Glass substrate package
10173833 ยท 2019-01-08
Assignee
Inventors
Cpc classification
B65D85/62
PERFORMING OPERATIONS; TRANSPORTING
H01L21/67369
ELECTRICITY
B65D81/051
PERFORMING OPERATIONS; TRANSPORTING
International classification
H01L21/673
ELECTRICITY
B65D81/05
PERFORMING OPERATIONS; TRANSPORTING
Abstract
Provided is a glass substrate package (1), including a plurality of disc-shaped glass substrates (2) packaged in a box (3), in which the plurality of disc-shaped glass substrates (2) are stacked and packaged in a horizontal posture under a state in which slip sheets (4) are interposed between the plurality of disc-shaped glass substrates (2).
Claims
1. A glass substrate package, comprising a plurality of disc-shaped glass substrates packaged in a packaging material, wherein the plurality of disc-shaped glass substrates are stacked and packaged in a horizontal posture under a state in which protective sheets are interposed between the plurality of disc-shaped glass substrates, wherein each of the plurality of disc-shaped glass substrates comprises a positioning portion formed by partially removing an outer peripheral end portion thereof in order to position the disc-shaped glass substrates, wherein the packaging material comprises a side wall portion configured to surround the outer peripheral end portions of the plurality of disc-shaped glass substrates, wherein the plurality of disc-shaped glass substrates are packaged so that the positioning portions are free from being brought into contact with the side wall portion, and wherein part of the outer peripheral end portion of each of the plurality of disc-shaped glass substrates is brought into contact with the side wall portion.
2. The glass substrate package according to claim 1, wherein the plurality of disc-shaped glass substrates are stacked under a state in which positions of the positioning portions are aligned with each other.
3. The glass substrate package according to claim 1, wherein the packaging material comprises an upper wall portion opposed to the disc-shaped glass substrate positioned in an uppermost layer of the plurality of disc-shaped glass substrates, and wherein the disc-shaped glass substrate positioned in the uppermost layer and the upper wall portion have a cushioning material filled therebetween.
4. The glass substrate package according to claim 1, wherein the packaging material comprises a box-shaped member, and the box-shaped member is formed in a developable manner.
5. The glass substrate package according to claim 1, wherein the positioning portion is a notch or an orientation flat.
6. A glass substrate package, comprising a plurality of disc-shaped glass substrates packaged in a packaging material, wherein the plurality of disc-shaped glass substrates are stacked and packaged in a horizontal posture under a state in which protective sheets are interposed between the plurality of disc-shaped glass substrates, wherein each of the plurality of disc-shaped glass substrates comprises a positioning portion formed by partially removing an outer peripheral end portion thereof in order to position the disc-shaped glass substrates, wherein the packaging material comprises a side wall portion configured to surround the outer peripheral end portions of the plurality of disc-shaped glass substrates, wherein the plurality of disc-shaped glass substrates are packaged so that the positioning portions are free from being brought into contact with the side wall portion, wherein part of the outer peripheral end portion of each of the plurality of disc-shaped glass substrates is brought into contact with the side wall portion, and wherein, when the plurality of disc-shaped glass substrates are seen in plan view, the side wall portion forms a square circumscribing the plurality of disc-shaped glass substrates.
Description
BRIEF DESCRIPTION OF DRAWINGS
(1)
(2)
(3)
(4)
(5)
DESCRIPTION OF EMBODIMENTS
(6) Now, a glass substrate package according to an embodiment of the present invention is described with reference to the accompanying drawings. First, description is given of the configuration of the glass substrate package according to the embodiment of the present invention.
