FE-NI-P ALLOY MULTI-LAYER STEEL SHEET AND MANUFACTURING METHOD THEREFOR

20190010623 ยท 2019-01-10

    Inventors

    Cpc classification

    International classification

    Abstract

    The present disclosure relates to an FeNiP alloy multilayered steel sheet and a method of manufacturing the same.

    Provided is an FeNiP alloy multilayered steel sheet including: an FeNi alloy layer including 30 wt % to 85 wt % of Ni, a remainder Fe, and other inevitable impurities, with respect to 100 wt % as a whole; and an FeP alloy layer including 6 wt % to 12 wt % of P, a remainder Fe, and other inevitable impurities, with respect to 100 wt % as a whole, in which the FeNi alloy layer and the FeP alloy layer are alternately laminated on each other several times.

    Claims

    1. An FeNiP alloy multilayered steel sheet comprising: an FeNi alloy layer including 30 wt % to 85 wt % of Ni, a remainder Fe, and other inevitable impurities, with respect to 100 wt % as a whole; and an FeP alloy layer including 6 wt % to 12 wt % of P, a remainder Fe, and other inevitable impurities, with respect to 100 wt % as a whole, wherein the FeNi alloy layer and the FeP alloy layer are alternately laminated on each other several times.

    2. The FeNiP alloy multilayered steel sheet of claim 1, wherein the FeP alloy layer has an amorphous base structure, and includes, with respect to the total volume 100% of microstructures of the alloy layer, less than 5% of an Fe.sub.2P phase, an Fe.sub.3P phase, or a combination thereof.

    3. The FeNiP alloy multilayered steel sheet of claim 2, wherein the FeP alloy layer includes less than 50% of crystal grains having a grain size of 10 nm or less, with respect to the total volume 100% of microstructures of the FeP alloy layer.

    4. The FeNiP alloy multilayered steel sheet of claim 3, wherein the FeNi alloy layer has an amorphous base structure, and includes less than 50% of crystal grains having a grain size of 10 nm or less, with respect to the total volume 100% of microstructures of the FeNi alloy layer.

    5. The FeNiP alloy multilayered steel sheet of claim 1, wherein the FeNi alloy layer and the FeP alloy layer are alternately laminated on each other one time to ten times.

    6. A method of manufacturing an FeNiP alloy multilayered steel sheet, the method comprising: preparing an electroforming substrate; electrodepositing an FeNi alloy layer on a surface of the electroforming substrate; electrodepositing an FeP alloy layer on a surface of the FeNi alloy layer; laminating the two kinds of alloy layers in multiple layers by alternately repeating the electrodepositing of the FeNi alloy layer and the electrodepositing of the FeP alloy layer; and peeling, from the electroforming substrate, a multilayered steel sheet in which the two kinds of alloy layers are alternately laminated on each other.

    7. The method of claim 6, wherein in the laminating of the two kinds of alloy layers in multiple layers by alternately repeating the electrodepositing of the FeNi alloy layer and the electrodepositing of the FeP alloy layer, the FeNi alloy layer and the FeP alloy layer are alternately laminated on each other one time to ten times.

    8. The method of claim 6, wherein the electrodepositing of the FeNi alloy layer on the surface of the electroforming substrate includes: preparing a plating solution including an iron compound and a nickel compound; applying a current to the plating solution; and electrodepositing the FeNi alloy layer on the surface of the electroforming substrate by reducing iron ions and nickel ions by the applied current.

    9. The method of claim 33, wherein the iron compound is FeSO.sub.4, Fe(SO.sub.3NH.sub.2).sub.2, FeCl.sub.2, Fe powder or a combination thereof.

    10. The method of claim 9, wherein a concentration of the iron compound in the plating solution ranges from 0.5 M to 4.0 M.

    11. The method of claim 33, wherein in the preparing of the plating solution including the iron compound and the nickel compound, the nickel compound is NiSO.sub.4, NiCl.sub.2, or a combination thereof.

