Current and/or voltage sensor device with a memory element

Abstract

A voltage and or current sensor device for use in medium- or high voltage application, wherein a sensor or sensors of the sensor device is or are arranged in a housing. To enhance communication between the sensor and an electronical device, in order to use maximum possible accuracy potential of the voltage and current sensors, a signal and/or data memory element is integrated in the sensor housing, or placed near the sensor such that the sensor device output signal can be directly evaluated.

Claims

1. A voltage sensor device, comprising: at least one voltage sensor, wherein the sensor or sensors of the sensor device is or are arranged in a sensor housing; a signal and/or data memory element; information about a correction factor or actual transformation ratio of the sensor stored in the memory element; a connector configured to connect a measuring device to the voltage sensor device; one or more first wires connected to the sensor and the connector to output a sensor signal to the measuring device; one or more second wires connected to the memory element and the connector to transfer the information about the correction factor or actual transformation ratio to the measuring device; a primary impedance element of a voltage divider of the voltage sensor, placed in the sensor housing; and a secondary impedance element of the voltage divider of the voltage sensor, placed or integrated in the connector or a boot thereof.

2. The voltage sensor device according to claim 1, wherein the sensor housing or the sensor device housing is made of a resin, or of plastic with a filling of insulating material.

3. The voltage sensor device according to claim 1, wherein the voltage sensor device is equipped with a signal cable connector, and that the memory element is integrated in the signal cable connector equipped at the end of the output cable of the sensor device.

4. The voltage sensor device according to claim 3, wherein the device comprises: a clamp-on connector boot for fixation for a cable and RJ45 connector.

5. The voltage sensor device according to claim 1, wherein the memory element is within a housing made of insulating material.

6. The voltage sensor device according to claim 1, wherein the memory element is within a housing made of semiconductive material.

7. The voltage sensor device according to claim 1, wherein the memory element is within a housing made of conductive material.

8. The voltage sensor device according to claim 1, wherein the memory element is an Electrically Erasable Programmable Read-Only Memory (EEPROM) element, which is provided with correction and/or calibration factors of the sensors and/or with additional data, in addition to storing measurement data.

9. The voltage sensor device according to claim 2, wherein the voltage sensor device is equipped with a signal cable connector, and that the memory element is integrated in the signal cable connector equipped at the end of the output cable of the sensor device.

10. The voltage sensor device according to claim 9, wherein the device comprises: a clamp-on connector boot for fixation for a cable and RJ45 connector.

11. The voltage sensor device according to claim 10, wherein the memory element is within a housing made of insulating material.

12. The voltage sensor device according to claim 10, wherein the memory element is within a housing made of semiconductive material.

13. The voltage sensor device according to claim 10, wherein the memory element is within a housing made of conductive material.

14. The voltage sensor device according to claim 10, wherein the memory element is an Electrically Erasable Programmable Read-Only Memory (EEPROM) element, which is provided with correction and/or calibration factors of the sensors and/or with additional data, in addition to storing measurement data.

15. The voltage sensor device according to claim 1, wherein the memory element is integrated in the sensor housing, or placed in a cavity in the sensor housing.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Exemplary embodiments are shown in following figures:

(2) FIG. 1 shows exemplary placement of a memory element inside an insulating body or in a cavity of the current and/or voltage sensing device;

(3) FIG. 2 shows exemplary placement of the memory element outside of the insulating body of the current and or voltage sensing device;

(4) FIG. 3 shows an RJ45 connector with clamp-on boot; and

(5) FIG. 4 shows an exemplary placement of a secondary impedance element of the voltage divider.

DETAILED DESCRIPTION

(6) Exemplary embodiments of a device disclosed herein can enhance correspondence between the sensor and the electronical device, in order to use maximum possible accuracy potential of the voltage and/or current sensors.

(7) For example, a signal and/or data memory element is integrated in the sensor housing, or placed near the sensor such that the sensor device output signal can be directly evaluated.

(8) So it is realized, that each individual sensor is able to store its individual signal history as well as the individual calibration data set or actual transformation ratio information. This results furthermore in sensors with high accuracy.

(9) Fortunately the housing can be a housing formed as a resin or plastic case filled by some material, the sensor housing or the sensor device housing being made of a resin, or of plastic with a filling of insulating material. This is easy to produce.

(10) In an exemplary embodiment, the voltage and or current sensor device is equipped with a signal cable connector, and the near to the sensor placed memory element is integrated in the signal cable connector equipped at the end of the output cable of the sensor device.

(11) So the sensor device includes (e.g., consists of) at least one current and/or voltage sensor, a housing, an output cable, and a connector, placed at the end of the output cable.

(12) The memory element can be connected to the sensor device. Therefore, there could be two exemplary locations. One is to put it inside of the sensor device housing, and the other one is to place it in the boot of the connector.

(13) But it could be that the memory element is outside of the connector or sensor device housing to, for example, centralize all memory elements from all sensor devices in one substation. In that case the memory element could be located some distance from the sensor device.

(14) In an exemplary embodiment, the device is equipped with, or embellished as a clamp-on connector boot in such a way that further sensor-relevant or sensor-signal-relevant elements are integrated inside this boot or connector, and that fixation for a cable and connector connection can be used.

(15) In an exemplary embodiment, at least one impedance element, which is a secondary impedance element of a voltage divider of the voltage sensor, is placed or integrated in that boot or connector, wherein the primary impedance element of the voltage divider is placed in the sensor device housing.

(16) A connector boot in that sense is a connector housing.

(17) The housing can be made of insulating material, or semiconductive material, or a conductive material. An advantage of the use of semi-conductive or conductive material, is that by that, a electromagnetic shielding is provided.

