Phase-Switched Impedance Modulation Amplifier
20190020313 ยท 2019-01-17
Inventors
Cpc classification
H03F2200/301
ELECTRICITY
H03F2200/387
ELECTRICITY
H03F1/56
ELECTRICITY
H03F2200/391
ELECTRICITY
International classification
H03F1/02
ELECTRICITY
H03F1/56
ELECTRICITY
Abstract
Described is a phase-switched phase-switched, impedance modulation amplifier (PSIM). The PSIM has an input that can be coupled to a source and an output that can be coupled to a load. The PSIM includes one or more phase-switched reactive elements and a controller. The controller provides a control signal to each of the one or more phase-switched reactive elements. In response to one or more control signals provided thereto, each phase-switched reactive element provides a corresponding selected reactance value such that an impedance presented to an input or output port of an RF amplifier may be varied.
Claims
1. A radio frequency (RF) amplifier system having an input port and an output port, the RF amplifier system comprising: an RF amplifier having an input port coupled to the input port of the RF amplifier system and having an output port; and a phase-switched tunable impedance network coupled between the output port of the RF amplifier and an output port of the RF amplifier system, the phase-switched tunable impedance network configured such that in response to input signal provided thereto, the phase-switched tunable impedance network varies an impedance thereof to modulate an impedance presented to the output port of the RF amplifier.
Description
BRIEF DESCRIPTION OF THE DRAWING FIGURES
[0041] Other aspects, features, and advantages of the broad concepts sought to be protected herein will become more fully apparent from the following detailed description, the appended claims, and the accompanying drawings in which like reference numerals identify similar or identical elements. Reference numerals that are introduced in the specification in association with a drawing figure may be repeated in one or more subsequent figures without additional description in the specification in order to provide context for other features.
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DETAILED DESCRIPTION
[0064] Table 1 summarizes a list of acronyms employed throughout this specification as an aid to understanding the described embodiments:
TABLE-US-00001 TABLE 1 CMOS Complementary CR Cognitive Radio Metal-Oxide Semiconductor FET Field Effect Transistor HEMT High-Electron-Mobility Transistor IC Integrated Circuit LUT Look Up Table MEMS Micro-ElectroMechanical PA Power Amplifier Systems PSIM Phase-Switched PS-TMN Phase-Switched Impedance Modulation Tunable impedance Matching Network RF Radio Frequency SDR Software Defined Radio TMN Tunable impedance WPT Wireless Power Transfer Matching Network ZCS Zero Current Switching ZVS Zero Voltage Switching
[0065] Described embodiments are directed toward phase-switched, tunable matching networks (PS-TMNs) and phase-switched, impedance modulation amplifiers (PSIMs). Both the phase-switched, tunable matching networks and the phase-switched, impedance modulation amplifiers include phase-switched variable network reactance elements. When configured in the context of PS-TMNs and phase-switched, impedance modulation amplifiers, such phase-switched variable network reactance elements provide rapid, high bandwidth, continuous impedance matching over a wide impedance range, while operating efficiently at high power levels without requiring high bias voltages or currents. PS-TMNs might be employed alone, or might also be employed in combination with other matching techniques such as discrete switched reactance banks.
[0066] PS-TMNs might be employed in a variety of reconfigurable and adaptive RF systems, for example, RF front ends for software-defined radio (SDR) and cognitive radio (CR) applications that operate over a wide range of frequency bands, at different bandwidths, and in accordance with a variety of communication standards. PS-TMNs might also be employed in other RF applications, such as drivers for RF plasma loads to compensate for rapid load variations, or in wireless power transfer (WPT) systems to compensate for impedance mismatches between the transmitter and receiver to maximize transferred power and/or efficiency.
[0067] The PSIMs may be operable as zero voltage switching (ZVS) radio frequency (RF) amplifiers. Such PSIM amplifiers might employ a PS-TMN to operate over a large frequency range by efficiently modulating output power over a wide frequency range and/or matching into highly variable loads (e.g., loads that are variable over a wide impedance range).
