 73, 75, 77, 79 and 81, if the reaction percentages of pattern-transferred resins are lower than 50%, damages arise in resin molds or pattern-transferred resins.

(25) As shown in Entries 68, 74 and 80, if the reaction percentages of pattern-transferred resins are higher than 50%, presence of absence of damages in resin molds or pattern-transferred resins depends on blends of the Shore hardness of resin molds and pattern-transferred resin as explained above.

(26) TABLE-US-00006 TABLE 6 Compositions for formation of resin mold having a pattern with size of 600 m and for formation of resin to which the pattern is transferred (pattern-transferred resin) and Shore hardness, reaction percentages of resin mold and pattern-transferred resin Entry Entry Entry Entry Entry Entry Entry Entry Entry 82 83 84 85 86 87 88 89 90 Composition for Constituent A 99.5% 99.5% 99.5% 99.5% 49.75% 49.75% 20.7% 20.7% 20.7% formation of resin Constituent B 49.75% 49.75% 78.8% 78.8% 78.8% mold with a pattern Constituent C Constituent D 0.5% 0.5% 0.5% Constituent E 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% Composition for Constituent F 62.0% 62.0% 62.0% 62.0% formation of pattern- Constituent G 37.8% 37.8% 37.8% 37.8% transferred resin Constituent H 49.9% 49.9% Constituent I 49.9% 49.9% Constituent J 89.8% 89.8% 99.8% Constituent K 10.0% 10.0% Constituent L Constituent M Constituent E 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% Exposure time of resin mold 1200 1200 1200 1200 1200 1200 1200 1200 1200 Reaction percentage of resin mold .sup.85% .sup.85% .sup.85% .sup.85% .sup.80% .sup.80% .sup.76% .sup.76% .sup.76% Shore hardness of resin mold 28 28 28 28 48 48 58 58 58 Exposure time of pattern-transferred 400 10 400 10 400 10 400 10 400 resin Reaction percentage of pattern- .sup.88% .sup.45% .sup.63% .sup.42% .sup.88% .sup.45% .sup.78% .sup.45% .sup.75% transferred resin Shore hardness of pattern- 11 5 78 51 11 5 56 25 48 transferred resin Pattern size 600 m 600 m 600 m 600 m 600 m 600 m 600 m 600 m 600 m Presence of damage of resin mold or A P A P A P P P A pattern-transferred resin Entry Entry Entry Entry Entry Entry Entry Entry Entry 91 92 93 94 95 96 97 98 99 Composition for Constituent A 20.7% formation of resin Constituent B 78.8% 99.5% 99.5% 99.5% 99.5% 68.4% 68.4% 68.4% 68.4% mold with a pattern Constituent C Constituent D 0.5% 31.1% 31.1% 31.1% 31.1% Constituent E 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% 0.5% Composition for Constituent F 62.0% 62.0% 62.0% 62.0% 62.0% 62.0% formation of pattern- Constituent G transferred resin Constituent H Constituent I Constituent J 99.8% 98.8% 98.8% Constituent K Constituent L 37.8% 37.8% Constituent M 37.8% 37.8% 37.8% 37.8% Constituent E 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% 0.2% Exposure time of resin mold 1200 1200 1200 1200 1200 1200 1200 1200 1200 Reaction percentage of resin mold .sup.76% .sup.68% .sup.68% .sup.68% .sup.68% .sup.65% .sup.65% .sup.65% .sup.65% Shore hardness of resin mold 58 65 65 65 65 78 78 78 78 Exposure time of pattern-transferred 10 400 10 400 10 400 10 400 10 resin Reaction percentage of pattern- .sup.38% .sup.82% .sup.42% .sup.75% .sup.38% .sup.82% .sup.43% .sup.82% .sup.42% transferred resin Shore hardness of pattern- 20 41 22 48 20 35 18 41 22 transferred resin Pattern size 600 m 600 m 600 m 600 m 600 m 600 m 600 m 600 m 600 m Presence of damage of resin mold or P A P P P A P P P pattern-transferred resin

(27) As shown in Entries 83, 85, 87, 89, 91, 93, 95, 97 and 99, if the reaction percentages of patter-transferred resin are lower than 50%, damages arise in resin molds or pattern-transferred resins.

