OPTICAL ELEMENT HAVING A PROTECTIVE COATING, METHOD FOR THE PRODUCTION THEREOF AND OPTICAL ARRANGEMENT
20220373723 · 2022-11-24
Inventors
Cpc classification
G03F7/7085
PHYSICS
International classification
C23C16/455
CHEMISTRY; METALLURGY
Abstract
An optical element includes: a substrate, a reflective coating, applied to the substrate, for reflecting radiation in a first wavelength range (Δλ.sub.1) between 100 nm and 700 nm, preferably between 100 nm and 300 nm, more preferably between 100 nm and 200 nm, and a protective coating applied to the reflective coating. The substrate is formed from a material which is transparent to the radiation in the first wavelength range (Δλ.sub.1). The reflective coating is applied to a rear face of the substrate and is structured to reflect radiation that passes through the substrate to the reflective coating. Also disclosed are an optical arrangement with at least one such optical element and a method of producing such an optical element.
Claims
1. An optical element, comprising: a substrate, a reflective coating, applied to a rear face of the substrate, for reflecting radiation in a first wavelength range (Δλ.sub.1) between 100 nm and 300 nm, and a protective coating applied to the reflective coating, wherein the substrate is formed from a fluoridic material which is transparent to the radiation in the first wavelength range (Δλ.sub.1), wherein the reflective coating is structured to reflect radiation that passes through the substrate to the reflective coating, and wherein the protective coating comprises at least one layer of a material non-transparent to the first wavelength range (Δλ.sub.1).
2. The optical element of claim 1, wherein the first wavelength range (Δλ.sub.1) is between 100 nm and 200 nm.
3. The optical element of claim 1, wherein the protective coating has a thickness of at least 50 nm.
4. The optical element of claim 1, wherein the protective coating has at least one layer of an oxidic material which is selected from the group consisting of: Al.sub.2O.sub.3, SiO.sub.2, MgO, BeO, HfO.sub.2, Sc.sub.2O.sub.3, Y.sub.2O.sub.3, Yb.sub.2O.sub.3 and combinations thereof.
5. The optical element of claim 1, wherein the reflective coating consists essentially of aluminium or an aluminium alloy.
6. The optical element of claim 1, wherein the reflective coating comprises a multilayer coating having a plurality of alternating layers composed of materials having different refractive indices (n.sub.a, n.sub.b).
7. The optical element of claim 6, wherein the multilayer coating has at least one layer of a fluoridic material which is selected from the group consisting of: AlF.sub.3, LiF, BaF.sub.2, NaF, MgF.sub.2, CaF.sub.2, LaF.sub.3, GdF.sub.3, HoF.sub.3, YbF.sub.3, YF.sub.3, LuF.sub.3, ErF.sub.3, Na.sub.3AlF.sub.6, Na.sub.5Al.sub.3F.sub.14, ZrF.sub.4, HfF.sub.4 and combinations thereof.
8. The optical element of claim 6, wherein at least one layer of aluminium or an aluminium alloy is applied to the multilayer coating.
9. The optical element of claim 6, wherein the protective coating takes the form of a multilayer coating having a plurality of alternating layers of materials having different refractive indices.
10. The optical element of claim 1, further comprising a further substrate on which a surface is formed, which is bonded to a surface of the protective coating by a direct bond, wherein the surface bonded to the surface of the protective coating is formed atop a coating applied to the further substrate.
11. The optical element of claim 10, wherein the substrate has a thickness (D) of less than 5 mm.
12. The optical element of claim 10, wherein the substrate, the further substrate, the protective coating, the reflective coating and the coating of the further substrate are transparent in a second wavelength range (Δλ.sub.2) different than the first wavelength range (Δλ.sub.1), wherein the second wavelength range (Δλ.sub.2) comprises wavelengths greater than wavelengths of the first wavelength range (Δλ.sub.1) and comprises wavelengths between 200 nm and 2000 nm.
13. The optical element of claim 10, wherein a coefficient of thermal expansion (α.sub.1) of the substrate and a coefficient of thermal expansion (α.sub.2) of the further substrate differ by not more than 5*10.sup.−6K.sup.−1.
14. The optical element of claim 10, wherein the further substrate is formed from a fluoridic material selected from the group consisting of: CaF.sub.2, MgF.sub.2, LiF, LaF.sub.3, BaF.sub.2 and SrF.sub.2.
