Abstract
A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure and a magnetic element assembled to the stack. The magnetic element includes a magnetic matrix and an inductive element. The inductive element is at least partially enclosed by the magnetic matrix, so that an electric current flow direction through the inductive element is essentially in a horizontal direction with respect to the stack. Further, a magnetic inlay and a manufacturing method are described.
Claims
1. A component carrier comprising: a stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; and a magnetic element assembled to the stack, wherein the magnetic element comprises: a magnetic matrix; and an inductive element, wherein the inductive element is at least partially enclosed by the magnetic matrix, so that an electric current flow direction through the inductive element is essentially in a horizontal direction with respect to the stack.
2. The component carrier according to claim 1, wherein a main axis of a magnetic field, which is generated based on an interaction of the magnetic matrix and the inductive element, is oriented essentially parallel to a direction of main extension of the stack.
3. The component carrier according to claim 1, wherein the inductive element comprises one or more loops, in particular windings, more in particular a coil-like structure.
4. The component carrier according to claim 1, wherein the magnetic matrix is embedded in a first cavity of the stack, and wherein the first cavity comprises a shape from the group which consists of: a hole, a slit, a loop, a winding, a meander.
5. The component carrier according to claim 1, wherein the inductive element is arranged in a second cavity of the magnetic matrix, in particular wherein a remaining part of the second cavity is filled with an electrically insulating material and/or second magnetic matrix material, more in particular wherein the second cavity comprises a shape from the group which consists of: a hole, a slit, a loop, a winding, a meander.
6. The component carrier according to claim 1, wherein the component carrier further comprises: at least one eccentric hole, in particular a vertical hole, arranged through the inductive element, wherein the eccentric hole separates, in particular at least partially, a first electrically conductive part from a second electrically conductive part of the inductive element.
7. The component carrier according to claim 6, wherein the first electrically conductive part and the second electrically conductive part of the inductive element are electrically connected by an electrically conductive trace.
8. The component carrier according to claim 7, wherein the component carrier comprises three or more eccentric holes arranged through the inductive element, wherein the inductive element is separated into three or more electrically conductive parts, wherein at least two of the electrically conductive parts are electrically connected by a respective electrically conductive trace, in particular wherein two or more electrically conductive traces are arranged in an alternating manner.
9. The component carrier according to claim 6, wherein the at least one eccentric hole is at least partially filled with an electrically insulating material and/or third magnetic matrix material.
10. The component carrier according to claim 1, wherein the component carrier further comprises: a further magnetic matrix assembled to the stack; and a further inductive element, wherein the further inductive element is at least partially enclosed by the further magnetic matrix, so that an electric current flow direction through the further inductive element is essentially in a horizontal direction with respect to the stack; wherein the inductive element and the further inductive element are electrically connected.
11. The component carrier according to claim 10, wherein electrical connection is configured so that the inductive element and the further inductive element form a common loop, in particular a common winding.
12. The component carrier according to claim 1, wherein the component carrier further comprises: an electrical connector, wherein the electrical connector is assembled to the stack, so that a direction of main extension of the electrical connector is oriented essentially parallel to a direction of main extension of the stack.
13. The component carrier according to claim 12, wherein a first part of the electrical connector is electrically connected to a first part of the inductive element at a first position, and wherein a second part of the electrical connector is electrically connected to a second part of the inductive element at a second position, in particular wherein the first position and the second position are at different vertical heights with respect to the stack.
14. The component carrier according to claim 1, wherein the magnetic matrix comprises at least one of the following features: wherein the magnetic matrix continuously fills a volume around the inductive element and in particular between windings of the inductive element; wherein the magnetic matrix comprises at least one of the group consisting of a rigid solid, a sheet, and a paste; wherein the magnetic matrix comprises one of the group which consists of: electrically conductive, electrically insulating, partially electrically conductive and partially electrically insulating; wherein the relative magnetic permeability pr of the magnetic matrix is in a range from 2 to 100, in particular 20 to 80; wherein the magnetic matrix comprises at least one material of the group consisting of a ferromagnetic material, a ferrimagnetic material, a permanent magnetic material, a soft magnetic material, a ferrite, a metal oxide, a dielectric matrix, in particular a prepreg, with magnetic particles therein, and an alloy, in particular an iron alloy or alloyed silicon; wherein the magnetic matrix comprises a planar shape, and wherein a direction of main extension of the magnetic matrix is oriented essentially parallel to a direction of main extension of the stack.
