MECHANICAL VIBRATION-ISOLATED, LIQUID HELIUM CONSUMPTION-FREE AND EXTREMELY LOW TEMPERATURE REFRIGERATING SYSTEM

Abstract

The present disclosure relates to the technical field of cryogenic cooling. In particular, the present disclosure relates to a mechanical vibration-isolated, liquid helium consumption-free cryogenic cooling device. The system according to some embodiments of the present disclosure comprises: a closed-cycle cryogenic cooling system, a helium heat exchange gas cooling and vibration isolation interface system, a cryogenic throttle valve cooling system, and a temperature feedback control system. The cryogenic cooling system provided by the present disclosure can achieve extremely low temperatures, as low as 1.4 K (based on helium-4 medium) or 0.2 K (based on helium-3 medium) without the need for the consumption of liquid helium. The disclosed cooling system can also efficiently isolate intrinsic mechanical vibrations of the closed-cycle cooling system. The disclosed cooling system can achieve variable temperature regulation through the temperature feedback control system. The disclosed cooling system can be compatible with ultra-high vacuum environments for high-temperature baking.

Claims

1-3. (canceled)

4. A cryogenic cooling system, comprising: a cooling and vibration isolation interface containing a helium heat exchange gas; a closed-cycle cooling system including a cold head, a compressor, and a helium pipeline; and a cryogenic throttle valve cooling system thermally coupled to a low-temperature end of the cooling and vibration isolation interface, the cryogenic throttle valve cooling system including: a throttle valve configured to liquefy helium gas, and a liquid helium vessel configured to store liquid helium.

5. The cryogenic cooling system of claim 4, further comprising: a feedback temperature control component disposed adjacent to the liquid helium vessel.

6. The cryogenic cooling system of claim 4, further comprising: a feedback temperature control component disposed adjacent to the low-temperature end of the cooling and vibration isolation interface.

7. The cryogenic cooling system of claim 4, wherein the closed-cycle cooling system further includes a compressor and a helium gas pipeline disposed between the compressor and the cold head.

8. The cryogenic cooling system of claim 4, further comprising: a thermal radiation shield fixed onto the cooling and vibration isolation interface to reduce radiation thermal leakage.

9. The cryogenic cooling system of claim 4, further comprising: a rubber sealing the cold head and the top end of the cooling and vibration isolation interface and configured to isolate a mechanical vibration of the cold head.

10. The cryogenic cooling system of claim 4, wherein the heat exchange gas is configured to operate as a heat exchange medium and to isolate a mechanical vibration of the cold head.

11. The cryogenic cooling system of claim 4, wherein the cryogenic throttle valve cooling system further includes an inlet gas piping and a helium heat exchanger, and the inlet gas piping and the helium heat exchanger are configured to perform a heat exchange between each other.

12. The cryogenic cooling system of claim 11, wherein the cryogenic throttle valve cooling system further includes an outlet gas piping, a portion of the inlet gas piping is nested by a portion of the outlet gas piping, the portion of the inlet gas piping and the portion of the outlet gas piping are configured to perform a counterflow heat exchange between each other.

13. The cryogenic cooling system of claim 12, wherein the outlet gas piping is coupled to the liquid helium vessel.

14. The cryogenic cooling system of claim 11, wherein the throttle value includes a metal line inserted into the inlet gas piping to achieve a cryogenic temperature for the helium gas passing through the throttle value.

15. The cryogenic cooling system of claim 4, further comprising: a thermal switch configured to control the heat conduction between the cryogenic throttle valve cooling system and the cooling and vibration isolation interface.

16. The cryogenic cooling system of claim 15, wherein in response to the fill of helium gas, the thermal switch is configured to be closed for the heat conduction between the cryogenic throttle valve cooling system and the cooling and vibration isolation interface.

17. The cryogenic cooling system of claim 15, wherein in response to a vacuum, the thermal switch is configured to be open to cause a thermal isolation between the cryogenic throttle valve cooling system and the cooling and vibration isolation interface.

18. The cryogenic cooling system of claim 4, further comprising: a vacuum pump configured to provide a low-pressure environment for the liquid helium vessel.