(7) As illustrated in
(8) Each of the plurality of disc-shaped glass substrates 2 is a glass substrate serving as a support configured to support a semiconductor wafer in a back grinding step of the semiconductor wafer. In each of the disc-shaped glass substrates 2, a notch 2aa serving as a positioning portion, which is formed by partially removing an outer peripheral end portion 2a, is formed. The notch 2aa is formed in order to position the disc-shaped glass substrate 2 by determining the direction of the disc-shaped glass substrate 2 when the disc-shaped glass substrate 2 is seen in plan view. Further, each of the disc-shaped glass substrates 2 has warpage which is curved so that one of upper and lower surfaces becomes convex, and a marking 2b for determining the direction of the warpage based on the SEMI standard is formed in the vicinity of the notch 2aa in each of the disc-shaped glass substrates 2. The marking 2b is formed of, for example, a character string drawn with a large number of dots formed on the disc-shaped glass substrate 2 by laser irradiation. Then, the plurality of disc-shaped glass substrates 2 are stacked under a state in which the positions of the notches 2aa, and the directions of the warpage are aligned with each other. In this embodiment, the plurality of disc-shaped glass substrates 2 are stacked under a state in which the lower surface of the upper and lower surfaces of each of the disc-shaped glass substrates 2 becomes convex.
(9) In this case, for example, an average thermal expansion coefficient of the disc-shaped glass substrate 2 within the temperature range of from 30 C. to 380 C. is preferably increased when the ratio of a semiconductor chip is small and the ratio of a sealing material is large in a semiconductor wafer supported by the disc-shaped glass substrate 2. Meanwhile, when the ratio of the semiconductor chip is large and the ratio of the sealing material is small in the semiconductor substrate, the average thermal expansion coefficient is preferably decreased.
(10) When the average thermal expansion coefficient of the disc-shaped glass substrate 2 within the temperature range of from 30 C. to 380 C. needs to be regulated to 010.sup.7/ C. or more and less, than 5010.sup.7/ C., it is preferred that the disc-shaped glass substrate 2 comprise as a glass composition, in terms of mass %, 55% to 75% of SiO.sub.2, 15% to 30% of Al.sub.2O.sub.3, 0.1% to 6% of Li.sub.2O, 0% to 8% of Na.sub.2O+K.sub.2O (total content of Na.sub.2O and K.sub.2O), and 0% to 10% of MgO+CaO+SrO+BaO (total content of MgO, CaO, SrO, and BaO). Alternatively, it is also preferred that the disc-shaped glass substrate 2 comprise as a glass composition, in terms of mass %, 55% to 75% of SiO.sub.2, 10% to 30% of Al.sub.2O.sub.3, 0% to 0.3% of Li.sub.2O+Na.sub.2O+K.sub.2O (total content of Li.sub.2O, Na.sub.2O, and K.sub.2O), and 5% to 20% of MgO+CaO+SrO+BaO.
(11) Further, when the average thermal expansion coefficient of the disc-shaped glass substrate 2 within the temperature range of from 30 C. to 380 C. needs to be regulated to 5010.sup.7/ C. or more and less than 7010.sup.7/ C., it is preferred that the disc-shaped glass substrate 2 comprise as a glass composition, in terms of mass %, 55% to 75% of SiO.sub.2, 3% to 15% of Al.sub.2O.sub.3, 5% to 20% of B.sub.2O.sub.3, 0% to 5% of MgO, 0% to 10% of CaO, 0% to 5% of SrO, 0% to 5% of BaO, 0% to 5% of ZnO, 5% to 15% of Na.sub.2O, and 0% to 10% of K.sub.2O. It is more preferred that the disc-shaped glass substrate 2 comprise as a glass composition, in terms of mass %, 64% to 71% of SiO.sub.2, 5% to 10% of Al.sub.2O.sub.3, 8% to 15% of B.sub.2O.sub.3, 0% to 5% of MgO, 0% to 6% of CaO, 0% to 3% of SrO, 0% to 3% of BaO, 0% to 3% of ZnO, 5% to 15% of Na.sub.2O, and 0% to 5% of K.sub.2O.
(12) In addition, when the average thermal expansion coefficient of the disc-shaped glass substrate 2 within the temperature range of from 30 C. to 380 C. needs to be regulated to 7010.sup.7/ C. or more and 8510.sup.7/ C. or less, it is preferred that the disc-shaped glass substrate 2 comprise as a glass composition, in terms of mass %, 60% to 75% of SiO.sub.2, 5% to 15% of Al.sub.2O.sub.3, 5% to 20% of B.sub.2O.sub.3, 0% to 5% of MgO, 0% to 10% of CaO, 0% to 5% of SrO, 0% to 5% of BaO, 0% to 5% of ZnO, 7% to 16% of Na.sub.2O, and 0% to 8% of K.sub.2O. It is more preferred that the disc-shaped glass substrate 2 comprise as a glass composition, in terms of mass %, 60% to 68% of SiO.sub.2, 5% to 15% of Al.sub.2O.sub.3, 5% to 20% of B.sub.2O.sub.3, 0% to 5% of MgO, 0% to 10% of CaO, 0% to 3% of SrO, 0% to 3% of BaO, 0% to 3% of ZnO, 8% to 16% of Na.sub.2O, and 0% to 3% of K.sub.2O.