15. A magnetic inlay for a component carrier, wherein the magnetic inlay comprises: a magnetic matrix having a plate-shape; and an inductive element, wherein the inductive element is at least partially embedded horizontally in the magnetic matrix, so that an electric current flow direction through the inductive element is essentially in a horizontal direction with respect to the plate-shaped magnetic matrix.
16. A method of manufacturing a component carrier, the method comprising: providing a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure; at least partially enclosing an inductive element by a magnetic matrix to form a magnetic element assembled to the stack, so that an electric current flow direction through the inductive element is essentially in a horizontal direction with respect to the stack.
17. The method according to claim 16, further comprising at least one of the following features: wherein the method further comprises: forming a first cavity in the stack, in particular in the at least one electrically insulating layer structure; and at least partially filling the first cavity with first magnetic matrix material; wherein the method further comprises: forming a second cavity in the first magnetic matrix material; and at least partially filling the second cavity with electrically conductive material, thereby providing the inductive element; wherein filling the second cavity comprises: plating the sidewalls of the second cavity; or filling the second cavity, in particular, wherein the method further comprises forming a remaining part in the filled second cavity; wherein the method further comprises: filling a remaining part of the second cavity, which remaining part does not comprise the inductive element, with an electrically insulating material and/or second magnetic matrix material; wherein the method further comprises: forming an eccentric hole, in particular a vertical hole, through the inductive element, thereby separating a first part from a second part of the inductive element; wherein the method further comprises: filling the eccentric hole at least partially with electrically insulating material or third magnetic matrix material; wherein the method further comprises: electrically connecting the inductive element with a further inductive element, so that the inductive element and the further inductive element form a common loop, in particular a common winding.
18. A method of manufacturing a magnetic inlay for a component carrier, the method comprising: providing a magnetic matrix having a plate-shape; and at least partially embedding an inductive element horizontally in the magnetic matrix, so that an electric current flow direction through the inductive element is essentially in a horizontal direction with respect to the plate-shaped magnetic matrix.
19. The method according to claim 18, further comprising at least one of the following features: wherein the method further comprises: providing the inductive element, in particular within an electrically conductive frame structure, and subsequently embedding the inductive element within magnetic matrix material; wherein the method further comprises: providing the inductive element on a temporary carrier; embedding the inductive element in first magnetic matrix material; removing the temporary carrier in order to expose a surface of the inductive element; and arranging second magnetic matrix material on the exposed surface of the inductive element; wherein the method further comprises: forming an electrical connection, in particular a blind via or a through via, through the magnetic matrix in order to electrically connect the embedded inductive element.
20. A method, comprising: providing a magnetic element, in particular a magnetic inlay, in a component carrier layer stack, applying an electrical source to the magnetic element so that an electric current flow direction through the magnetic element is essentially in a horizontal direction with respect to the component carrier layer stack.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
[0122] FIG. 1A shows a side view of a component carrier with a horizontal electric current flow direction through a magnetic matrix-enclosed inductive element according to an exemplary embodiment of the disclosure.
[0123] FIG. 1B shows a top view of the component carrier of FIG. 1A according to an exemplary embodiment of the disclosure.
[0124] FIG. 2A, FIG. 2B and FIG. 2C illustrate conventional examples of a circuit board with a vertical electric current flow direction through a plated through hole.
[0125] FIG. 3A, FIG. 3B, FIG. 3C, FIG. 3D, FIG. 3E, FIG. 3F and FIG. 3G, respectively, show a method of manufacturing a magnetic element. FIG. 3H illustrates an embodiment where the magnetic element is elongated rather than circular in a cross-sectional view. Both embodiments include an eccentric hole.
