Component Carrier With Inductive Element Included in Layer Build-up, and Manufacturing Method

Abstract

A component carrier includes a stack with at least one electrically insulating layer structure, a structured electrically conductive layer assembled to the stack, where a part of the structured electrically conductive layer is configured as an inductive element, and a magnetic matrix embedded in the stack. The magnetic matrix at least partially surrounds the inductive element. Further, a manufacturing method is described.

Claims

1. A component carrier, comprising: a stack comprising at least one electrically insulating layer structure; a structured electrically conductive layer assembled to the stack, wherein a part of the structured electrically conductive layer is configured as an inductive element; and a magnetic matrix embedded in the stack, wherein the magnetic matrix at least partially surrounds the inductive element.

2. The component carrier according to claim 1, wherein the inductive element is sandwiched between a first part of the magnetic matrix and a third part of the magnetic matrix, in particular, wherein the inductive element is essentially encapsulated by the magnetic matrix, more in particular wherein a second part of the magnetic matrix at least partially fills a space in the inductive element.

3. The component carrier according to claim 1, wherein the inductive element comprises one or more loops, in particular windings, more in particular a coil-like structure.

4. The component carrier according to claim 2, wherein the first part of the magnetic matrix is embedded in a cavity of the stack.

5. The component carrier according to claim 2, wherein the third part of the magnetic matrix is embedded in a further electrically insulating layer structure of the stack.

6. The component carrier according to claim 1, wherein a further electrically conductive layer structure is arranged directly on top of the magnetic matrix; or wherein the further electrically conductive layer structure is arranged on top of the magnetic matrix with at least one further electrically insulating layer structure in between.

7. The component carrier according to claim 1, further comprising: at least one via that extends through the first magnetic matrix and/or the third magnetic matrix in order to electrically connect the inductive element.

8. The component carrier according to claim 6, wherein the via is electrically connected to the further electrically conductive layer structure.

9. The component carrier according to claim 1, further comprising: at least one further via that extends through the further electrically insulating layer structure in order to electrically connect to a part of the structured electrically conductive layer which part is not the inductive element.

10. The component carrier according to claim 1, wherein the structured electrically conductive layer is a discontinuous layer.

11. The component carrier according to claim 1, wherein the magnetic matrix comprises at least one of the following features: wherein the magnetic matrix continuously fills a volume around the inductive element and in particular between windings of the inductive element; wherein the magnetic matrix comprises at least one of the group consisting of a rigid solid, a sheet, and a paste; wherein the magnetic matrix comprises one of the group which consists of: electrically conductive, electrically insulating, partially electrically conductive and partially electrically insulating; wherein the relative magnetic permeability μr of the magnetic matrix is in a range from 2 to 10.sup.6, in particular 2 to 1000, more in particular 20 to 80; wherein the magnetic matrix comprises at least one material of the group consisting of a ferromagnetic material, a ferrimagnetic material, a permanent magnetic material, a soft magnetic material, a ferrite, a metal oxide, a dielectric matrix, in particular a prepreg, with magnetic particles therein, and an alloy, in particular an iron alloy or alloyed silicon; wherein the magnetic matrix comprises a planar shape; wherein a direction of main extension of the magnetic matrix is oriented essentially parallel to a direction of main extension of the stack.

12. The component carrier according to claim 1, wherein the inductive element comprises an inductance per area in the range 10 to 10000 nH/mm.sup.2.

13. The component carrier according to claim 1, further comprising: an electronic component, in particular an active component, assembled to the stack, wherein the magnetic matrix is arranged below, in particular directly below, the electronic component.

14. The component carrier according to claim 1, further comprising at least one of the following features: the extension of the first magnetic matrix and/or the third magnetic matrix in at least one of the directions of main extension of the stack is larger than the extension of the second magnetic matrix in said direction; a shift between at least two of the first magnetic matrix, the second magnetic matrix, and the third magnetic matrix, in at least one of the directions of main extension of the stack, is 100 μm or less, in particular 50 μm or less, and/or 10% or lower than the total length of the magnetic matrix.