(28) As shown in Entries 88, 94 and 98, if the reaction percentages of pattern-transferred resin are higher than 50%, presence of absence of damages in resin molds or pattern-transferred resins depends on blends of the Shore hardness of resin molds and pattern-transferred resin as explained above.

(29) TABLE-US-00007 TABLE 7 Compositions for formation of resin mold with patterns with sizes of 1 m and 50 m and formation of resin to which the pattern is transferred (pattern-transferred resin) and Shore hardness Entry 100 Entry 101 Entry 102 Composition for Constituent A formation of resin Constituent B 68.4% 68.4% 68.4% mold with a pattern Constituent C Constituent D 31.1% 31.1% 31.1% Constituent E 0.5% 0.5% 0.5% Composition for Constituent F 62.0% formation of Constituent G 37.8% pattern-transferred Constituent H 49.9% 49.9% resin Constituent I 49.9% 49.9% Constituent J Constituent K Constituent L Constituent M Constituent E 0.2% 0.2% 0.2% Exposure time of resin mold 1200 1200 1200 Reaction percentage of resin mold 65% 65% 65% Shore hardness of resin mold 78 78 78 Exposure time of pattern-transferred 400 400 400 resin Reaction percentage of pattern- 63% 88% 63% transferred resin Shore hardness of pattern- 78 11 78 transferred resin Pattern size 1 m 50 m 50 m Presence of damage of resin mold or A A P pattern-transferred resin

(30) Such blend of the Shore hardness is not observed for a fine pattern such as a 1 m pattern as shown in Entry 100 while such blend of the Shore hardness is observed for pattern of which size is greater than or equal to 50 m as shown in Entries 101 and 102.

(31) Presence or Absence of Damage Resins for Pattern Dimension of 200 m

(32) A Ni mold subjected to a treatment for improvement of mold releasablity with the treatment agent containing fluorine compound (DURASURF HD-2101Z, Daikin Industries, Ltd.) is prepared. The thickness and area of the Ni mold are 0.1 mm and 50 mm.sup.2, respectively. The Ni mold has a surface on which a pattern is formed by recesses and convex portions. The width and depth of each of the recess portions are 200 m together while the width of each of the convex portions is 400 m. A composition for formation of resin mold is deposited on the patterned surface of the Ni mold. Further a non-alkali glass of which thickness and area are 1.1 mm and 100 mm.sup.2, respectively, is disposed on the coating film of the composition such that the thickness of the coating film becomes approximately 1 mm. The coating film is irradiated under nitrogen atmosphere with a light from UV-LED lamp of which wavelength and intensity are 365 nm and 50 mW/cm.sup.2, respectively, for 1200 seconds or 10 seconds.

(33) The resin mold formed by the light irradiation is separated from the Ni mold. A composition for formation of resin that the pattern is transferred from the resin mold is deposited on the surface of the resin mold with the pattern transferred from the Ni mold. Further a non-alkali glass of which thickness and area are 1.1 mm and 100 mm.sup.2, respectively, is disposed on the coating film of the composition such that the thickness of the coating film becomes approximately 1 mm. The coating film is irradiated under nitrogen atmosphere with a light from a UV-LED lamp of which wavelength and intensity are 365 nm and 20 mW/cm.sup.2, for 400 seconds or 10 seconds, in a state in which the coating film contacts the patterned surface of the resin mold. The patterned resin formed by the light irradiation is separated from the resin mold.