15. An optical arrangement of a wafer inspection device, comprising: a radiation source for generating radiation in a first wavelength range (Δλ.sub.1) between 100 nm and 700 nm; and an optical element, comprising: a substrate, a reflective coating, applied to a rear face of the substrate, for reflecting radiation in a first wavelength range (Δλ.sub.1) between 100 nm and 300 nm, and a protective coating applied to the reflective coating, wherein the substrate is formed from a fluoridic material which is transparent to the radiation in the first wavelength range (Δλ.sub.1), and wherein the reflective coating is structured to reflect radiation that passes through the substrate to the reflective coating; wherein the optical arrangement is structured to direct the radiation from the radiation source onto a front face of the substrate.
16. The optical arrangement of claim 15, wherein the radiation source or a further radiation source is structured to generate further radiation in a second wavelength range (Δλ.sub.2) different than the first wavelength range (Δλ.sub.1), wherein the second wavelength range (Δλ.sub.2) comprises wavelengths greater than wavelengths of the first wavelength range (Δλ.sub.1) and comprises wavelengths between 200 nm and 2000 nm, and wherein the optical arrangement is structured to direct the further radiation in the second wavelength range (Δλ.sub.2) onto the front face or onto the rear face of the substrate.
17. A method of producing a reflective optical element, comprising: applying a reflective coating to a rear face of a substrate formed from a fluoridic material, wherein the reflective coating is structured to reflect radiation in a first wavelength range (Δλ.sub.1) between 100 nm and 300 nm, and to transmit further radiation in a second wavelength range (Δλ.sub.2) different than the first wavelength range (Δλ.sub.1), which passes through the substrate to the reflective coating, and wherein the substrate is formed from a material transparent to the radiation in the first wavelength range (Δλ.sub.1) and to the further radiation in the second wavelength range (Δλ.sub.2), and applying a protective coating to the reflective coating which has a thickness (d) of at least 50 nm.
18. The method of claim 17, further comprising directly bonding a surface of the protective coating to a surface formed on a further substrate.
19. The method of claim 18, wherein the protective coating is formed from an oxidic material, and wherein the surface formed on the further substrate comprises the same material formed on the surface of the protective coating.
20. The method of claim 17, further comprising removing material on a front face of the substrate to reduce a thickness (D) of the substrate.
21. The method of claim 17, wherein the protective coating is applied to the reflective coating by atomic layer deposition.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0048] Working examples are shown in the schematic drawing and are elucidated in the description that follows. The figures show:
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DETAILED DESCRIPTION
[0060] In the description of the drawings that follows, identical reference numbers are used for components that are the same or have the same function.
[0061]
[0062] Applied to the reflective coating 3, on its face or surface remote from the substrate 2, is a protective coating 4 that protects the reflective coating 3 from oxidation, inter alia. Owing to the fact that the radiation 5 does not have to penetrate the protective coating 4 applied to the rear face 2b of the substrate 2, the protective coating 4 may in principle have a high thickness d. In order to achieve a sufficient protective effect for the reflective coating 3 that covers the protective coating 4, it has been found to be beneficial when the protective coating 4 has a thickness d of at least 50 nm, preferably of at least 90 nm, and in particular of at least 120 nm.
[0063] In the examples shown in
[0064] In the optical element 1 shown in
[0065] Rather than a reflective coating 3 of a metallic material, the reflective coating 3 may be formed from dielectric materials.