15. A method of manufacturing a component carrier, the method comprising: providing a stack comprising at least one electrically insulating layer structure; assembling an electrically conductive layer to the stack; structuring the electrically conductive layer, so that a part of the structured electrically conductive layer is configured as an inductive element; and assembling a magnetic matrix to the stack, so that the magnetic matrix at least partially surrounds the inductive element.

16. The method according to claim 15, wherein the method further comprises: forming a cavity in at least one electrically insulating layer structure of the stack; arranging a first part of the magnetic matrix at least partially in the cavity; and assembling the electrically conductive layer on or at least partially around the first part of the magnetic matrix.

17. The method according to claim 15, wherein structuring further comprises: removing electrically conductive material from the electrically conductive layer in order to provide gaps; and at least partially filling the gaps with a second part of the magnetic matrix.

18. The method according to claim 15, wherein structuring further comprises: removing magnetic matrix material in order to provide gaps; and at least partially filling the gaps with additional electrically conductive material.

19. The method according to claim 15, further comprising: covering the embedded inductive element with a third part of the magnetic matrix.

20. The method according to claim 15, further comprising: covering the embedded inductive element with a lid structure, in particular wherein the lid structure comprises a lid electrically insulating layer structure and/or a lid electrically conductive layer structure.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0086] FIG. 1A, FIG. 1B, FIG. 1C, FIG. 1D, FIG. 1E, FIG. 1F, FIG. 1G and FIG. 1H show a method of manufacturing a component carrier according to an exemplary embodiment of the disclosure.

[0087] FIG. 2A, FIG. 2B, FIG. 2C, FIG. 2D, FIG. 2E, and FIG. 2F show a method of manufacturing a component carrier according to a further exemplary embodiment of the disclosure.

[0088] FIG. 3A and FIG. 3B show respectively a component carrier according to a further exemplary embodiment of the disclosure.

[0089] FIG. 4 shows a magnetic element according to a further exemplary embodiment of the disclosure.

DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS

[0090] The illustrations in the drawings are schematically presented. In different drawings, similar or identical elements are provided with the same reference signs.

[0091] FIG. 1A to FIG. 1H show a method of manufacturing a component carrier according to an exemplary embodiment of the disclosure.

[0092] As illustrated in FIG. 1A, a component carrier layer stack 110 (e.g., a copper-clad laminate or a plurality of single sheets) is provided which comprises a plurality of electrically insulating layer structures (or only one insulating layer structure) 102 sandwiched between two electrically conductive layer structures 104. Before attaching (laminating) the upper electrically conductive layer structure 104, a cavity 130 has been formed in the top electrically insulating layer structure 103 (e.g., by laser cutting, milling, etc.). The cavity 130 can also be formed by controlled depth milling or femto-laser or pico-laser (in particular when using only one insulating layer structure 102).

[0093] As shown in FIG. 1B, a first part of a magnetic matrix 155a (e.g., magnetic paste or a pre-cut magnetic inlay) is formed within the cavity 130, thereby embedding magnetic matrix material 155 in the layer stack 110. Embedding the first part of a magnetic matrix 155a is also done before attaching (laminating) the upper electrically conductive layer structure 104. Forming the magnetic matrix 155a can for example comprise one of the following: printing, arranging a film (local structuring may be needed), arranging an inlay (glue between previous magnetic matrix material can be assumed).

[0094] FIG. 1C illustrates in an alternative embodiment (with respect to FIG. 1A), a lid structure 160 is provided and placed on top of the layer stack 110. The lid structure 160 comprises in this example the upper electrically conductive layer structures 104 and an electrically insulating layer structure 103 with the cavity 130 (e.g., a pre-cut prepreg (no flow)).

[0095] FIG. 1D shows in an alternative embodiment (with respect to FIG. 1B), the first part of the magnetic matrix 155a is arranged in the cavity 130. This may be done within the lid structure 160 before placing the lid structure 160 on the layer stack 110. In another example, the first part of the magnetic matrix 155a is arranged on the layer stack 110 and is then covered by the lid structure 160.

