Method and device for producing a structured surface on a steel embossing roller

Abstract

A method for structuring a steel embossing roller surface includes using a short pulse laser including at least one of a femtosecond laser and a picosecond laser. The structuring is macrostructuring with dimensions of over 20 m and depths up to 150 m and more. The short pulse laser has: in single pulse operation, a fluence in the range of 0.5 J/cm.sup.2 to 3.5 J/cm.sup.2, and in burst operation, a mean burst fluence of 0.5 J/cm.sup.2 to 70 J/cm.sup.2 per pulse; a wavelength of 532 nm to 1064 nm; a repetition rate of 1 kHz to 10 MHz; a pulse to pulse spacing on the roller of 10% to 50% of the beam diameter for the femtosecond laser and of 10-25% and 40-50% of the beam width for the picosecond laser; a laser pulse position near the roller surface; and deflection velocities of up to 100 m/s and more.

Claims

1. A method for producing a structured surface on a steel embossing roller by a laser beam of a short pulse laser including at least one of a femtosecond laser and a picosecond laser via a deflection unit, the structured surface being macrostructured with dimensions of over 20 m and depths up to 150 m and more that is produced by the short pulse laser using a parameter combination of: a fluence in a range of 0.5 J/cm.sup.2 to 70 J/cm.sup.2, a wavelength of 532 nm to 1064 nm, a repetition rate of 1 kHz to 10 MHz, and deflection velocities of up to 100 m/s and more at a surface of the steel embossing roller caused by the deflection unit, and wherein the picosecond laser is operated in a burst mode with the parameters: a number of single pulses in a burst of 2 to 20, a pulse duration of the single pulses in the burst of 5 ps to 15 ps, a temporal pulse spacing of the single pulses in the burst of 10 ns to 30 ns, a mean burst fluence on the steel embossing roller of 0.5 mJ/cm.sup.2 to 70 J/cm.sup.2, and a beam focus radius on the steel embossing roller of 10 m to 50 m, a characteristic of a pulse energy of the single pulses in the burst being gradually varied or adjusted in a predetermined manner.

2. The method according to claim 1, wherein the steel embossing roller is continuously machined by displacing an impingement point of the laser beam by the deflection unit on a surface of the steel embossing roller simultaneously in an X axis and on a circumference of the steel embossing roller.

3. The method according to claim 1, wherein the steel embossing roller is machined block by block by being both displaced in all three coordinate directions and rotated.

4. The method according to claim 1, wherein an energy of the single pulses of the laser beam of the burst decreases with increased time.

5. The method according to claim 1, wherein the mean burst fluence is about 10 J/cm.sup.2.

6. The method according to claim 1, wherein the short pulse laser includes at least the femtosecond laser, and wherein the parameter combination further includes: a pulse to pulse spacing on the steel embossing roller of 10% to 50% of a diameter of the laser beam of the femtosecond laser, and a position of a focus plane of the laser beam near a surface of the steel embossing roller.

7. The method according to claim 1, wherein the short pulse laser includes at least the picosecond laser, and wherein the parameter combination further includes: a pulse to pulse spacing on the steel embossing roller of 10% to 25% of a diameter of the laser beam of the picosecond laser, and a position of a focus plane of the laser beam near a surface of the steel embossing roller.

8. The method according to claim 1, wherein the short pulse laser includes at least the picosecond laser, and wherein the parameter combination further includes: a pulse to pulse spacing on the steel embossing roller of 40% to 50% of a diameter of the laser beam of the picosecond laser, and a position of a focus plane of the laser beam near a surface of the steel embossing roller.

9. The method according to claim 1, wherein the structured surface produced on the steel embossing roller is comprised of macrostructures with dimensions up to 400 m formed by the laser beam.

10. The method according to claim 1, wherein the deflection velocities are 100 m/s and more.

11. The method according to claim 2, wherein the laser beam is displaced in the X axis and the steel embossing roller is simultaneously rotated.

Description

(1) The invention will be explained in more detail hereinafter with reference to schematized drawings of exemplary embodiments where

(2) FIG. 1 shows a first exemplary embodiment of a laser system of the invention for continuous engraving,

(3) FIG. 2 shows a second exemplary embodiment of a laser system of the invention for block by block engraving, and

(4) FIG. 3 shows a schematic illustration of laser bursts.

(5) One essential novelty of the described method is the possibility of providing modern materials with macrodimensional surface structures having engraving dimensions of over 20 m, more particularly also of over 70 m, and engraving depths of up to 400 m, which is otherwise impossible with the conventional laser machining methods. In macrotechnology there is a great need to be able also to structure the surfaces of heterogeneous, high-alloyed iron base materials, which become increasingly important in manufacturing technology, with surface structures. The heterogeneous structural composition of these materials is indispensable for the special properties of the roller surfaces that are required.