(13) In addition, when the average thermal expansion coefficient of the disc-shaped, glass substrate 2 within the temperature range of from 30 C. to 380 C. needs to be regulated to more than 8510.sup.7/ C. and 12010.sup.7/ C. or less, it is preferred that the disc-shaped glass substrate 2 comprise as a glass composition, in terms of mass %, 55% to 70% of SiO.sub.2, 3% to 13% of Al.sub.2O.sub.3, 2% to 8% of B.sub.2O.sub.3, 0% to 5% of MgO, 0% to 10% of CaO, 0% to 5% of SrO, 0% to 5% of BaO, 0% to 5% of ZnO, 10% to 21% of Na.sub.2O, and 0% to 5% of K.sub.2O.
(14) Further, when the average thermal expansion coefficient of the disc-shaped glass substrate 2 within the temperature range of from 30 C. to 380 C. needs to be regulated to more than 12010.sup.7/ C. and 16510.sup.7/ C. or less, it is preferred that the disc-shaped glass substrate 2 comprise as a glass composition, in terms of mass %, 53% to 65% of SiO.sub.2, 3% to 13% of Al.sub.2O.sub.3, 0% to 5% of B.sub.2O.sub.3, 0.1% to 6% of MgO, 0% to 10% of CaO, 0% to 5% of SrO, 0% to 5% of BaO, 0% to 5% of ZnO, 20% to 40% of Na.sub.2O+K.sub.2O, 12% to 21% of Na.sub.2O, and 7% to 21% of K.sub.2O.
(15) With the foregoing, the average thermal expansion coefficient of the disc-shaped glass substrate 2 is easily regulated within a desired range, and the devitrification resistance is enhanced. Therefore, the disc-shaped glass substrate 2 having a small variation in thickness is easily obtained.
(16) The slip sheet 4 is formed of, for example, a pulp sheet or a polyethylene sheet. The slip sheet 4 is formed into a square shape, and the length of one side of the square is set to a length equal to the diameter or the disc-shaped glass substrate 2. With this, the slip sheet 4 is capable of covering an entire principal surface (upper surface and lower surface) of the disc-shaped glass substrate 2 to protect the principal surface from the occurrence of a scratch and the like. A corner portion (site corresponding to a corner of the square) of the slip sheet 4 projects from the outer peripheral end portion 2a of the disc-shaped glass substrate 2.
(17) Here, in this embodiment, the slip sheet 4 is used as the protective sheet. However, the present invention is not limited thereto, and for example, a resin, sheet, a film, or the like may be used as the protective sheet. In addition, in this embodiment, the slip sheet 4 is formed into a square shape. However, the present invention is not limited thereto, and the slip sheet 4 formed into any shape may be used. Further, it is not always necessary that the slip sheet 4 project from the outer peripheral end portion 2a of the disc-shaped glass substrate 2. For example, the slip sheet 4 with a circular shape having the same area as that of the principal surface of the disc-shaped glass substrate 2 may be used so that an outer peripheral profile of the disc-shaped glass substrate 2 and an outer peripheral profile of the slip sheet 4 are superimposed on one another in plan view.
(18) The box 3 comprises a box main body 3a configured to accommodate the plurality of disc-shaped glass substrates 2 and a lid member 3b configured to cover the box main body 3a from above. As materials for the box main body 3a and the lid member 3b, a resin, wood, paper, plastic, and the like may be used. Both the box main body 3a and the lid member 3b can be fixed to each other through intermediation of a pressure-sensitive adhesive tape 5.