    12. The method of claim 11, wherein in the preparing of the plating solution including the iron compound and the nickel compound, a concentration of the nickel compound in the plating solution ranges from 0.1 M to 3.0 M.

    13. The method of claim 33, wherein the plating solution includes an addition agent, and a concentration of the addition agent in the plating solution ranges from 0.001 M to 0.1 M.

    14. (canceled)

    15. (canceled)

    16. (canceled)

    17. (canceled)

    18. The method of claim 33, wherein in the electrodepositing of the FeNi alloy layer on the surface of the electroforming substrate by reducing iron ions and nickel ions by the applied current, a thickness of the FeNi alloy layer electrodeposited on the surface of the electroforming substrate ranges from 0.1 ?m to 1000 ?m.

    19. (canceled)

    20. (canceled)

    21. (canceled)

    22. (canceled)

    23. The method of claim 33, wherein in the preparing of the plating solution including the iron compound and the phosphorus compound, the phosphorus compound is NaH.sub.2PO.sub.2, H.sub.3PO.sub.2, H.sub.3PO.sub.3, or a combination thereof.

    24. The method of claim 23, wherein in the preparing of the plating solution including the iron compound and the phosphorus compound, a concentration of the phosphorus compound in the plating solution ranges from 0.01 M to 3.0 M.

    25. (canceled)

    26. (canceled)

    27. (canceled)

    28. (canceled)

    29. (canceled)

    30. The method of claim 33, wherein in the electrodepositing of the FeP alloy layer on the surface of the FeNi alloy layer by reducing iron ions and phosphorus ions by the applied current, a thickness of the FeP alloy layer electrodeposited on the surface of the FeNi alloy layer ranges from 0.1 ?m to 1000 ?m.

    31. (canceled)

    32. The method of claim 33, wherein in the preparing of the electroforming substrate, the electroforming substrate includes stainless, titanium, or a combination thereof.

    33. The method of claim 8, wherein the electrodepositing of the FeP alloy layer on the surface of the FeNi alloy layer includes: preparing a plating solution including an iron compound and a phosphorus compound; applying a current to the plating solution; and electrodepositing the FeP alloy layer on the surface of the FeNi alloy layer by reducing iron ions and phosphorus ions by the applied current.

    Description

    DESCRIPTION OF THE DRAWINGS

    [0034] FIG. 1 is a flowchart illustrating a method of manufacturing an ultra-thin multilayered steel sheet according to an embodiment of the present disclosure.

    [0035] FIG. 2 illustrates an FeNiP alloy multilayered steel sheet according to the embodiment of the present disclosure.

    MODE FOR INVENTION

    [0036] The advantages and features of the present disclosure, and the manner of achieving them will become apparent with reference to embodiments described in detail below together with the accompanying drawings. However, the present disclosure is not limited to the following embodiments, and may be implemented in other various forms. Further, the present embodiments are merely provided to make the present disclosure complete, and completely inform the scope of the present disclosure to those skilled in the art to which the present disclosure pertains. Furthermore, the present disclosure is only defined by the appended claims. The same components are designated by the same reference numerals throughout the specification.

    [0037] Thus, in some embodiments, widely known technologies are not specifically described to avoid ambiguous interpretation of the present disclosure. Unless otherwise defined, all terms (including technical terms and scientific terms) used in the specification may be used to be commonly understood by those skilled in the art to which the present disclosure pertains. When it is described throughout the specification that a first component includes a second component, this means that a third component is not excluded but is further included unless specifically otherwise described. Further, a singular form includes a plural form unless otherwise mentioned in a phrase.

    [0038] An FeNiP alloy multilayered steel sheet according to an embodiment of the present disclosure may include: an FeNi alloy layer including, with respect to 100 wt % as a whole, 30 wt % to 85 wt % of Ni, a remainder Fe, and other inevitable impurities; and an FeP alloy layer including, with respect to 100 wt % as a whole, 6 wt % to 12 wt % of P, a remainder Fe, and other inevitable impurities.

