Glass powder blend, glass powder paste and photoelectric package

Abstract

The present invention provides a glass powder blend comprising glass powder and additives, wherein the additives comprise copper powder, and the copper powder accounts for 2-3 mass % based on the total amount of the glass powder blend in 100 mass %. The present invention also provides a glass powder paste and a photoelectric package. Due to the addition of copper powder to the glass powder, the melting point of the glass powder blend can be decreased, thereby lowering the temperature for melting the glass powder blend by using laser, and reducing the thermal stress generated during encapsulation.

Claims

1. A glass powder blend consisting of glass powder and additives, wherein the additives are composed of copper powder, TeO.sub.2 powder, and ceramic powder, and the copper powder accounts for 2-3 mass % based on the total amount of the glass powder blend in 100 mass % and the copper powder has an average particle diameter between 1.0 m and 2.5 m.

2. The glass powder blend according to claim 1, wherein the TeO2 powder accounts for 3-6 mass % based on the total amount of the glass powder blend in 100 mass %.

3. The glass powder blend according to claim 1, wherein the glass powder comprises V2O5 powder and P2O5 powder, wherein, based on the total amount of the glass powder blend in 100 mass %, the V2O5 powder accounts for 40-60 mass %, and the P2O5 powder accounts for 18-36 mass %.

4. The glass powder blend according to claim 1, wherein the glass powder comprises PbO powder, B2O3 powder and ZnO powder, wherein, based on the total amount of the glass powder blend in 100 mass %, the PbO powder accounts for 45-60 mass %, the B2O3 powder accounts for 20-40 mass %, and the ZnO powder accounts for 10-15 mass %.

5. The glass powder blend according to claim 1, wherein each of the components in the glass powder blend has an average particle diameter between 0.3 m and 4 m.

6. A glass powder paste characterized by comprising the glass powder blend according to claim 1 and a solvent for glass powder, wherein the glass powder blend accounts for 25-75 mass % of the glass powder paste, with balance of the solvent for glass powder.

7. The glass powder paste according to claim 6, wherein the solvent for glass powder comprises: based on the total amount of the solvent for glass powder in 100 mass %, 40-53 mass % of ethyl cellulose; 19-26 mass % of isopropanol; 12-15 mass % of resin; 5-10 mass % of terebinthina; and 4-10 mass % of ethanol.

8. The glass powder paste according to claim 7, wherein the resin is epoxy resin or acrylic resin.

9. The glass powder paste according to claim 7, wherein the terebinthina includes but not limited to terpinyl formate, terpinyl acetate and -terpinyl propionate.

10. A photoelectric package, including a first substrate, a second substrate, a photoelectric element disposed between the first substrate and the second substrate and an encapsulating material surrounding the photoelectric element, wherein the encapsulating material connects the first substrate to the second substrate fixedly, the photoelectric package is characterized in that the encapsulating material is formed by curing the glass powder paste according to claim 6 and a solvent for glass powder with a laser.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 shows the photograph of the glass powder paste after sintering according to an example of the present invention;

(2) FIG. 2 shows the photograph of the glass powder paste after irradiation by laser according to an example of the present invention;

(3) FIG. 3 shows the photograph of the glass powder paste as a comparative sample after sintering;

(4) FIG. 4 shows the photograph of the glass powder paste as a comparative sample after irradiation by laser.

DETAILED DESCRIPTION OF CERTAIN EMBODIMENTS

(5) Hereinafter, specific embodiments of the present invention will be described in detail. It should be understood that the specific embodiments described herein are only intended to illustrate and explain the present invention, but not to limit the invention.

(6) In one aspect, the present invention provides a glass powder blend comprising glass powder and additives, wherein the additives comprise copper powder, and the copper powder accounts for 2-3 mass % based on the total amount of the glass powder blend in 100 mass %.

(7) Due to the addition of copper powder to the glass powder, the melting point of the glass powder blend can be decreased, thereby lowering the temperature difference for melting the glass powder blend by using laser, and reducing the thermal stress generated during encapsulation.

(8) Controlling the mass percentage of copper powder in the range of 2-3% can not only reduce the melting temperature of the glass powder blend efficiently, but also make the glass powder paste prepared by the glass powder blend have a suitable viscosity.

