HEARING DEVICE COMPRISING A SHIELDING COMPONENT

Abstract

Disclosed is a hearing device configured to be worn at or in an ear of a user. The hearing device comprises a substrate. The substrate comprises one or more electronic components mounted on the substrate. The hearing device comprises a shielding component. The shielding component being arranged on the substrate to provide a space between the shielding component and the substrate. The shielding component is configured to cover at least a first electronic component of the one or more electronic components on the substrate. The space between the shielding component and the substrate is at least partly filled with a fill encapsulation material configured for encapsulating at least the first electronic component. The shielding component comprises a reservoir configured to collect/accumulate any excess fill encapsulation material from the space between the shielding component and the substrate.

Claims

1. A hearing device configured to be worn at or in an ear of a user, the hearing device comprising: a substrate; one or more electronic components mounted on the substrate; and a shielding component configured to cover at least a first electronic component of the one or more electronic components on the substrate; wherein a space between the shielding component and the substrate is at least partly filled with an encapsulation material configured to encapsulate at least the first electronic component; wherein the shielding component comprises a reservoir configured to receive an excess encapsulation material that is outside the space between the shielding component and the substrate; and wherein the shielding component comprises one or more side parts and a top part, and wherein the reservoir is at the top part of the shielding component.

2. The hearing device according to claim 1, wherein the excess encapsulation material in the reservoir is visible when viewed from outside the shielding component.

3. The hearing device according to claim 1, wherein the shielding component comprises an internal face facing towards the substrate, and wherein the shielding component comprises an external face facing towards a surrounding.

4. The hearing device according to claim 3, wherein the reservoir is at least partly defined by a portion of the external face of the shielding component.

5. The hearing device according to claim 1, wherein the shielding component comprises a filling hole configured to deliver the encapsulation material to at least a part of the space.

6. The hearing device according to claim 1, wherein the shielding component is made from an electrically conductive material, and wherein the shielding component is an electromagnetically shielding component configured to electromagnetically shield at least the first electronic component.

7. The hearing device according to claim 1, wherein the shielding component is made from a solid metal plate.

8. The hearing device according to claim 1, wherein the shielding component comprises at least one filling hole configured to receive the encapsulation material to at least partially fill the space between the shielding component and the substrate.

9. The hearing device according to claim 8, wherein the at least one filling hole is at the reservoir.

10. The hearing device according to claim 1, wherein the shielding component has a first height above the substrate, wherein the first height of the shielding component corresponds with a height of of the first electronic component.

11. The hearing device according to claim 1, wherein the first electronic component is at least a part of a power management circuit of the hearing device, and wherein the shielding component is configured to reduce electromagnetic interference of the first electronic component.

12. The hearing device according to claim 1, wherein the one or more side parts of the shielding component form a non-parallel angle with respect to a plane of the substrate.

13. The hearing device according to claim 1, wherein the top part of the shielding component extends in a direction that is parallel to a plane of the substrate.

14. The hearing device according to claim 1, wherein the shielding component comprises one or more air escape holes.

15. A method of manufacturing a hearing device configured to be worn at or in an ear of a user, the method comprising: providing a substrate having a first electronic component mounted thereon; providing a shielding component having one or more side parts, a top part, and a reservoir at the top part of the shielding component; covering the first electronic component on the substrate with the shielding component; filling at least a part of a space between the shielding component and the substrate with an encapsulation material, the encapsulation material configured to encapsulate at least the first electronic component; and receiving, by the reservoir of the shielding component, an excess encapsulation material that is outside the space between the shielding component and the substrate.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0079] The above and other features and advantages will become readily apparent to those skilled in the art by the following detailed description of exemplary embodiments thereof with reference to the attached drawings, in which:

[0080] FIG. 1 schematically illustrates an exemplary hearing device 2 configured to be worn at an ear of a user.

[0081] FIGS. 2a) and 2b) schematically illustrates an exemplary hearing device 2, the hearing device 2 having a shielding component 8 comprising at least one filling hole 24 and one or more air escape holes 26.

[0082] FIG. 3 schematically illustrates an exemplary hearing device 2, the hearing device 2 having a shielding component 8 comprising an elevation/rise/protrusion 28.

[0083] FIG. 4 schematically illustrates an example of a hearing device 2.