    [0039] The FeNiP alloy multilayered steel sheet may be provided in which the FeNi alloy layer and the FeP alloy layer are alternately laminated on each other several times.

    [0040] In more detail, the FeNi alloy layer and the FeP alloy layer may be alternately laminated on each other one time to ten times.

    [0041] In this case, the multilayered steel sheet in which the two kinds of alloy layers are alternately laminated on each other several times does not include a separate bonding layer between the two kinds of alloy layers.

    [0042] Further, the FeP alloy layer may have an amorphous base structure, and may include, with respect to the total volume 100% of microstructures of the alloy layer, less than 5% of an Fe.sub.2P phase, an Fe.sub.3P phase, or a combination thereof.

    [0043] In more detail, the above-described precipitate phases are reduced to the range, so that magnetic characteristics may be improved and iron loss may be reduced.

    [0044] In addition, the FeP alloy layer and the FeNi alloy layer may include less than 50% of crystal grains having a grain size of 10 nm or less with respect to the total volume 100% of microstructures.

    [0045] In more detail, the FeP alloy layer and the FeNi alloy layer may have a form in which crystal grains mixedly exist in the amorphous structure. From this, a saturation magnetic flux density may be improved as compared to an amorphous single phase. When the crystal grains having the size range mixedly exist, the improving effect may be maximized.

    [0046] In addition, in the specification, the grain size means an average diameter of a spherical substance existing in a measurement unit. When the substance has a non-spherical shape, the grain size means the diameter of a sphere, which is calculated in a state in which the non-spherical substance is approximated to a spherical shape.

    [0047] Further, the grain size of the crystal grains disclosed in the specification is a result calculated by substituting, into Scherrer's equation, a diffraction angle and the intensity of a diffraction beam of data obtained by using the XRD analysis method.

    [0048] Hereinafter, the reason why compositions of the alloy layer are limited will be described in an embodiment of the present disclosure.

    [0049] First, Ni may serve to improve processability by reducing hardness. In more detail, when the content of Ni exceeds 30 wt %, the hardness is reduced, so that an occurrence rate of cracks occurring in an edge portion during a punching process may be reduced. A crack occurrence reducing effect can be identified through an initial crack occurrence angle test during bending deformation according to the embodiment of the present disclosure. However, considering that nickel is an expensive raw material, when the content of nickel exceeds 85 wt %, changes in characteristics depending on the content of nickel are not high, and thus it is preferable that 85 wt % or less of nickel is added.

    [0050] Further, since P serves to reduce iron loss by increasing specific resistance, the specific resistance may increase as the amount of added P increases. However, when more than 12 wt % of P is added, the processability may deteriorate. On the other hand, when less than 6 wt % of P is added, the amorphous phase is not formed, and thus an additional specific resistance increasing effect may not be acquired.

    [0051] A method of manufacturing an FeNiP alloy multilayered steel sheet according to another embodiment of the present disclosure may include: preparing an electroforming substrate; electrodepositing an FeNi alloy layer on a surface of the electroforming substrate; electrodepositing an FeP alloy layer on a surface of the FeNi alloy layer; laminating the two kinds of alloy layers in multiple layers by alternately repeating the electrodepositing of the FeNi alloy layer and the electrodepositing of the FeP alloy layer; and peeling, from the electroforming substrate, a multilayered steel sheet in which the two kinds of alloy layers are alternately laminated on each other.

    [0052] First, in the preparing of the electroforming substrate, the electroforming substrate may include stainless, titanium, or a combination thereof. However, in addition, since all materials having acid resistance and having an oxide film may be used, the present disclosure is not limited to the materials.