[0068] Referring to
[0069] In some embodiments, control circuit 106 controls operation of PS-TMN 112 based, at least partially, upon information received from an optional feedforward circuit 104 coupled to source 102 and/or an optional feedback circuit 110 coupled to load 114. In some embodiments, optional feedforward circuit 104 includes adaptive predistortion circuit 107 and control circuit 106 includes look up table (LUT) 108. For example, as will be described in greater detail below, some embodiments might employ one or more non-linear control techniques (e.g., by control circuit 106) to determine appropriate control signals for PS-TMN 112, such as employing fixed or adaptable look-up tables (e.g., LUT 108) to store predetermined control signal information, feedback (e.g., by feedback circuit 110) and/or feedforward compensation (e.g., by feedforward circuit 104) to adaptively adjust control signal information, or performing digital predistortion of the control signals (e.g., by predistortion circuit 107), or other similar techniques.
[0070] PS-TMN 112 includes one or more phase-switched reactance elements 116(1)-116(N). As will be described in greater detail below, phase-switched reactance elements 116(1)-116(N) might be implemented using one or more capacitive elements (e.g., capacitors), one or more inductive elements (e.g., inductors), or a combination of both. Phase-switched reactance elements 116(1)-116(N) can be controlled to adjust the effective impedance (Z.sub.S,IN and Z.sub.L,IN) presented to the terminals of PS-TMN 112 at a desired frequency. The phase-switched reactance elements 116(1)-116(N) are switched, for example by either a shunt or a series switch, and the effective impedance of the phase-switched reactance elements is controlled by adjusting the phase and/or duty-cycle of the shunt or series switch. In some embodiments, the desired frequency might be the RF frequency of operation of RF source 102 (e.g., the frequency of the signal provided from RF source 102 to PS-TMN 112).
[0071] By modulating the effective impedance at a desired frequency of operation of RF system 100 (e.g., by adjusting the impedance of phase-switched reactive elements 116(1)-116(N)), it is possible to adjust, tune, change or otherwise manipulate the impedance presented by PS-TMN 112 to source 102 and/or load 114. For example, phase-switched reactance elements 116(1)-116(N) allow PS-TMN 112 to present a desired impedance (Z.sub.S,IN) to PS-TMN 112 from source 102 and a desired impedance (Z.sub.L,IN) into PS-TMN 112 from load 114.
[0072] The control signals provided to PS-TMN 112 operate to control the timing of turning on and/or off the switches of phase-switched reactance elements 116(1)-116(N) with respect to the RF signal provided from source 102. The switching provides the effective reactance values of phase-switched reactance elements 116(1)-116(N) that effect the desired impedance transformation of PS-TMN 112. Feedforward information might include information about the effective input impedance of PS-TMN 112, the timing of RF waveforms, specified signal levels and/or impedance levels, etc. Feedback information might include measured information about the effective load impedance and/or power reflected from the load, the timing of RF waveforms, etc.
[0073] Thus, in some embodiments, PS-TMN 112 might be employed to provide a desired impedance transformation between source 102 and load 114. For example, PS-TMN 112 might provide an impedance match between source 102 and load 114. Alternatively, the impedance of PS-TMN 112 might be adjusted to compensate for variations in the impedance (Z.sub.L) of load 114 such that source 102 is coupled to a more stable impedance (e.g., Z.sub.S,IN) provided by PS-TMN 112.
[0074] Referring to
[0075] If switch 206 is always off (open), then the effective capacitance, C.sub.EFF, of phase-switched variable capacitance 200 presented to source 202 is equivalent to the physical capacitance, C.sub.0, of capacitor 204. Alternatively, if switch 206 is always on (closed), then the low impedance path between the terminals of switch 206 effectively shorts capacitor 204, and phase-switched variable capacitance 200 behaves as an infinite capacitor in the sense that the voltage across capacitor 204 remains zero irrelevant of current I. The effective capacitance, C.sub.EFF, of capacitor 204 can theoretically be controlled between C.sub.0 and infinity by controlling the conduction angle of switch 206 over an AC cycle of sinusoidal current source 202 from 0 to 2. As used herein, a conduction angle is the angle of the sinusoidal signal at which switch 206 is turned on. The conduction angle with which the switch is turned on may be entirely determined by a switching signal Q (e.g., the switching angle) or partly determined by switching signal Q and partly by circuit waveforms such as voltage V.sub.C and current I.