[0084] FIGS. 5a) and 5b) schematically illustrate an example of a block-diagram of an embodiment of a hearing device 2.

[0085] FIG. 6 schematically illustrates a flow chart of a method 100 of manufacturing a substrate for a hearing device configured to be worn at an ear of a user.

DETAILED DESCRIPTION

[0086] Various embodiments are described hereinafter with reference to the figures. Like reference numerals refer to like elements throughout. Like elements will, thus, not be described in detail with respect to the description of each figure. It should also be noted that the figures are only intended to facilitate the description of the embodiments. They are not intended as an exhaustive description of the claimed invention or as a limitation on the scope of the claimed invention. In addition, an illustrated embodiment needs not have all the aspects or advantages shown. An aspect or an advantage described in conjunction with a particular embodiment is not necessarily limited to that embodiment and can be practiced in any other embodiments even if not so illustrated, or if not so explicitly described.

[0087] FIG. 1 schematically illustrates an exemplary hearing device 2 configured to be worn at an ear of a user. The hearing device 2 comprises a substrate 4. The substrate 4 comprises one or more electronic components 6 mounted on the substrate 4. The hearing device 2 comprises a shielding component 8. The shielding component 8 being arranged on the substrate 4 to provide a space 10 between the shielding component 8 and the substrate 4. The shielding component 8 is configured to cover at least a first electronic component 6′ of the one or more electronic components 6 on the substrate 4. The space 10 between the shielding component 8 and the substrate 4 is at least partly filled with a fill encapsulation material 12 configured for encapsulating at least the first electronic component 6′. The shielding component 8 comprises a reservoir 14 configured to collect/accumulate any excess fill encapsulation material from the space 10 between the shielding component 8 and the substrate 4.

[0088] FIG. 1 further shows that the reservoir 14 is configured to be visually inspectable, whereby any excess fill encapsulation material (not shown) in the reservoir 14 is configured to be visible.

[0089] FIG. 1 shows that the shielding component 8 comprises one or more side parts 16 being substantially perpendicular to the substrate 4. FIG. 1 also shows that the shielding component 8 comprises a top part 18 being substantially parallel to the substrate 4. FIG. 1 shows that the reservoir 14 is provided on the top part 18 of the shielding component 8.

[0090] FIG. 1 shows that the shielding component 8 comprises an internal face 20, where the internal face 20 points towards the substrate 4 thereby defining the space 10 between the shielding component 8 and the substrate 4. The fill encapsulation material 12 is provided through the shielding component 8 to the internal face 20 of the shielding component 8.

[0091] FIG. 1 shows that the shielding component 8 comprises an external face 22, where the external face 22 points towards the surroundings, and where the reservoir 14 is provided on the external face 22 of the shielding component 8.

[0092] FIG. 1 furthermore shows that the shielding component 8 has a first height, i.e. vertical distance, above the substrate 4, wherein the first height is configured to match/correspond to a second height, i.e. vertical distance, being the height of at least the first electronic component 6′ on the substrate 4. Thus, the first height of the shielding component 8 and the second height of the first electronic component 6′ may be substantially the same, the first height of the shielding component 8 may just be a little bit higher than the second height of the first electronic component 6′.

[0093] FIG. 1 further shows that the shielding component 8 has a first height, i.e. vertical distance, above the substrate 4 which varies to match/correspond to different second heights, i.e. vertical distances, of one or more of the electronic components 6 on the substrate 4 covered by the shielding component 8. As the electronic components 6 covered by the shielding component 8 may have different heights, i.e. vertical distances, the height of the shielding component 8 may vary to match/correspond to the different heights of the electronic components 6. Thus the varying first height of the shielding component 8 and the varying second height of the electronic components 6 may be substantially the same, the first height of the shielding component 8 may just be a little bit higher than the second height of the electronic component 6.