    [0053] In more detail, the surface of the electroforming substrate may be a material which may have conductivity and of which a surface may be separated from an electrodeposit after the electrodepositing. In more detail, the surface of the electroforming substrate may be a material having less thermal deformation at 100? C. or less and acid resistance against acidic electrolyte. Further, the surface of the electroforming substrate may be a material which has proper adhesiveness with the electrodeposit to facilitate the electroforming, and has excellent wear resistance by which the electroforming substance may withstand the repeated electrodeposition and the peeling.

    [0054] Thereafter, the electrodepositing of the FeNi alloy layer on the surface of the electroforming substance may be performed.

    [0055] In more detail, the electrodepositing of the FeNi alloy layer on the surface of the electroforming substrate may include: preparing a plating solution including an iron compound and a nickel compound; applying a current to the plating solution; and electrodepositing the FeNi alloy layer on the surface of the electroforming substrate by reducing iron ions and nickel ions by the applied current.

    [0056] First, in the preparing of the plating solution including an iron compound and a nickel compound, although the iron compound may include FeSO.sub.4, Fe(SO.sub.3NH.sub.2).sub.2, FeCl.sub.2, Fe powder, or a combination thereof, the present disclosure is not limited thereto.

    [0057] In this case, a concentration of the iron compound in the plating solution may be 0.5 M to 4.0 M.

    [0058] When the concentration of the iron compound is in the above range, it is easy to form the FeNi alloy layer.

    [0059] In addition, although the nickel compound may be NiSO4, NiCl2 or a combination thereof, the present disclosure is not limited thereto.

    [0060] In this case, a concentration of the nickel compound in the plating solution may be 0.1 M to 3.0 M.

    [0061] When the concentration of the nickel compound is in the above range, it is easy to form the FeNi alloy layer.

    [0062] Further, the plating solution may include an addition agent, and a concentration of the addition agent in the plating solution may be 0.001 M to 0.1 M.

    [0063] In this case, the addition agent may include glycolic acid, saccharin, beta-alanine, DL-alanine, succinic acid, or a combination thereof. However, the present disclosure is not limited thereto.

    [0064] In more detail, when the addition agent having the concentration is further included, it is further easy to form a plated layer.

    [0065] A pH of the plating solution may range from 1 to 4, and the temperature of the plating solution may range from 30? C. to 100? C.

    [0066] In more detail, the pH of the plating solution may be adjusted to the range by one or more acids and/or one or more bases being added.

    [0067] When the pH and the temperature of the plating solution are in the above ranges, it may be easy to form the plated layer.

    [0068] Thereafter, the applying of the current to the plating solution may be performed.

    [0069] In this case, the current may be a direct current or a pulse current, and a current density of the current may be 1 A/dm.sup.2 to 100 A/dm.sup.2.

    [0070] The electrodepositing of the FeNi alloy layer on the surface of the electroforming substrate by reducing the iron ions and the nickel ions by the applied current may be performed.

    [0071] The thickness of the FeNi alloy layer electrodeposited on the surface of the electroforming substrate may be 0.1 ?m to 1000 ?m.

    [0072] In addition, the FeNi alloy layer electrodeposited on the surface of the electroforming substrate may include 30 wt % to 85 wt % of Ni, a remainder Fe, and other inevitable impurities, with respect to 100 wt % as a whole. The reason why the compositions of the FeNi alloy layer are limited is the same as that described above, and thus will be omitted.

    [0073] Thereafter, the electrodepositing of the FeP alloy layer on the surface of the FeNi alloy layer may be performed.

    [0074] In this case, the electrodepositing of the FeP alloy layer on the surface of the FeNi alloy layer may include: preparing a plating solution including an iron compound and a phosphorus compound; applying a current to the plating solution; and electrodepositing the FeP alloy layer on the surface of the FeNi alloy layer by reducing iron ions and phosphorus ions by the applied current.