(18) In an exemplary embodiment, the memory element is an Electrically Erasable Programmable Read-Only Memory (EEPROM) element.

(19) According to an exemplary method, the voltage and/or current sensor is equipped near the sensor location with an electronic device, only to this individual sensor related data memory element, in such a way, that individual historical sensing data and/or individual calibration or parameter data are implemented into this data memory, and this data memory communicates automatically with a central calculation and/or monitoring device.

(20) In case more than one sensing device is connected to same electronic device, one memory element containing information related to all connected sensing devices can be used. In that case it has to be assured, that sensing elements cannot be mixed and can be properly identified in order to assign correct parameters/correction data, stored in a memory element, to an appropriate sensing element.

(21) In an exemplary embodiment, the correspondence (i.e., communication) between the data memory and the output evaluating device is operated via electrical wires, or via wireless access.

(22) An exemplary modification of the method is that the data memory is furthermore equipped with an electronic device to retrieve its sensor data automatically after plug-on of the cable to be monitored.

(23) So the memory element can be an Electrically Erasable Programmable Read-Only Memory (EEPROM) element, which is provided with correction factors of premanufactured sensors, additionally to its function of storing measurement data.

(24) Exemplary embodiments include the use of a memory element which can be used to store the data related to the voltage and/or current sensing devices. Such data could be directly read by the connected measuring devices, without the need for manual insertion of the data into the measuring device. Location of such a memory element could be either in a cavity of a sensing device, where the output cable is being connected, or at the end of the cable where connector is used to provide standardized termination or interface to the measuring devices.

(25) Exemplary embodiments can use an additional memory element, such as an EEPROM, which contains information about a value of a correction factor or actual transformation ratio. Information about a correction factor or actual transformation ratio is inserted into the memory element during routine tests of the voltage and/or current sensing devices. This information will be read by the measuring devices, once they are connected to the voltage and/or current sensing elements, thus enabling precise transfer of the information about a correction factor or factors or actual transformation ratio from the sensing device into the measuring device. Once this information enters the measuring device, it will be stored there and the measuring device does not need to further communicate or transfer the information about a correction factor or ratio again from the memory element inside of the sensing device.

(26) A memory element can store data about correction factors or an actual transformation ratio, once this device is used, and it can recover and store much more information, such as serial number, type designation, production data, name of producer, parameters, dimensions, setting parameters, correction curves or look-up tables etc.

(27) A location of the memory element (3) can varied based on a particular design of a voltage and/or current sensing device (1). In case there is a need for strong mechanical protection, it is possible to place the memory element into the insulating body of a voltage and/or current sensing device (1) or in a cavity (2) that is later properly fixed or covered, see FIG. 1.

(28) Access of the connected measuring device to the memory element (3) can be done by means of one wire or more wires (8) and (9). Output wires (6) and (7) coming out of current and/or voltage sensing device are not affected by the signal going to/from the memory element (3). All wires (6), (7), (8) and (9) are located within the same connector, so once the sensing device is connected to the measuring device, connection to the memory element is enabled as well.

(29) Common memory elements implement communication protocols such as I.sup.2C integrated circuits, or SPI (serial periperical interface bus) requiring 3 or more wires for the power supply of the memory element and for the data transfer. For simpler integration and lower costs it can be desirable to reduce the number of wires required by the memory element. It therefore can be beneficial to use a memory element where both the power supply function and the data transfer functions are achieved via one single wire such as in a 1-wire bus system.

(30) Additionally, a temperature sensor may be installed in the sensor device sharing the same wires with the memory element. The temperature sensor may be included in the same integrated circuit with the memory element or in a separate integrated circuit.

(31) In case the insulating body of the sensing device exerts excessive mechanical pressure or temperature during a production process or during operation, it is beneficial to locate the memory element outside of the insulating body. In case the output cable is a part of a voltage and/or current sensing device, it might be possible to place the memory element at the end of that cable, simply there, where output wires of the sensing device might be easily accessible, see FIG. 2.

(32) In case the memory element (3) is placed at the end of cable (4) and in case such end is equipped with a connector (5), the memory element can be placed within the connector (5) or in a connector boot.

(33) In an exemplary embodiment, such a connector (5) could be an RJ45 connector, with clamp-on boot for insulation and mechanical protection of that connector, having a cavity, which enables insertion of a small memory element. See FIG. 3.

(34) FIG. 4 shows a housing of the sensor device 1, wherein is located a first voltage divider impedance 20. In this Figure, voltage detectors or indicators, secondary impedances are located outside of the body or housing 1, which contains a primary impedance. Secondary impedance 30 can be included inside of the electronic devices to which a voltage detector is connected. Together, they can operate as voltage divider. As the products can be produced separately, it can be difficult to achieve very precise accuracy.

(35) Therefore for a proper adjustment of voltage division accuracy after casting, it can be helpful to have both primary and secondary impedances aligned and tested together as one device.

(36) As shown in FIG. 4, a voltage sensing device includes (e.g., consists of) primary terminal 10, primary impedance 20, secondary impedance 30, insulating body 40, output cable 4 with two output wires and output connector 5. Secondary impedance 30 is located in the separate connector boot, in a further intermediate terminal box. If so, the intermediate box can require an additional connection of the output cable and secondary impedance 30 and it also should be subsequently covered to prevent environmental influences and surrounding electric and/or magnetic fields in service. This may lead to higher costs of the device and also towards bigger or non-symmetric size of divider housing.

(37) It will be appreciated by those skilled in the art that the present invention can be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The presently disclosed embodiments are therefore considered in all respects to be illustrative and not restricted. The scope of the invention is indicated by the appended claims rather than the foregoing description and all changes that come within the meaning and range and equivalence thereof are intended to be embraced therein.