[0094] FIGS. 2a) and 2b) schematically illustrates an exemplary hearing device 2 configured to be worn at an ear of a user. The hearing device 2 comprises a substrate 4. The substrate 4 comprises one or more electronic components (not shown) mounted on the substrate 4. The hearing device 2 comprises a shielding component 8. The shielding component 8 being arranged on the substrate 4 to provide a space (not shown) between the shielding component 8 and the substrate 4. The shielding component 8 is configured to cover at least a first electronic component (not shown) of the one or more electronic components on the substrate 4. The space between the shielding component 8 and the substrate 4 is at least partly filled with a fill encapsulation material (not shown) configured for encapsulating at least the first electronic component. The shielding component 8 comprises a reservoir 14 configured to collect/accumulate any excess fill encapsulation material from the space between the shielding component 8 and the substrate 4.

[0095] FIG. 2a) shows the shielding component 8 in a side-view perspective.

[0096] FIG. 2b) shows the shielding component 8 in a top view perspective.

[0097] FIGS. 2a) and 2b) further shows that the reservoir 14 is configured to be visually inspectable, whereby any excess fill encapsulation material (not shown) in the reservoir 14 is configured to be visible.

[0098] FIG. 2a) shows that the shielding component 8 comprises one or more side parts 16 being substantially perpendicular to the substrate 4. FIGS. 2a) and 2b) also shows that the shielding component 8 comprises a top part 18 being substantially parallel to the substrate 4. FIGS. 2a) and 2b) shows that the reservoir 14 is provided on the top part 18 of the shielding component 8.

[0099] FIGS. 2a) and 2b) shows that the shielding component 8 comprises an external face 22, where the external face 22 points towards the surroundings, and where the reservoir 14 is provided on the external face 22 of the shielding component 8. The fill encapsulation material (not shown) is provided through the shielding component 8 to an internal face (not shown) of the shielding component 8, the internal face pointing towards the substrate 4 thereby defining the space between the shielding component 8 and the substrate 4.

[0100] FIGS. 2a) and 2b) shows that the shielding component 8 comprises at least one filling hole 24 configured for receiving the fill encapsulation material to fill the space between the shielding component 8 and the substrate 4. The filling hole 24 may be a through-hole in the shielding component 8. The filling hole 24 is shown in the top part 18 of the shielding component 8. In FIGS. 2a) and 2b) two filling holes 24 are shown.

[0101] FIGS. 2a) and 2b) shows that the at least one filling hole 24 is provided in the reservoir 14.

[0102] FIGS. 2a) and 2b) shows that the shielding component 8 comprises one or more air escape holes 26 configured for allowing air to escape the space between the shielding component 8 and the substrate 4 during and/or after the fill encapsulation material is filled in the space. The air escape holes 26 is shown in the top part 18 of the shielding component 8. The air escape holes 26 are provided along an edge of the top part 18 of the shielding component.

[0103] FIG. 3 schematically illustrates an exemplary hearing device 2 configured to be worn at an ear of a user. The hearing device 2 comprises a substrate 4. The substrate 4 comprises one or more electronic components (not shown) mounted on the substrate 4. The hearing device 2 comprises a shielding component 8. The shielding component 8 being arranged on the substrate 4 to provide a space (not shown) between the shielding component 8 and the substrate 4. The shielding component 8 is configured to cover at least a first electronic component (not shown) of the one or more electronic components on the substrate 4. The space between the shielding component 8 and the substrate 4 is at least partly filled with a fill encapsulation material (not shown) configured for encapsulating at least the first electronic component. The shielding component 8 comprises a reservoir 14 configured to collect/accumulate any excess fill encapsulation material from the space between the shielding component 8 and the substrate 4.

[0104] FIG. 3 shows the shielding component 8 in a side-view perspective.

[0105] FIG. 3 further shows that the reservoir 14 is configured to be visually inspectable, whereby any excess fill encapsulation material (not shown) in the reservoir 14 is configured to be visible.

[0106] FIG. 3 shows that the shielding component 8 comprises one or more side parts 16 being substantially perpendicular to the substrate 4. FIG. 3 also shows that the shielding component 8 comprises a top part 18 being substantially parallel to the substrate 4. FIG. 3 shows that the reservoir 14 is provided on the top part 18 of the shielding component 8.

[0107] FIG. 3 shows that the shielding component 8 comprises an external face 22, where the external face 22 points towards the surroundings, and where the reservoir 14 is provided on the external face 22 of the shielding component 8. The fill encapsulation material (not shown) is provided through the shielding component 8 to an internal face (not shown) of the shielding component 8, the internal face pointing towards the substrate 4 thereby defining the space between the shielding component 8 and the substrate 4.

