Board Drilling Apparatus, Drill Bit, and Method for Board Drilling Apparatus to Drill a Board
20220371103 · 2022-11-24
Inventors
Cpc classification
B23B35/00
PERFORMING OPERATIONS; TRANSPORTING
H05K2203/0207
ELECTRICITY
B23B27/14
PERFORMING OPERATIONS; TRANSPORTING
H05K3/429
ELECTRICITY
International classification
B23B35/00
PERFORMING OPERATIONS; TRANSPORTING
Abstract
A board drilling apparatus, drill bit, and method for board drilling apparatus to drill a board. The board drilling apparatus (4) is configured to drill a board comprising at least a target conductive layer (13), an insulation layer, and a hole (3) covered with conductive material through at least part of the board in thickness, to remove at least part of the conductive material, the board drilling apparatus (4) comprising a drill bit (41) and a controller (43): the drill bit (41) comprising an insulation part (412) at least in center of end of the drill bit (41) and a conductive part (411) at least on edge of the end of the drill bit (41), arranged to enable only the insulation part (412) to be in touch with the conductive material of the hole (3) when the board drilling apparatus (4) is drilling the board, and arranged to enable the conductive part to get in touch with the target conductive layer (13) once the conductive material on the way to the target conductive layer (13) has just been removed; and the controller (43) configured to stop drilling when receiving an electrical signal occurred in response to the drill bit touching the target conductive layer of the board.
Claims
1-17. (canceled)
18. A board drilling apparatus configured to drill a board comprising at least a target conductive layer, an insulation layer, and a hole covered with conductive material through at least part of the board in thickness, to remove at least part of the conductive material, the board drilling apparatus comprising a drill bit and a controller: the drill bit comprising an insulation part at least in a center of an end of the drill bit and a conductive part at least on an edge of the end of the drill bit, arranged to enable only the insulation part to be in touch with the conductive material of the hole when the board drilling apparatus is drilling the board, and arranged to enable the conductive part to get in touch with the target conductive layer once the conductive material on the way to the target conductive layer has just been removed; and the controller configured to stop drilling when receiving an electrical signal occurred in response to the drill bit touching the target conductive layer of the board.
19. The board drilling apparatus of claim 18, wherein the conductive part covers at least part of a cutting edge of the end of the drill bit.
20. The board drilling apparatus of claim 18, wherein the conductive part covers at least part of a groove of the end of the drill bit.
21. The board drilling apparatus of claim 18, wherein the board comprises muliple conductive layers in parallel, each of which gets in touch with the conductive part of the drill bit and generates a respective electrical signal as the drill bit drills that conductive layer, wherein the target conductive layer is selected from the multiple conductive layers.
22. The board drilling apparatus of claim 18, further comprising a tip in the center of the end of the drill bit, which is small enough to fit the hole without getting in touch with the conductive material of the hole when the drill bit is aligned to the hole.
23. The board drilling apparatus of claim 18, wherein the insulation part is made of material comprising one or more of the following: diamond material or zirconium dioxide.
24. The board drilling apparatus of claim 18, wherein the insulation part is in a center of the end of the drill bit and the rest of the drill bit is the conductive part.
25. The board drilling apparatus of claim 18, wherein the board is a circuit board.
26. A drill bit of a board drilling apparatus configured to drill a board comprising at least a target conductive layer, an insulation layer, and a hole covered with conductive material through at least part of the board in thickness, to remove at least part of the conductive material, wherein the drill bit comprises: an insulation part at least in a center of an end of the drill bit and a conductive part at least on an edge of the end of the drill bit, arranged to enable only the insulation part to be in touch with the conductive material of the hole when the board drilling apparatus is drilling the board, and arranged to enable the conductive part to get in touch with the target conductive layer once the conductive material on the way to the target conductive layer has just been removed.
27. The drill bit of claim 26, wherein the conductive part covers at least part of a cutting edge of the end of the drill bit.
28. The drill bit of claim 26, wherein the conductive part covers at least part of a groove of the end of the drill bit.
29. The drill bit of claim 26, further comprising a tip in the center of the end of the drill bit, which is small enough to fit the hole without getting in touch with the conductive material of the hole when the drill bit is aligned to the hole.
30. The drill bit of claim 26, wherein the insulation part is made of material comprising one or more of the following: diamond material or zirconium dioxide.
31. The drill bit of claim 26, wherein the drill bit is configured to drill a circuit board.
32. A method for a board drilling apparatus to drill a board comprising at least a target conductive layer, an insulation layer, and a hole covered with conductive material through at least part of the board in thickness, to remove at least part of the conductive material, the board drilling apparatus comprising a drill bit and a controller, the drill bit comprising an insulation part at least in a center of an end of the drill bit and a conductive part at least on an edge of the end of the drill bit, arranged to enable only the insulation part to be in touch with the conductive material of the hole when the board drilling apparatus is drilling the board, and arranged to enable the conductive part to get in touch with the target conductive layer once the conductive material on the way to the target conductive layer has just been removed, the method comprising: aligning the insulation part to the conductive material of the hole; starting drilling the board along the hole to remove the conductive material; and stopping drilling by the controller when the controller receives an electrical signal occurred in response to the drill bit touching the target conductive layer of the board.