(6) These different structural phases have very different physical properties, however, leading to corresponding differences in local macroscopic behavior during laser machining. Therefore, up to now, these materials could not be laser macrostructured economically as required. With the novel method as disclosed below such materials can now be macrostructured also. The novel method is combinable with a microstructuring process and is therefore capable of producing structures of highest resolution even on these complex, heterogeneous materials, which represents a breakthrough in the field of materials technology.

(7) The machining of printing cylinders for offset printing or of other rotary printing moulds using short pulse lasers has been known per se for some time. The thermally ablating laser machining techniques by means of e.g. YAG:Nd lasers in the pulse width range of 30 ns and above that are known today allow engraving steel surfaces in dimensions of more than approx. 70 m at a depth of approx. 100 m, but fine relief structures cannot be produced reliably and quickly since the ablation depth is difficult to control and other effects affect the obtainable surface quality.

(8) For producing embossing rollers having different structures it is advantageous to shape them by means of different laser devices so as to be able to supplement the macrostructures with microstructures at a different resolution using different focus spot sizes and different powers.

(9) For a subsequent microstructuring process, the short pulse lasers available today operate at wavelengths of 700 nm to 2100 nm, thereby allowing a corresponding resolution of the engraving below 1 m. An even higher resolution is possible by a frequency multiplication of the laser radiation. As the case may be, the superposition of a finer structure would allow producing a hologram directly on the embossing roller for subsequent transmission onto the foil. In this case it may be advantageous to provide the already macrostructured roller with a coating e.g. of ta-C.

(10) FIG. 1 schematically illustrates a first laser system L1 that is intended for continuous engraving=macrostructuring. L1 includes a laser 1 that is connected to a control circuit 2 that controls laser 1 and a deflection unit 3 which may comprise beam splitters as well as acousto-optical or electro-optical modulators or polygon mirrors. Deflection unit 3, focusing optics 5, and deflection mirror 6 form engraving unit 4 that is linearly displaceable in the X axis as symbolically indicated by the X arrow. Alternatively, the entire laser device L1 may be displaceable in the X axis.

(11) Control circuit 2 is connected to a position detector 7 for detecting and evaluating the data of the rotating workpiece 8, in this case an embossing roller blank. The workpiece is driven by a drive 9. By the combination of the linear displacement of the engraving unit and of the rotation of the roller a constant helical line SL is created that allows a uniform machining.

(12) The application of a deflection unit that may e.g. comprise one or multiple beam splitter(s) as well as electro-optical or acousto-optical modulators or one or multiple polygon mirrors allows splitting the initial laser beam into two or multiple laser beams impinging on two or multiple tracks simultaneously but at such a mutual distance that they do not interfere. Moreover, the time interval between the impingement of the individual pulses can be chosen large enough to avoid a thermal overload.

(13) FIG. 2 shows a laser system for block by block machining of the workpiece which also allows the desired macrostructuring with a suitable choice of the parameters. Laser system 2 comprises a laser device 10 that is connected to a control circuit 11 which is in turn connected to a rotary drive 12.

(14) Through a mask and diaphragm combination 13, laser beam LA reaches a deflection mirror 14 and subsequently impinges on workpiece 16 via a focusing optics 15 that forms engraving unit 19 together with the aforementioned components. The workpiece is depicted here as a macrostructured embossing roller having teeth 17 and a logo gap 18. In this embodiment variant, the workpiece is displaceable in the three coordinate directions and rotatable by means of rotary drive 12. For certain applications, this principle may also be used in a machining operation according to FIG. 1. Also, a combination of both displacement methods is possible.

(15) By the application of short pulse lasers whose laser pulses are comprised between 10 femtoseconds and 100 picoseconds, the energy is applied in a very short time period so that a so-called cold ablation becomes possible where the material is evaporated very quickly without an inacceptable heating of the adjacent material. The undesirable liquid state of the material that produces crater edges and splashes can thus be almost completely avoided. Therefore, such lasers can also be successfully used for the so-called block by block machining according to FIG. 2.

(16) As already mentioned it is an object of the present invention to produce steel embossing rollers, in particular, which have a very large number of small teeth as well as areas without teeth or with modified teeth where both the tooth shape, e.g. pyramidal with a square or rectangular horizontal projection, or frustoconical, and the tooth height and the pitch, i.e. the spacing of the teeth may vary, or male-female structures where the female structures are associated to the male structures, or folding or perforating tools and the like.

(17) An economically reasonable industrial utilization of high performance ps systems for the aforementioned structures was not possible until now. In particular, in contrast to the production of printing moulds, no solution could be found for machining steel rollers in the required piece number. The granularity of this material and the inhomogeneities in the mixture of the components precluded this.