(34) The presence or absence of damage of the patterned resin separated from the resin mold and the resin mold is checked by a confocal laser microscope (OLS3100, Olympus). If damage is found for either of the patterned resin separated from the resin mold or the resin mold, or if separation of the patterned resin from the resin mold is impossible, the combination of compositions is designated as P as shown in Tables. If damage is not found in either of the resins, the combination of compositions is designated as A as shown in Tables.

(35) Presence or Absence of Damage Resins for Pattern Dimension of 600 m

(36) A Ni mold subjected to a treatment for improvement of mold releasability with the treatment agent containing fluorine compound (DURASURF HD-2101Z, Daikin Industries, Ltd.) is prepared. The thickness and area of the Ni mold are 0.2 mm and 50 mm.sup.2, respectively. The Ni mold has a surface on which a pattern formed by recess and convex portions. The width and depth of each of the recess portions are 600 m together while the width of each of the convex portions is 900 m. A composition for formation of resin mold is deposited on the patterned surface of the Ni mold. Further a non-alkali glass of which thickness and area are 1.1 mm and 100 mm.sup.2, respectively, is disposed on the coating film of the composition such that the thickness of the coating film becomes approximately 1 mm. The coating film is irradiated under nitrogen atmosphere with a light from UV-LED lamp of which wavelength and intensity are 365 nm and 50 mW/cm.sup.2, respectively, for 1200 seconds or 10 seconds. The resin mold formed by the light irradiation is separated from the Ni mold.

(37) A composition for formation of resin to be separated from the resin mold is deposited on the surface of the resin mold with the pattern transferred from the Ni mold. Further a non-alkali glass of which thickness and area are 1.1 mm and 100 mm.sup.2, respectively, is disposed on the coating film of the composition such that the thickness of the coating film becomes approximately 1 mm. The coating film is irradiated under nitrogen atmosphere with a light from UV-LED lamp of which wavelength and intensity are 365 nm and 20 mW/cm.sup.2, respectively, for 400 seconds or 10 seconds, in a state in which the coating film contacts the patterned surface of the resin mold. The patterned resin formed by the light irradiation is separated from the resin mold.

(38) The presence or absence of damage of the patterned resin separated from the resin mold and the resin mold is checked by a confocal laser microscope (OLS3100, Olympus). If damage is found for either of the patterned resin separated from the resin mold and the resin mold, or if separation of the patterned resin from the resin mold is impossible, the combination of compositions is designated as P as shown in Tables. If damage not found in either of the resins after separation from the resin mold, the combination of compositions is designated as A as shown in Tables.

(39) Measurement of Shore Hardness

(40) A non-alkali glass subjected to a treatment for improvement of mold releasability with the treatment agent containing a fluorocompound (OPTOOL HD-1101Z, Daikin Industries, Ltd) is prepared. The thickness and area of the non-alkali glass are 1.1 mm and 100 mm.sup.2, respectively. A composition for formation of resin mold is deposited on the non-alkali glass. Further a non-alkali glass of which thickness and area are 1.1 mm and 100 mm.sup.2, respectively, is disposed on the coating film of the composition such that the thickness of the coating film becomes approximately 1 mm. The coating film is irradiated under nitrogen atmosphere with a light from UV-LED lamp of which wavelength and intensity are 365 nm and 50 mW/cm.sup.2, respectively, for 1200 seconds. The resin mold formed by the light irradiation is separated from the non-alkali glass. Six resin molds obtained by the above operation are stacked and Shore hardness is measured by a material hardness durometer Type D (GS-720G, TECLOCH).

(41) A non-alkali glass subjected to a treatment for improvement of mold releasability with the treatment agent containing a fluorocompound (OPTOOL HD-1101Z, Daikin Industries, Ltd) is prepared. The thickness and area of the non-alkali glass are 1.1 mm and 100 mm.sup.2, respectively. A composition for formation of resin to which a pattern of the resin mold is transferred from the resin mold is deposited on the non-alkali glass. Further a non-alkali glass of which thickness and area are 1.1 mm and 100 mm.sup.2, respectively, is disposed on the coating film of the composition such that the thickness of the coating film becomes approximately 3 mm. The coating film is irradiated under nitrogen atmosphere with a light from UV-LED lamp of which wavelength and intensity are 365 nm and 20 mW/cm.sup.2, respectively, for 400 seconds. The resin formed by the light irradiation is separated from the non-alkali glass. Two resins obtained by the above operation are stacked and Shore hardness is measured by a material hardness durometer Type D (GS-720G, TECLOCH).