33. The method of claim 32, wherein the board comprises multiple conductive layers parallel to the target conductive layer, each of which gets in touch with the drill bit and generates a respective electrical signal as the drill bit drills that conductive layer, the method further comprising: selecting the target conductive layer from the multiple conductive layers of the board before starting drilling; and setting the controller before starting drilling to enable the controller to recognize the respective electrical signal corresponding to the target conductive layer based on the selecting.
34. The method of claim 32, wherein the board is a circuit board.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The foregoing and other features of this disclosure will become more fully apparent from the following description and appended claims, taken in conjunction with the accompanying drawings. Understanding that these drawings depict only several embodiments in accordance with the disclosure and are, therefore, not to be considered limiting of its scope, the disclosure will be described with additional specificity and details through use of the accompanying drawings.
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DETAILED DESCRIPTION
[0027] Embodiments herein will be described in detail hereinafter with reference to the accompanying drawings, in which embodiments are shown. These embodiments herein may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. The elements of the drawings are not necessarily to scale relative to each other. Like numbers refer to like elements throughout.
[0028] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” “comprising,” “includes” and/or “including” when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
[0029] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood. For example, “board” refers to a commonly understood board, rather than only “circuit board”, though “circuit board” is used as an example in embodiments of the invention.
[0030]
[0031] U.S. Pat. No. 9,827,616B2 discloses a drilling method that requires predetermining of depth of the target layer, including the following steps: performing a drilling motion from an initial location, and generating a first electrical signal when coming into contact with a first conductive layer of the PCB, determining a first conductive location according to the first electrical signal, and obtaining first Z-coordinate information; continuing to perform the drilling motion after drilling through the first conductive layer, and generating a second electrical signal when coming into contact with a second conductive layer, determining a second conductive location according to the second electrical signal, and obtaining second Z-coordinate information; continuing to perform the drilling motion and drilling through the PCB to obtain a through hole; and performing back drilling in the location of the through hole according to a preset depth, and the preset depth is a medium thickness between the second conductive layer and the first conductive layer plus a compensation depth.
[0032] However, in some references, the depth of the target layer in the board is not uniform and varies, which often changes the amount of the stub portion that needs to be removed. Drilling too deeply will disconnect the signal layer from the hole, as shown in
[0033] Besides, In the method of U.S. Pat. No. 9,827,616B2, the board has to be designed specifically for generating different electrical signals for determining different Z-coordinate information, which is not universally applicable.
[0034] In some references, the drill bit 41 is wholly conductive, for example, it is made of steel. If we connect the target conductive layer 13 with the drill bit 41 via a wire as shown in
[0035]
[0036]
[0037] In one embodiment as shown in
[0038] In an embodiment of the present invention, the insulation part 411 is made of material comprising one or more of the following: diamond material or zirconium dioxide.
[0039] In an embodiment of the present invention, the conductive part 412 is made by metal plating.
[0040] The controller 43 is configured to stop drilling when receiving an electrical signal occurred in response to the drill bit 41 touching the target conductive layer 13 of the board. The electrical signal could be conducted all the way to the controller 43 from the conductive part 411 of the drill bit 41, or could be transmitted wirelessly to the controller 43. Some details of the electrical signals will be described below with reference to
[0041] The target conductive layer 13 is selected from the conductive layers 11, 12, 13, and 14, each of which corresponds to a respective electrical signal occurred in response to the drill bit 41 touching it. It is noted that embodiments herein are described with the conductive layer 13 selected as the target layer, even though conductive layers 12, 14, etc. could also be selected as the target layer. When there is a further insulation layer below the conductive layer 11 and the hole is through it, the conductive layer 11 may also be selected as the target conductive layer.
[0042]
[0043] It is noted that in the process of drilling, the conductive part 411 of the drill bit 41 will not get in touch with the conductive material of the hole 3, but only the insulation part 412 of the drill bit 41 will be in touch with the conductive material of the hole 3.
[0044] Once the conductive layer 11 is drilled through, the loop is open as the conductive layer 11 is no longer connected with the conductive material of the hole 3 and the first electrical signal terminates. Then as the conductive part 411 of the drill bit 41 gets in touch with the conductive layer 12, part of the target conductive layer 13, the wire, part of the conductive part 411 of the drill bit 41, part of the conductive layer 12, and part of the conductive material of the hole 3 will form a loop, and then a second electrical signal is generated, as shown by a pulse beside the conductive layer 12 in
[0045] Similarly, once the conductive layer 12 is drilled through, the loop is open again as the conductive layer 12 is no longer connected with the conductive material of the hole 3 and the second electrical signal terminates. Then as the conductive part 411 of the drill bit 41 gets in touch with the conductive layer 13, part of the target conductive layer 13, the wire and part of the conductive part 411 of the drill bit 41 will form a loop, and then a third electrical signal is generated, as shown by a pulse beside the conductive layer 12 in
[0046] In this embodiment, the first, second and third electrical signals may be the same, and the controller 43 recognizes the electrical signal corresponding to the target conductive layer 13 by counting electrical signal numbers. However, the present invention is not limited to this embodiment, and a person skilled in the art would know that variations could be made regarding how the controller 43 recognizes the electrical signal corresponding to the target conductive layer 13.