[0066]
[0067] In the optical element 1 shown in
TABLE-US-00001 Reflective coating with Reflective coating with single protective layer multilayer protective coating # Material Layer thickness Material Layer thickness First substrate — First substrate — MgF.sub.2 MgF.sub.2 1 BaF.sub.2 25.1 BaF.sub.2 25.1 2 LiF 28.0 LiF 28.0 3 BaF.sub.2 25.1 BaF.sub.2 25.1 4 LiF 28.0 LiF 28.0 5 BaF.sub.2 25.1 BaF.sub.2 25.1 6 LiF 28.0 LiF 28.0 7 BaF.sub.2 25.1 BaF.sub.2 25.1 8 LiF 28.0 LiF 28.0 9 BaF.sub.2 25.1 BaF.sub.2 25.1 10 LiF 28.0 LiF 28.0 11 BaF.sub.2 25.1 BaF.sub.2 25.1 12 LiF 28.0 LiF 28.0 13 BaF.sub.2 25.1 BaF.sub.2 25.1 14 LiF 28.0 LiF 28.0 15 BaF.sub.2 25.1 BaF.sub.2 25.1 16 LiF 28.0 LiF 28.0 17 BaF.sub.2 25.1 BaF.sub.2 25.1 18 LiF 28.0 LiF 28.0 19 BaF.sub.2 25.1 BaF.sub.2 25.1 20 LiF 28.0 LiF 28.0 21 BaF.sub.2 25.1 BaF.sub.2 25.1 22 LiF 28.0 LiF 28.0 23 BaF.sub.2 25.1 BaF.sub.2 25.1 24 LiF 28.0 LiF 28.0 25 BaF.sub.2 25.1 BaF.sub.2 25.1 26 LiF 28.0 LiF 28.0 27 BaF.sub.2 25.1 BaF.sub.2 25.1 28 LiF 29.9 LiF 29.9 29 BaF.sub.2 26.9 BaF.sub.2 26.9 30 LiF 29.9 LiF 29.9 31 BaF.sub.2 26.9 BaF.sub.2 26.9 32 LiF 29.9 LiF 29.9 33 BaF.sub.2 26.9 BaF.sub.2 26.9 34 LiF 29.9 LiF 29.9 35 BaF.sub.2 26.9 BaF.sub.2 26.9 36 LiF 29.9 LiF 29.9 37 BaF.sub.2 26.9 BaF.sub.2 26.9 38 LiF 29.9 LiF 29.9 39 BaF.sub.2 26.9 BaF.sub.2 26.9 40 LiF 29.9 LiF 29.9 41 BaF.sub.2 26.9 BaF.sub.2 26.9 42 LiF 29.9 LiF 29.9 43 BaF.sub.2 26.9 BaF.sub.2 26.9 44 LiF 29.9 LiF 29.9 45 BaF.sub.2 26.9 BaF.sub.2 26.9 46 LiF 29.9 LiF 29.9 47 BaF.sub.2 26.9 BaF.sub.2 26.9 48 LiF 29.9 LiF 29.9 49 BaF.sub.2 26.9 BaF.sub.2 26.9 50 LiF 29.9 LiF 29.9 51 BaF.sub.2 26.9 BaF.sub.2 26.9 52 LiF 29.9 LiF 29.9 53 BaF.sub.2 26.9 BaF.sub.2 26.9 54 LiF 29.9 LiF 29.9 55 BaF.sub.2 26.9 BaF.sub.2 26.9 56 LiF 29.9 LiF 29.9 57 BaF.sub.2 26.9 BaF.sub.2 26.9 58 LiF 29.9 LiF 29.9 59 BaF.sub.2 26.9 BaF.sub.2 26.9 60 LiF 31.2 LiF 31.2 61 BaF.sub.2 28.1 BaF.sub.2 28.1 62 LiF 31.2 LiF 31.2 63 BaF.sub.2 28.1 BaF.sub.2 28.1 64 LiF 31.2 LiF 31.2 65 BaF.sub.2 28.1 BaF.sub.2 28.1 66 LiF 31.2 LiF 31.2 67 BaF.sub.2 28.1 BaF.sub.2 28.1 68 LiF 31.2 LiF 31.2 69 BaF.sub.2 29.2 BaF.sub.2 29.2 70 LiF 32.5 LiF 32.5 71 BaF.sub.2 29.2 BaF.sub.2 29.2 72 LiF 32.5 LiF 32.5 73 BaF.sub.2 29.2 BaF.sub.2 29.2 74 LiF 32.5 LiF 32.5 75 BaF.sub.2 29.2 BaF.sub.2 29.2 76 LiF 32.5 LiF 32.5 77 BaF.sub.2 29.2 BaF.sub.2 29.2 78 LiF 32.5 LiF 32.5 79 BaF.sub.2 29.2 BaF.sub.2 29.2 80 LiF 32.5 LiF 32.5 81 BaF.sub.2 29.2 BaF.sub.2 29.2 82 LiF 32.5 LiF 32.5 83 BaF.sub.2 29.2 BaF.sub.2 29.2 84 LiF 32.5 LiF 32.5 85 BaF.sub.2 29.2 BaF.sub.2 29.2 86 LiF 32.5 LiF 32.5 87 BaF.sub.2 29.2 BaF.sub.2 29.2 88 LiF 32.5 LiF 32.5 89 BaF.sub.2 29.2 BaF.sub.2 29.2 90 LiF 32.5 LiF 32.5 91 BaF.sub.2 29.2 BaF.sub.2 29.2 92 LiF 32.5 LiF 32.5 93 BaF.sub.2 29.2 BaF.sub.2 29.2 94 LiF 32.5 LiF 32.5 95 BaF.sub.2 29.2 BaF.sub.2 29.2 96 LiF 32.5 LiF 32.5 97 BaF.sub.2 29.2 BaF.sub.2 29.2 98 LiF 32.5 LiF 32.5 99 Al.sub.2O.sub.3 120 Al.sub.2O.sub.3 26.5 100 Environment or — SiO.sub.2 32.2 further substrate 101 Al.sub.2O.sub.3 26.5 102 SiO.sub.2 32.2 103 Al.sub.2O.sub.3 26.5 104 SiO.sub.2 32.2 105 Al.sub.2O.sub.3 26.5 106 SiO.sub.2 32.2 107 Al.sub.2O.sub.3 26.5 108 SiO.sub.2 32.2 109 Al.sub.2O.sub.3 26.5 110 SiO.sub.2 32.2 111 Al.sub.2O.sub.3 26.5 112 SiO.sub.2 32.2 113 Al.sub.2O.sub.3 26.5 114 SiO.sub.2 32.2 115 Al.sub.2O.sub.3 26.5 116 SiO.sub.2 32.2 117 Al.sub.2O.sub.3 26.5 118 SiO.sub.2 32.2 119 Al.sub.2O.sub.3 26.5 120 SiO.sub.2 32.2 121 Al.sub.2O.sub.3 26.5 122 SiO.sub.2 32.2 123 Al.sub.2O.sub.3 26.5 124 SiO.sub.2 32.2 125 Al.sub.2O.sub.3 26.5 126 SiO.sub.2 32.2 127 Al.sub.2O.sub.3 26.5 100 Environment or — further substrate
