ROTATION RATE SENSOR, METHOD FOR MANUFACTURING A ROTATION RATE SENSOR
20190049248 ยท 2019-02-14
Inventors
Cpc classification
B81B3/0072
PERFORMING OPERATIONS; TRANSPORTING
B81B3/0051
PERFORMING OPERATIONS; TRANSPORTING
G01C19/5747
PHYSICS
B81B2203/058
PERFORMING OPERATIONS; TRANSPORTING
G01C19/5783
PHYSICS
International classification
G01C19/5783
PHYSICS
G01C19/5762
PHYSICS
G01C19/5747
PHYSICS
Abstract
A rotation rate sensor including a substrate, a drive structure, which is movable with regard to the substrate, a detection structure, and a Coriolis structure, the drive structure, the Coriolis structure, and the detection structure being essentially situated in a layer, in that an additional layer is situated essentially in parallel to the layer above or underneath the layer, a mechanical connection between the Coriolis structure and the drive structure being established with a first spring component, the first spring component being configured as a part of the additional layer, and/or a mechanical connection between the detection structure and the substrate being established with a second spring component, the second spring component being configured as a part of the additional layer.
Claims
1-10. (canceled)
11. A rotation rate sensor, comprising: a substrate; a drive structure, which is movable with regard to the substrate; a detection structure; and a Coriolis structure, wherein the drive structure, the Coriolis structure, and the detection structure are essentially situated in a layer, and wherein an additional layer is situated essentially in parallel to the layer above or underneath the layer; wherein a mechanical connection between the Coriolis structure and the drive structure is established with a first spring component, which is configured as a part of the additional layer, and/or wherein a mechanical connection between the detection structure and the substrate is established with a second spring component, which is configured as a part of the additional layer.
12. The rotation rate sensor of claim 11, wherein the first spring component has a lesser expansion in an extension direction perpendicular to a main extension plane of the additional layer than in a first main extension direction of the additional layer and in a second main extension direction of the additional layer, and/or wherein the second spring component has a lesser expansion in the extension direction perpendicular to the main extension plane of the additional layer than in the first main extension direction of the additional layer and in the second main extension direction of the additional layer.
13. The rotation rate sensor of claim 11, wherein the additional layer is formed underneath the layer, and a further additional layer is formed essentially in parallel to the layer above the layer, and wherein a mechanical connection between the Coriolis structure and the drive structure is established with a further first spring component, which is configured as a part of the further additional layer, and/or wherein a mechanical connection between the detection structure and the substrate is established with a further second spring component, which is configured as a part of the further additional layer.
14. The rotation rate sensor of claim 13, wherein the further first spring component has a lesser expansion in a further extension direction perpendicular to a further main extension plane of the further additional layer than in a first further main extension direction of the further additional layer and in a second further main extension direction of the further additional layer, and/or wherein the further second spring component has a lesser expansion in the further extension direction perpendicular to the further main extension plane of the further additional layer than in the first further main extension direction of the further additional layer and in the second further main extension direction of the further additional layer.
15. The rotation rate sensor of claim 11, wherein the first spring component and/or the second spring component includes at least one beam.
16. The rotation rate sensor of claim 11, wherein the first spring component and/or the second spring component includes a framework structure or a lattice structure.
17. The rotation rate sensor of claim 11, wherein the first spring component has a lesser expansion in an extension direction perpendicular to a main extension plane of the additional layer than the Coriolis structure, the detection structure, and/or the drive structure, and/or wherein the second spring component has a lesser expansion in an extension direction perpendicular to a main extension plane of the additional layer than the Coriolis structure, the detection structure, and/or the drive structure.
18. The rotation rate sensor of claim 11, wherein the rotation rate sensor is configured to detect a rotation rate in a first main extension direction of the layer and/or a second main extension direction of the layer.
19. The rotation rate sensor of claim 11, wherein a detection electrode is situated at least partially above or underneath the detection structure.
20. A method for manufacturing a rotation rate sensor, the method comprising: providing a substrate; providing a drive structure, which is movable with regard to the substrate; providing a detection structure; and providing a Coriolis structure, wherein the drive structure, the Coriolis structure, and the detection structure are essentially situated in a layer, and wherein an additional layer is situated essentially in parallel to the layer above or underneath the layer; wherein a mechanical connection between the Coriolis structure and the drive structure is established with a first spring component, which is configured as a part of the additional layer, and/or wherein a mechanical connection between the detection structure and the substrate is established with a second spring component, which is configured as a part of the additional layer.
21. The rotation rate sensor of claim 11, wherein the first spring component and/or the second spring component includes a plurality of beams.
22. The rotation rate sensor of claim 11, wherein the first spring component and/or the second spring component includes a plurality of beams, and wherein the further first spring component and/or the further second spring component includes at least one beam.
23. The rotation rate sensor of claim 11, wherein the first spring component and/or the second spring component includes a plurality of beams, and wherein the further first spring component and/or the further second spring component includes a plurality of beams.
24. The rotation rate sensor of claim 11, wherein the first spring component and/or the second spring component includes a framework structure or a lattice structure, and wherein the further first spring component and/or the further second spring component includes a framework structure or a lattice structure.
25. The rotation rate sensor of claim 11, wherein the first spring component has a lesser expansion in an extension direction perpendicular to a main extension plane of the additional layer than the Coriolis structure, the detection structure, and/or the drive structure, and/or wherein the second spring component has a lesser expansion in an extension direction perpendicular to a main extension plane of the additional layer than the Coriolis structure, the detection structure, and/or the drive structure, wherein the further first spring component having a lesser expansion in a further extension direction perpendicular to a further main extension plane of the further additional layer than the Coriolis structure, the detection structure, and/or the drive structure, and/or wherein the further second spring component has a lesser expansion in the further extension direction perpendicular to the further main extension plane) of the further additional layer than the Coriolis structure, the detection structure, and/or the drive structure.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
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[0035] It may be provided according to the present invention that layer 10, additional layer 20 and further additional layer 40 (and further may be provided, conductive buried layer 15) are polysilicon functional layers. In this case, oxide layers, which have passages with the aid of which the functional layers are connected (i.e. polysilicon material is also situated in the passages), are typically deposited between different functional layers 10, 20, 40, 15. This is indicated in