(42) Presence or Absence of Damage Resins for Pattern Dimension of 1 m

(43) A Ni mold has been subjected to a treatment for improvement of mold releasability with the treatment agent containing fluorine compound (DURASURF HD-2101Z, Daikin Industries, Ltd.) is prepared. The thickness and area of the Ni mold are 1 mm and 50 mm.sup.2, respectively. The Ni mold has a surface on which a pattern formed by recess and convex portions. The width and depth of each of the recess portions are 1 m together while the width of each of the convex portion is 2 m. A composition for formation of resin mold is deposited on the patterned surface of the Ni mold. Further a non-alkali glass of which thickness and area are 1.1 mm and 100 mm.sup.2, respectively, is disposed on the coating film of the composition such that the thickness of the coating film becomes approximately 1 mm. The coating film is irradiated under nitrogen atmosphere with a light from UV-LED lamp of which wavelength and intensity are 365 nm and 50 mW/cm.sup.2, respectively, for 1200 seconds. The resin mold formed by the light irradiation is separated from the Ni mold.

(44) A composition for formation of resin to which the pattern of the resin mold is transferred from the resin mold is deposited on the surface of the resin mold with the pattern transferred from the Ni mold. Further a non-alkali glass of which thickness and area are 1.1 mm and 100 mm.sup.2, respectively, is disposed on the coating film of the composition such that the thickness of the coating film becomes approximately 1 mm. The coating film is irradiated under nitrogen atmosphere with a light from a UV-LED lamp of which the wavelength and intensity are 365 nm and 20 mW/cm.sup.2, respectively, for 400 seconds, in a state in which the coating film contacts the patterned surface of the resin mold. The resin formed by the light irradiation is separated from the resin mold.

(45) The presence or absence of damage of the resin separated from the resin mold and the resin mold is checked by a confocal laser microscope (OLS3100, Olympus). If damage is found for either of the patterned resin separated from the resin mold and the resin mold, or if separation of the patterned resin from the resin mold is impossible, the combination of compositions is designated as P as shown in Table 7. If damage not found in either of the resins after separation from the resin mold, the combination of compositions is designated as A as shown in Table 7.

(46) Presence or Absence of Damage Resins for Pattern Dimension of 50 m

(47) A Ni mold has been subjected to a treatment for improvement of mold releasability with the treatment agent containing fluorine compound (DURASURF HD-2101Z, Daikin Industries, Ltd.) is prepared. The thickness and area of the Ni mold are 1 mm and 50 mm.sup.2, respectively. The Ni mold has a surface on which a pattern formed by recess and convex portions. The width and depth of each of the recess portions are 50 m together while the width of each of the convex portion is 100 m. A composition for formation of resin mold is deposited on the patterned surface of the Ni mold. Further a non-alkali glass of which thickness and area are 1.1 mm and 100 mm.sup.2, respectively, is disposed on the coating film of the composition such that the thickness of the coating film becomes approximately 1 mm. The coating film is irradiated under nitrogen atmosphere with a light from a UV-LED lamp of which wavelength and intensity are 365 nm and 50 mW/cm.sup.2, respectively, for 1200 seconds. The resin mold formed by the light irradiation is separated from the Ni mold.