[0108] FIG. 3 shows that the shielding component 8 comprises at least one filling hole 24 configured for receiving the fill encapsulation material to fill the space between the shielding component 8 and the substrate 4. The filling hole 24 may be a through-hole in the shielding component 8. The filling hole 24 is shown in the top part 18 of the shielding component 8. In FIG. 3 two filling holes 24 are shown.

[0109] FIG. 3 shows that the at least one filling hole 24 is provided in the reservoir 14.

[0110] FIG. 3 shows that the shielding component 8 comprises one or more air escape holes 26 configured for allowing air to escape the space between the shielding component 8 and the substrate 4 during and/or after the fill encapsulation material is filled in the space. The air escape holes 26 is shown in the top part 18 of the shielding component 8. The air escape holes 26 are provided along an edge of the top part 18 of the shielding component.

[0111] FIG. 3 shows that the shielding component 8 comprises an elevation/rise/protrusion 28 configured for guiding the flow of fill encapsulation material in the space between the shielding component 8 and the substrate 3. The elevation/rise/protrusion 28 is shown to be provided in an end of the shielding component 8 having a lower height than another end of the shielding component 8. The elevation/rise/protrusion 28 in the shielding component 8 may secure that the fill encapsulation material will flow all the way out to all corners and parts of the space between the shielding component 8 and the substrate 4 as fast as possible.

[0112] FIG. 4 schematically illustrates an example of a hearing device 2, such as a hearing aid. The hearing device 2 comprises a microphone 422, for receiving an input signal and converting it into an audio signal. The audio signal is provided to a processing unit 424 for processing the audio signal and providing a processed output signal for compensating a hearing loss of a user of the hearing device 2. A receiver 426 is connected to an output of the processing unit 424 for converting the processed output signal into an output sound signal, e.g. a signal modified to compensate for a user's hearing impairment. Typically, the receiver 426 comprises a transducer, and the receiver 426 is often referred to as a speaker. The processing unit 424 may comprise elements such as amplifiers, compressors, noise reduction systems, etc. The hearing device 420 may further comprise a wireless communication unit 428 for wireless data communication interconnected with an antenna structure 430 for emission and reception of an electromagnetic field. The wireless communication unit 428, such as a radio or a transceiver, connects to the processing unit 424 and the antenna structure 430, for communicating with an electronic device, an external device, or with another hearing device, such as another hearing aid located in/on/at another ear of the user, typically in a binaural hearing system. The hearing device 2 may comprise two or more antenna structures.

[0113] FIGS. 5a) and 5b) schematically illustrate an example of a block-diagram of an embodiment of a hearing device 2. In FIG. 5a), the hearing device 2 comprises a first transducer, i.e. microphone 202, to generate one or more microphone output signals based on a received an audio signal. The one or more microphone output signals are provided to a signal processor 204 for processing the one or more microphone output signals. A receiver or speaker 206 is connected to an output of the signal processor 204 for converting the output of the signal processor into a signal modified to compensate for a user's hearing impairment, and provides the modified signal to the speaker 206.

[0114] The hearing device signal processor 204 may comprise elements such as an amplifier, a compressor and/or a noise reduction system etc. The signal processor 204 may be implemented in a signal processing chip 204′. The hearing device may further have a filter function, such as compensation filter for optimizing the output signal.

[0115] The hearing device 2 further comprises a wireless communication unit 214 interconnected with magnetic induction antenna 216 such as a magnetic induction coil. The wireless communication unit 214 and the magnetic induction antenna 216 may be configured for wireless data communication using emission and reception of magnetic field. The wireless communication unit may be implemented as a wireless communication chip 214′, such as a magnetic induction control chip 214′.

[0116] The hearing device 200 further comprises a power source 212, such as a battery or a rechargeable battery. Furthermore, a power management unit 210 is provided for controlling the power provided from the battery 212 to the signal processor 204, the receiver, the one or more microphones, the wireless communication unit (RF) 208, and the wireless communication unit (MI) 214. The magnetic induction antenna is configured for communication with another electronic device, in some embodiments configured for communication with another hearing device, such as another hearing device located at another ear, typically in a binaural hearing device system.