(9) In the present invention, specific components of the glass powder are not particularly limited. For example, the glass powder may be any commercially available glass powder.

(10) As an embodiment of the present invention, the glass powder comprises V.sub.2O.sub.5 powder and P.sub.2O.sub.5 powder, wherein, based on the total amount of the glass powder blend in 100 mass %, the V.sub.2O.sub.5 powder accounts for 40-60 mass %, and the P.sub.2O.sub.5 powder accounts for 18-36 mass %. Preferably, the glass powder may further comprise one or more trace components selected from ZrO, TiO, MoO.sub.3, SiO.sub.2, ZnO, Al.sub.2O.sub.3 and the like.

(11) Alternatively, as another embodiment of the present invention, the glass powder comprises PbO powder, B.sub.2O.sub.3 powder and ZnO powder, wherein, based on the total amount of the glass powder blend in 100 mass %, the PbO powder accounts for 45-60 mass %, the B.sub.2O.sub.3 powder accounts for 20-40 mass %, and the ZnO powder accounts for 10-15 mass %. Similarly, in this embodiment, the glass powder may further comprise one or more trace components selected from ZrO, TiO, MoO.sub.3, SiO.sub.2, Al.sub.2O.sub.3 and the like.

(12) Herein, the term trace component(s) means that the amount of the component(s) is(are) no more than 1.5% of the total mass of the glass powder, preferably no more than 1%, more preferably no more than 0.5%. Usually, the total amount of the trace components is no more than 3% of the total mass of the glass powder, preferably no more than 2%, more preferably no more than 1.5%.

(13) Preferably, the additives further comprise TeO.sub.2 powder which accounts for 3-6 mass % based on the total amount of the glass powder blend in 100 mass %.

(14) TeO.sub.2 powder can improve the absorptivity of the glass powder blend to laser having infrared wavelength during its molten by laser, thereby improving the efficiency of encapsulation.

(15) Controlling the mass percent of TeO.sub.2 between 3% and 6% involves the following advantages: on one hand, it can prevent the superfusion of the glass powder to avoid the overtemperature during the encapsulation; on the other hand, it will not increase the required power of laser, thereby reducing the power consumption and saving energy.

(16) Preferably, the additives further comprise ceramic powder. Adding ceramic powder can reduce the expansion coefficient of the glass powder blend, thereby further reducing the stress generated in the encapsulation.

(17) Preferably, each of the components in the glass powder blend has an average particle diameter between 0.3 m and 4 m. Controlling each of the components of the blend in above range can not only reduce the expansion coefficient and melting temperature of the glass powder blend efficiently, but also make them disperse evenly in the solvent of the glass powder paste which will be described below. Preferably, the copper powder has a particle diameter between 1.0 m and 2.5 m.

(18) In another aspect, the present invention provides a glass powder paste comprising the above-mentioned glass powder blend according to the present invention, and a solvent for glass powder, wherein the glass powder blend accounts for 25-75 mass % based on the total amount of the glass powder paste in 100 mass %, with balance of the solvent for glass powder.

(19) During the encapsulation process, the glass powder blend is made into glass powder paste which is handily coated between the substrates and the amount of which to be coated on the substrate is also easily controlled.

(20) As described above, the glass powder blend has a relatively low melting point and a similar expansion coefficient to that of the substrate, therefore the produced stress is small accordingly when the glass powder paste is used in the encapsulation.

(21) As a specific embodiment of the present invention, the solvent for glass powder may include (based on the total amount of the solvent for glass powder in 100 mass %):

(22) 40-53 mass % of ethyl cellulose;

(23) 23-26 mass % of isopropanol;

(24) 12-15 mass % of resin;

(25) 5-10 mass % of terebinthina; and

(26) 4-10 mass % of ethanol.

(27) The resin may be epoxy resin or acrylic resin. The terebinthina includes but not limited to terpinyl formate, terpinyl acetate and -terpinyl propionate.

