PROCESS FOR PROVIDING INORGANIC POLYMER CERAMIC-LIKE MATERIALS

Abstract

A process for providing inorganic polymer ceramic-like materials. The process comprises providing a first material which comprises at least one non-oxide ceramic powder, and, at least one metal oxide, and providing a second material which comprises a caustic slurry composed of alkaline water and a solvent, and, combining the materials with stirring. There is also provided a composition of matter provided by the above-mentioned process which is a chemically bonded ceramic polymer comprising metal oxide and non-oxide ceramic bonds.

Claims

1. (canceled)

2. A composition as claimed in claim 10 wherein the non-oxide ceramic is covalently bonded to the polymer backbone.

3. A process for providing inorganic polymer ceramic-like materials, said process comprising: A. providing a first material which comprises at least one non-oxide ceramic powder, and, at least one metal oxide; B. providing a second material which comprises a caustic slurry composed of alkaline water and a solvent; C. combining A. and B. and stirring.

4. A process as claimed in claim 3 wherein, in addition, there is present a material to cause an internal exothermal reaction to cure the materials.

5. A product produced by the process of claim 4.

6. A process as claimed in claim 4 wherein the at least one non-oxide ceramic powder is selected from the group consisting essentially of SiC, SiN, TiN, BC, WC, and BN.

7. A process as claimed in claim 3 wherein the at least one metal oxide is selected from the group consisting of alumina oxide, silicon oxide, magnesium oxide, lithium oxide, and calcium oxide.

8. A process as claimed in claim 3 wherein the solvent is selected from the group consisting essentially of methanol, ethanol and reactive amorphous carbon.

9. The process as claimed in claim 3 wherein, in addition, there is present other materials selected from the group consisting of fillers, and fibers.

10. A composition of matter produced by combining: a. a non-oxide ceramic, b. a polymer selected from the group consisting of: i. an amorphous polymer, and, ii. a microcrystalline polymer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] FIG. 1 is a flow diagram showing flexural strength data for non-oxide additive, compared to identical 2 batches of formulations without the additive cured at 87 C. (std1, std2) and 107 C. (std1 high temp, std2 high temp).

DETAILED DESCRIPTION OF THE INVENTION

[0014] There has been discovered a family of advanced inorganic/organic hybrid composite polymer ceramic containing mixed oxide and non-oxide metal bonds. These polymer materials can be euphonically described as thermoset ceramics. The material combines strength, hardness and high temperature performance of technical ceramics with the strength, ductility, thermal shock resistance, density, and easy processing of a polymer. The unique chemical structure of the polymer materials provide tailored strength properties, hardness, toughness and wear properties.

[0015] There has also been discovered a class of materials and methods to coat parts to form a controlled porosity, thermal conduction, emissivity, surface hardness, flexibility, toughness, elongation, electrical conduction, density, electromagnetic properties.

[0016] Due to the highly tailorable nature of the ceramic materials' properties, its compatibility with functional additives, ease of fabrication, and high strength-to-weight ratio, there are many applications to which it can be applied. Chemically bonded ceramic formulations can be customized to provide system components that are not only application-tailored in their shape, but in their physiochemical properties as well. In addition to the ceramics versatility in terms of manufacturing parts and components from the material itself, the material also has several applications for use in the coating industry. The chemical inertness and temperature resistance of the material to 3400 f. allows it to be used to coat both nonferrous and ferrous metals and metal alloys. Due to its high dimensional stability at high temperatures and low reactivity, the material can allow a disruptive innovation in allowing steel to be made non-corroding, low friction, low electrical and heat conducting. The tailorable thermal conductivity of the material is of especially great interest

[0017] The Chemically boded ceramic has several readily apparent dimensions of appeal: Its composition can be composed of available refined feed stocks, and can optionally include various quantities of USA-sourced technical grade postindustrial waste stream materials, offsetting both bulk material costs and decreasing environmental impact of formulation.

[0018] It contains no formaldehyde, VOC's, or heavy metals, thus mitigating personnel safety risk.

It is potentially amenable to 3D-printing-based rapid prototyping and fabrication methodologies; applications include rapid production of both part and molds
When used as a mold, the HCPC material can be tooled quickly in gel state, thereby minimizing machine time and labor expenses.

[0019] If used as a mold, its high temperature stability and thermal conductivity allows for fast demold times of both cast metals, and sequentially, thermoset/plastics.

[0020] The same mold can be used to cast multiple material types, including LiAl alloys, Steel, and as well as organic polymers.

[0021] A new method for producing a new class of inorganic polymer ceramic like materials is disclosed. The polymers are a mixture of metal oxide and non-oxide ceramics. The polymers are useful as a mold tooling, coatings, foams and a wide range of products with ceramic like properties. The polymer may be sprayed, cast, milled, printed or a combination thereof. Functionality can be modified with additives to modify toughness, strength, hardness, thermal conductivity, emissivity appearance etc. The polymer may be homogenous or heterogeneous with different hardness, toughness, strength, wear or conductive properties.

[0022] Resin requires at least SiCC. The instant invention has only one SiC, or so it is theorized. The curable resin composition according to the present invention may further include an inorganic filler. The inorganic filler is exemplified by, but not limited to, nanosilica, nanotitania, nanozirconia, carbon nanotubes, silica, alumina, mica, synthetic mica, talc, calcium oxide, calcium carbonate, zirconium oxide, titanium oxide, barium titanate, kaolin, bentonite, diatomaceous earth, boron nitride, aluminum nitride, silicon carbide.