[0076] Referring to
[0077] If the switch includes a diode that naturally prevents the voltage from going negative, the timing of actively turning switch Q on may be relaxed, since it will naturally commutate ON when the switch voltage reaches zero and the active turn-on signal can be issued while the diode conducts. The capacitor C.sub.0 across the switch provides snubbing of the turn off transition, providing zero-voltage-switching (ZVS) turn off of switch 206.
[0078] As shown in
[0079] Adjusting a sets where in the cycle switch 206 turns on and off (e.g., controls the conduction angle of switch 206) and hence controls the voltage at which the capacitor peaks. Thus, there is a relationship between the switching angle (a) and the magnitude of the fundamental component of V.sub.C() at the switching frequency. Consequently, the effective capacitance, C.sub.EFF, of capacitor 204 can be represented as a function of a:
[0080] Referring to
[0081] Similarly to the switched-capacitor implementation of a phase-switched variable reactance described in regard to
[0082] Referring to
[0083] In particular, curve 502 shows I.sub.L(), curve 506 shows V() and curve 504 shows Q() for a half-wave switched inductor. As shown in
[0084] Adjusting a sets where in the cycle switch 406 turns on and off (e.g., controls the conduction angle of switch 406) and hence controls the current at which the inductor peaks. Thus, similarly to the switched-capacitor implementation of a phase-switched variable reactance described in regard to
[0085] As a result of topological duality, expression (1b) for the effective inductance is the same as that of expression (1a) for the effective capacitance. Expression (1a) is consistent with the intuitive expectation for infinite effective capacitance when the switch is always in the on state (=) and predicts the equivalence between C.sub.EFF and C.sub.0 when the switch is permanently off (=0). Expression (1b) is similarly consistent with the intuitive expectation for infinite effective inductance when the switch is always in the off state (=0) and predicts the equivalence between L.sub.EFF and L.sub.0 when the switch is permanently on (=). Thus, in accordance with expressions (1a) and (1b), the effective capacitance C.sub.EFF or the effective inductance L.sub.EFF at the switching frequency can be modulated by controlling the conduction angle of the switch associated with the capacitor or inductor.
[0086] Referring to
[0087] As shown in
[0088] Referring to
[0089] Note that
[0090] As described in regard to
[0091] In particular, as shown in
[0092] As with half-wave switching (e.g., as shown in
Similarly, the effective inductance, L.sub.EFF, of inductor 404 can be represented as a function of a:
[0093] Thus, the effective capacitance/inductance that can be achieved for a given switching angle, a, with full-wave switched networks (e.g., relationships (2a) and (2b)) is half the effective capacitance/inductance that can be achieved with half-waved switched networks (e.g., relationships (1a) and (1b)). However, full-wave switched networks inherently result in reduced harmonic content of the capacitor voltage and inductor current compared to half-wave switched networks for the same switching angle, (i.e the switching angle which controls the total switch conduction angle). On the other hand, implementing full-wave switching requires the switch has to operate at twice the operating frequency (e.g., to switch twice per cycle). Further, for capacitive modulation, bidirectional blocking switches are required, which can complicate switch implementation with typical semiconductor switches.
[0094] Relationships (1) and (2) above show that the effective capacitance and inductance for the switched networks shown in
[0095] Phase-switched variable capacitance 200 and phase-switched variable inductance 400 can be employed as building blocks for implementing phase-switched variable reactances and other adjustable circuits such as TMNs. Particularly, some applications could benefit substantially from variable reactances whose value can be controlled over a range spanning both capacitive and inductive reactances, and/or by modulating the effective reactance over a more limited range. Augmenting phase-switched variable capacitance 200 and/or phase-switched variable inductance 400 with additional reactive components can provide a wider range of variable reactances.
[0096]
[0097] For example,
[0098] As would be understood by one of skill in the art, circuit variants other than the ones illustrated in
[0099] As described in regard to
[0100] Referring to
[0101] Referring to
[0102] Digitally controlled capacitor network 1102 includes a plurality of capacitors and associated switches, shown as capacitors 1104, 1108, and 1112, and switches 1106, 1110, and 1114. In some embodiments, each of capacitors 1104, 1108, and 1112 have a unique capacitance value, allowing the capacitance value of digitally controlled capacitor network 1102 to be varied across a large capacitance range. For example, as shown in
[0103] Switches 1106, 1110, and 1114 are coupled in series with corresponding ones of capacitors 1104, 1108, and 1112 and are operable to adjust the capacitance of digitally controlled capacitor network 1102 by connecting (or disconnecting) the respective capacitors. Switches 1106, 1110, and 1114 might operate based upon one or more control signals from control circuit 106. As described, switches 1106, 1110, and 1114 generally operate at a frequency less than the RF frequency to adjust the capacitance value of digitally controlled capacitor network 1102.
