METHOD OF DIGITALLY GRADING LEATHER BREAK
20190017128 ยท 2019-01-17
Inventors
Cpc classification
International classification
C14B17/00
CHEMISTRY; METALLURGY
Abstract
A method and apparatus for grading leather based upon the size and spacing of the breaks in the leather. All or a portion of a hide is fed to a fixture that compresses a local area of the hide into a concave shape. The outer side of the hide is compressed and the inner side of the hide is expanded to cause breaks to be manifested in a local area. The local area of the hide is scanned with a digitizing profilometer that measures the depth of the breaks as the hide is fed through the fixture. The depth data measured by the digitizing profilometer is recorded by a controller. The depth data is then correlated with location data representing the local area scanned to develop a map of the break.
Claims
1. A method of grading leather comprising: fixturing all or a portion of a hide in a fixture that compresses a local area of the hide into a concave shape with a grain side of the hide being compressed and a flesh side of the hide being expanded to cause a break to be manifested; scanning the local area of the hide with a digitizing profilometer that measures depth and width of the break as the hide is fed through the fixture; recording depth and width data as measured by the digitizing profilometer; and correlating the depth data with hide position data representing the local area scanned to develop a map of the break.
2. The method of claim 1 analyzing the map by measuring a size of spaces between the break and converting the size of the spaces to digital data.
3. The method of claim 2 wherein the step of converting the size of spaces between the break is performed by applying a Fourier transform of the depth data and location data.
4. The method of claim 1 wherein the depth data is analyzed to identify peaks and valleys in the local area, and wherein a distance between either the peaks or the valleys is used to grade breaks in the local area.
5. The method of claim 4 wherein the distance between the break is converted into wave form data and separated into distinct wave forms that are digitized to grade the local areas of the hide.
6. The method of claim 5 wherein the wave form data is correlated to location data to develop at least a partial map of the break of the hide.
7. The method of claim 1 wherein the step of fixturing the portion of the hide includes feeding the hide through the fixture.
8. A machine for measuring a hide for break comprising: a shaping fixture for conforming a local area of the hide to form a grain surface of the hide into a concave shape and a flesh surface of the hide into a convex shape; a digitizing profilometer measures a depth of a break as the hide is fed through the fixture and develops depth data; and a controller that records break data and correlates the break data with position data representing the local area scanned to develop a map of the depth data of the break.
9. The machine of claim 8 wherein the controller analyzing a size of spaces between the break and converts the size of the spaces to digital data.
10. The machine of claim 9 wherein the controller converts the size of spaces by applying a Fourier transform of the depth data and location data.
11. The machine of claim 8 wherein the controller analyzes the depth data to identify peaks and valleys in the local area, and wherein a distance between either the peaks or the valleys is used to determine a distance between the break, wherein a grade is assigned based upon the distance between break in the local areas of the hide.
12. The machine of claim 11 wherein the controller analyzes the distance between break by converting the data into wave form data and separating the wave form data into distinct wave forms that are digitized to grade the local areas of the hide.
13. The machine of claim 12 wherein the controller analyzes the wave form data and correlates the wave form data to location data to develop a break map for the hide.
14. The machine of claim 8 wherein the digitizing profilometer is a laser surface profile scanner.
15. The machine of claim 8 wherein the digitizing profilometer is a capacitance sensor.
16. The machine of claim 8 wherein the digitizing profilometer is a fiber optic sensor.
17. The machine of claim 8 wherein the digitizing profilometer is an acoustic echo profiler.
18. The machine of claim 8 further comprising: a feed system, wherein the shaping fixture has a transparent semi-cylindrical guide and the feed system includes a set of feed rollers that feed the hide around the semi-cylindrical guide that forms the hide surface into the concave shape and a set of pinch rollers that pull the hide away from the semi-cylindrical guide, and wherein the digitizing profilometer scans the hide surface on the semi-cylindrical guide as the digitizing profilometer moves parallel to a cylindrical axis of the semi-cylindrical guide.
19. The machine of claim 8 further comprising: a feed system, wherein the shaping fixture has a transparent roller guide and the feed system includes at least one feed roller that feeds the hide around the roller guide that forms the hide surface into the concave shape and at least one extractor roller that pulls the hide away from the roller guide, and wherein the digitizing profilometer scans the grain surface as the hide is fed around the roller guide and as the digitizing profilometer moves parallel to a cylindrical axis of the roller guide.
20. The machine of claim 8 further comprising: a feed system, including a set of feed rollers and a set of pinch rollers that form the hide surface into the concave shape, and wherein the digitizing profilometer scans the hide surface as the digitizing profilometer moves parallel to an axis of the concave shape.
21. The machine of claim 8 further comprising: a feed system, wherein the shaping fixture has a concave semi-cylindrical groove and the feed system includes a set of feed rollers that feed the hide into the semi-cylindrical groove and pinch rollers that pull the hide away from the semi-cylindrical groove, wherein the semi-cylindrical groove defines a plurality of vacuum ports that are operatively connected to a source of vacuum that draws the hide surface into the concave shape, and wherein the digitizing profilometer scans the hide surface as the digitizing profilometer moves parallel to a cylindrical axis of the semi-cylindrical groove.
Description
BRIEF DESCRIPTION OF THE DRAWINGS
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DETAILED DESCRIPTION
[0030] The illustrated embodiments are disclosed with reference to the drawings. However, it is to be understood that the disclosed embodiments are intended to be merely examples that may be embodied in various and alternative forms. The figures are not necessarily to scale and some features may be exaggerated or minimized to show details of particular components. The specific structural and functional details disclosed are not to be interpreted as limiting, but as a representative basis for teaching one skilled in the art how to practice the disclosed concepts.
[0031] Referring to
[0032] In the embodiment shown in
[0033] A controller 34 receives digital data from a laser surface profiler 36 that can be processed in real time or stored for later analysis. The laser surface profiler 36 shown in
[0034] Referring to
[0035] Referring to
[0036] Referring to
[0037] Referring to
[0038] Referring to
[0039] Referring to
[0040] Referring to
[0041] Pieces, or blanks, are cut from the hide with dies 58 having knife edges (not shown) that are placed on the grain surface of the hide 12. The hide 12 with the dies 58 in position are then placed in a press that exerts pressure on the dies 58 to cut pieces in the desired shape from the hide 12.
[0042] Referring to
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[0044] The embodiments described above are specific examples that do not describe all possible forms of the disclosure. The features of the illustrated embodiments may be combined to form further embodiments of the disclosed concepts. The words used in the specification are words of description rather than limitation. The scope of the following claims is broader than the specifically disclosed embodiments and also includes modifications of the illustrated embodiments.