Printed board with wiring pattern for detecting deterioration, and manufacturing method of the same

Abstract

A printed board with a wiring pattern for detecting deterioration includes an insulating substrate, a wiring pattern group that is formed on the insulating substrate and includes a wiring pattern for detecting deterioration; and a solder resist covering the wiring pattern group, in which the board has a thin film section, and a thick film section in which a thickness of the solder resist is larger than the thin film section, and the wiring pattern for detecting deterioration is formed in the thin film section whose entire surrounding area or partial surrounding area is surrounded by the thick film section.

Claims

1. A printed board with a wiring pattern for detecting deterioration, comprising: an insulating substrate; a wiring pattern group that is formed on the insulating substrate and includes a wiring pattern for detecting deterioration which detects a degree of deterioration of the printed board; and solder resist covering the wiring pattern group, wherein the printed board with a wiring pattern for detecting deterioration has: a thin film section in which a thickness of the solder resist from the insulating substrate surface is small; and a thick film section in which the thickness of the solder resist is larger than the thin film section, and the wiring pattern for detecting deterioration is formed in the thin film section whose entire surrounding area or partial surrounding area is surrounded by the thick film section.

2. The printed board with a wiring pattern for detecting deterioration according to claim 1, wherein the thickness of the solder resist in the thin film section is smaller than the thickness of the wiring pattern of the wiring pattern group.

3. The printed board with a wiring pattern for detecting deterioration according to claim 1, wherein a width of the wiring pattern for detecting deterioration is narrower than a width of another wiring pattern in the wiring pattern group.

4. The printed board with a wiring pattern for detecting deterioration according to claim 1, wherein part or all of the thin film section and the thick film section are formed apart from each other.

5. The printed board with a wiring pattern for detecting deterioration according to claim 1, wherein a silk printing layer or an insulating resin material layer is formed on all or a part of the solder resist which is formed so as to surround the wiring pattern for detecting deterioration.

6. A printed board with a wiring pattern for detecting deterioration, comprising: an insulating substrate; a wiring pattern group that is formed on the insulating substrate and includes a wiring pattern for detecting deterioration which detects a degree of deterioration of the printed board; and solder resist formed on the insulating substrate, wherein the wiring pattern for detecting deterioration is formed on a surface region of the insulating substrate whose entire surrounding area or partial surrounding area is surrounded by the solder resist, and an entirety of the wiring pattern for detecting deterioration is not covered by the solder resist.

7. The printed board with a wiring pattern for detecting deterioration according to claim 6, wherein the width of the wiring pattern for detecting deterioration is narrower than the width of another wiring pattern in the wiring pattern group.

8. A printed board with a wiring pattern for detecting deterioration, comprising: an insulating substrate; a wiring pattern group that is formed on the insulating substrate and includes a wiring pattern for detecting deterioration which detects a degree of deterioration of the printed board; and solder resist formed on the insulating substrate, wherein the wiring pattern for detecting deterioration is formed on a surface region of the insulating substrate whose entire surrounding area or partial surrounding area is surrounded by the solder resist, a part of the wiring pattern for detecting deterioration is covered by the solder resist, and a thickness of solder resist covering the part of the wiring pattern for detecting deterioration is smaller than a thickness of solder resist forming a region of the wiring pattern for detecting deterioration whose entire surrounding area or partial surrounding area is surrounded by the solder resist.

9. A method for manufacturing a printed board with a wiring pattern for detecting deterioration which comprises: an insulating substrate; and a wiring pattern for detecting deterioration which is formed on the insulating substrate and detects a degree of deterioration of the printed board, the method including: a first step of forming a first solder resist layer having a smaller thickness than the thickness of the wiring pattern for detecting deterioration; and a second step of forming a second solder resist layer on the first solder resist layer so as to surround the entire surrounding area or partial surrounding area of the wiring pattern for detecting deterioration.

10. The manufacturing method of a printed board with a wiring pattern for detecting deterioration according to claim 9, the method including: a third step of forming a silk printing layer or an insulating resin material layer on all or a part of the second solder resist layer.

11. A method for manufacturing a printed board with a wiring pattern for detecting deterioration which comprises: an insulating substrate; and a wiring pattern group for detecting deterioration including a wiring pattern for detecting deterioration which is formed on the insulating substrate and detects a degree of deterioration of the printed board, the method including: a first step of forming a first solder resist layer covering another wiring pattern except the wiring pattern for detecting deterioration in the wiring pattern group; and a second step of forming a second solder resist layer on a part on the first solder resist layer so as to surround the entire surrounding area or partial surrounding area of the wiring pattern for detecting deterioration.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) The above and other objects and features of the present invention will be obvious from the ensuing description of embodiments with reference to the accompanying drawings, in which:

(2) FIG. 1 is a view showing a cross-sectional structure of a printed board in a first embodiment of the present invention;

(3) FIG. 2 is a view showing a cross-sectional structure of a printed board in a second embodiment of the present invention;

