METHOD FOR SHAPING FRAME STRUCTURE USING MULTILAYER BOARD

Abstract

The present invention relates to a method for shaping a frame structure using a multilayer board to solve the technical problem of low production efficiency of the existing bamboo frame structure. The present invention has the first solution of bending a multilayer board into a profiled board using the board bending technology; cutting the profiled board into several framing units; and finally connecting end portions of one, two or plural framing units one another, thereby forming a frame structure. The present invention has the second solution of gluing and stacking a plurality of single boards and laminating them into a profiled board; cutting the profiled board into several framing units; and finally connecting end portions of one, two or plural framing units one another, thereby forming a frame structure.

Claims

1. A method for shaping a frame structure using a multilayer board, comprising the steps of bending a multilayer board into a profiled board; cutting the profiled board into several framing units; and finally connecting end portions of one, two or plural framing units one another, thereby forming a frame structure.

2. The method for shaping a frame structure using a multilayer board according to claim 1, comprising: S1: bending the multilayer board to form a profiled board; S2: processing a connecting groove on the profiled board; S3: cutting the profiled board into several framing units; S4: connecting the end portions of one, two or plural framing units one another, thereby forming a frame structure.

3. A method for shaping a frame structure using a multilayer board, comprising the steps of gluing and stacking a plurality of single boards and laminating them into a profiled board; cutting the profiled board into several framing units; and finally connecting end portions of one, two or plural framing units one another, thereby forming a frame structure.

4. The method for shaping a frame structure using a multilayer board according to claim 3, comprising. S1: bending and shaping a plurality of single boards on a special shape forming machine to make into a profiled board; S2: processing a connecting groove on the profiled board; S3: cutting the profiled board into several framing units; S4: connecting the end portions of one, two or plural framing units one another, thereby forming a frame structure.

5. The method for shaping a frame structure using a multilayer board according to claim 3, wherein the single board is a bamboo or wood single board.

Description

DESCRIPTION OF THE DRAWINGS

[0033] FIG. 1 is a schematic diagram showing the process for shaping a frame structure using a three-layer board in the first embodiment.

[0034] FIG. 2 is a schematic diagram showing the process for shaping a frame structure using three single boards in the second embodiment.

[0035] Reference numerals: 1three-layer board, 2U-shaped board, 3connecting groove, 4framing unit, 4framing unit, 5frame structure, 6single board, 7three-layer superposed board.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0036] In order to explain the technical contents, the object and effects to be realized of the present invention in detail, the present invention will be explained further in detail in combination with the embodiments and drawings.

First Embodiment

[0037] As shown in FIG. 1, a three-layer board is taken as an example in FIG. 1.

[0038] A method for shaping a frame structure using a three-layer board includes the following steps of:

[0039] S1: bending a three-layer board 1 to form a U-shaped board 2.

[0040] The three-layer board 1 commercially available or the one manufactured by coating glue on three single boards, and then stacking the glued three single boards, and putting them in a hot-embossing machine. The single board is a bamboo or wood single board.

[0041] Prior to bending, it needs to microwave heat and soften the three-layer board 1. The three-layer board is bent step by step, to avoid cracking during bending.

[0042] S2: processing a connecting groove 3 at two ends of the U-shaped board 2.

[0043] Usually, connecting portions at the two ends of the U-shaped board 2 can be slotted by a slot milling machine at the same time, to form a connecting groove 3.

[0044] S3: cutting the U-shaped board 2 into several framing units 5.

[0045] The U-shaped board 2 is cut uniformly in a direction of a Z axis of the U-shaped board 2 by a multiple blade saw.

[0046] S4: connecting the end portions of two framing units 5 one another, thereby forming a frame structure. The final finished product is formed by grinding, polishing and painting the formed frame structure 5.

Second Embodiment

[0047] As shown in FIG. 2, three single boards are taken as an example in FIG. 2.

[0048] A method for shaping a frame structure using three single boards 6 includes the following steps of:

[0049] S1: gluing and successively stacking three single boards to form a three-layer superposed board 7 just in a superposed state without glue; bending and shaping the three-layer superposed board 7 on a special shape forming machine to make into a U-shaped board 2; the special shape forming machine is provided with a microwave heating device to entirely heat the three-layer superposed board uniformly.

[0050] S2: processing a connecting groove 3 at the two ends of the U-shaped board.

[0051] Connecting portions at the two ends of the profiled board can be slotted by a slot milling machine at the same time.

[0052] S3: cutting the U-shaped board 2 into several framing units 5.

[0053] The U-shaped board 2 is cut uniformly in a direction of a Z axis of the profiled board by a multiple blade saw.

[0054] S4: connecting the end portions of two framing units 5 one another, thereby forming a frame structure. The final finished product is formed by grinding, polishing and painting the formed frame structure 5.

[0055] The foregoing description only shows preferable embodiments of the present invention, and does not intend to limit the patent scope of the present invention. Equivalent structures or equivalent flows made in accordance with the specification and drawings of the present invention may be applied in other related arts directly or indirectly, and fall within the protection scope of the present invention.