Method for the new production of through holes in a layer system
10190419 · 2019-01-29
Assignee
Inventors
- Bahadir Basdere (Berlin, DE)
- DIANA FELKEL (BERLIN, DE)
- Andrea Massa (Berlin, DE)
- Rolf Wilkenhöner (Kleinmachnow, DE)
- Adrian Wollnik (Dallgow-Döberitz, DE)
Cpc classification
B23K2103/172
PERFORMING OPERATIONS; TRANSPORTING
F01D5/184
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F01D5/288
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B23K2103/26
PERFORMING OPERATIONS; TRANSPORTING
F05D2260/202
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F05D2230/13
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B23K26/389
PERFORMING OPERATIONS; TRANSPORTING
B23P2700/06
PERFORMING OPERATIONS; TRANSPORTING
F01D5/005
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B23K26/40
PERFORMING OPERATIONS; TRANSPORTING
Y10T29/49337
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
F01D5/186
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
International classification
F01D5/00
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F01D5/18
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
F01D5/28
MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
B23K26/40
PERFORMING OPERATIONS; TRANSPORTING
Abstract
Introducing a through hole into a substrate (4) before coating, and performing the removal thereafter, shortens the machining times for producing a through hole (18) with a diffuser (13) and also subjects the intermediate layers to less stress.
Claims
1. A method for production of a component, the method comprising: producing a substrate by casting; producing a plurality of spaced through holes arranged in a hole pattern across a thickness of the substrate, each of the plurality of spaced through holes having a constant cross section over an entire thickness of the substrate; scanning the hole pattern of the plurality of spaced through holes in a first scan with a scanning device to obtain a scanned hole pattern; saving the scanned hole pattern of the first scan; coating the substrate, and at least partially the plurality of spaced through holes, with a metallic material to obtain an inner metallic layer after the first scan; removing from the plurality of spaced through holes the metallic material; coating the inner metallic layer with an outer ceramic layer to obtain a coated outer ceramic layer after removing from the plurality of spaced holes the metallic material; scanning and saving another hole pattern of holes on a surface of the substrate in a second scan after coating the inner metallic layer with the outer ceramic layer to obtain another scanned hole pattern; by comparing the scanned hole pattern and the another scanned hole pattern, at least identifying the plurality of spaced through holes and determining orientations and positions of the plurality of spaced through holes; and forming diffusers into the coated outer ceramic layer and the inner metallic layer, each diffuser being associated with a respective one of the plurality of spaced through holes.
2. The method as claimed in claim 1, wherein the removing is performed manually.
3. The method as claimed in claim 1, wherein each diffuser includes a portion that is an asymmetric widening of an upper part of a respective one of the plurality of spaced through holes.
4. The method as claimed in claim 1, wherein the plurality of spaced through holes are produced in the substrate by machining.
5. The method as claimed in claim 1, further comprising using a laser removal method comprising substantially at least 20% different pulse frequencies for producing the plurality of spaced through holes and forming the diffusers.
6. The method as claimed in claim 5, further comprising producing the plurality of spaced through holes using pulse durations in the millisecond range.
7. The method as claimed in claim 1, wherein material is removed by laser pulses with pulse durations in the nanosecond range or the sub-nanosecond range to form the diffusers or to remove material from the plurality of spaced through holes.
8. The method of claim 1, further comprising performing a material-blasting process comprised of sand blasting or shot peening after the producing of the plurality of spaced through holes.
9. The method of claim 1, wherein the diffusers extend into the substrate.
10. The method of claim 1, further comprising removing at least ceramic material from the plurality of spaced through holes in order to finish the through holes.
11. The method of claim 10, wherein a laser with at least 20% different pulse frequencies is used to remove the ceramic material.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
(1) In the figures:
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9) The figures and the description herein represent only exemplary embodiments of the invention.
DESCRIPTION OF A PRIOR ART EMBODIMENT
(10)
(11) In the case of turbine blades 120, 130 (
(12) In order to produce a diffuser 13, first a cylindrical hole 11, 11 is created through the layers 7, 10 and through the substrate 4 as shown in
(13) The cross section of the hole 11, 11 can also be of another cross sectional shape, but it is at least constant over the entire length, as seen over the depth, after the first production step.