(4) FIG. 3 is a view showing a cross-sectional structure of a printed board in a third embodiment of the present invention;

(5) FIG. 4 is a view showing a cross-sectional structure of a printed board in a fourth embodiment of the present invention;

(6) FIG. 5 is a view showing a cross-sectional structure of a printed board in a fifth embodiment of the present invention;

(7) FIG. 6 is a view showing a first step in the first embodiment of the manufacturing method of a printed board according to the present invention;

(8) FIG. 7 is a view showing a second step in the first embodiment of the manufacturing method of a printed board according to the present invention;

(9) FIG. 8 is a view showing a first step in the second embodiment of the manufacturing method of a printed board according to the present invention;

(10) FIG. 9 is a view showing a second step in the second embodiment of the manufacturing method of a printed board according to the present invention; and

(11) FIG. 10 is a view showing a cross-sectional structure of a printed board including a conventional wiring pattern for detecting deterioration.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

(12) Hereinafter, a wiring pattern denotes a conductor pattern constituting wirings of a printed board.

First Embodiment

(13) FIG. 1 shows the first embodiment of the present invention. In a printed board 100, a wiring pattern 13 for detecting deterioration and a wiring pattern 14 other than the wiring pattern for detecting deterioration are formed as a wiring pattern group on a surface of an insulating substrate 15. The same applies to other embodiments. The insulating substrate 15 on which the wiring pattern 13 for detecting deterioration is formed is covered by solder resist 12. The wiring pattern 14 is a conductor pattern provided in order to allow the printed board 100 to constitute an electronic circuit provided with a regular function.

(14) The printed board 100 has a thin film section 16 in which the thickness of the solder resist 12 is smaller than a thick film section 17, and the thick film section 17 in which the thickness is larger than the thin film section 16. The wiring pattern 13 for detecting deterioration is formed in a region (the thin film section 16) surrounded by the thick film section 17. Further, the thickness of solder resist in the thin film section 16 is the thickness of the wiring pattern 13 for detecting deterioration or less. Herein, the film thickness of the thin film section 16 and the thick film section 17 is the distance to a surface of the solder resist 12 by using a surface of the insulating substrate 15 as a reference. Further, a width d.sub.13 of the wiring pattern 13 for detecting deterioration may be narrower than a width d.sub.14 of the other wiring pattern 14.

(15) Accumulation of mist or liquid accumulation caused by cutting liquid can be created easily in the region (the thin film section 16) surrounded by the thick film section 17, and the thickness of the solder resist 12 on the wiring pattern 13 for detecting deterioration and corner parts of the wiring pattern 13 for detecting deterioration is thinner than that in a regular wiring pattern, and furthermore, a pattern width is also narrower than the regular wiring pattern, so that large deterioration of electronic properties, which is exceptional in the printed board 100, occurs in the wiring pattern 13 for detecting deterioration, and deterioration of the printed board 100 can be detected early.

(16) As an embodiment of the present invention, a printed board in which part or all of the thin film section 16 in which the thickness of the solder resist 12 is relatively small and the thick film section 17 in which the thickness is relatively large are apart from each other is included.

Second Embodiment

(17) FIG. 2 shows the second embodiment of the present invention. In a printed board 101, the wiring pattern 13 for detecting deterioration and the wiring pattern 14 other than the wiring pattern for detecting deterioration are formed on the surface of the insulating substrate 15. The printed board 101 has a region 18 where solder resist is not formed between the thin film section 16 and the thick film section 17 of the solder resist 12. In the printed board 101, a volume of a recess surrounded by the thick film section 17 becomes larger comparing to the printed board 100 by an increased amount of the region 18 where the solder resist 12 is not formed. Thus, accumulation of mist or liquid accumulation can be created more easily, and deterioration due to electric corrosion or corrosion becomes even larger.

(18) As an embodiment of the present invention, a printed board having a structure in which the solder resist 12 is not formed on and in the vicinity of the wiring pattern 13 for detecting deterioration is also included.

Third Embodiment

(19) FIG. 3 shows the third embodiment. In a printed board 102, the wiring pattern 13 for detecting deterioration and the wiring pattern 14 other than the wiring pattern for detecting deterioration are formed on the surface of the insulating substrate 15. In the printed board 102, the wiring pattern 13 for detecting deterioration is provided for a space whose entire surrounding area or partial surrounding area is surrounded by the solder resist 12, but all of the wiring pattern 13 for detecting deterioration is not covered by the solder resist 12. The wiring pattern 13 for detecting deterioration deteriorates early because it is not covered by the solder resist 12 but is exposed. Reference code 19 denotes a wiring pattern for detecting deterioration which is not covered by solder resist.