[0104] Referring to
[0105] Digitally controlled inductor network 1202 includes a plurality of inductors and associated switches, shown as inductors 1206, 1210, and 1214, and switches 1204, 1208, and 1212. In some embodiments, each of inductors 1206, 1210, and 1214 have a unique inductance value, allowing the inductance value of digitally controlled inductor network 1202 to be varied across a large inductance range. For example, as shown in
[0106] Switches 1204, 1208, and 1212 are coupled in parallel with corresponding ones of inductors 1206, 1210, and 1214 and are operable to adjust the inductance of digitally controlled inductor network 1202 by connecting (or shorting, e.g., providing a low-impedance path to bypass the inductor) the respective inductors. Switches 1204, 1208, and 1212 might operate based upon one or more control signals from control circuit 106. As described, switches 1204, 1208, and 1212 generally operate at a frequency less than the RF frequency to adjust the capacitance value of digitally controlled inductor network 1202.
[0107] Digitally controlled capacitor network 1102 and digitally controlled inductor network 1202 expand the range over which the reactance of the phase-switched reactance (e.g., capacitor C.sub.0 1116 and parallel switch 1118, or inductor L.sub.0 1216 and series switch 1218) can be continuously varied without introducing excessive harmonic content to source 102 and/or load 114. For example, the embodiments shown in
[0108] For example, the effective capacitance C.sub.EFF at the switching frequency of hybrid switched capacitor network 1100 can be controlled between a lower capacitance vale C.sub.0 and an upper capacitance value by half-wave switching the RF switch with the switching angle, a, varying from 0 to approximately /2 as shown in
[0109] In various embodiments, the RF switch of TMN 112 (e.g., switch 206 or switch 406) can be implemented as one of or a combination of various types of switching elements, for example based upon the RF frequency or other operating parameters of RF system 100. For example, lateral or vertical FETs, HEMTs, thyristors, diodes, or other similar circuit elements might be employed.
[0110] Phase-switched variable capacitance 200 and phase-switched variable inductance 400 can be employed as circuit elements within more complex phase-switched tunable matching networks (PS-TMNs), for example a Pi-network topology PS-TMN (Pi-TMN), although other network topologies are possible, such as L-networks, T-networks, or other similar networks.
Z.sub.S=(R.sub.S.sup.1+jB.sub.S).sup.1(3)
Z.sub.L=(R.sub.L.sup.1+jB.sub.L).sup.1(4).
Thus, it can be shown that the susceptances B.sub.1 and B.sub.2 required to match the load impedance Z.sub.L to the source impedance Z.sub.S are given by:
Thus, Pi-TMN 1302 can be employed to match load impedance Z.sub.L to source impedance Z.sub.S by adjusting the values of variable shunt capacitive susceptances B.sub.1 1310 and B.sub.2 1314.
[0111] As shown in
[0112] Referring to
[0113]
[0114] In an illustrative embodiment, phase-switched Pi-TMN circuit 1502 operates at 27.12 MHz and is capable of matching a 50 source impedance to a load impedance that varies over approximately a 10:1 resistance range and a 5:1 reactance range (both capacitively and inductively), by properly adjusting the switching angles (.sub.1 and .sub.2) of the switches and the phase shift between them (e.g., by adjusting switching control signals q1 and q2).
[0115] Implementing variable capacitive susceptances B.sub.1 and B.sub.2 as half-wave FET-switched capacitor networks provides zero-voltage-switched (ZVS) operation of the switches, and allows each variable reactance to be implemented with a single, ground-referenced switch (e.g., FET 1512 for variable capacitive susceptance B.sub.1 and FET 1522 for variable capacitive susceptance B.sub.2). ZVS operation is desired in switched systems as it reduces switching power loss and improves the overall system efficiency. Furthermore, the output (drain-to-source) capacitance of FETs 1512 and 1522 are in parallel with phase-switched capacitors C.sub.P1 and C.sub.P2 and, thus can be added to the shunt capacitances and utilized as part of the TMN.