[0126] FIG. 4A, FIG. 4B, FIG. 4C and FIG. 4D, respectively, show a method of manufacturing a component carrier with a horizontal electric current flow direction through a magnetic matrix-enclosed inductive element according to an example embodiment.
[0127] FIG. 5A, FIG. 5B, FIG. 5C, FIG. 5D, FIG. 5E, and FIG. 5F, respectively, show a method of manufacturing a component carrier with a horizontal electric current flow direction through a magnetic matrix-enclosed inductive element according to an example embodiment.
[0128] FIG. 6A, FIG. 6B, FIG. 6C, and FIG. 6D, respectively, show a method of manufacturing a component carrier with a horizontal electric current flow direction through a magnetic matrix-enclosed inductive element according to an example embodiment.
[0129] FIG. 7A, FIG. 7B, FIG. 7C, FIG. 7D, FIG. 7E, and FIG. 7F, respectively, show a method of manufacturing a component carrier with a horizontal electric current flow direction through a magnetic matrix-enclosed inductive element according to an example embodiment.
[0130] FIG. 8A, FIG. 8B, FIG. 8C, FIG. 8D, and FIG. 8E, respectively, show a method of manufacturing a component carrier with a horizontal electric current flow direction through a magnetic matrix-enclosed inductive element according to an example embodiment.
[0131] FIG. 9A, FIG. 9B, FIG. 9C, FIG. 9D, FIG. 9E, FIG. 9F, FIG. 9G, FIG. 9H, and FIG. 9I, respectively, show a method of manufacturing a component carrier with a horizontal electric current flow direction through a magnetic matrix-enclosed inductive element according to an example embodiment.
[0132] FIG. 10A, FIG. 10B and FIG. 10C illustrate the structures of Model 1 and corresponding simulations according to exemplary embodiments of the disclosure.
[0133] FIG. 10D, FIG. 10E and FIG. 10F illustrate the structures of Model 2 and corresponding simulations according to exemplary embodiments of the disclosure.
[0134] FIG. 10G, FIG. 10H and FIG. 10I illustrate the structures of Model 3 and corresponding simulations according to exemplary embodiments of the disclosure.
[0135] FIG. 10J, FIG. 10K and FIG. 10L illustrate the structures of Model 4 and corresponding simulations according to exemplary embodiments of the disclosure.
[0136] FIG. 10M, FIG. 10N and FIG. 10O illustrate the structures of Model 5 and corresponding simulations according to exemplary embodiments of the disclosure.
[0137] FIG. 11A illustrates the structures of Model 6 of the disclosure.
[0138] FIG. 11B illustrates the structures of Model 7 of the disclosure.
[0139] FIG. 11C illustrates the structures of Model 8 of the disclosure.
[0140] FIG. 11D illustrates the structures of Model 9 of the disclosure.
DETAILED DESCRIPTION OF ILLUSTRATED EMBODIMENTS
[0141] The illustrations in the drawings are schematically presented. In different drawings, similar or identical elements are provided with the same reference signs.
[0142] Before, referring to the drawings, exemplary embodiments will be described in further detail, some basic considerations will be summarized based on which exemplary embodiments of the disclosure have been developed.
[0143] According to an exemplary embodiment, by using an eccentric borehole in a copper clad hole, which is filled with magnetic paste, a vertical inductor is created. When extending the holes to slits, the properties can be further improved. This concept enables an easy creation of inductor structures in PCBs and low ohmic resistance due to a usage of the copper wall of the drill as an electrical inductor. The changed electric current flow direction allows to build thinner cores.
[0144] FIG. 1A and FIG. 1B show a component carrier 100 with a horizontal electric current flow direction through a magnetic matrix-enclosed inductive element according to exemplary embodiments of the disclosure. The component carrier 100 comprises a stack 110 (e.g., a copper-clad laminate or a multilayer stack) comprising electrically conductive layer structures 104 and an electrically insulating layer structure 102 (e.g., a core layer).