(18) During extensive research aiming to structure steel up to depths of 400 m with small roughness values, different problems arose which made an application for the intended macro-embossing impossible, in addition to the above-described problems in macro-machining. Specifically, due to structural differences and other material dependencies, hardly eliminable bulges and holes resulted after the laser machining.

(19) It was also found that the theoretical ablation volume calculated per pulse and repetition frequency strongly deviates from the actual ablation rate. Consequently, no technically utilizable parameters and relationships existed for contemplating an industrial application of short pulse technology to steel.

(20) After prolonged tests, the following parameter combination was found that enables one skilled in the art to implement the engraving of steel rollers in the reproduction accuracy and quality required for fine embossing technology. In this context, among the short pulse lasers, a differentiation can be made between the femtosecond (fs) lasers and the picosecond (ps) lasers with pulse durations ranging from 10 fs to 100 ps.

(21) Besides the predetermined pulse duration that is a function of the laser type, a large number of parameters are relevant for the intended industrial utilization, particularly but not exclusively in steel engraving.

(22) For lasers in single pulse mode, these include: a) fluence, b) wavelength, c) repetition rate, d) pulse to pulse spacing on the workpiece, e) position of the laser beam focus plane resp. of the laser beam imaging plane relative to the surface of the substrate, f) deflection velocity.

(23) Until recently, the available beam guide systems were not able to guide the laser power onto the surface being engraved in the required quality and processing time since the required deflection velocities of over 100 m/s could not be attained in keeping with the required accuracy of the machining process. For structure widths of e.g. 100 m, the Gaussian beam radius should not exceed 15 m, which additionally requires a very good command of the laser beam positioning accuracy as defined by the fineness of the structure to be produced on the substrate.

(24) In further research it was found that the desired machining of embossing rollers by means of single pulses can be substantially improved when different pulse sequences are used. Thus, a particular operating mode developed for selected ps laser types, the burst mode in the technical literature, produces good results in steel engraving. In the burst mode, as opposed to the above-described single pulse operation of a ps laser at a predetermined repetition rate, rather than ps laser beam pulses, ps laser beam bursts are generated with a temporal pulse to pulse spacing of the single bursts in the range of tens of nanoseconds, typically 20 ns, and a temporal burst to burst spacing in the range of 10.sup.3 to 10.sup.7 seconds, typically 10 s, i.e. with a burst repetition frequency or repetition rate of the laser of 1 kHz to 10 MHz, see FIG. 3.

(25) FIG. 3 shows a strongly schematic illustration of an example of bursts where the x axis is the time axis and the pulse energy is charted on the y axis.

(26) The maximum possible repetition rate of the ps laser in burst mode is dependent upon and limited by the number of single pulse in the burst. The pulse duration of the single pulses of the ps laser and the pulse durations of the pulses in burst mode are comparable.

(27) A burst may comprise an adjustable number of up to 20 single ps pulses. The pulse energy of the single pulses in the burst may exponentially decrease according to a function that is typical of the laser apparatus while the temporal pulse to pulse spacing of the single pulses in the burst remains the same, or the characteristic of the pulse energy of the single pulses in the burst may be predetermined, so that a constant pulse energy of the pulses in the burst or a decrease or an increase of the pulse energy of the pulses in the burst or alternatively first a decrease and then again an increase of the pulse energy of the pulses in the burst are possible.

(28) Furthermore, one pulse or multiple pulses in the burst may be blanked, e.g. in the FlexBurst-Mode of the laser types Time-Bandwidth Duetto and Time-Bandwidth Fuego of the Time-Bandwidth Products company. A frequency doubling or frequency tripling or further frequency multiplication, SHG or THG, of the laser radiation is also possible in burst mode operation of the ps laser.

(29) Thus, for lasers in burst mode, the following parameters apply: g) number of single pulses in the burst, h) pulse duration of the single pulses in the burst, i) temporal pulse spacing of the single pulses in the burst, j) mean burst fluence on the workpiece, k) beam focus radius on the workpiece, and l) distribution of the burst fluence on the single pulses.

(30) Possible machining parameters and results in the operation of the ps laser in burst mode are e.g.: number of pulses in burst up to 20, fluence of burst 0.5-70 J/cm.sup.2, ablation depth per burst up to 100 nm, ablation volume per burst up to 100 m.sup.3, bottom roughness of the produced structures from 450 nm to 1000 nm at structure depths of 60 m to 200 m.

(31) The advantages of burst mode machining as compared to ps laser machining with single pulses are:

(32) Higher ablation rates in the structuring of metallic materials as compared to ps pulse irradiation with single pulses having the same energy as the total burst energy, i.e. at equal fluences of the single pulses and of the bursts and at the same pulse to pulse spacing and overlap of the single pulses and of the bursts, i.e. at the same repetition rate of the single pulses as the burst repetition rate.