    [0075] In the preparing of the plating solution including the iron compound and the phosphorus compound, the iron compound may be FeSO.sub.4, Fe(SO.sub.3NH.sub.2).sub.2, FeCl.sub.2, Fe powder, or a combination thereof, and a concentration of the iron compound in the plating solution may be 0.5 M to 4.0 M.

    [0076] Further, the phosphorus compound may be NaH.sub.2PO.sub.2, H.sub.3PO.sub.2, H.sub.3PO.sub.3, or a combination thereof, and a concentration of the phosphorus compound in the plating solution may be 0.01 M to 3.0 M.

    [0077] In addition, the plating solution may include an addition agent, and a concentration of the addition agent in the plating solution may be 0.001 M to 0.1 M.

    [0078] The addition agent may be glycolic acid, saccharin, beta-alanine, DL-alanine, succinic acid, or a combination thereof. However, the present disclosure is not limited thereto.

    [0079] A pH of the plating solution may range from 1 to 4, and the temperature of the plating solution may range from 30? C. to 100?.

    [0080] Thereafter, the applying of the current to the plating solution may be performed.

    [0081] In this case, the current may be a direct current or a pulse current, and a current density of the current may be 1 A/dm.sup.2 to 100 A/dm.sup.2.

    [0082] The electrodepositing of the FeP alloy layer on the surface of the FeNi alloy layer by applying the iron ions and the phosphorus ions by the applied current.

    [0083] In this case, the thickness of the FeP alloy layer electrodeposited on the surface of the FeNi alloy layer may be 0.1 ?m to 1000 ?m.

    [0084] In addition, the FeP alloy layer electrodeposited on the surface of the FeNi alloy layer may include 6 wt % to 12 wt % of P, a remainder Fe, and inevitable impurities, with respect to 100 wt % as a whole.

    [0085] Thereafter, the laminating of the two kinds of alloy layers in multiple layers by alternately repeating the electrodepositing of the FeNi alloy layer and the electrodepositing of the FeP alloy layer may be performed.

    [0086] In more detail, the above-described electrodepositing of the FeNi alloy layer and the above-described electrodepositing of the FeP alloy layer may be alternately performed several times. In more detail, the two kinds of alloy layers may be alternately laminated on each other in multiple layers several times.

    [0087] In more detail, in the laminating of the two kinds of alloy layers in multiple layers by alternately repeating the electrodepositing of the FeNi alloy layer and the electrodepositing of the FeP alloy layer,

    [0088] The FeNi alloy layer and the FeP alloy layer may be alternately laminated in multiple layers one time to ten times.

    [0089] Finally, the peeling of, from the electroforming substrate, the multilayered steel sheet in which the two kinds of alloy layers are alternately laminated on each other may be performed.

    [0090] According to the above description, the two kinds of alloy layers are alternately laminated on the electroforming substrate in multiple layers. Accordingly, the FeNiP alloy multilayered steel sheet may be acquired by the peeling of, from the electroforming substance, the multilayered steel sheet in which the two kinds of alloy layers are alternately laminated on each other.

    [0091] In more detail, the steel sheet having a desired thickness may be acquired by laminating the two kinds of alloy layers in a thin plate several times through an electroforming process.

    [0092] Hereinafter, the present disclosure may be described in detail through embodiments. The following embodiments are merely intended to describe the present disclosure, and the contents of the present disclosure are not limited by the following embodiments.

    EMBODIMENT

    [0093] After an electroforming steel sheet is prepared, a current is applied to a plating solution including an iron compound and a nickel compound.

    [0094] A FeNi alloy layer including 36 wt % of Ni, a remainder Fe, and inevitable impurities with respect to 100 wt % as a whole is electrodeposited on a surface of the electroforming steel sheet by the current.

    [0095] Thereafter, in a state in which the steel sheet on which the FeNi alloy layer is electrodeposited is injected into the plating solution including an iron compound and a phosphorus compound, the current is applied to the plating solution.