[0145] According to FIG. 1A, a magnetic matrix 155, being a magnetic sheet, is assembled (embedded in) to the stack 110 and an inductive element 120 is partially enclosed by the magnetic matrix 155. In particular, a through hole in the stack 110 comprises at its sidewalls the magnetic matrix 155, wherein the magnetic matrix 155 is further covered by material of the inductive element 120. At the top and at the bottom of the through hole, the inductive element is electrically connected to an electrical connector 160 and/or to an electrically conductive layer structure 104 of the stack 110. The height of the through hole (and the corresponding core layer) can be very thin, for example around 1 mm.
[0146] FIG. 1B shows a top view on the component carrier 100 described for FIG. 1A above. It can be seen that the inductive element 120 is not a closed ring as in the conventional design (see FIG. 2). Instead, a first part 121a of the inductive element 120 and a second part 121b of the inductive element 120 are electrically disconnected from each other (e.g., separated by a non-depicted eccentric hole). The first part 121a is electrically connected to a first part of the electrical connector 160a, while the second part 121b is electrically connected to a second part of the electrical connector 160b. The electrical connector 160 is oriented horizontally to the component carrier 100, i.e., the direction of main extension of the electrical connector 160 is parallel to the direction of main extension (along the x-axis) of the component carrier 100 or stack 110. Since the electrical connector 160 forms part of the inductive element 120 in this manner, a direction of main extension of the inductive element 120 is also oriented parallel to a direction of main extension of the component carrier 100/stack 110.
[0147] As the electric current flow direction E is horizontal, a main axis of a magnetic field, which is generated based on the interaction of the magnetic matrix 155 and the inductive element 120, is oriented parallel to the direction of main extension of the stack (along the x-axis).
[0148] The outer diameter should be bigger in size than the inner diameter by a factor that considers registration chains.
[0149] FIG. 3A to FIG. 3H show a method of manufacturing a component carrier 100 with an eccentric hole 140 according to exemplary embodiments of the disclosure.
[0150] In FIG. 3A, a component carrier 100 with an electrically insulating layer structure 102 (e.g., FR4 core) is provided. A first cavity 130 is drilled into the electrically insulating layer structure 102.
[0151] As illustrated in FIG. 3B, the first cavity 130 is completely filled by a first magnetic matrix material 155a, e.g., a magnetic paste.
[0152] In FIG. 3C, a second cavity 131, being smaller than the first cavity 130, is drilled in the first magnetic matrix 155a. Subsequently, the sidewalls of the second cavity 131 are plated with an electrically conductive material, in particular copper, thereby providing an inductive element 120 that is partially enclosed by the magnetic matrix 155. The inductive element 120 only fills a first part of the second cavity 131.
[0153] As shown in FIG. 3D, the second (remaining) part of the second cavity 131 is completely filled with an insulating material, in this example a second magnetic matrix 155b.
[0154] In FIG. 3E, the eccentric hole 140 is drilled through the inductive element 120 (and partially through the first/second magnetic matrix 155a/155b), so that a first part 120a of the inductive element 120 and a second part 120b of the inductive element 120 are electrically separated from each other.
[0155] In the example shown in FIG. 3F, the eccentric hole 140 is filled with a third magnetic matrix 155c.
[0156] In FIG. 3G, the first part 120a is electrically connected to a first part of an electrical connector 160a and the second part 120b is electrically connected to a second part of the electrical connector 160b. Hereby, the first connection position and the second connection position are at different vertical (along the z-axis) levels with respect to the stack 110. The electrical connector 160 is assembled to the stack 110, so that a direction of main extension x, y of the electrical connector 160 is oriented parallel to a direction x, y of main extension of the stack 110. At the end of the described method, a magnetic element 150 is obtained, wherein an electric current flow direction E is horizontal with respect to the component carrier 100.
[0157] FIG. 3H shows the same concept as described for FIG. 3G with the difference that the first cavity 130/second cavity 131 is not formed as a hole but as a slit.
