SENSOR DEVICE WITH A FLEXIBLE ELECTRICAL CONDUCTOR STRUCTURE

Abstract

A sensor device for integration in an electrical circuit includes a support layer (12), which is formed with a release layer; at least one flexible insulating layer (14, 32), which is made using a printing method; and at least one flexible electrical conductor structure (20, 34), which is applied with a printing method onto the insulating layer (14). The insulating layer (14, 32) and the conductor structure (20, 34) form a flexible unit, which is removable without damage from the support layer (12).

Claims

1. A sensor device arrangement for integration into an electrical circuit, comprising: at least one flexible insulating layer (14, 14, 32); at least one flexible electrical conductor structure (20, 20, 34), which is applied with a printing method onto the insulating layer (14, 14, 32), an adhesive layer (22) arranged above the electrical conductor structure (20, 20, 34), and a substrate (40) having an absorbent material, wherein the insulating layer (14, 14, 32) and the at least one flexible conductor structure (20, 20, 34) form a flexible unit, and wherein the adhesive layer (22) is adhered to the substrate (40) for attachment of the flexible unit to the substrate (40).

2. The sensor device arrangement according to claim 1, wherein the insulating layer (14, 14, 32) is made from a lacquer.

3. The sensor device arrangement according to claim 2, wherein the lacquer is a modified lacquer.

4. The sensor device arrangement according to claim 1, wherein the insulating layer is formed at least in regions as multi-layered.

5. The sensor device arrangement according to claim 1, wherein the conductor structure (20, 20, 32) is formed from a conductive printing material, wherein said conductive printing material is selected from the group consisting of copper, silver, a carbon bond, a conductive polymer structure, graphene, and/or a conductive dye of nano-particles.

6. Use of the sensor device of claim 1 as a dampness sensor or moisture sensor.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Exemplary embodiments of the sensor device according to the invention are schematically shown in the drawings and are described in greater detail in the following description. In the drawings:

[0036] FIG. 1 shows a plan view of a sensor device according to the invention, which is formed as an incontinence sensor;

[0037] FIG. 2 shows a section through the device according to FIG. 1 along the line II-II in FIG. 1;

[0038] FIG. 3 shows a plan view of an alternative embodiment of a device according to the invention, which is formed as a strain sensor;

[0039] FIG. 4 shows a section through the device according to FIG. 3 along line IV-IV in FIG. 3; and

[0040] FIG. 5 shows an arrangement of the sensor device on a substrate by means of an adhesive layer.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0041] In FIGS. 1 and 2, a dampness or moisture sensor 10 for monitoring the incontinence of a person is shown. The sensor 10 is formed as flexible strips, which, for example, can be adhered to an individual's pants specifically designed for this purpose. The sensor 10, which is shown in the drawing in its condition after assembly, includes a support layer 12, which is formed as a release film, that is, a film with a release layer, and an interim print substrate. An insulating layer 14 is applied onto the support film 12 via a screen printing process, the insulating layer 14 comprising a lacquer made from a polyurethane base, which is hardened by means of UV radiation. The insulating layer 14 has a high flexibility. On the insulating layer 14, a conductor structure 20 formed from two electrical conductors 16 and 18 is imprinted, which likewise is formed to be flexible. The conductor structure 20 is formed from a conductive printing material is made from a copper base.

[0042] In order to enable attachment of the unit made from the insulating layer 14 and the conductor structure 20 to a substrate 40, for example, the pants of the person, so that the unit is removable from the release layer without damage, an adhesive layer 22 is formed on the conductor structure 20, which likewise can be applied according to a printing method. (See FIG. 5). For protection of the adhesive layer before assembly, a cover layer 24 can be provided, which likewise is formed as a so-called release film.

[0043] In FIGS. 3 and 4, a strain sensor 30 is shown, which has a support layer 12 according to the embodiment of FIGS. 1 and 2, which serves as an interim print support, on which first an insulating layer 14 is placed during production. The insulating layer 14 is formed from a lacquer made from a polyurethane base and is applied to the support layer 12 according to a print screen method.

[0044] On the insulating layer 14, an electrical conductor structure 20 is applied according to a print screen method, which comprises a plurality of parallel, strip-like conductors, which are formed from a printing material containing silver. Also, the conductor structure 20 has a high flexibility.

[0045] A second insulating layer 32 is imprinted onto the conductor structure 20, and likewise according to a print screen method and by application of a polyurethane printing material.

[0046] A second flexible electrical conductor structure 34 is imprinted on the side of the insulating layer 32 facing the electrical conductor structure 20, which comprises strip-like electrical conductors, which run at right angles to the strips of the electrical conductor structure 20.

[0047] In order to produce an electrical connection between the electrical conductor structure 34 and the electrical conductor structure 20, a recess 36 is formed in the insulating layer 32, which is produced by excluding the corresponding point during printing of the insulating layer 32. The recess 36 is filled with the printing material of the second electrical conductor structure 34, so that the electrical connection between the two conductor structures 34 and 20 is realized.

[0048] According to the embodiment shown in FIGS. 3 and 4, the strain sensor 30 has an adhesive layer 22, which likewise is applied via a print screen method and is protected by means of a covering 24. For assembly, the cover layer 24, which is formed as a release film, is pulled off, so that the strain sensor 30 can be attached via the adhesive layer 22 to a substrate 40. (See FIG. 5).

[0049] The electrical conductor structures 20 and 34 of the strain sensor 30 as well as the conductors 16 and 18 of the electrical conductor structure 20 of the moisture detector according to FIGS. 1 and 2 can be connected with a corresponding, suitable evaluation unit.