TRANSISTOR ASSEMBLIES

Abstract

A transistor module assembly includes a longitudinally extending load bus bar, a longitudinally extending feed bus bar parallel to the load bus bar, and at least one transistor package operatively connected to the load and feed bus bars. The transistor package includes a drain surface and a source lead. The drain surface is operatively connected to the feed bus bar for receiving current therefrom. The source lead is operatively connected to the load bus bar for dissipating current from the transistor package to the load bus bar.

Claims

1. A transistor module assembly, comprising: a longitudinally extending load bus bar; a longitudinally extending feed bus bar parallel to the load bus bar; and at least one transistor package operatively connected to the load and feed bus bars, wherein the transistor package includes a drain surface operatively connected to the feed bus bar for receiving current therefrom, and a source lead operatively connected to the load bus bar for dissipating current from the transistor package to the load bus bar, wherein the load bus bar and the feed bus bar are opposite from one another across the transistor package in a direction perpendicular to the drain surface.

2. The transistor module assembly as recited in claim 1, further comprising a printed wiring board (PWB) operatively connected to a gate lead of the at least one transistor package.

3. The transistor module assembly as recited in claim 2, wherein the gate lead and the source lead extend from the same side of the transistor package.

4. The transistor module assembly as recited in claim 1, wherein the load bus bar includes a tab extending transversely from the load bus bar.

5. The transistor module assembly as recited in claim 4, wherein the source lead is operatively connected to the tab of the load bus bar.

6. The transistor module assembly as recited in claim 4, wherein the tab is one of a series of tabs that are longitudinally spaced apart along the load bus bar.

7. The transistor module assembly as recited in claim 1, wherein the at least one transistor package is one of multiple transistor packages, wherein each transistor package includes a respective gate lead connected to a PWB, wherein the PWB interconnects the gate leads of the multiple transistor packages.

8. The transistor module assembly as recited in claim 1, wherein an end of the load bus bar and an end of the feed bus bar are bolted to the main power connections.

9. The transistor module assembly as recited in claim 1, wherein the at least one transistor package is one of multiple transistor packages, wherein the load bus bar includes a series of longitudinally spaced apart tabs extending transversely from the load bus bar, and wherein the source lead of each transistor package is operatively connected to a respective one of the series of tabs.

10. (canceled)

11. The transistor module assembly as recited in claim 1, wherein the load bus bar is proximate to an insulated surface of the transistor package.

12. The transistor module assembly as recited in claim 1, wherein the transistor package is a MOSFET package.

13. The transistor module assembly as recited in claim 1, wherein an end of the load bus bar and an end of the feed bus bar includes respective transverse legs.

14. A transistor module assembly, comprising: a longitudinally extending load bus bar; a longitudinally extending feed bus bar parallel to the load bus bar; and at least one transistor package operatively connected to the load and feed bus bars, wherein the transistor package includes a drain surface operatively connected to the feed bus bar for receiving current therefrom, a source lead operatively connected to the load bus bar for dissipating current from the transistor package to the load bus bar, and a gate lead extending from the transistor package, wherein the gate lead and the source lead each extend from the same side of the transistor package and in the same longitudinal direction.

15. The transistor module assembly as recited in claim 14, further comprising a printed wiring board (PWB) operatively connected to the gate lead.

16. The transistor module assembly as recited in claim 14, wherein the load bus bar includes a tab extending transversely from the load bus bar.

17. The transistor module assembly as recited in claim 16, wherein the source lead is operatively connected to the tab of the load bus bar.

18. The transistor module assembly as recited in claim 16, wherein the tab is one of a series of tabs that are longitudinally spaced apart along the load bus bar.

19. The transistor module assembly as recited in claim 14, wherein the at least one transistor package is one of multiple transistor packages, wherein each respective gate lead of the multiple transistor packages is connected to a PWB, wherein the PWB interconnects the gate leads of the multiple transistor packages.

20. The transistor module assembly as recited in claim 14, wherein the load bus bar and the feed bus bar are opposite from one another across the transistor package

21. The transistor module assembly as recited in claim 14, wherein the load bus bar is proximate to an insulated surface of the transistor package.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0008] So that those skilled in the art to which the subject disclosure appertains will readily understand how to make and use the devices and methods of the subject disclosure without undue experimentation, embodiments thereof will be described in detail herein below with reference to certain figures, wherein:

[0009] FIG. 1 is a schematic view of an exemplary embodiment of a transistor module assembly constructed in accordance with the present disclosure, showing the load bus bar and the feed bus bar having transistor packages operatively connected thereto;

[0010] FIG. 2A is a schematic view of a cross-section of the transistor module assembly of FIG. 1, showing the gate lead mounted to the PWB;

[0011] FIG. 2B is a schematic view of a cross-section of the transistor module assembly of FIG. 1, showing the source lead connected to one of the tabs of the load bus bar; and

[0012] FIG. 3 is a schematic view of another exemplary embodiment of a transistor module assembly constructed in accordance with the present disclosure, showing longitudinally extending bus bars, each with respective transverse end legs.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Reference will now be made to the drawings wherein like reference numerals identify similar structural features or aspects of the subject disclosure. For purposes of explanation and illustration, and not limitation, a partial view of an exemplary embodiment of a transistor module assembly in accordance with the disclosure is shown in FIG. 1 and is designated generally by reference character 100. Other embodiments of transistor module assembly and methods of making transistor module assemblies in accordance with the disclosure, or aspects thereof, are provided in FIGS. 2A-3, as will be described. The systems and methods described herein can be used in electrical systems, such as in aircraft power distribution systems, though the present disclosure is not limited to aircraft or to power distribution systems in general.