[0158] FIG. 4A to FIG. 4D show a method of manufacturing a component carrier 100 according to an exemplary embodiment of the disclosure, wherein a plurality of slits are electrically connected to each other to form a common winding structure.
[0159] In FIG. 4A, a plurality of slits are provided that have been manufactured e.g., according to the method described for FIG. 3D above. The only differences being that the second (remaining) part of the second cavity 131 has been filled by insulating resin 170 instead of second magnetic paste 155b. A further magnetic matrix 156 is thus assembled to the stack 110 and a further inductive element 125 is embedded in the further magnetic matrix 156.
[0160] As shown in FIG. 4B, instead of one eccentric hole 140 (see FIG. 3e above), two eccentric holes 140 are drilled (at the outermost ends in the horizontal direction) into each slit structure.
[0161] As illustrated in FIG. 4C, in this design, two separated electrical connectors 160 are applied (e.g., using plating and structuring) to electrically connect the plurality of slits with each other. Hence, the inductive element 120 and the further inductive element 125 are electrically connected with each other to thereby form a (common) winding.
[0162] As shown in FIG. 4D, in an embodiment very similar to the one illustrated in FIG. 4C, a continuous electrical connector 160 is applied to electrically connect the slits with each other.
[0163] FIG. 5A to FIG. 5F show a method of manufacturing a component carrier 100 according to an exemplary embodiment of the disclosure, wherein a plurality of slits are electrically connected to each other to form a common winding structure (without using eccentric holes).
[0164] In FIG. 5A, a component carrier 100 with an electrically insulating layer structure 102 (e.g., FR4) is provided. A first cavity 130, having the shape of a slit, is formed into the electrically insulating layer structure 102 four times.
[0165] As illustrated in FIG. 5B, the first cavities 130 are completely filled with a first magnetic matrix 155a, e.g., a magnetic paste, to provide a magnetic matrix 155 and a further magnetic matrix 156.
[0166] As shown in FIG. 5C, a second cavity 131, being smaller than the first cavity 130, is formed (rerouting) in the first magnetic matrix 155a.
[0167] Subsequently, in FIG. 5D, the sidewalls of the second cavity 131 are plated with an electrically conductive material, in particular copper, thereby providing the inductive element 120 and the further inductive element 125.
[0168] In FIG. 5E, the remaining part of the second cavities 131 is completely filled with an insulating material, in this example an insulating polymer paste 170.
[0169] As shown in FIG. 5F, a plurality of one-piece electrical connectors 160 are applied (e.g., using plating and structuring) to electrically connect the inductive element 120 of a first slit with the further inductive element 125 of a second slit, respectively, to thereby form a (common) winding. In contrast to the examples described for FIGS. 4C and 4D above, no eccentric holes 140 are applied here.
[0170] FIG. 6A to FIG. 6D show a method of manufacturing a component carrier 100 according to an exemplary embodiment of the disclosure, wherein a meander-shaped inductive element with an eccentric hole is formed.
[0171] In FIG. 6A, a first magnetic matrix 155a is provided, either within a component carrier 100 or as a magnetic inlay 150 for a component carrier 100. A second cavity 131, having the shape of a meander (with three windings), is formed (rerouting) into the first magnetic matrix 155a (in this example there is no first cavity).
[0172] As shown in FIG. 6B, an inductive element 120 is arranged at the sidewalls of the second cavity 131 by plating said sidewalls.
[0173] In FIG. 6C, the remaining part of the second cavity 131 is filled with a second magnetic matrix 155b.
[0174] As illustrated in FIG. 6D, the eccentric hole 140 is drilled through the inductive element 120 (and partially through the first/second magnetic matrix material 155a/155b), so that a first part 120a of the inductive element 120 and a second part 120b of the inductive element 120 are electrically separated from each other. Further, the eccentric hole 140 is filled with a third magnetic matrix 155c. Thereby, a magnetic element 150 is obtained that can be used as an inlay 150 for a component carrier 100.
[0175] FIG. 7A to FIG. 7F show a method of manufacturing a component carrier 100 according to an exemplary embodiment of the disclosure, wherein a meander-shaped inductive element without an eccentric hole is formed.