[0116] In illustrative Pi-TMN circuit 1502, inductive reactance X 1312 shown in
[0117] In the embodiment shown in
[0118] The quality factor, Q, of the series-resonant circuit of L.sub.S2 1516 and C.sub.S2 1518 controls the interaction between phase-switched capacitor C.sub.P1 1520 and phase-switched capacitor C.sub.P2 1514. For example, increasing the quality factor Q (e.g., by increasing the values of L.sub.S2 1516 and C.sub.S2 1518) reduces the interaction between phase-switched capacitor C.sub.P1 1520 and phase-switched capacitor C.sub.P2 1514, although increasing the quality factor Q also reduces the effective bandwidth of the network.
[0119] For example, for phase-switched Pi-TMN circuit 1502 to achieve the matching range shown in
[0120] Switching of FETs 1512 and 1522 is synchronized to their drain current based upon the switching angle , which is based upon the desired effective capacitance of capacitors C.sub.P1 and C.sub.P2. As described above for half-wave phase-switched capacitors, FETs 1512 and 1522 are turned off after their drain current crosses from negative to positive, and then turned on again once their respective drain voltages ring down to zero. The appropriate value of a for each of FETs 1512 and 1522 can be calculated by determining the required B.sub.1 and B.sub.2 susceptances for a desired load impedance Z.sub.L as given by relationships (5) and (6). Once each capacitive susceptance B.sub.1 and B.sub.2 is known, that value can be plugged in as C.sub.EFF (C.sub.0 is a known value as the physical capacitance of the capacitor) in relationship (1a) (for a half-wave phase-switched capacitor) or relationship (2a) (for a full-wave phase-switched capacitor) to determine values of a that correspond to the desired susceptance values.
[0121] As described, for phase-switched networks having non-purely sinusoidal current excitation, relationships (1) and (2) might not result in an exact value of a to achieve the desired susceptance. Further, nonlinearity of the drain-to-source switch capacitances and the mutual interaction of the two switched networks (e.g., capacitive susceptances B.sub.1 and B.sub.2) might also result in inaccurate calculation of a. Thus, some embodiments employ non-linear control techniques (e.g., by control circuit 106) to determine the appropriate values of a, such as fixed or adaptable look-up tables (e.g., LUT 108), feedback (e.g., by feedback circuit 110), feedforward compensation (e.g., by feedforward circuit 104), digital predistortion of the switching angles (e.g., by predistortion circuit 107), or other similar techniques.
[0122] To set the correct value of switching control parameter a for each of FETs 1512 and 1522 for Pi-TMN circuit 1502 to achieve a given impedance, LUT 108 might store predetermined switching angles (e.g., .sub.1 and .sub.2) corresponding to various load impedances. For example, table 2 shows an illustrative list of possible load impedances that Pi-TMN circuit 1502 can match to a 50 source and the corresponding values of switching angles .sub.1 and .sub.2 for the switch control signals q1 and q2:
TABLE-US-00002 TABLE 2 Load Impedance Z.sub.L .sub.1 .sub.2 () (degrees) (degrees) 48.8 + 10.90j 0.0 0.0 103 + 8.12j 78.1 95.7 165 0.923j 87.9 91.8 282 + 3.20j 97.6 85.9 524 19.30j 107.0 79.1 1000 + 15.90j 117.0 72.2
[0123] Table 2 shows that it is possible for Pi-TMN circuit 1502 to match a 50 source impedance to a load impedance that varies resistively over at least a factor of 10:1. Based upon the switching angles (.sub.1 and .sub.2) listed table 2 and the plot of effective reactance (e.g., C.sub.EFF/C.sub.0 or L.sub.EFF/L.sub.0) versus shown in
[0124] Other types of systems can also employ the phase-switched networks described herein. For example, a wide range of systems can benefit from an RF power amplifiers (PA) that deliver power at a particular frequency or over a particular band of frequencies. Such PAs might beneficially control output power over a wide range and maintain high efficiency across its operating range. Conventional linear amplifiers (e.g., class A, B, AB, etc.) offer the benefits of wide-range dynamic output power control and high fidelity amplification, but have limited peak efficiency that degrades rapidly with power back-off. On the other hand, switching PAs (e.g., inverters such as class D, E, F, , etc.), offer high peak efficiency, but only generate constant envelope signals (at a constant supply voltage) while remaining in switched mode.
