METHOD FOR PRODUCING A METAL-CERAMIC SUBSTRATE WITH PICOLASER

Abstract

One aspect relates to a method of processing metallized ceramic substrates and to a metal-ceramic substrate obtained by this method.

Claims

1-15. (canceled)

16. A method for processing of metal-ceramic substrates, comprising: generating a laser scribing line as a predetermined breaking line in the metal-ceramic substrate using a laser beam; or at least partially cutting through the metal-ceramic substrate using a laser beam; wherein the processing is carried out using a laser and when generating the laser scribing line as a predetermined breaking line or when cutting through, a pulse duration of the laser is used which is chosen such that essentially no melting phases of the ceramic material are formed.

17. The method according to claim 16, wherein the laser scribing line is formed continuously or discontinuously.

18. The method according to claim 16, wherein the laser is a p-sec laser.

19. The method according to claim 16, wherein the laser has a pulse duration of 0.1 to 100 ps.

20. The method according to claim 16, wherein, during the generation of the laser scribing line as a predetermined breaking line, the laser scribing line is generated in several crossings of the laser and/or the at least partially cutting through of the metal-ceramic substrate occurs in several crossings of the laser.

21. The method according to claim 16, wherein the laser is an IR laser.

22. The method according to claim 21, wherein the IR laser has a power of 60 to 160 watts.

23. The method according to claim 21, wherein the frequency of the IR laser is 350 to 650 kHz.

24. The method according to any claim 21, wherein the pulse energy of the IR laser is 100 to 300 J.

25. The method according to claim 21, wherein the spot diameter of the IR laser is 20 to 100 m.

26. The method according to claim 16, wherein the method is carried out in a device having a suction device that absorbs dusts, which result from the laser processing.

27. A metallized ceramic substrate obtained by the method according to claim 16.

28. The metallized ceramic substrate according to claim 27, wherein the ceramic substrate has a continuous scribing trench.

29. The metallized ceramic substrate according to claim 27, wherein the ceramic substrate has a continuous scribing trench with a depth of at least 20 m, each perpendicular to a planar surface of the ceramic substrate.

30. The metallized ceramic substrate according to claim 27, wherein the ceramic substrate has a contour which deviates from a straight line and which has been produced by cutting the ceramic substrate using a laser beam.

Description

EXAMPLE 1

(1) Metal-Ceramic Substrate:

[0100] The following tests are performed on a metal-ceramic substrate obtained by the DCB method.

[0101] The ceramic substrate is an Al.sub.2O.sub.3 ceramic material. The layer thickness of the ceramic substrate is 0.38 mm (test series 1) and 0.63 mm (test series 2).

(2) Laser

[0102] The subsequent tests are carried out with the following laser:

[0103] Power: 100 W

[0104] Laser source: IR

[0105] Pulse duration laser: 0.1 to 100 ps

[0106] Pulse energy laser: 10 to 500 J

[0107] Spot diameter: 30 m

[0108] Frequency laser: 350 to 650 kHz

[0109] With the laser described above, a laser scribing line is generated in the ceramic substrate, and then the ceramic substrate is broken in the laser scribing line.

(3) Results

[0110]

TABLE-US-00001 Breaking behavior Test series real processing speed ceramic substrate 1 7.5 m/sec + 1 10 m/sec + 1 15 m/sec 0 1 20 m/sec 2 7.5 m/sec + 2 10 m/sec + 2 15 m/sec 0 2 20 m/sec

Rating:

[0111] +: good breaking behavior

[0112] 0: average breaking behavior

[0113] : bad breaking behavior

[0114] The test series show that real speeds of the IR laser between up to 15 m/sec are suitable for breaking behavior. Higher real speeds of the IR laser lead to a poor breaking behavior.

[0115] With these speeds of the IR laser, glass phases in the laser scribing line are essentially avoided and sufficient micro-cracks are formed so that it is possible to cut through the ceramic.

[0116] Real speeds below 0.05 m/sec are disadvantageous because too deep scribing lines (too much formation of glass phases) result. In addition, real speeds below 0.05 m/sec are disadvantaged for economic reasons.