[0176] In FIG. 7A, a first magnetic matrix 155a is provided, either within a component carrier 100 or as a magnetic inlay 150 for a component carrier 100. A second cavity 131, having the shape of a meander (with three windings), is drilled into the first magnetic matrix 155a (in this example, there is no first cavity).
[0177] As shown in FIG. 7B, an inductive element 120 is arranged at the sidewalls of the second cavity 131 by plating said sidewalls.
[0178] In FIG. 7C, the remaining part of the second cavity 131 is filled with a second magnetic matrix material 155b.
[0179] As illustrated in a side view of the product in FIG. 7C, FIG. 7D, shows a further magnetic matrix 155 (magnetic sheet) has been arranged (laminated) on top of the inductive element 120, so that the inductive element 120 is fully embedded horizontally in the center of the magnetic matrix 155. Further, electrically conductive layers 121a, 121b have been respectively laminated on the top and on the bottom main surface of the magnetic matrix 155.
[0180] In FIG. 7E, the embedded inductive element 120 is electrically connected by blind vias 123, 124 (Figure above) or plated through holes (Figure below). The vias 123, 124 have been provided by drilling and subsequent plating (either completely filling in the case of blind vias or sidewall-plating in the case of through holes).
[0181] As illustrated in FIG. 7F, the electrically conductive layers 121a, 121b have been structured (e.g., using photo-structuring) to provide electrically conductive pads that are connected to the blind vias 123, 124 or the plated through hole vias 123, 124. Thereby, a magnetic element 150 is obtained that can be used as an inlay 150 for a component carrier 100.
[0182] FIG. 8A to FIG. 8E show a method of manufacturing a component carrier 100 according to an exemplary embodiment of the disclosure, wherein a meander-shaped inductive element is embedded in a magnetic matrix (without an eccentric hole).
[0183] In FIG. 8A, a meander-shaped inductive element 120 with seven windings is provided and comprises an additional electrically conductive frame structure 121, 122 around the actual windings. Said inductive element 120 can be manufactured, for example, by photo-structuring and/or etching a copper foil.
[0184] As illustrated in FIG. 8B, the inductive element 120 is laminated with two magnetic matrices 155, in particular magnetic sheets. After embedding the winding part, the electrically conductive frame structure 121, 122 encircles the magnetic matrix 155.
[0185] As shown in FIG. 8C, holes are drilled through the electrically conductive frame structures 121a, 121b above and below the matrix 155, and the magnetic matrix 155, in order to provide connections to the embedded winding part of the inductive element 120. The holes are then filled with copper to provide blind vias 123, 124.
[0186] In FIG. 8D, the upper electrically conductive frame structure 121a and the lower electrically conductive frame structure 121b are removed (electrically conductive pads, however, remain) by photo-structuring, so that the magnetic matrix 155 is exposed.
[0187] As shown in FIG. 8E, the electrically conductive frame structure 122a, 122b is completely removed and a magnetic element 150 is obtained that can be used as an inlay 150 for a component carrier 100.
[0188] FIG. 9A to FIG. 9I show a method of manufacturing a component carrier 100 according to an exemplary embodiment of the disclosure, wherein an inductive element is embedded in a magnetic matrix (without an eccentric hole).
[0189] In FIG. 9A, an electrically conductive layer 182 is arranged on a temporary carrier 183.
[0190] As shown in FIG. 9B, the electrically conductive layer 182 is structured to obtain an electrically conductive inductive element 120.
[0191] In FIG. 9C, an electrically insulating material 184 is formed (at least partially) around the inductive element 120. In the example shown, the electrically insulating material 184 comprises (laser-cut) pieces of prepreg.
[0192] As illustrated in FIG. 9D, a first magnetic matrix material 155a is arranged (printed) on the temporary carrier 183, so that the inductive element 120 is laterally surrounded by the first magnetic matrix material 155a.
[0193] In FIG. 9E, a further first magnetic matrix material 155a is arranged (printed) on top of the inductive element 120 and covers the same.