(33) A better quality, in particular lower surface roughnesses of the produced structure shapes as compared to ps pulse irradiation with single pulses having the same overlap, also at higher fluences of the burst.

(34) In burst mode, higher total burst energies, i.e. higher fluences of the burst can be applied to the workpiece surface in the structuring process. Since, due to the number of pulses in the burst, the pulse energies of the single pulses in the burst are correspondingly lower than in the case of single pulses having the same pulse energy as the total burst energy, the fluences of the single pulses in the burst are also substantially lower than the fluence of the single pulses; in burst mode, machining is thus carried out in the low fluence regime, i.e. not substantially above the ablation threshold, and a higher quality of the produced structural shapes is obtained, as could be demonstrated. When structuring with single pulses, high pulse energies cannot be used in this manner since machining would already take place in the high fluence regime, i.e. far above the ablation threshold, and the quality of the produced structures would be lower.

(35) The parameters indicated above may e.g. take the following values. For single pulse operation, these are: a) Fluence:

(36) fs laser: For machining with femtosecond pulses, a fluence range of 0.5 J/cm.sup.2 to 3.5 J/cm.sup.2 is suggested. Tests with higher fluences were not found to be satisfactory.

(37) ps laser: In the tests it was found that high fluences are not suitable for machining with picosecond pulses. The applicable fluence range should be situated shortly above the ablation threshold. Fluences of 0.5 J/cm.sup.2 to 10 J/cm.sup.2 were tested and it was found that the range from 0.5 to 3 J/cm.sup.2 yielded the best machining results. b) Wavelength:

(38) Three different wavelengths were used, namely 775 nm, 1030 nm, and 1064 nm, and a frequency doubling was performed at 1064 nm that resulted in a halving of the wavelength to 532 nm. It was found that the wavelength affects the result due to the different absorption coefficients. Higher wavelengths do not seem suitable for machining due to the low absorption coefficient. Thus, a range of 532 nm to 1064 nm results for the intended machining. c) Repetition rate:

(39) Tests were conducted with pulse repetition frequencies up to 1 MHz. It was found that good results were obtainable up to this frequency. However, the result slightly deteriorated at higher pulse repetition frequencies. One way to avoid these high frequencies and still to achieve a high productivity is beam splitting. Thus, for example, 400 W short pulse lasers are commercially available whose beam is split into 8 partial beams for simultaneous machining. In this manner, the repetition rate remains at approx. 1 MHz. Suggested is a repetition rate of 1 kHz to 10 MHz. d) Pulse to pulse spacing on the workpiece:

(40) It was found that the ablation rate was reduced by a greater overlap of consecutive pulses. This is due to the fact that the following pulse is shielded by the preceding pulse. Therefore, a high pulse to pulse spacing on the workpiece should be chosen.

(41) ps laser: Suggested range for machining: 40-50% of the beam diameter as the pulse to pulse spacing on the workpiece for small pulse machining densities. At higher densities, a smaller overlap in the range of 10%-25% should be contemplated.

(42) fs laser: A pulse to pulse spacing on the workpiece of 10%-50% of the beam diameter. e) Position of the laser beam focus plane relative to the surface of the substrate:

(43) In all tests the focus was positioned on the surface of the workpiece. Placing the focus above the workpiece is not advisable. It is therefore suggested to position the focus at, i.e. on or slightly below the workpiece surface. f) Deflection velocities up to 100 m/s and above were tested and found to be applicable.

(44) Beam Diameter:

(45) In the tests, different beam diameters were used. This parameter does not greatly affect the machining operation.

(46) Pulse Width:

(47) The pulse widths used were 150 fs, 178 fs, and 12 ps. All pulse widths were suitable for machining. The pulse width may possibly be further increased to obtain an even higher ablation rate while maintaining a good quality. Smaller pulse widths yield a better quality but are associated with a lower ablation rate. Consequently, for the intended machining, a pulse width range of 150 fs to 12 ps is suggested.

(48) Additionally, for machining in burst mode, the following typical but not limiting values were found: h) pulse duration of the single pulses in the burst 5 ps to 15 ps, i) temporal pulse spacing of the single pulses in the burst 10 ns to 30 ns, j) mean burst fluence on the workpiece 0.5 J/cm.sup.2 to 70 J/cm.sup.2, k) beam focus radius on the workpiece 10 m to 50 m, the characteristic of the pulse energy of the single pulses in the burst being gradually reduced, increased, or adjusted in a predetermined manner.

(49) The values of b) to g) also apply to burst operation analogously unless they deviate specifically.