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[0048] Before that, as the conductive part 411 of the drill bit 41 will not get in touch with the conductive material of the hole 3, but only the insulation part 412 of the drill bit 41 will be in touch with the conductive material of the hole 3, there is no loop formed and no signal received by the controller 43.
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[0050] It is noted that in the process of drilling, the conductive part 411 of the drill bit 41 will not get in touch with the conductive material of the hole 3, but only the insulation part 412 of the drill bit 41 will be in touch with the conductive material of the hole 3.
[0051] Once the conductive layer 11 is drilled through, the loop is open as the conductive layer 11 is no longer connected with the conductive material of the hole 3 and the first electrical signal terminates. Then as the conductive part 411 of the drill bit 41 gets in touch with the conductive layer 13, part of the target conductive layer 13, the wire and part of the conductive part 411 of the drill bit 41 will form a loop, and then a second electrical signal is generated, as shown by a pulse beside the conductive layer 13 in
[0052] In this embodiment, the first and second electrical signals may be the same, and the controller 43 recognizes the electrical signal corresponding to the target conductive layer 13 by counting electrical signal numbers. However, the present invention is not limited to this embodiment, and a person skilled in the art would know that variations could be made regarding how the controller 43 recognizes the electrical signal corresponding to the target conductive layer 13.
[0053] Embodiments of the present invention can ensure a proper drilling depth that will neither disconnect the target conductive layer from the hole, nor leave a stub portion in the hole, regardless of how the depths of the conductive layers and the insulations layers vary, as shown by a schematic view of the board after drilling according to an embodiment of the present invention in
[0054]
[0055] In an embodiment, the method starts at step 1506, wherein the drill bit 41 of the board drilling apparatus 4 is aligned to the hole, which requires the insulation part 412 of the drill bit 41 being aligned to the conductive material of the hole 3. In this way, only the insulation part 412 is in touch with the conductive material of the hole 3. It will be easier for the board drilling apparatus of
[0056] Then at step 1508, drilling the board along the hole 3, to remove the conductive material of the hole 3.
[0057] Then at step 1510, when the controller 43 receives an electrical signal occurred in response to the drill bit 41 touching the target conductive layer 13 of the board, the controller 43 stops drilling.
[0058] Generally, a board may comprise multiple conductive layers as shown in
[0059] As each of the several conductive layers corresponds to a respective electrical signal, and the controller 43 is required to recognize it, a controller setting step 1504 is needed before step 1508, to enable it to recognize the electrical signal of the target conductive layer, based on the selection of step 1502. For example, in
[0060]
[0061] Furthermore, the controller 43 comprises at least one computer program product 438, in the form of a non-volatile or volatile memory, e.g., an Electrically Erasable Programmable Read-Only Memory (EEPROM), a flash memory and a hard drive. The computer program product 438 comprises a computer program 430, which comprises code/computer readable instructions, which when executed by the processor 436 in the controller 43, causes the controller 43 to perform actions, e.g., adapting to the setting for it to recognize the electrical signal of the target conductive layer, determining whether the received electrical signal corresponds to the target conductive layer, sending signals to stop drilling, etc..
[0062] The processor 436 may be a single CPU (Central processing unit), but could also comprise two or more processing units. For example, the processor 436 may include general purpose microprocessors, instruction set processors and/or related chips sets and/or special purpose microprocessors such as Application Specific Integrated Circuit (ASICs). The processor 436 may also comprise board memory for caching purposes. The computer program 430 may be carried by a computer program product 438 connected to the processor 436. The computer program product may comprise a computer readable medium on which the computer program is stored. For example, the computer program product may be a flash memory, a Random-access memory (RAM), a Read-Only Memory (ROM), or an EEPROM, and the computer program modules to perform different actions described above could in alternative embodiments be distributed on different computer program products in the form of memories within the controller 43.
[0063] The embodiments of the present invention, as a whole or by scenario, can ensure a proper drilling depth that will neither drills too much, nor leave a stub portion in the hole, regardless of how the depths of the conductive layers and the insulations layers vary. No predetermined depth is required. This is particular advantageous in electronic systems that utilize high-speed signals, where the board is a circuit board, such as a multilayer printed circuit board, as the signal to noise ratio will be greatly enhanced as a result.
[0064] While the embodiments have been illustrated and described herein, it will be understood by those skilled in the art that various changes and modifications may be made, and equivalents may be substituted for elements thereof without departing from the true scope of the present technology. In addition, many modifications may be made to adapt to a particular situation and the teaching herein without departing from its central scope. Therefore it is intended that the present embodiments not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out the present technology, but that the present embodiments include all embodiments falling within the scope of the appended claims.