[0117] The hearing device 2 may furthermore have a wireless communication unit 208, such as a wireless communication circuit, for wireless data communication interconnected with an RF antenna 218 for emission and reception of an electromagnetic field. The wireless communication unit may be implemented as a wireless communication chip 208′. The wireless communication unit 208, including a radio or a transceiver, connect to the hearing device signal processor 204 and the RF antenna 218, for communicating with one or more external devices, such as one or more external electronic devices, including at least one smart phone, at least one tablet, at least one hearing accessory device, including at least one spouse microphone, remote control, audio testing device, etc., or, in some embodiments, with another hearing device, such as another hearing device located at another ear, typically in a binaural hearing device system.

[0118] The signal processor 204, the wireless communication unit (RF) 208, the wireless communication unit (MI) 214 and the power management unit 210 may be implemented as signal processing chip 204′, wireless communication chip (RF) 208′, wireless communication chip (MI) 214′ and power management chip 210′, respectively.

[0119] In FIG. 5b), a hearing device corresponding to the hearing device as shown in FIG. 5a is seen, except that in FIG. 5b, only one wireless communication unit 214 is present being interconnected with the magnetic induction antenna 216, the signal processor 204 and the power management unit 210.

[0120] Likewise, even though not shown, also a hearing device having only one wireless communication unit 208 being interconnected with an RF antenna for reception and emission of an electromagnetic field is envisaged.

[0121] The first electronic component, see FIG. 1, may be at least a part of a power management circuit of the power management unit 210 of the hearing device 2, and the electromagnetic interference of the first electronic component, see FIG. 1, may be reduced by the shielding component, see FIGS. 1-3.

[0122] FIG. 6 schematically illustrates a flow chart of a method 100 of manufacturing a substrate for a hearing device configured to be worn at an ear of a user. The hearing device comprises the substrate. The substrate comprises one or more electronic components mounted on the substrate including a first electronic component. The hearing device comprises a shielding component comprising a reservoir.

[0123] The method comprises a step 102 of providing the substrate comprising the one or more electronic components including the first electronic component.

[0124] The method comprises a step 104 of arranging the shielding component on the substrate to provide a space between the shielding component and the substrate, where the shielding component covers at least the first electronic component of the one or more electronic components on the substrate. The shielding component may be soldered to the substrate, so that no fill encapsulation material will escape between the shielding component and the substrate.

[0125] The method comprises a step 106 of filling the space between the shielding component and the substrate at least partly with a fill encapsulation material configured for encapsulating at least the first electronic component.

[0126] The method comprises a step 108 of collecting/accumulating, in the reservoir of the shielding component, any excess fill encapsulation material from the space between the shielding component and the substrate.

[0127] Although particular features have been shown and described, it will be understood that they are not intended to limit the claimed invention, and it will be made obvious to those skilled in the art that various changes and modifications may be made without departing from the scope of the claimed invention. The specification and drawings are, accordingly to be regarded in an illustrative rather than restrictive sense. The claimed invention is intended to cover all alternatives, modifications and equivalents.