[0125] One technique for output power control in a switching PA is through load modulation, where the load of the PA is modulated by an external network. In described embodiments, the load of the PA is modulated by a phase-switched tunable matching network (TMN) (e.g., a network including one or more phase-switched variable capacitances 200 or phase-switched variable inductances 400, such as Pi-TMN circuit 1502). For example, an impedance transformation of a phase-switched TMN might control the output power of a PA.
[0126] Referring to
[0127] In various embodiments, PA 1602 is (1) a switching inverter, (2) an amplitude-modulated linear PA, or (3) a combination of these (e.g., depending on desired output). For example,
[0128] As described, modulating the effective loading impedance Z.sub.TMN seen by the PA looking into the phase-switched TMN (e.g., TMN 1604 or 1710) controls the output power over the operating power range of the PSIM amplifier (e.g., amplifiers 1602 and 1702). Additionally, the operating power range of the PSIM amplifier can be further extended by also employing amplitude modulation of the PA drive signal for large output power back off.
[0129] Some embodiments might also employ other power modulation techniques such as discrete or continuous drain modulation of the power amplifier. Drain modulation of the PA modulates (e.g., switches) a bias voltage applied to a bias terminal of the PA. For example, one drain modulation technique might switching the bias voltage among multiple discrete voltage levels or continuously adjusting the bias voltage across a voltage range.
[0130] In addition to performing impedance modulation and output power control of the RF PA, a phase-switched TMN (e.g., TMN 1604 or 1710) can also compensate for variation in the load impedance Z.sub.L. For example, the phase-switched TMN can be continuously tuned to match a variable load impedance to a desired RF inverter loading impedance, Z.sub.TMN, for a given output power level, by employing the phase-switched TMN to compensate for variations in the amplifier's loading network impedance as the operating frequency changes and, thus, maintain ZVS operation. Thus, a PSIM amplifier (e.g., PSIM amplifiers 1600 and 1700) dynamically controls the output power it delivers to a widely varying load impedance, such as an RF plasma load, across a large frequency range.
[0131] Therefore, a PSIM amplifier (e.g., PSIM amplifiers 1600 and 1700) allows (1) efficient dynamic control of output power over a wide power range; (2) the ability to impedance match and deliver power into a wide-ranging load, and (3) fully zero-voltage-switching (ZVS) operation across a frequency range for frequency-agile operation.
[0132] Although the block diagrams of PSIM amplifiers 1600 and 1700 shown in
[0133] In most embodiments a PSIM amplifier can be a zero-voltage switching (ZVS) amplifier with the switching transistors operating substantially in switched-mode and turning on and off under zero-voltage switching, enabling high efficiency to be achieved. In other implementations, a PSIM amplifier might provide switched-mode operation (e.g., saturated operation) over some of its operating range (e.g., while delivering high output power) and utilize linear-mode operation over other portions of its range.
[0134] For example,
[0135]
[0136]
[0137]
[0138]
[0139] As shown in
[0140] Referring to
[0141] Referring to
[0142]
[0143] PSIM amplifier 2100 includes RF PA (inverter) 2102, Pi-TMN 2104, branch filter 2106, and load impedance Z.sub.L. RF PA 2102 includes FET switch 2108, inductor L.sub.F and an output network formed by capacitors C.sub.F and C.sub.S1 and inductor L.sub.S1. In the embodiment shown in
[0144] RF PA 2102 maintains zero-voltage-switching (ZVS) and high efficiency at different output power levels when Pi-TMN 2104 maintains the inverter load impedance Z.sub.TMN as an approximately resistive load at the frequency of operation of RF PA 2102. RF PA 2102 generates peak RF power when Z.sub.TMN is 50 (e.g., matches load impedance Z.sub.L). Dynamic control of power back off of RF PA 2102 can be achieved by Pi-TMN 2104 modulating Z.sub.TMN.