(28) In yet another aspect, the present invention provides a photoelectric package which includes a first substrate, a second substrate, a photoelectric element disposed between the first substrate and the second substrate and an encapsulating material surrounding the photoelectric element, wherein the encapsulating material connects the first substrate to the second substrate fixedly, and the encapsulating material is formed by melting the above glass powder paste of the present invention with laser and then curing. The technology of melting-and-curing glass powder paste by laser is well-known in the art, which need not to be repeated here.

(29) Usually, the photoelectric element is an organic light emitting diode (OLED). Due to the small stress in the encapsulation, the display device has a high flatness when such photoelectric package is used in a display device.

EXAMPLES

(30) Hereinafter, the expansion coefficient was measured by a thermal dilatometer wi63479 (available from Winsinstrument (Beijing) Technology Co., Ltd.); the particle diameter was measured by a Malvern laser particle size analyzer Mastersizer 2000 (available from Malvern Instruments Ltd.); the glass transition temperature and the melting temperature were measured by a thermo gravimetric analyzer Q50001R TGA (available from TA Instruments Ltd.); and the viscosity was measured by a viscometer RVF-100 (available from Brookfield Company) at 25 C. and 10 rpm of rotational speed with a rotor having a diameter of 8.71 mm. Unless otherwise specified, the raw materials of the glass powder were purchased from Beijing Asahi Electronic Materials Co., Ltd.; the ceramic powder was purchased from West Japan Trade Corporation; and the glass powder solvents were purchased from Beijing Chemical Reagent Works. The term D(n)=X m means that n100% of the powder in the glass powder blend has a particle diameter of X m or less.

Example 1

(31) 48 g of V.sub.2O.sub.5 powder, 25 g of P.sub.2O.sub.5 powder, 6 g of TeO.sub.2 powder, 3 g of copper powder, and 27 g of ceramic powder CP-0076 were mixed evenly to obtain 110 g glass powder blend, wherein the results measured by Malvern laser particle size analyzer show that, in the glass powder blend, D(0.1)=0.63 m, D(0.5)=1.56 m, D(0.9)=2.97 m, and the copper powder has an average particle diameter of 1.5 m.

(32) 100 g of the resulted glass powder blend was added to 300 g of glass powder solvent so as to obtain a glass powder paste. The components of the glass powder solvent are as follows: 160 g of ethyl cellulose, 65 g of isopropanol, 45 g of Topic-s resin (available from Nissan Chemical Co. Ltd.), 30 g of dihydroterpinyl acetate (available from Sekisui Chemical Co., Ltd.), and 30 g of ethanol.

(33) The resulted glass powder paste has a glass transition temperature Tg of 302 C., an initial melting temperature Ts of 335 C., a final melting temperature of 405 C., an expansion coefficient of 4610.sup.7/ C., and a viscosity of 126 Pa.Math.S.

(34) Substrates used for OLED are Lotus XT high-temperature glasses available from Corning Glass Company and they have an expansion coefficient of 34.510.sup.7/ C. which is similar to the expansion coefficient of the glass powder blend provided in this example.

Example 2

(35) 60 g of V.sub.2O.sub.5 powder, 18 g of P.sub.2O.sub.5 powder, 3 g of TeO.sub.2 powder, 2 g of copper powder, and 17 g of ceramic powder were mixed evenly to obtain 100 g glass powder blend, wherein the results measured by Malvern laser particle size analyzer show that, in the glass powder blend, D(0.1)=0.63 m, D(0.5)=1.56 m, D(0.9)=2.97 m, and the copper powder has an average particle diameter of 1.5 m. The ceramic powder is CP-0076 purchased from West Japan Trade Corporation.

(36) 100 g of the resulted glass powder blend was added to 100 g of glass powder solvent so as to obtain a glass powder paste. The components of the glass powder solvent are as follows: 53 g of ethyl cellulose, 23 g of isopropanol, 15 g of Topic-s resin, 5 g of dihydroterpinyl acetate, and 4 g of ethanol.

(37) The resulted glass powder paste has a glass transition temperature Tg of 316 C., an initial melting temperature Ts of 405 C., a final melting temperature of 450 C., an expansion coefficient of 46.710.sup.7/ C., and a viscosity of 114 Pa.Math.S.