(19) The box main body 3a comprises a bottom portion 3aa on which the plurality of disc-shaped glass substrates 2 are mounted, and a side wall portion 3ab which is connected to the bottom portion 3aa and is configured to surround the outer peripheral end portion 2a of each of the disc-shaped glass substrates 2. The bottom portion 3aa is formed into a square in plan view. Further, as illustrated in
(20) Further, each of the disc-shaped glass substrates 2 is accommodated (packaged) in the box main body 3a so that the notch 2aa of the substrate is free from being brought into contact with the side wall portion 3ab. More specifically, each of the disc-shaped glass substrates 2 is accommodated (packaged) in the box main body 3a so that each of the disc-shaped glass substrates 2 is arranged with the notch 2aa facing a corner of a square formed by the side wall portion 3ab.
(21) The side wall portion 3ab of the box main body 3a comprises four wall portions 3aba to 3abd, and each of the wall portions 3aba to 3abd is capable of changing the posture thereof from a vertical posture illustrated in
(22) The lid member 3b comprises an upper wall portion 3ba opposed to the disc-shaped glass substrate 2 positioned in the uppermost layer of the plurality of disc-shaped glass substrates 2. As illustrated in
(23) Here, in this embodiment, the box main body 3a and the lid member 3b are fixed to each other through intermediation of the pressure-sensitive adhesive tape 5. However, the present invention is not limited thereto. The box main body 3a and the lid member 3b may be fixed to each other, for example, by being tied with a string or by being wound with a rubber band. Further, in this embodiment, all the four wall portions 3aba to 3abd forming the side wall portion 3ab of the box main body 3a are capable of changing the posture thereof from a vertical posture to a horizontal posture. However, the present invention is not limited thereto. Only part of the four wall portions 3aba to 3abd may be capable of changing the posture thereof.
(24) Now, the main action and effect in the case of using the glass substrate package 1 are described.
(25) According to the glass substrate package 1, the plurality of disc-shaped glass substrates 2 can be packaged in the box 3 merely by stacking the plurality of disc-shaped glass substrates 2 in a horizontal posture and interposing the slip sheets 4 between the disc-shaped glass substrates 2. Therefore, the cost required for packaging the disc-shaped glass substrates 2 can be reduced. In addition, the plurality of disc-shaped glass substrates 2 are stacked in a horizontal posture, and hence the application of an excessive stress to the outer peripheral end portion 2a of each of the disc-shaped glass substrates 2 can also be avoided. As a result, the occurrence of such a situation that the disc-shaped glass substrate 2 is broken from the outer peripheral end portion 2a can be prevented accurately.
(26) Here, the configuration of the glass substrate package according to the present invention is not limited to the configuration described in the above-mentioned embodiment. In the above-mentioned embodiment, the bottom portion of the box main body is formed into a square in plan view, but may be formed into a circle or a polygon. Similarly, in the above-mentioned embodiment, when the disc-shaped glass substrate is seen in plan view, the side wall portion forms a square circumscribing the disc-shaped glass substrate, but may form a circle or a polygon.
(27) Further, in the glass substrate package according to the above-mentioned embodiment, a protective tape may be attached so as to cover the notch formed in each of the disc-shaped glass substrates in order to protect the notch. In this case, protective tapes may be individually attached to the notches of the plurality of disc-shaped glass substrates, or the notches of the plurality of disc-shaped glass substrates may be collectively covered with a single protective tape. When the notches are collectively covered with the single protective tape, it is preferred that, as the slip sheets to be interposed between the plurality of disc-shaped glass substrates, circular slip sheets each having the same area as that of the principal surface of the disc-shaped glass substrate be used.
(28) Further, in the above-mentioned embodiment, the configuration in which the disc-shaped glass substrate comprising the notch as the positioning portion is packaged is adopted, but the present invention is not limited thereto. As illustrated in
REFERENCE SIGNS LIST
(29) 1 glass substrate package 2 disc-shaped glass substrate 2a outer peripheral end portion 2aa notch 2ab orientation flat 2b marking 3 box 3a box main body 3aa bottom portion 3ab side wall portion 3aba wall portion 3abb wall portion 3abc wall portion 3abd wall portion 4 slip sheet 5 pressure-sensitive adhesive tape 6 hole 7 protrusion 8 bubble cushioning material P point