Items

[0128] 1. A hearing device configured to be worn at or in an ear of a user, the hearing device comprising: [0129] a substrate comprising one or more electronic components mounted on the substrate; [0130] a shielding component arranged on the substrate to provide a space between the shielding component and the substrate;
where the shielding component is configured to cover at least a first electronic component of the one or more electronic components on the substrate,
wherein the space between the shielding component and the substrate is at least partly filled with a fill encapsulation material configured for encapsulating at least the first electronic component;
wherein the shielding component comprises a reservoir configured to collect/accumulate any excess fill encapsulation material from the space between the shielding component and the substrate.
2. The hearing device according to any of the preceding items, wherein the reservoir is configured to be visually inspectable, whereby any excess fill encapsulation material in the reservoir is configured to be visible.
3. The hearing device according to any of the preceding items, wherein the shielding component comprises one or more side parts being substantially perpendicular to the substrate, and wherein the shielding component comprises a top part being substantially parallel to the substrate, and wherein the reservoir is provided on the top part of the shielding component.
4. The hearing device according to any of the preceding items, wherein the shielding component comprises an internal face, where the internal face points towards the substrate thereby defining the space between the shielding component and the substrate, and where the fill encapsulation material is provided through the shielding component to the internal face of the shielding component; and where the shielding component comprises an external face, where the external face points towards the surroundings, and where the reservoir is provided on the external face of the shielding component.
5. The hearing device according to any of the preceding items, wherein the shielding component is made of an electrically conductive material, and wherein the shielding component is an electromagnetically shielding component configured for electromagnetically shield at least the first electronic component.
6. The hearing device according to any of the preceding items, wherein the shielding component is made of a solid metal plate.
7. The hearing device according to any of the preceding items, wherein the shielding component comprises at least one filling hole configured for receiving the fill encapsulation material to fill the space between the shielding component and the substrate.
8. The hearing device according to the preceding items, wherein the at least one filling hole is provided in the reservoir.
9. The hearing device according to any of the preceding items, wherein the shielding component comprises one or more air escape holes configured for allowing air to escape the space between the shielding component and the substrate during and/or after the fill encapsulation material is filled in the space.
10. The hearing device according to any of the preceding items, wherein the shielding component has a first height above the substrate, wherein the first height is configured to match/correspond to a second height being the height of at least the first electronic component on the substrate.
11. The hearing device according to any of the preceding items, wherein the shielding component has a first height above the substrate which varies to match/correspond to different second heights of one or more of the electronic components on the substrate covered by the shielding component.
12. The hearing device according to any of the preceding items, wherein the shielding component comprises an elevation/rise/protrusion configured for guiding the flow of fill encapsulation material in the space between the shielding component and the substrate.
13. The hearing device according to any of the preceding items, wherein the first electronic component is at least a part of a power management circuit of the hearing device, and wherein the electromagnetic interference of the first electronic component is reduced by the shielding component.
14. A method of manufacturing a substrate for a hearing device configured to be worn at or in an ear of a user, the hearing device comprising: [0131] the substrate comprising one or more electronic components mounted on the substrate including a first electronic component, [0132] a shielding component comprising a reservoir;
the method comprises: [0133] providing the substrate comprising the one or more electronic components including the first electronic component; [0134] arranging the shielding component on the substrate to provide a space between the shielding component and the substrate, where the shielding component covers at least the first electronic component of the one or more electronic components on the substrate; [0135] filling the space between the shielding component and the substrate at least partly with a fill encapsulation material configured for encapsulating at least the first electronic component; [0136] collecting/accumulating, in the reservoir of the shielding component, any excess fill encapsulation material from the space between the shielding component and the substrate.

LIST OF REFERENCES

[0137] 2 hearing device [0138] 4 substrate [0139] 6 one or more electronic components [0140] 6′ first electronic component [0141] 8 shielding component [0142] 10 space between the shielding component and the substrate [0143] 12 fill encapsulation material [0144] 14 reservoir [0145] 16 side parts of the shielding component [0146] 18 top part of the shielding component [0147] 20 internal face of the shielding component [0148] 22 external face of the shielding component [0149] 24 filling hole [0150] 26 air escape hole [0151] 28 elevation/rise/protrusion of the shielding component [0152] 100 method of manufacturing a substrate for a hearing device configured to be worn at an ear of a user [0153] 102 method step of providing the substrate comprising the one or more electronic components including the first electronic component [0154] 104 method step of arranging the shielding component on the substrate to provide a space between the shielding component and the substrate, where the shielding component covers at least the first electronic component of the one or more electronic components on the substrate [0155] 106 method step of filling the space between the shielding component and the substrate at least partly with a fill encapsulation material configured for encapsulating at least the first electronic component [0156] 108 method step of collecting/accumulating, in the reservoir of the shielding component, any excess fill encapsulation material from the space between the shielding component and the substrate [0157] 202 microphone [0158] 204 signal processor [0159] 204′ a signal processing chip [0160] 206 receiver/speaker [0161] 208 the wireless communication unit (RF) [0162] 208′ wireless communication chip [0163] 210 power management unit [0164] 210′ power management chip [0165] 212 power source/battery [0166] 214 wireless communication unit (MI) [0167] 214′ wireless communication chip [0168] 216 magnetic induction antenna [0169] 218 RF antenna [0170] 422 microphone [0171] 424 processing unit [0172] 426 receiver [0173] 428 wireless communication unit [0174] 430 antenna structure