(38) Substrates used for OLED are Lotus XT high-temperature glasses available from Corning Glass Company, and they have an expansion coefficient of 34.510.sup.7/ C. which is similar to the expansion coefficient of the glass powder blend provided in this example.

Example 3

(39) 46 g of PbO powder, 22 g of B.sub.2O.sub.3 powder, 13 g of ZnO powder, 3 g of copper powder, 13 g of ceramic powder, 2 g of TeO.sub.2 powder and the balance of trace components were mixed evenly to obtain 100 g glass powder blend, wherein the results measured by Malvern laser particle size analyzer show that, in the glass powder blend, D(0.1)=0.53 m, D(0.5)=1.56 m, D(0.9)=3.57 m, and the copper powder has an average particle diameter of 1.5 m.

(40) 100 g of the resulted glass powder blend was added to 285 g of glass powder solvent so as to obtain a glass powder paste. The components of the glass powder solvent are as follows: 139 g of ethyl cellulose, 65 g of isopropanol, 42 g of Topic-s resin, 26 g of dihydroterpinyl acetate, and 13 g of ethanol.

(41) The resulted glass powder paste has a glass transition temperature Tg of 297 C., an initial melting temperature Ts of 324 C., a final melting temperature of 397 C., an expansion coefficient of 4910.sup.7/ C., and a viscosity of 137 Pa.Math.S.

(42) Substrates used for OLED are Lotus XT high-temperature glass available from Corning Glass Company, and they have an expansion coefficient of 34.510.sup.7/ C. which is similar to the expansion coefficient of the glass powder blend provided in this example.

Example 4

(43) 65 g of PbO powder, 20 g of B.sub.2O.sub.3 powder, 5 g of ZnO powder, 3 g of copper powder, 6.2 g of ceramic powder and the balance of trace components were mixed evenly to obtain 100 g glass powder blend, wherein the results measured by Malvern laser particle size analyzer show that, in the glass powder blend, D(0.1)=0.53 m, D(0.5)=1.56 m, D(0.9)=3.57 m, and the copper powder has an average particle diameter of 1.5 m.

(44) 100 g of the resulted glass powder blend was added to 285 g of glass powder solvent so as to obtain a glass powder paste. The components of the glass powder solvent are as follows: 146 g of ethyl cellulose, 65 g of isopropanol, 34 g of Topic-s resin, 26 g of dihydroterpinyl acetate, and 14 g of ethanol.

(45) The resulted glass powder paste has a glass transition temperature Tg of 318 C., an initial melting temperature Ts of 364 C., a final melting temperature of 425 C., an expansion coefficient of 3410.sup.7/ C., and a viscosity of 98 Pa.Math.S.

(46) Performance Test and Comparison

(47) The glass powder paste obtained in Example 2 was used as Sample 1, and a commercially available product DP-02 (available from Continents Electronic Materials Co., Ltd., Korea) was used as Sample 2. The viscosity values of samples 1 and 2 were measured respectively, and the characters of each sample after being sintered and irradiated with laser were observed by Nikon metallographic microscope (available from Nikon Corporation, magnified 10 times), as shown in FIGS. 1-4. The evaluation results are shown in Table 1 below.

(48) TABLE-US-00001 TABLE 1 Sample 1 Sample 2 Viscosity 80,000 cps 90,000 cps Sintering temperature 420 C. 450 C. Photograph after smooth and clear rough and uneven sintering edges edges Photograph after good sealing and bad sealing and irradiation by laser no crack slight cracks

(49) It can be seen from the table that, the sintering temperature of Sample 1 containing fine copper powder is lower than that of Sample 2 without fine copper powder; and after being sintered, the edges of Sample 1 are smooth and clear whereas the edges of Sample 2 are rough and uneven. Moreover, Sample 1 after being irradiated by laser can achieve good sealing and has no crack defect, whereas Sample 2 exists slight cracks and results in bad sealing.

(50) It can be understood that, the foregoing description of the embodiments has been provided for the purpose of illustrating the principles of the present invention; however the present invention is not limited to this. Obviously, many modifications and variations will be apparent to a person skilled in the art without departing from the spirit and essence of the present invention, and these modifications and variations also fall into the scope of the invention.