19. A method of cryogenic cooling, comprising: conducting a heat exchange between a cold head of a closed-cycle cooling system and a cooling and vibration isolation interface by a helium heat exchange gas; and liquefying a portion of the helium exchange gas into a liquid helium by a cryogenic throttle valve cooling system, the cryogenic throttle valve cooling system thermally coupled to the helium heat exchange gas of the cooling vibration isolation interface via a thermal switch.

20. The method of claim 19, wherein the helium heat exchange gas is configured to isolate a mechanical vibration of the cold head.

21. The method of claim 19, wherein a thermal radiation shield is fixed onto the cooling and vibration isolation interface to reduce radiation thermal leakage.

22. The method of claim 19, wherein a rubber is disposed to seal the cold head and the top end of the cooling and vibration isolation interface and configured to isolate a mechanical vibration of the cold head.

23. The method of claim 19, further comprising: conducting a heat exchange between a second helium gas transferring through an inlet gas piping and a helium heat exchanger.

24. The method of claim 23, further comprising: conducting a counterflow heat exchange between a second helium gas transferring through a portion of an inlet gas piping and a portion of an outlet gas piping surrounding the portion of the inlet gas piping.

25. The method of claim 19, further comprising: storing the liquid helium in a liquid helium vessel.

26. The method of claim 25, further comprising: providing a low pressure to the liquid helium vessel by a vacuum pump connected through an outlet gas piping.

27. The method of claim 19, further comprising: by controlling the quantity of helium gas in the thermal switch, opening the thermal switch to cause a thermal isolation between the cryogenic throttle valve cooling system and the cooling and vibration isolation interface.

28. The method of claim 19, furthering comprising: performing a cooling temperature adjustment by a first temperature feedback control system disposed adjacent to the liquid helium vessel and a second temperature feedback control system disposed adjacent to a low-temperature end of the cooling and vibration isolation interface.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0016] FIG. 1 is a schematic of a mechanical vibration-isolated, liquid helium consumption-free, cryogenic cooling device according to at least some embodiments of the present disclosure.

[0017] FIG. 2 is a sample assembly sectional diagram of a cold head component of a closed-cycle cryogenic cooling system, a helium heat exchange gas cooling and vibration isolation interface system, and a cryogenic throttle valve cooling system.

[0018] FIG. 3 is a sample assembly schematic of a cryogenic throttle valve cooling system.

[0019] Numerals within the figures: 1Closedcycle cooling system; 2Helium heat exchange gas cooling and vibration isolation interface system; 3Cryogenic throttle valve cooling system; 4First temperature feedback control system; 5Second temperature feedback control system; 6Vacuum chamber; 7Closedcycle cold head; 8Cooling and vibration isolation interface; 9Helium heat exchange gas; 10Thermal radiation shield; 11Soft rubber; 12Inlet gas piping; 13Helium heat exchanger; 14Counterflow heat exchange unit; 15Throttle valve; 16Liquid helium vessel (can include helium-4 or helium-3); 17Thermal switch; 18Outlet gas piping.

DETAILED DESCRIPTION

[0020] In order to further clarify the use of the present disclosure, embodiments have been presented below as well as reference diagrams for further detailed explanation of the present disclosure.

[0021] A device according to the present disclosure comprises: a closed-cycle cryogenic cooling system 1; a helium heat exchange gas cooling and vibration isolation interface system 2; a cryogenic throttle valve cooling system 3; and a temperature feedback control system, including a first temperature feedback control system 4 and a second feedback control system 5. Those components can be enclosed in a vacuum chamber 6.

[0022] The closed-cycle cryogenic cooling system 1 includes: a closed-cycle cold head 7, a compressor (shown in FIG. 1), and a helium gas pipeline. The helium heat exchange gas cooling and vibration isolation interface system 2 includes: a cooling and vibration isolation interface 8, a helium heat exchange gas 9, a thermal radiation shield 10, and soft rubber 11.

[0023] The cryogenic throttle valve cooling system 4 includes: inlet gas piping 12, a helium heat exchanger 13, a counterflow heat exchange unit 14, a throttle valve 15, a liquid helium vessel 16 (including, e.g., helium-4 or helium-3), a thermal switch 17, and outlet gas piping 18.