Fourth Embodiment

(20) FIG. 4 shows the fourth embodiment. In a printed board 103, the wiring pattern 13 for detecting deterioration and the wiring pattern 14 other than the wiring pattern for detecting deterioration are formed on the surface of the insulating substrate 15. Similar to FIG. 3, in the printed board 103, the wiring pattern 13 for detecting deterioration is provided for a space whose entire surrounding area or partial surrounding area is surrounded by the solder resist 12. Unlike FIG. 3, part of the wiring pattern 13 for detecting deterioration (a portion shown by reference code 20) is covered by the solder resist 12. Reference code 20 denotes a region where a part of the wiring pattern for detecting deterioration is not covered by solder resist.

(21) The thickness of the solder resist 12 formed on the wiring pattern 13 for detecting deterioration is thinner than the thickness of the solder resist 12 which is formed so as to surround the region where the wiring pattern 13 for detecting deterioration is formed. Part of the wiring pattern 13 for detecting deterioration deteriorates early because it is not covered by the solder resist 12 but is exposed.

Fifth Embodiment

(22) FIG. 5 shows the fifth embodiment. In a printed board 104, the wiring pattern 13 for detecting deterioration and the wiring pattern 14 other than the wiring pattern for detecting deterioration are formed on the surface of the insulating substrate 15. A silk printing layer 21 is formed on a surface of a thick film section of the solder resist 12 which has a solder resist structure similar to FIG. 1 and is formed so as to surround the wiring pattern 13 for detecting deterioration. Accumulation of mist or liquid accumulation can be created more easily by an amount of height increased by the silk printing layer 21, and deterioration due to electric corrosion or corrosion progresses even faster. Note that an insulating resin material other than silk printing may be used as a material formed on the surface of the solder resist 12.

(23) <Manufacturing Method 1>

(24) Next, the manufacturing method of a printed board according to the present invention is shown by using FIG. 6 and FIG. 7. FIG. 6 is a view showing the first step in the manufacturing method of a printed board according to the present invention. FIG. 7 is a view showing the second step in the manufacturing method of a printed board according to the present invention.

(25) A method of one embodiment of the present invention for manufacturing a printed board 105 including: the insulating substrate 15; the wiring pattern 13 for detecting deterioration which is formed on a surface of the insulating substrate 15 and used for detecting a degree of deterioration of the printed board 105; and the solder resist 12 covering the wiring pattern 13 for detecting deterioration includes a first step of forming first solder resist 12a having a smaller thickness than the thickness of the wiring pattern 13 for detecting deterioration, and a second step of forming second solder resist 12b so as to surround the entire surrounding area or partial surrounding area of the wiring pattern 13 for detecting deterioration. Since the first solder resist 12a and the second solder resist 12b have the same material, they have no problem in adhesion.

(26) <Manufacturing Method 2>

(27) Next, another manufacturing method of a printed board according to the present invention is shown by using FIG. 8 and FIG. 9. FIG. 8 is a view showing the first step in the second embodiment of the manufacturing method of a printed board according to the present invention. FIG. 9 is a view showing the second step in a second embodiment of the manufacturing method of a printed board according to the present invention.

(28) A method of the second embodiment of the present invention for manufacturing a printed board 106 including: the insulating substrate 15; and a wiring pattern group constituted by including the wiring pattern 13 for detecting deterioration which is formed on the surface of the insulating substrate 15 and used for detecting a degree of deterioration of the printed board 106, and the wiring pattern 14 other than the wiring pattern for detecting deterioration; and the solder resist 12 formed on the insulating substrate 15 includes a first step of forming first solder resist 12c on the wiring pattern 14 other than the wiring pattern for detecting deterioration, and a second step of forming second solder resist 12d at least in a part on the first solder resist 12c so as to surround the entire surrounding area or partial surrounding area of the wiring pattern 13 for detecting deterioration. Note that embodiments of the present invention are not limited to the drawings shown.

(29) As described above, in the embodiments of the present invention, the thin film section in which the thickness of solder resist is relatively thin and the thick film section in which the thickness is relatively thick are formed, and the wiring pattern for detecting deterioration is formed in the region (thin film section) surrounded by the thick film section. Further, the thickness of solder resist in the region (thin film section) should be the thickness of the wiring pattern for detecting deterioration or less. Furthermore, a pattern width is made thinner limited to the thin film section.

(30) By forming the region (thin film section) surrounded by the thick film section of solder resist in the printed board of the present invention, accumulation of mist or liquid accumulation due to cutting liquid or the like can be created easily in the region, which can be an origin of electric corrosion or corrosion.

(31) Furthermore, by making the thickness of solder resist in the region (thin film section) be the thickness of the wiring pattern for detecting deterioration or less, a solder resist thickness on the wiring pattern and corner parts of the wiring pattern is made thinner, and the width of the wiring pattern for detecting deterioration is made narrower than the regular wiring pattern to promote deterioration due to electric corrosion or corrosion. By promoting deterioration by the above-described structure, large deterioration of electronic properties, which is exceptional in the entire printed board, is generated in the wiring pattern for detecting deterioration, so that deterioration of the printed board can be detected early. Further, by making the pattern width narrower limited to the thin film section where the wiring pattern for detecting deterioration is formed, reduction of yield in the printed board manufacturing process can be suppressed to a minimum limit.