Thermal-barrier coating
20190055846 ยท 2019-02-21
Inventors
Cpc classification
F05D2220/32
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2300/2285
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F01D5/288
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F01D25/12
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2260/20
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2240/30
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2230/90
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2300/2284
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F01D5/28
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
C23C16/455
CHEMISTRY; METALLURGY
Abstract
Thermal-barrier coatings for protecting a substrate from heat include a nitride layer, with the nitride layer including an interstitial nitride of a transition metal. In some embodiments, the nitride layer may include, for example, titanium nitride, niobium nitride, hafnium nitride, vanadium nitride, or zirconium nitride. The implementations further include a method comprising providing a substrate for use in assembling structures (e.g., a turbine blade) configured to be exposed to high temperature conditions, and applying a coating to the substrate, with the coating comprising a nitride layer, and with the nitride layer comprising transition-metal nitride.
Claims
1. An apparatus comprising a substrate and a coating that comprises a nitride layer, wherein said nitride layer comprises an interstitial nitride of a transition metal.
2. The apparatus of claim 1, further comprising a top layer having an exposed face and a face that faces said nitride.
3. The apparatus of claim 1, wherein said nitride layer comprises titanium nitride.
4. The apparatus of claim 1, wherein said nitride layer comprises niobium nitride.
5. The apparatus of claim 1, wherein said nitride layer comprises hafnium nitride.
6. The apparatus of claim 1, nitride layer comprises vanadium nitride.
7. The apparatus of claim 1, wherein said nitride comprises zirconium nitride.
8. The apparatus of claim 1, wherein said nitride layer has a thickness of 100 nanometers.
9. The apparatus of claim 1, further comprising a refractory oxide ceramic disposed between said nitride layer and said substrate.
10. The apparatus of claim 1, further comprising a layer of 7YSX disposed between said nitride layer and said substrate.
11. The apparatus of claim 1, further comprising an alumina layer that faces said nitride layer, wherein said alumina layer has an exposed face.
12. The apparatus of claim 1, further comprising an exposed layer of yttrium aluminum, wherein said nitride layer faces said yttrium aluminum.
13. The apparatus of claim 1, further comprising a gas turbine, wherein said substrate is part of a turbine blade.
14. The apparatus of claim 1, wherein said substrate is nickel-based super alloy.
15. The apparatus of claim 1, further comprising a top layer that that has a diffusivity to oxygen gas that is below 10.sup.13 square centimeters per second at 1500K wherein said top layer has an exposed face and a face that faces said nitride layer.
16. The apparatus of claim 1, wherein said nitride layer has a thickness of at least 100 nanometers.
17. A method comprising: providing a substrate for use in assembling structures exposed to high temperature conditions, and applying a coating to the substrate, wherein said coating comprises a nitride layer, and wherein said nitride layer comprises transition-metal nitride.
18. The method of claim 17, wherein applying a coating further comprises applying a top layer of oxygen-impervious material disposed on said nitride layer, wherein said top layer has a face exposed to oxygen and a face that faces said nitride layer, wherein said top layer has a diffusivity to oxygen gas that is below 10.sup.13 square centimeters per second at 1500K.
19. The method of claim 17, wherein applying a coating to a substrate comprises applying a coating to turbine blades of a gas turbine.
20. The method of claim 17, further comprising exposing said coating to combustion gases that radiate as a black body at a temperature of between 1800K and 2100K and causing at least a hundredfold reduction in radiative load at said substrate.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0027] These and other feature and advantages of the subject matter described herein will be apparent from the following detailed description and the accompanying figures, in which
[0028]
[0029]
[0030]
[0031]
[0032]
[0033] Like reference symbols in the various drawings indicate like elements.
DETAILED DESCRIPTION
[0034] Described herein are implementations for thin film thermal barrier coating (TBC) structures that can reflect a substantial portion (e.g., most, in some circumstances) of the thermal radiation from combustion gases at a temperature of around 2000 K. The thermal-barrier coatings described herein may be multilayer structures (e.g., a minimum of two layers). Such multilayer structures may include alternating films of interstitial metallic nitrides and alumina or yttrium aluminum garnet. In some embodiments, film deposition techniques (sputtering or electron beam deposition for nitride films, sputtering or atomic layer deposition for alumina or yttrium aluminum garnet films) may be used to deposit the thermal-barrier coating. The implementations described herein can be used as a shield or reflector for thermal radiation for wavelengths in part of the visible spectrum and the infrared spectrum, and potentially can decrease the radiative load on the underlying metal substrate by almost two orders of magnitude, leading to reduced cooling and greater efficiency
[0035]
[0036]
[0037] Disposed on a surface of the substrate 18 is a first layer 20 made of a material with low heat conductivity. Examples of such materials include refractory oxide ceramic compounds. Such materials are chosen for the efficiency with which they scatter phonons and photons. A typical material is 7YSZ, or zirconium stabilized by 7% yttrium.