[0023] The present invention disclosed is unique from existing prior art in both its fundamental composition of matter, and perhaps more notable, its mechanism of synthesis. The reaction pathway by which the disclosed material is obtained proceeds through first the dissolution of the amorphous silicon, alumina, carbon, and alkali metal (LiOH), in an alkaline solution co-solvated with one or more polar aprotic or protic solvents. This solution hardens into a gel-state as a result silanol condensation complimented by of cationic stabilization of the free labile anionic network forming elements (Al, Si, O, C). The physical properties of this gel state, and the states immediately preceding it, are largely a function of the relative concentration of divalent cations: monovalent cations to network forming elements (Al, Si, O, C).

[0024] This gel is stable between several minutes to several months, after which it will undergo dehydration-mediated shrinkage and cracking. The gel state is then subjected to curing at elevated temperatures and humidity, consisting of various pH water and solvents, at various pressures. During this curing, the reactivity of the system increases as solvolysis of the gel system recuperates alkalinity of the system, re-dissolving the silanol condensation product to a greater or lesser extent, and mediating a complete amorphous structure formation of the network forming elements (Al, Si, O, C).

[0025] The added heat of the system overcomes the endothermic barrier preventing the network forming reactions from taking place previously. Al and Si are bound via bridging oxygen generated via hydrolysis, which consumes alkalinity of the gel, and CSi, SiCSi and potentially metastable AlC, bonds are formed. The fundamental monomer of the reaction may be any variation of O, Al, C, and Si, e.g. AlOSiCSiOAlO. More monocationic species will lead to a more polymeric and generally weaker structure, whereas divalent cationic species, preferably Li, serve to create an even greater degree of crosslinking. Ca++ and Mg++ are less preferable due to their tendencies to rapidly form hydrates which often do not re-dissolve in the second phase of the reaction.

EXAMPLES

[0026] As shown in FIG. 1, the polymer material is processed as a reactive two-part material, similar to epoxy. During the fabrication process, the material as mixed can have a viscosity from 500 to 25,000 cPS. The lower viscosity is better for spraying thin films. The medium viscosity is best for casting parts in forms, while the higher viscosity is suitable as a extruded or prilled. The spray techniques may include air spraying, airless spraying, electro spraying, rotary cone spraying, and ultrasonic spraying.

[0027] The final cure reaction occurs when the gel state part is exposed to temperatures of 160-250 F for 2-6 hours. Longer curing times yield stronger materials. This cures the polymer to an advanced ceramic-like state. Shrinkage is in the range of less than 0.01%, allowing very fine tolerances. A molecularly-smooth surface allows for low cost high performance, rapid, complex parts manufacture with excellent surface texture. The texture may be smooth and high gloss or may be made matte as desired. The advanced hybrid is a suitable alternative for critical and strategic coatings.

Example 1

[0028] A Solid Component comprising:

[0029] 170 g Fly Ash

[0030] 80 g Silicon Carbide

[0031] A Liquid Component comprising:

[0032] 8.5 g Methanol

[0033] 23.9 Sodium hydroxide

[0034] 0.4 ethylene glycol

[0035] 4.6 g borax

[0036] 3.3 g 37% formalin

[0037] 95.1 8 g 40% sodium silicate solution

[0038] 4.2 g Water

[0039] The solid component was blended into the liquid component to make a fully mixed slurry. The slurry was poured into a form and allowed to form a hydrogel for two hours. The form was removed and the solid hydrogel placed in a polyethylene bag, sealed and cured for 12 hours at 80 C. The cured ceramic was removed from the bag.

Example 2

Example 2

[0040] Flexural strength data for Non-oxide additive, compared to identical 2 batches of formulations without the additive cured at 87 C. (std1, std2) and 107 C. (std1 high temp, std2 high temp). For the examples, the activator was blended with the dry components into a slurry and cast into a bar form. The slurry was cured for 24 hours at either 87 C. or 107 C. as indicated in each example. The flex data was generated using ASTM C 1341.

B4C-110: 135 g Activator, 175 g Fly ash, 2 g sodium poly-methyl methacrylate, 110 g boron carbide
B4C-63: 135 g Activator, 175 g Fly Ash, 2 g sodium poly-methyl methacrylate, 63 g boron carbide
B4C-93: 135 g Activator, 175 g Fly Ash, 2 g sodium poly-methyl methacrylate, 93 g boron carbide
Eut: 135 g Activator, 175 g Fly Ash), 2 g sodium poly-methyl methacrylate, 27 g SiC, 83 g boron carbide
SiC-120: 135 g Activator, 175 g Fly Ash, 2 g sodium poly-methyl methacrylate, 120 g boron carbide
SiC-201: 135 g Activator, 175 g Fly Ash, 2 g sodium poly-methyl methacrylate, 201 g boron carbide
SiC-80: 135 g Activator, 175 g Fly Ash, 2 g sodium poly-methyl methacrylate, 80 g boron carbide

Std1 or 2: 135 g Activator, 175 g Fly Ash

[0041] Activator Solution

[0042] 7 g Methanol

[0043] 20 g potassium hydroxide

[0044] 1.8 g ethylene glycol

[0045] 3.6 g borax

[0046] 3.4 g formalin

[0047] 99.2 g 40% sodium silicate solution