[0096] FIG. 1E shows that following the steps illustrated in FIG. 1A and FIG. 1B or FIG. 1C and FIG. 1D, a semi-finished component carrier (preform) 180 is obtained, which comprises the first part of the magnetic matrix 155a embedded in the cavity 130 within the stack 110.

[0097] In FIG. 1F it is further shown that the upper electrically conductive layer structure 104 is structured (patterned) and becomes the structured electrically conductive layer structure 140. Material has been removed during structuring, so that the structured electrically conductive layer structure 140 has been separated into (isolated) parts and forms a discontinuous layer. The part of the structured electrically conductive layer structure 140, which covers the first part of the magnetic matrix 155a, is thereby structured so that it forms one or more inductive elements 120. For example, said part 120 of the structured electrically conductive layer 140 has been shaped in form of windings that function similar to a coil inductance. In between the windings, there are now gaps present. The inductive element(s) may differ in its dimensions (x, z) in a cross-sectional view (e.g., thicker/larger parts may be present).

[0098] Optionally, the lower electrically conductive layer structure 104 can also be structured.

[0099] As further shown in FIG. 1G, the gaps are at least partially filled by a second part of the magnetic matrix 155b.

[0100] Illustrated in FIG. 1H is a component carrier 100 comprising: i) the stack 110 with a plurality of electrically insulating layer structures 102, ii) the structured electrically conductive layer 140 embedded in the stack 110, wherein a part of the electrically conductive layer structure 140 is configured as the inductive element 120, and iii) the magnetic matrix 155 embedded in the stack 110, wherein the magnetic matrix 155 (at least partially) surrounds the inductive element 120 (thereby forming a magnetic element 150).

[0101] In this example, the inductive element 120 is fully surrounded (encapsulated) by the magnetic matrix 155, because the structure shown in FIG. 1G (wherein the inductive element 120 is exposed) has been covered by a third part of the magnetic matrix 155c. Said third part of the magnetic matrix 155c is further embedded in a further electrically insulating layer structure 107 that is covered by a further electrically conductive layer structure 106. These further structures 106, 107 can be formed by lamination. In another example, these further structures 106, 107 are formed using a lid structure 160 as described above.

[0102] In the example shown, the component carrier 100 is a multi-layer component carrier that comprises a plurality of layers formed in a build-up process. Advantageously, forming and embedding the inductive element can be directly integrated into the layer build-up process.

[0103] FIG. 2A to FIG. 2F show a method of manufacturing a component carrier according to a further exemplary embodiment of the disclosure.

[0104] As illustrated in FIG. 2A, a component carrier layer stack 110 is provided which comprises a plurality of electrically insulating layer structures 102 sandwiched between two electrically conductive layer structures 104. A cavity 130 has been formed in the top electrically insulating layer structure 103 and in the upper electrically conductive layer structure 104, which is a structured electrically conductive layer structure 140. The cavity 130 in this example is a large cavity, e.g., formed by photo-imaging or laser. The cavity 130 can also be formed by controlled depth milling or femto-laser or pico-laser (in particular when using only one insulating layer structure 102).

[0105] In FIG. 2B, magnetic matrix material 155 is arranged (e.g., printed) within the cavity 130 and fully fills the cavity 130.

[0106] In FIG. 2C, gaps are formed (e.g., using a laser) in an upper part of the magnetic matrix material 155, which upper part corresponds to a second part of the magnetic matrix 155b. A lower part, wherein no gaps are formed, corresponds to a third part of the magnetic matrix 155c. The second part of the magnetic matrix 155b is (essentially) on the same vertical level as the structured electrically conductive layer structure 140. The gaps are formed in a manner that a (negative) shape of a winding is provided in the second part of the magnetic matrix 155b.