(48) A composition for formation of resin to which the pattern of the resin mold is transferred from the resin mold is deposited on the surface of the resin mold with the pattern transferred from the Ni mold. Further a non-alkali glass of which thickness and area are 1.1 mm and 100 mm.sup.2, respectively, is disposed on the coating film of the composition such that the thickness of the coating film becomes approximately 1 mm. The coating film is irradiated under nitrogen atmosphere with a light from a UV-LED lamp of which wavelength and intensity are 365 nm and 20 mW/cm.sup.2, respectively, for 400 seconds, in a state in which the coating film contacts the patterned surface of the resin mold. The patterned resin formed by the light irradiation is separated from the resin mold.

(49) The presence or absence of damage of the resin separated from the resin mold and the resin mold is checked by a confocal laser microscope (OLS3100, Olympus).

(50) If damage is found for either of the patterned resin separated from the resin mold and the resin mold, or if separation of the patterned resin from the resin mold is impossible, the combination of compositions is designated as P as shown in Table 7. If damage not found in either of the resins after separation from the resin mold, the combination of compositions is designated as A as shown in Table 7.

(51) Estimation of Percentage of Reaction for Resin Mold and Patterned Resin

(52) A peak at 810 cm.sup.1, which is assigned to CCH bending vibration observed by FT-IR spectroscopy is noted. The reaction percentage for the resin mold is estimated by calculation of decrease ratio of the intensity of the peak at 810 cm.sup.1 by the light irradiation of a coating film of a composition for a resin mold or resin to which a pattern of the resin mold is transferred from the resin mold on the bases of the intensity of a peak at 1,700 cm.sup.1, which is assigned to CO stretching and remains unchanged even by photoirradiation of the coating film. Concretely, the reaction rate is calculated by the following equation:
Percentage of Reaction (%)=(1(A1.sub.UV/A2.sub.UV)/(A1.sub.0/A2.sub.0))100 wherein: A1.sub.0, A2.sub.0, A1.sub.UV and A2.sub.UV are an area of the peak at CO stretching of the coating film, an area of the peak at CCH bending vibration of the coating film, an area of the peak at CO stretching of the resin mold and an area of the peak at CCH bending vibration of the resin mold.

(53) Reaction percentage for the separated mold is estimated in manner similar to the above method.

(54) FT-IR Spectroscopy Measurement of Resin Mold

(55) A non-alkali glass subjected to a treatment for improving mold releasability with a treatment agent containing a fluorocompound (OPTOOL HD-1101Z, Daikin Industries, Ltd) is prepared. The thickness and area of the non-alkali glass are 1.1 mm and 100 mm.sup.2, respectively. A composition for formation of resin mold is deposited on the non-alkali glass. Further a non-alkali glass of which thickness and area are 1.1 mm and 100 mm.sup.2, respectively, is disposed on the coating film of the composition such that the thickness of the coating film becomes approximately 1 mm. The coating film is irradiated under nitrogen atmosphere with a light from UV-LED lamp of which wavelength and intensity are 365 nm and 50 mW/cm.sup.2, respectively, for 10 seconds. The resin mold formed by the light irradiation is separated from the non-alkali glass. FT-IR measurement of the resin mold is used by attenuated total reflection (ATR) method.

(56) FT-IR Spectroscopy Measurement of Patterned Resin

(57) A non-alkali glass subjected to a treatment for improving mold releasability with a treatment agent containing a fluorocompound (OPTOOL HD-1101Z, Daikin Industries, Ltd) is prepared. The thickness and area of the non-alkali glass are 1.1 mm and 100 mm.sup.2, respectively. A composition for formation of resin to which a pattern of the resin mold is transferred from the resin mold is deposited on the non-alkali glass. Further a non-alkali glass of which thickness and area are 1.1 mm and 100 mm.sup.2, respectively, is disposed on the coating film of the composition such that the thickness of the coating film becomes approximately 3 mm. The coating film is irradiated under nitrogen atmosphere with a light from UV-LED lamp of which wavelength and intensity are 365 nm and 20 mW/cm.sup.2, respectively, for 10 seconds. The resin formed by the light irradiation is separated from the non-alkali glass. FT-IR measurement of the resin is used by attenuated total reflection (ATR) method.