    [0096] A FeP alloy layer including 11 wt % of P, a remainder Fe, and inevitable impurities with respect of 100 wt % as a whole is electrodeposited on a surface of the FeNi alloy layer by the current.

    [0097] Thereafter, the FeNi alloy layer and the FeP alloy layer are alternately electrodeposited several times.

    [0098] Finally, the multilayered steel sheet in which the two kinds of alloy layers are alternately laminated on each other is acquired by peeling, from the electroforming substrate, the multilayered steel sheet in which the two kinds of alloy layers are alternately laminated on each other.

    Comparative Example 1

    [0099] Two kinds of powders including a powder including 10.5 wt % of P, a remainder Fe, and inevitable impurities and an Fe pure iron powder are used.

    [0100] In more detail, the two kinds of powders are mixed with each other, and are sintered at 700? C. or more.

    [0101] Thereafter, the sintered powders are hot rolled to produce a steel sheet including two kinds of alloys.

    Comparative Example 2

    [0102] A plurality of thin plates, each of which includes 36 wt % of Ni, a remainder Fe, and inevitable impurities with respect to 100 wt % as a whole, are prepared.

    [0103] Thereafter, the thin plates are laminated on each other using adhesive resin, so that a multilayered steel sheet, in which a plurality of metal thin plates are coupled to each other, are produced.

    TABLE-US-00001 TABLE 1 Initial crack generated 50 Hz, 1.5 T iron loss bending angle [W/kg] Comparative Example 1 7.4 degrees 10.5 Comparative Example 2 15 degrees 6.23 Embodiment 35 degrees 2.12

    [0104] As represented in Table 1, crack generation degrees obtained when the multilayered steel sheet is bent according to the manufacturing methods are compared with each other using the embodiment and the comparative examples.

    [0105] In more detail, the bending angle is obtained by measuring an angle, at which a crack is generated initially, by bending a material having a size of 1 mm?60 mm?60 mm in a zero-degree horizontal state.

    [0106] As a result, as represented by Table 1, in the case of the embodiment in which a plurality of alloy layers are laminated on each other using an electroforming process, it can be identified that the amount of cracks generated during processing is significantly low as compared to the comparative examples. This is because a difference between deformation rates of the alloy layers is small due to strong chemical bonding.

    [0107] On the other hand, it can be identified that in the case of the comparative examples 1 and 2 using sintering or resin, a crack generated angle is very low and the amount of iron loss is also large, as compared to the embodiment.

    [0108] In more detail, it can be identified that in the case of the comparative example 2 using the FeNi alloy layer, mechanical properties (the bending angle) are excellent, as compared to the comparative example 1 not using a nickel-based alloy layer.

    [0109] However, it can be identified that in the case of the comparative example 1 in which the FeP alloy layer is sintered to produce the multilayered steel sheet, since the nickel-based alloy layer is not used, the mechanical properties are bad as compared to the comparative example 2, and the amount of the iron loss is large as compared to the comparative example 2 not including P.

    [0110] In contrast, in the case of the embodiment, the iron loss is low, and at the same time, the mechanical properties are excellent as compared to the comparative examples 1 and 2.

    [0111] Although the embodiments of the present disclosure have been described above with reference to the accompanying drawings, it may be understood by those skilled in the art to which the present disclosure pertains that the present disclosure may be implemented in other detailed forms without changing the technical spirit or the essential feature of the present disclosure.

    [0112] Therefore, it should be understood that the above-described embodiments are not restrictive but illustrative in all aspects. The scope of the present disclosure is defined not by the detailed description but by the appended claims, and it should be interpreted that all changes and modifications that are derived from the meaning and scope of the appended claims, and the equivalent concepts thereof are included in the scope of the present disclosure.

    DESCRIPTION OF SYMBOLS

    [0113] 10: Electroforming substrate [0114] 20: FeNi alloy layer [0115] 31: FeP alloy layer