[0145] For operation over a 20.86 MHz to 27.12 MHz frequency range, the illustrative embodiment of PSIM amplifier 2100 shown in
[0146] The series reactive network branch formed by capacitor C.sub.S2 and inductor L.sub.S2 has a 50 inductive impedance at a frequency of 20.86 MHz and also DC isolates the two switched networks (e.g., capacitor C.sub.P2 and FET 2110 and capacitor C.sub.P1 and FET 2112). The impedance of capacitor C.sub.S2 and inductor L.sub.S2 sets the resistive range over which Z.sub.TMN of Pi-TMN 2104 can be modulated. The series resonant network formed by capacitor C.sub.S3 and inductor L.sub.S3 provides additional filtering of the load current I.sub.L and prevents DC currents and high-frequency harmonic content being coupled to the load Z.sub.L. Pi-TMN 2104 can modulate the impedance, Z.sub.TMN, presented to RF PA 2102 by appropriately driving FET switches 2110 and 2112, for example by adjusting the conduction angles of the FETs. By modulating the impedance Z.sub.TMN presented to RF PA 2102, Pi-TMN 2014 can control the output power that is delivered from RF PA 2102 to load Z.sub.L.
[0147]
[0148] To set the correct value of switching angle, .sub.1, of FET 2112 and switching angle, .sub.2, of FET 2110 for Pi-TMN 2104 to achieve a given impedance, LUT 108 might store predetermined switching angles (e.g., .sub.1 and .sub.2) corresponding to various impedances. For example, table 3 shows an illustrative list of possible impedances Z.sub.TMN that can be matched to a 50 load impedance Z.sub.L and the corresponding switching angles (e.g., .sub.1 and .sub.2). The values of table 3 might be determined based upon simulation of PSIM amplifier 2100, where FETs 2110 and 2112 are modeled having an on-state resistance of 10 m and a body diode having a 0.4V forward voltage drop. The output power listed in table 3 includes power delivered at the fundamental and higher frequencies when the PSIM amplifier is supplied with a 48 VDC power supply.
TABLE-US-00003 TABLE 3 Switching TMN Impedance Frequency .sub.1 .sub.2 Z.sub.TMN Output Power (MHz) (degrees) (degrees) () (W) 27.12 82.1 48.6 55.5 + 6.06j 19.8 27.12 64.4 68.3 125 1.60j 12.3 27.12 61.3 66.4 500 1.14j 3.5 20.86 0.10 0.10 48.9 1.20j 58.6 20.86 146 87.7 498 5.90j 5.4
[0149] As described, PSIM amplifier 2100 maintains zero-voltage-switching of all FET switches across a wide range of output power, loading impedance, and frequency of operation. For example, for illustrative PSIM amplifier 2100 to deliver an output power of 58.6 W to 50 load Z.sub.L at 20.86 MHz with a power supply voltage of 48 VDC, TMN 2102 is required to provide nearly a 1:1 impedance match (e.g., Z.sub.L=Z.sub.TMN=50). Under this operating condition, the required effective shunt capacitance at nodes N.sub.1 and N.sub.2 is equivalent to the C.sub.P1 and C.sub.P2 capacitances, respectively, and hence FET switches 2110 and 2112 are off during the entire cycle and the drain voltage waveforms of FET switches 2110 and 2112 would be sinusoidal.
[0150] As another example, for illustrative PSIM amplifier 2100 to deliver an output power of 3.50 W to 50 load Z.sub.L at 27.12 MHz with a power supply voltage of 48 VDC, TMN 2102 is required to provide an impedance Z.sub.TMN of approximately 500 (as shown in table 3). Under this operating condition, the required effective shunt capacitance at nodes N.sub.1 and N.sub.2 is higher than the C.sub.P1 and C.sub.P2 capacitances, respectively, and hence FET switches 2110 and 2112 are turned on for a certain portion of the cycle while maintaining ZVS. Despite high frequency harmonic content of the drain voltage waveforms of FET switches 2110 and 2112, the load current I.sub.L flowing through load Z.sub.L should remain nearly sinusoidal. Thus, PSIM amplifier 2100 is capable of providing dynamic output power control while matching into a variable load across a range of switching frequencies.
[0151] Therefore, as described herein, various embodiments provide tunable matching networks based upon phase-switched variable network reactance elements, referred to herein as phase-switched tunable matching networks (PS-TMNs). Such PS-TMNs provide rapid, high bandwidth, continuous impedance matching over a wide impedance range, while operating efficiently at high power levels without requiring high bias voltages or currents. Such PS-TMNs might be employed alone, or might also be employed in combination with other matching techniques such as discrete switched reactance banks. Described embodiments also provide zero voltage switching (ZVS) radio frequency (RF) amplifiers, referred to herein as phase-switched impedance modulation (PSIM) amplifiers. Such PSIM amplifiers might employ a PS-TMN to operate over a large frequency range by efficiently modulating output power over a wide frequency range and matching into highly variable loads (e.g., match to a wide impedance range).