[0024] In the helium heat exchange gas cooling and vibration isolation interface system 2, the cold head 7 of the closed-cycle cooler extends into the cooling and vibration isolation interface 8, and the helium heat exchange gas 9 disposed between the cold head and the cooling vibration isolation interface acts as a cooling medium. The soft rubber 11 connects and seals the cold head 7 and the top end of the cooling and vibration isolation interface 8. While sealing the helium exchange gas 9, the soft rubber 11 can also isolate the low-frequency mechanical vibrations of the cold head. The thermal radiation shield 10 is fixed onto the cooling and vibration isolation interface 8 and is used to reduce the thermal leakage caused by the high-temperature radiation.

[0025] The temperature feedback control system includes a temperature sensor, a heating component, and a feedback temperature control component connected through a circuit. The first temperature feedback control system 4 and the second temperature feedback control system 5 are respectively mounted adjacent to the liquid helium vessel 16 and the low-temperature end of the cooling and vibration isolation interface 8.

[0026] In the cryogenic throttle valve cooling system 3, the helium heat exchanger 13, the thermal switch 17, and the liquid helium vessel 16 are sealed by, e.g., welding. The cryogenic throttle valve cooling system 3 is thermally coupled to the low-temperature end of the helium heat exchange gas cooling and vibration isolation interface system. The inlet gas piping 12 first performs a heat exchange with the helium heat exchanger 13 to lower the temperature; a portion of the inlet gas piping 12 then passes through the outlet gas piping 17 to form a counterflow heat exchange mechanism in order to further lower the temperature of the pre-throttle helium. The throttle valve 15 includes a metal line inserted into the inlet gas piping. The diameter of the metal line is close to the inner diameter of the inlet gas piping. The high-pressure helium gas achieves a cryogenic temperature after passing through the throttle valve, and a portion of the helium liquefies and forms liquid helium which is stored in the liquid helium vessel 16. The outlet gas piping connection is sealed and connected with the liquid helium vessel 16 though welding, and forms the counterflow thermal exchange mechanism along with the inlet gas piping. A vacuum pump (as shown in FIG. 1) can be used to provide a low-pressure environment for the helium vessel and the outlet gas piping, allowing the throttle cooling effect to sustain continuously.

[0027] When there is a certain amount of helium gas in the thermal switch 17, the thermal switch 17 is at close state; whereas the thermal switch is pumped into a vacuum environment, the switch is at open state. The thermal switch is used to control the heat conduction between the cryogenic throttle valve cooling system and the helium heat exchange gas cooling and vibration isolation interface system. When the thermal switch is closed, the thermal conductivity is increased, and the temperature can be rapidly lowered through the cooling effect of the cooling and vibration isolation interface. When the thermal switch is open, the heat transfer between the cooling and vibration isolation interface and the liquid helium vessel can be isolated to reduce thermal leakage.

[0028] In the inlet gas piping 12 and outlet gas piping 18, the pipe diameters may change depending on different temperatures and pressures to ensure that the mass flow rate of the helium gas in the piping remains a constant.

[0029] In some embodiments, a closed-cycle cooling system can be used to resolve the issue of cryogenic cooling operation specifying large quantities of liquid helium. Using a helium heat exchange gas cooling and vibration isolation interface resolves the issue of cooler operation producing micrometer-level and even larger amplitude of low-frequency mechanical vibrations. Using a cryogenic throttle valve cooling system resolves the issue of closed-cycle systems being unable to achieve ultralow temperatures. Using a temperature feedback control system can achieve large-range variable temperature operations. Materials such as oxygen-free copper and stainless steel 316L are used to make the cooling and vibration isolation interface and cryogenic throttle valve cooling system in a vacuum environment, and are compatible with the high-temperature baking conditions specified by an ultra-high vacuum environment.

[0030] The specific embodiments above further describe the purposes, technical solutions, and beneficial outcomes of the present disclosure. It should be understood that the above descriptions are only specific embodiments of the present disclosure and are not limitations of the present disclosure. Any modification, equivalent replacement or improvement performed within the spirit or principle of the present disclosure should be included within the scope of protection of the present disclosure.