[0038] Disposed on a top surface of the first layer 20 (the surface not in contact with the substrate) is a second layer 22 that is made of an interstitial transition-metal nitride. Examples of suitable nitrides are titanium nitride, zirconium nitride, hafnium nitride, niobium nitride, and vanadium nitride. These layers may be applied by sputtering or electron beam deposition. A typical thickness for this nitride layer is about 100 nanometers.
[0039] Disposed on the second layer 22 is a third layer 24 made of a material that suppresses the ability of the material in the second layer 22 to engage in chemical reactions. A suitable material for the third layer 24 is alumina or yttrium aluminum garnet. This third layer may be deposited via sputtering or atomic layer deposition. A typical thickness for this third layer 24 is about ten micrometers.
[0040] The particular order of layers shown is only one of many possible orders. For example, it is also possible to place the second layer 22 between the substrate 18 and the third layer 24 with the first layer 20 being the outermost layer. Another embodiment has the second layer 22 between the substrate 18 and the first layer 20 with the third layer 24 being the outermost layer.
[0041] Transition-metal ceramics are generally better conductors of heat than oxide ceramics because they retain more of their metallic properties. They are also highly efficient at scattering and reflecting infrared radiation. As such, they tend to suppress heat transfer by radiation from hot combustion products. This tends to reduce the heat load passing through the oxide ceramic layer 20 as well as the region to be protected (e.g., the substrate 18 of
[0042] The implementations described herein, which comprise interstitial nitride ceramics, such as zirconium nitride, hafnium nitride, titanium nitride, and niobium nitride, provide improved thermal radiation barriers. Particularly, the interstitial nitrides described herein are metallic ceramics and have metal-like electrical conductivity as well as desirable optical properties. The refractive index for zirconium nitride, hafnium nitride, titanium nitride, and tungsten, which is a metal having a particularly high melting point, are shown in
[0043] To see how the metallic nitrides described herein might act as radiation shields in thermal-barrier coatings, the radiative heat flux that flows into a superalloy substrate that is capped with a thermal-barrier coating was simulated. Since the bond-coat is also metallic, for purposes of electromagnetic simulations, it was assumed that the dielectric function of the superalloy base and the bond-coat were substantially similar to the dielectric function of nickel. The bond-coat included an aluminum oxide (Al.sub.2O.sub.3) thermally-grown oxide layer. The oxide layer was simplified by considering only a 100-micrometer layer of zirconium dioxide. The region adjacent to the thermal-barrier coating is assumed to be filled with combustion gases, which are approximated collectively as a blackbody at 2000 K.
[0044] With reference to graph 330 of
[0045] Although optical data is useful for identifying suitable materials for use as radiation shields, it is not the only factor of significance.
[0046] Some relevant properties of interstitial nitrides as well as 7YSZ and yttrium aluminum garnet are given in Table 1 provided below.
TABLE-US-00001 TABLE 1 Properties of Refractory Ceramics for use in thermal barrier coatings or Melting K CTE Material point (Wm.sup.1K.sup.1) (10.sup.6 K.sup.1) ( .Math. cm) Comments ZrN 2980 24 7.24 7-21 K >> k.sub.YSZ; < .sub.YSZ; low .fwdarw. More reflective than NbN HfN 3387 20 6.9 33 Same as above. TiN 2950 27 9.35 10-30 K >> k.sub.YSZ; .sub.YSZ; low -> More reflective than NbN NbN 2630 3.8 10.1 58 K k.sub.YSZ; .sub.YSZ 7YSZ 2710 2.3 10.7 YAG 1960 3.0 9.1
[0047] The three nitrides zirconium nitride, hafnium nitride, and titanium nitride have relatively lower electrical resistivities, indicating that they may be better reflectors of IR electromagnetic waves and thermal radiation from combustion gases. The CTE (coefficient of thermal expansion) for zirconium nitride and hafnium nitride are lower than that of 7YSZ. The CTE for titanium nitride and niobium nitride are comparable with that of 7YSZ and yttrium aluminum garnet. The thermal conductivity of niobium nitride is lower than that of other interstitial nitrides. Thus, niobium nitride seems to possess all the thermophysical properties that a thermal-barrier coatings material should possess.
[0048] The physical and chemical stability of nitride films are also of importance in selecting suitable materials. There are at least two types of stability of interest: (1) stability under thermal cycling, and (2) stability in the presence of combustion products and oxygen. Some information is available regarding the stability of titanium nitride when subjected to thermal cycling. Films were subjected to temperature changes under vacuum conditions remain stable. In particular, although reflectivity tends to diminish at high temperatures, it remains sufficient to be practical for protection against high radiation loads.