[0107] In FIG. 2D, the gaps are filled with electrically conductive material (e.g., copper paste or during a local plating step), so that the electrically conductive layer structure 140 is further structured by the addition of material. Since the gaps and the electrically conductive layer structure 140 are on the same height (vertical level), the additional electrically conductive material also forms part of the (discontinuous) structured electrically conductive layer structure 140. The electrically conductive material filling the gaps is arranged in form of windings, so that the inductive element 120 (in the structured electrically conductive layer structure 140) is formed. An upper surface of said inductive element 120 is still exposed.

[0108] In FIG. 2E, a lid structure 160, which comprises a lid electrically insulating layer structure 162 with a cavity, and a lid electrically conductive layer structure 164, is provided and placed on top of the layer stack 110. In another example, a further electrically insulating layer structure 107 and/or a further electrically conductive layer structure 106 can be formed, e.g., by lamination.

[0109] As indicated in FIG. 2F, before the lid structure 160 is placed and arranged to the layer stack 110, a third part of the magnetic matrix 155c has been arranged on the exposed surface of the inductive element 120 (in another embodiment, the third magnetic matrix material 155c is attached to the lid structure 160). Thereby, the inductive element 120 is fully encapsulated in magnetic matrix material 155. The obtained component carrier 100 is very similar to the one described for FIG. 1H with the difference being, that the lid electrically conductive layer structure 164 is arranged directly on top of the magnetic matrix 155 instead of a further electrically insulating layer structure 107.

[0110] FIG. 3A and FIG. 3B show respectively a component carrier 100 according to an exemplary embodiment of the disclosure.

[0111] As illustrated in FIG. 3A, two blind holes have been drilled by laser drilling through the third magnetic matrix 155c and have been filled by copper material to yield (blind) vias 170 that are electrically connect to the embedded inductive element 120. The vias 170 are further electrically/thermally connected to the further electrically conductive layer structure 106.

[0112] In FIG. 3B, in a very similar manner to the component carrier in FIG. 3A, one of the vias 170 is a further via 172, that has been formed through the further electrically insulating layer structure 107 in order to electrically connect to a part of the structured electrically conductive layer 140, which part is not the inductive element 120. The further via 172 is also electrically/thermally connected to the further electrically conductive layer structure 106.

[0113] FIG. 4 shows a magnetic element 150 in/for a component carrier 100 according to a further exemplary embodiment of the disclosure. The extension of the first magnetic matrix 155a in the direction of main extension (x) of the stack 110 is larger than the extension of the second magnetic matrix 155b and the third magnetic matrix 155c in said direction (x). A shift 175 (form of a neck) between the second magnetic matrix 155b and the third magnetic matrix 155c in the direction of main extension (x) of the stack 110 is 10% or lower than the total length of the magnetic matrix 155.

[0114] It should be noted that the term “comprising” does not exclude other elements or steps and the “a” or “an” does not exclude a plurality. Also, elements described in association with different embodiments may be combined.

[0115] Implementation of the disclosure is not limited to the preferred embodiments shown in the figures and described above. Instead, a multiplicity of variants is possible which variants use the solutions shown and the principle according to the disclosure even in the case of fundamentally different embodiments.

REFERENCE SIGNS

[0116] 100 component carrier [0117] 102 electrically insulating layer structure [0118] 103 structured electrically insulating layer structure [0119] 104 electrically conductive layer structure [0120] 106 further electrically conductive layer structure [0121] 107 further electrically insulating layer structure [0122] 110 layer stack [0123] 120 inductive element [0124] 130 cavity [0125] 140 structured electrically conductive layer [0126] 150 magnetic element [0127] 155 magnetic matrix (material) [0128] 155a first part of magnetic matrix [0129] 155b second part of magnetic matrix [0130] 155c third part of magnetic matrix [0131] 160 lid structure [0132] 162 lid electrically insulating layer structure [0133] 164 lid electrically conductive layer structure [0134] 170 via [0135] 172 further via [0136] 175 shift [0137] 180 semi-finished component carrier