[0068] In the example given in the table above, the reflective coating 3 has alternating layers 6a and 6b of LiF (n.sub.a=1.425 at 180 nm) and BaF.sub.2 (n.sub.b=1.583 at 180 nm), respectively, which have respective thicknesses of 32.5 nm to 28 nm and of 29.2 nm to 25.1 nm. The protective layer coating 4 in the example of the optical element 1 shown in
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[0070]
[0071] As apparent from a comparison of the reflectance R of the optical element 1 of
[0072] For production of the optical element 1 of
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[0074]
[0075] In principle, the thickness D of the substrate 2, by virtue of the bonding to the carrier substrate 9, may have a lower thickness D than is the case for an optical element 1 without the carrier substrate 9. The carrier substrate 9 generally has a greater thickness D′ than the substrate 2, which may, for example, be more than about 10 mm.
[0076] In the example shown in
[0077]
[0078] Such a reflective coating 3 may, for example, be as described above with reference to
[0079] In the examples shown in
[0080] The transparency of the optical element 1 to the further radiation 5a in the second wavelength range Δλ.sub.2 can be utilized advantageously in different ways. In the example shown in
[0081] In the example shown in
[0082] It will be apparent that the optical elements 1 having no carrier substrate 9 that are shown in
[0083] The optical element 1 designed in the manner described above may be used in different optical arrangements.
[0084] The wafer inspection device 20 has a radiation source 21, from which the VUV radiation 5 in the first wavelength range Δλ.sub.1 is directed at a wafer 25 by an optical system 22. For this purpose, the radiation 5 is reflected onto the wafer 25 by a concave mirror 24. In the case of a mask inspection device, one possible arrangement would have a mask to be examined in place of the wafer 25.
[0085] The radiation reflected, diffracted and/or refracted by the wafer 25 is directed at a detector 27 for further evaluation by a further concave mirror 26, which is likewise associated with the optical system 22. The optical system 22 of the wafer inspection device 20 comprises a housing 27, in the interior 27a of which are disposed the two reflective optical elements or mirrors 24, 26. In the example shown in
[0086] The radiation source 21 may be exactly one radiation source or a combination of multiple individual radiation sources to provide an essentially continuous radiation spectrum. In other examples, it is also possible to use one or more narrowband radiation sources 21. Preferably, the wavelength band of the radiation 15 generated by the radiation source 21 is in the VUV wavelength range Δλ.sub.1 between 100 nm and 200 nm.
[0087] It is also possible, though not required, for the radiation source 21 to be designed to generate further radiation 5a in a second wavelength range Δλ.sub.2, which is preferably between 200 nm and 1000 nm. In one such example, the second wavelength range Δλ.sub.2 does not directly adjoin the first wavelength range Δλ.sub.1; instead, there is generally a wavelength range of at least 100 nm between the two wavelength ranges Δλ.sub.1, Δλ.sub.2. In other words, the two wavelength ranges Δλ.sub.1, Δλ.sub.2 are spaced apart on the spectrum.
[0088] The optical element 1 described above may also be used advantageously in other optical arrangements, for example in a lithography system, such as a VUV lithography system, or the like.