[0049] One way to promote the ability of a nitride film (e.g., titanium nitride, zirconium nitride, hafnium nitride, or niobium nitride) to function for extended periods at high temperatures in the presence of oxygen/combustion gases is by protecting the nitride film with another film that is optically transparent but opaque to the passage of oxygen. Some ceramic oxide materials described herein are optically transparent in the 0.5-5 m wavelength range. The transparency to oxygen can be gauged from the magnitude of the self-diffusion coefficient of oxygen in the material.
[0050] The temperature-dependent self-diffusion coefficient of oxygen can be represented as D.sub.O2/M=A exp(E/RT). The values of A, E, and D at 1500 K for diffusion of O.sub.2 through YSZ, yttrium aluminum garnet, and Al.sub.2O.sub.3 are given in Table 2 (below). In Table 2, the diffusivity D is of the form A exp(E/RT) with R, the universal gas constant, in joules per mole per degree Kelvin and T is the absolute temperature. At a representative temperature of T=1500 K, the diffusivity values computed for different materials included D.sub.O2/YSZ=1.510.sup.6 square centimeters per second, DO2/YAG=2.5810.sup.14 square centimeters per second, and D.sub.O2/Al2O3=2.910.sup.20 square centimeters per second (for a single crystal), and 1.910.sup.16 square centimeters per second (for a polycrystalline). The lower diffusivity of O.sub.2 through Al.sub.2O.sub.3 and YAG thus suggests a process of ensuring that metal nitride films are not affected by the ambient conditions, namely, by using interstitial metal nitride capped by Al.sub.2O.sub.3 or YAG films.
TABLE-US-00002 TABLE 2 Diffusivity of oxygen in some refractory ceramics for use in thermal barrier coatings. Prefactor E D at 1500 K Material A (cm.sup.2 .Math. s.sup.1) (J .Math. mol.sup.1) (cm.sup.2 .Math. s.sup.1) Comments O.sub.2 in YSZ 3.4 10.sup.3 95400 1.5 10.sup.6 Single crystal sample O.sub.2 in YAG 5.27 10.sup.3 325000 2.58 10.sup.14 Single crystal sample O.sub.2 in 1.12 10.sup.3 648520 2.9 10.sup.20 Single crystal Al.sub.2O.sub.3 sample O.sub.2 in 1.9 10.sup.3 635970 1.35 10.sup.19 Single crystal Al.sub.2O.sub.3 sample O.sub.2 in 2.0 460240 1.9 10.sup.16 Polycrystalline Al.sub.2O.sub.3 sample
[0051]
[0052] In some embodiments, applying the coating may further include applying a top layer of oxygen-impervious material disposed on the nitride layer. Such a top layer may have a face exposed to oxygen and a face that faces the nitride layer, with the top layer having a diffusivity to oxygen gas that is below 10.sup.13 square centimeters per second at 1500K. In some embodiments, applying the coating to the substrate may include applying the coating to turbine blades of a gas turbine. In some embodiments, the method 400 may further include exposing the coating to combustion gases that radiate as a black body at a temperature of between 1800K and 2100K and causing at least a hundredfold reduction in radiative load at said substrate.
[0053] Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly or conventionally understood. As used herein, the articles a and an refer to one or to more than one (i.e., to at least one) of the grammatical object of the article. By way of example, an element means one element or more than one element. About and/or approximately as used herein when referring to a measurable value such as an amount, a temporal duration, and the like, encompasses variations of +20% or 10%, 5%, or +0.1% from the specified value, as such variations are appropriate in the context of the systems, devices, circuits, methods, and other implementations described herein. Substantially as used herein when referring to a measurable value such as an amount, a temporal duration, a physical attribute (such as frequency), and the like, also encompasses variations of 20% or 10%, 5%, or 0.1% from the specified value, as such variations are appropriate in the context of the systems, devices, circuits, methods, and other implementations described herein.
[0054] As used herein, including in the claims, or as used in a list of items prefaced by at least one of or one or more of indicates a disjunctive list such that, for example, a list of at least one of A, B, or C means A or B or C or AB or AC or BC or ABC (i.e., A and B and C), or combinations with more than one feature (e.g., AA, AAB, ABBC, etc.). Also, as used herein, unless otherwise stated, a statement that a function or operation is based on an item or condition means that the function or operation is based on the stated item or condition and may be based on one or more items and/or conditions in addition to the stated item or condition.
[0055] Although particular embodiments have been disclosed herein in detail, this has been done by way of example for purposes of illustration only and is not intended to be limit the scope of the invention, which is defined by the scope of the appended claims. Features of the disclosed embodiments can be combined, rearranged, etc., within the scope of the invention to produce more embodiments. Some other aspects, advantages, and modifications are considered to be within the scope of the claims provided below. The claims presented are representative of at least some of the embodiments and features disclosed herein. Other unclaimed embodiments and features are also contemplated.