[0152] Reference herein to one embodiment or an embodiment means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the claimed subject matter. The appearances of the phrase in one embodiment in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments necessarily mutually exclusive of other embodiments. The same applies to the term implementation.
[0153] As used in this application, the words exemplary and illustrative are used herein to mean serving as an example, instance, or illustration. Any aspect or design described herein as exemplary or illustrative is not necessarily to be construed as preferred or advantageous over other aspects or designs. Rather, use of the words exemplary and illustrative is intended to present concepts in a concrete fashion.
[0154] Additionally, the term or is intended to mean an inclusive or rather than an exclusive or. That is, unless specified otherwise, or clear from context, X employs A or B is intended to mean any of the natural inclusive permutations. That is, if X employs A; X employs B; or X employs both A and B, then X employs A or B is satisfied under any of the foregoing instances. In addition, the articles a and an as used in this application and the appended claims should generally be construed to mean one or more unless specified otherwise or clear from context to be directed to a singular form.
[0155] To the extent directional terms are used in the specification and claims (e.g., upper, lower, parallel, perpendicular, etc.), these terms are merely intended to assist in describing the embodiments and are not intended to limit the claims in any way. Such terms, do not require exactness (e.g., exact perpendicularity or exact parallelism, etc.), but instead it is intended that normal tolerances and ranges apply. Similarly, unless explicitly stated otherwise, each numerical value and range should be interpreted as being approximate as if the word about, substantially or approximately preceded the value of the value or range.
[0156] Some embodiments might be implemented in the form of methods and apparatuses for practicing those methods. Further, as would be apparent to one skilled in the art, various functions of circuit elements might also be implemented as processing blocks in a software program. Described embodiments might also be implemented in the form of program code embodied in tangible media, such as magnetic recording media, hard drives, floppy diskettes, magnetic tape media, optical recording media, compact discs (CDs), digital versatile discs (DVDs), solid state memory, hybrid magnetic and solid state memory, or any other machine-readable storage medium, wherein, when the program code is loaded into and executed by a machine, such as a computer, the machine becomes an apparatus for practicing the claimed invention. Described embodiments might also be implemented in the form of program code, for example, whether stored in a storage medium, loaded into and/or executed by a machine, or transmitted over some transmission medium or carrier, such as over electrical wiring or cabling, through fiber optics, or via electromagnetic radiation, wherein, when the program code is loaded into and executed by a machine, such as a computer, the machine becomes an apparatus for practicing the claimed invention. When implemented on a processing device, the program code segments combine with the processor to provide a unique device that operates analogously to specific logic circuits. Such processing devices might include, for example, a general purpose microprocessor, a digital signal processor (DSP), a reduced instruction set computer (RISC), a complex instruction set computer (CISC), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA), a programmable logic array (PLA), a microcontroller, an embedded controller, a multi-core processor, and/or others, including combinations of the above. Described embodiments might also be implemented in the form of a bitstream or other sequence of signal values electrically or optically transmitted through a medium, stored magnetic-field variations in a magnetic recording medium, etc., generated using a method and/or an apparatus as recited in the claims.
[0157] Also for purposes of this description, the terms couple, coupling, coupled, connect, connecting, or connected refer to any manner known in the art or later developed in which energy is allowed to be transferred between two or more elements, and the interposition of one or more additional elements is contemplated, although not required. Conversely, the terms directly coupled, directly connected, etc., imply the absence of such additional elements. Signals and corresponding nodes or ports may be referred to by the same name and are interchangeable for purposes here.
[0158] It should be understood that the steps of the methods set forth herein are not necessarily required to be performed in the order described, and the order of the steps of such methods should be understood to be merely illustrative. Likewise, additional steps may be included in such methods, and certain steps may be omitted or combined, in methods consistent with various embodiments.
[0159] It will be further understood that various changes in the details, materials, and arrangements of the parts that have been described and illustrated herein might be made by those skilled in the art without departing from the scope of the following claims.