[0194] As shown in FIG. 9F, the temporary carrier 183 is removed and the inductive element 120 is exposed. The exposed surface of the inductive element 183 is flush with the first magnetic matrix material 155a and the (optional) electrically insulating material 184.
[0195] In FIG. 9G, a second magnetic matrix material 155b is arranged (printed) on the bottom of the inductive element 120 and covers the same, so that the inductive element 120 is completely embedded (encapsulated) in magnetic matrix material 155. Thereby, a magnetic element 150 is obtained that can be used as an inlay 150 for a component carrier 100.
[0196] As shown in FIG. 9H, the magnetic inlay 150 is embedded (sandwiched) between two electrically insulating layer structures 102 of component carrier material (e.g., prepreg) and two electrically insulating layer structures 104. Optionally, additional electrically insulating material 184 can be added. Optionally, electrically insulating material 184 can be removed after the magnetic matrix 155 has been applied. In another example, not using electrically insulating material 184 would be preferred, as there is less handling effort. The prepreg/resin from the upper/lower electrically insulating layer structures layers 102 may in such case flow into the gap and thereby fully embed the magnetic matrix element 150 (inlay).
[0197] In FIG. 9I, a component carrier 100 with an embedded magnetic inlay 150 is provided. The inductive element 120 is electrically contacted by blind vias 123, 124 that have been drilled through the electrically insulating layer structures 102 and that have been filled by electrically conductive material, respectively.
[0198] FIG. 10A to FIG. 10O show the structures of Model 1 to Model 5 and corresponding simulations according to exemplary embodiments of the disclosure.
[0199] Model 1 is represented in FIG. 10A. In this example of the magnetic element 150, two eccentric holes 140 are drilled (one of them not completely) through the inductive element 120, so that the inductive element 120 is separated in a first part 120a and a second part 120b. Each part is connected by a respective electrical connector 160a, 160b on top of the magnetic element 150. Here, no magnetic material is applied in the via.
[0200] FIG. 10B includes a simulation of the current density of Model 1.
[0201] FIG. 10C includes a simulation of the magnetic field of Model 1. The field tends to concentrate in the middle of the via (no magnetic material).
[0202] Model 2 is represented in FIG. 10D. In this example, two eccentric holes 140 are drilled (one of them not completely) through the inductive element 120, so that the inductive element is separated in a first part 120a and a second part 120b. The first part 120a is connected to the first part of the electrical connector 160a at the bottom and the second part 120b is connected to the second part of the electrical connector 160b at the top of the magnetic element 150. Thus, the electric current flow path is much longer than in Model 1. Here, no magnetic material is applied in the via.
[0203] FIG. 10E illustrates a simulation of the current density of Model 2.
[0204] FIG. 10F shows a simulation of the magnetic field of Model 2.
[0205] Model 3 is illustrated in FIG. 10G. In this example of the magnetic element 150, four eccentric holes 140 are drilled (only one of them completely) through the inductive element 120, so that the inductive element is separated into four parts which are interconnected alternatingly at the top and the bottom. Two parts are respectively an electrical connector 160a, 160b on top of the magnetic element 150. Here, no magnetic material is applied in the via.
[0206] FIG. 10H includes a simulation of the current density of Model 3.
[0207] FIG. 10I illustrates a simulation of the magnetic field of Model 3.
[0208] Model 4 is represented in FIG. 10J. This example is very similar to Model 3, but the first part of the inductive element 120 is connected to the first part of the electrical connector 160a at the bottom and a second part is connected to the second part of the electrical connector 160b at the top of the magnetic element 150. Here, no magnetic material is applied in the via.
[0209] FIG. 10K includes a simulation of the current density of Model 4.
[0210] FIG. 10L includes a simulation of the magnetic field of Model 4.
[0211] Model 5 is represented in FIG. 10M. This example is very similar to Model 4, but the via is embedded in magnetic matrix material 155a and filled with magnetic matrix material 155b.
[0212] FIG. 10N includes a simulation of the current density of Model 5.