[0014] As shown in FIG. 1, a transistor module assembly 100 includes a longitudinally extending load bus bar 104, and a longitudinally extending feed bus bar 102 parallel to load bus bar 104. Transistor module assembly 100 includes transistor packages 106 operatively connected to the load and feed bus bars, 104 and 102, respectively. Transistor packages 106 can include a variety of devices, e.g. solid-state switch devices such as, metal-oxide-semiconductor field-effect-transistors (MOSFET), insulated-gate bipolar-transistors (IGBT), or any other suitable type of switch device. Because the primary currents in and out of transistor packages 106 flow through major bus bars, as opposed to the printed wiring board (PWB), transistor module assembly 100 provides very low impedance connections to the feed/drain and load/source sides of transistor packages 106. This allows for more power and heat to flow in and out and results in a modular structure that is easily assembled into a large array of devices for high power applications.

[0015] With continued reference to FIG. 1, load bus bar 104 includes a series of longitudinally spaced apart tabs 108 extending transversely from load bus bar 104. Load bus bar 104 and feed bus bar 102 are opposite from one another across transistor package 106. An end of load bus bar 104 and an end of feed bus bar 102 are operatively connected to main power connections 118 (schematically shown). Feed bus bar 102 and main power connections 118 can be bolted together, soldered together, brazed together, or the like. Those skilled in the art will readily appreciate that, in the case of feed bus bar 102, main power connections 118 can be to a main power bus, and, for load bus bar 104, main power connections 118 can be electrically connected with one or more power-consuming devices or loads.

[0016] As shown in FIGS. 2A and 2B, each transistor package 106 includes a drain surface 107 is operatively connected to feed bus bar 102, e.g. can be soldered, bolted, or fastened in another manner, for receiving current from feed bus bar 102. Each transistor package 106 includes a respective gate lead 110. A PWB 114 is operatively connected to each gate lead 110 and interconnects gate leads 110 of multiple transistor packages 106. A source lead 112 extends from each transistor package 106 and is operatively connected, e.g. soldered or otherwise fastened, to a respective one of tabs 108 for conducting current from transistor package 106 to load bus bar 104. Source lead 112 is also operatively connected, e.g. soldered to, PWB 114. Source lead 112 used as a reference for gate lead 110. Gate lead 110 and source lead 112 extend from the same side of transistor package 106. Load bus bar 104 is adjacent to an insulated surface 120 of each transistor package 106. There can be a gap between load bus bar 104 and insulated surface 120, as shown in the figures, or load bus bar 104 can directly abut surface 120. The insulation material, not shown, can be positioned between insulated surface 120 and load bus bar 104. Both feed bus bar 102 and load bus bar 104 also carries heat from transistor package 106 out to main power connections 118, which improves overall heat dissipation from the array, thus resulting in high packaging density capabilities.

[0017] As shown in FIG. 3, a transistor module assembly 300 is similar to a transistor module assembly 100 described above. Transistor module assembly 300 includes a longitudinally extending load bus bar 304, a longitudinally extending feed bus bar 302 parallel to load bus bar 304, and transistor packages 306 operatively connected to load and feed bus bars, 304 and 302, respectively. Longitudinally extending load bus bar 304, longitudinally extending feed bus bar 302, and transistor packages 306, are all similar to longitudinally extending load bus bar 104, longitudinally extending feed bus bar 102, and transistor packages 106, respectively. Transistor module assembly 300, however, includes a longitudinally extending load bus bar 304 and a longitudinally extending feed bus bar 302 with respective transverse legs 330. By using transverse legs 330, the assembly is easily accessed for fastening via the top and bottom of assembly 300, e.g. the right side of transverse leg 330 on the right and the left side of transverse leg 330 on the left, as oriented in FIG. 3, allowing for access for mounting to main power connections 318 without interference from adjacent modules being in the way. This orientation provides for additional versatility in creating the electrical connections between load and feed bus bars, 304 and 302, and main power connections 318.

[0018] The methods and systems of the present disclosure, as described above and shown in the drawings provide for transistor module assemblies with superior properties including reduced electrical impedance and/or reduced heat generation from electrical current flow traversing the transistor module assemblies. While the apparatus and methods of the subject disclosure have been shown and described with reference to preferred embodiments, those skilled in the art will readily appreciate that change and/or modifications may be made thereto without departing from the scope of the subject disclosure.