(14) In
(15)
(16) A turbine blade 120, 130 (
(17) The substrate 4 in
(18) Then the layers 7, 10 are applied, which layers also deposit in the region of the diffuser (here in the region 15) as in
DESCRIPTION OF AN EMBODIMENT OF THE INVENTION
(19)
(20) The substrate 4, in particular the turbine blade 120, 130, is produced new, in particular is cast (
(21) In a second step, through holes 18 are introduced into the substrate 4 (
(22) The through holes 18 do not yet have a diffuser on the outer surface 16, if one is to be produced. They have a constant cross section over their depth, in particular a cylindrical shape.
(23) Optionally, in the intermediate step, the bored substrate 4 is blasted with material, in particular with sand, silicon carbide balls (SiC) or steel balls (not shown).
(24) This serves as activation for a subsequent coating and also to deburr the bored through holes 18.
(25) In a further step in
(26) The coating is then carried out with an optional metallic adhesion promoter layer 7 in
(27) Preferably, a metallic coating 7 is first applied, in particular by means of LVPS, HVOF or APS.
(28) Optionally, metallic material is removed and the coated holes 19 are opened (
(29) The ceramic coating 10 in
(30) In the process, the holes 19 are also at least partially or entirely coated.
(31) There follows a second scan in
(32) Then, ceramic material is removed from the through hole 18. (
(33) Preferably, in the same device, there is first created an outer diffuser 13 (
(34) A method according to the invention for the new production of a through hole 18 with a diffuser 13 (
(35) A through hole 18 is produced in the substrate 4 in
(36) However, in
(37) Only then are layers 7 (metallic, most preferably MCrAlX) and 10 (ceramic) applied (
(38) The material of the layers 7, 10 enters into the hole 18.
(39) Then, at least the ceramic material is removed from the through hole 19.
(40) Preferably, the diffuser 13 is then created through these layers 7, 10 (
(41) This is brought about preferably by laser machining.
(42) A view onto the surface 16 is shown in
(43) The through hole 18 is preferably produced using pulse durations in the millisecond range, in particular with pulse durations 1 ms.
(44) Pulse durations in the nanosecond range or the sub-nanosecond range, in particular less than or equal to 800 ns, most particularly less than or equal to 600 ns, are used to create the diffuser 13 or at least to remove the ceramic layers and to create the part 15.
(45) Such a component 1, 120, 130 (
(46) A technical challenge with this new process chain is to locate the already-introduced cooling air bores for the subsequent laser shaping and/or laser re-opening of the cooling air bores with such precision that an unacceptable offset between the through bores and the funnels of the film cooling bores does not occur. Currently, at least two possibilities are envisaged to permit this re-location: 1) Manual setup before the laser shaping, in particular by approaching all or optionally a certain number of bores per bore row or bore pattern with a camera system. In the process, the bore coordinates of the approached holes are recorded, andif necessarythe coordinates of the other holes are determined by interpolation. 2) Measuring the bore pattern and transferring the bore coordinates to the laser shaper. This can preferably be brought about by means of structured light projection. To that end, the blade geometry is measured after boring the cylindrical bores and after coating. By means of a best-fit approach, these two measurements are used to determine both the borehole coordinates and the bore angles, which are then delivered to the laser shaper. The boring program for the laser shaping/laser re-opening is then established with the aid of these data.
(47) The inventive step resides on one hand in the fact that the cylindrical through bores 18 are introduced before the ceramic thermal barrier layers 10 are applied, such that the thermal barrier layer is not damaged by the introduction process. The funnel-shaped cooling air bores 19 are introduced only by means of substantially reduced-energy laser shaping andif necessaryceramic coatdown is removed from the through bores 19.
(48) A further inventive step resides in that fact that the real bore pattern is determined by means of a measurement, in particular by geometry determining before and after coating. The actual position and the angle of each individual through hole 18 are delivered to the laser shaper, such that there is no unacceptable offset between the through bore and the film cooling funnel. In addition, possible manufacturing-related discrepancies between the 3D model and the real position of the bores are thus detected and taken into account.
(49) Further inventive steps reside in using the activation treatment prior to coating (sand blasting) also for cleaning and deburring purposes after laser boring.