[0213] FIG. 10O includes a simulation of the magnetic field of Model 5.
[0214] Table 1 below shows the simulation results of Models 1 to 5 with respect to the inductance (in nH) and the resistance (in mΩ) for different magnetic properties (μ). It can be seen that Model 5 (four eccentric holes, via filled with magnetic matrix material, and via embedded in magnetic matrix material 155a) shows the highest inductance value.
TABLE-US-00001 TABLE 1 Model 1 Model 2 Model 3 Model 4 Model 5 Inductance 0.733 1.93 1.44 2.67 3.18 (μ = 5) Inductance 0.779 3.13 1.53 3.92 4.67 (μ = 10) Resistance 65 41 166 132 166 (μ = 5) Resistance 70 43 176 141 198 (μ = 10)
[0215] FIG. 11A to FIG. 11D show the structures of Models 6 to Model 9 according to exemplary embodiments of the disclosure.
[0216] Model 6 is represented in FIG. 11A. This example is very similar to Model 1, but the via has been filled with magnetic matrix material 155b. In the simulation, air 199 is surrounding the via.
[0217] Model 7 is illustrated in FIG. 11B. This example is very similar to Model 6, but the via is surrounded by magnetic matrix material 155a.
[0218] Model 8 is shown in FIG. 11C. This example is very similar to Model 6, but four eccentric holes have been formed (compare Models 3 to 5). The via is filled with magnetic matrix material 155b and surrounded by air in the simulation.
[0219] Model 9 is shown in FIG. 11D. This example is very similar to Model 8, but instead of air, magnetic matrix material 155a is surrounding the via.
[0220] Table 2 below shows the simulation results of Models 6 to 9 with respect to the inductance (in nH) and the resistance (in mQ) for different magnetic properties (p). It can be seen that Model 9 (four eccentric holes, via filled with magnetic matrix material and embedded in magnetic matrix material) shows the highest inductance value.
TABLE-US-00002 TABLE 2 Model 6 Model 7 Model 8 Model 9 Inductance 0.705 1.07 1.36 2.05 (μ = 5) Inductance 0.745 1.3 1.43 2.4 (μ = 10) Resistance 63 90 154 200 (μ = 5) Resistance 67 115 161 242 (μ = 10)
[0221] It should be noted that the term “comprising” does not exclude other elements or steps and the “a” or “an” does not exclude a plurality. Also, elements described in association with different embodiments may be combined.
[0222] Implementation of the disclosure is not limited to the preferred embodiments shown in the figures and described above. Instead, a multiplicity of variants is possible which variants use the solutions shown and the principle according to the disclosure even in the case of fundamentally different embodiments.
REFERENCE SIGNS
[0223] 100 Component carrier [0224] 102 Electrically insulating layer structure [0225] 104 Electrically conductive layer structure [0226] 110 Layer stack [0227] 120 Electrically conductive structure, inductive element [0228] 120a First part inductive element [0229] 120b Second part inductive element [0230] 121 Electrically conductive frame structure/layer [0231] 121a Upper electrically conductive frame structure [0232] 121b Lower electrically conductive frame structure [0233] 122a Left side electrically conductive frame structure [0234] 122b Right side electrically conductive frame structure [0235] 123 First via [0236] 124 Second via [0237] 125 Further inductive element [0238] 130 First cavity [0239] 131 Second cavity [0240] 140 Eccentric hole [0241] 150 Magnetic element, magnetic inlay [0242] 155 Magnetic matrix [0243] 155a First magnetic matrix material [0244] 155b Second magnetic matrix material [0245] 155c Third magnetic matrix material [0246] 156 Further magnetic matrix [0247] 160 Electric connector [0248] 160a First part of electric connector [0249] 160b Second part of electric connector [0250] 170 Resin material [0251] 182 Electrically conductive layer [0252] 183 Temporary carrier [0253] 184 Electrically insulating material [0254] 199 Air [0255] E Electric current flow direction [0256] 200 Conventional circuit board [0257] 220 Conventional plated through hole [0258] 250 Conventional magnetic material
