Power tube connection structure of power amplifier and power amplifier

Abstract

A power tube connection structure includes a substrate, a printed circuit board, and a power tube, where a through groove allowing the power tube to pass through is cut into the printed circuit board, a mounting groove is cut into the upper surface of the substrate at a location corresponding to the through groove, one end of the power tube extends through the through groove, and is welded onto a bottom face of the mounting groove, the end of the power tube that extends into the mounting groove abuts onto a side wall of the mounting groove close to an output end of the power amplifier, and a solder flux escape channel is made into the side wall of the mounting groove close to the output end of the power amplifier.

Claims

1. A power tube connection structure of a power amplifier, comprising: a substrate; a printed circuit board covering an upper surface of the substrate; and a power tube; wherein the printed circuit board comprises a through groove configured to allow the power tube to pass through; wherein the substrate comprises a mounting groove cut into the upper surface of the substrate at a location that corresponds to the through groove; wherein one end of the power tube extends through the through groove, is welded to a bottom face of the mounting groove, and abuts a side wall of the mounting groove; wherein the mounting groove comprises a solder flux escape channel disposed in the side wall of the mounting groove; wherein the solder flux escape channel comprises a first opening disposed in the side wall of the mounting groove; wherein there is a gap between an inner wall of the through groove in the printed circuit board and an outer wall of the power tube; wherein the first opening is a semi-circular opening perpendicular to the bottom face of the mounting groove.

2. The power tube connection structure according to claim 1, wherein the power tube comprises a pin disposed over an upper surface of the printed circuit board, and the pin comprises a through hole at a location that corresponds to the first opening.

3. The power tube connection structure according to claim 1, wherein the printed circuit board comprises a second opening at a location that corresponds to the first opening.

4. The power tube connection structure according to claim 3, wherein the power tube comprises a pin disposed over an upper surface of the printed circuit board, and the pin comprises a through hole at a location that corresponds to the first opening.

5. The power tube connection structure according to claim 1, wherein the side wall of the mounting groove comprises a side push hole perpendicular to the bottom face of the mounting groove.

6. The power tube connection structure according to claim 1, further comprising: multiple protruding supports disposed in one plane on the bottom face of the mounting groove, wherein a height difference between the protruding supports and the bottom face of the mounting groove is in the range of 0.1-0.2 mm.

7. The power tube connection structure according to claim 6, wherein the multiple protruding supports comprise four protruding supports, wherein two protruding supports of the four protruding supports are disposed at a location corresponding to an output end of the power amplifier, and the other two protruding supports of the four protruding supports are disposed at a location corresponding to an input end of the power amplifier.

8. A power amplifier, comprising a power tube connection structure, the power tube connection structure comprising: a substrate; a printed circuit board covering an upper surface of the substrate; and a power tube; wherein the printed circuit board comprises a through groove configured to allow the power tube to pass through; wherein the substrate comprises a mounting groove cut into the upper surface of the substrate at a location that corresponds to the through groove; wherein one end of the power tube extends through the through groove, is welded to a bottom face of the mounting groove, and abuts a side wall of the mounting groove; wherein the mounting groove comprises a solder flux escape channel disposed in the side wall of the mounting groove; wherein the solder flux escape channel comprises a first opening disposed in the side wall of the mounting groove; wherein there is a gap between an inner wall of the through groove in the printed circuit board and an outer wall of the power tube; wherein the first opening is a semi-circular opening perpendicular to the bottom face of the mounting groove.

9. The power amplifier according to claim 8, wherein the power tube comprises a pin disposed over an upper surface of the printed circuit board, and the pin comprises a through hole at a location that corresponds to the first opening.

10. The power amplifier according to claim 8, wherein the printed circuit board comprises a second opening at a location that corresponds to the first opening.

11. The power amplifier according to claim 10, wherein the power tube comprises a pin disposed over an upper surface of the printed circuit board, and the pin comprises a through hole at a location that corresponds to the first opening.

12. The power amplifier according to claim 8, wherein the side wall of the mounting groove comprises a side push hole perpendicular to the bottom face of the mounting groove.

13. The power amplifier according to claim 8, wherein the power tube connection structure further comprises: multiple protruding supports disposed in one plane on the bottom face of the mounting groove, wherein a height difference between the protruding supports and the bottom face of the mounting groove is in the range of 0.1-0.2 mm.

14. The power amplifier according to claim 13, wherein the multiple protruding supports comprise four protruding supports, wherein two protruding supports of the four protruding supports are disposed at a location corresponding to an output end of the power amplifier, and the other two protruding supports of the four protruding supports are disposed at a location corresponding to an input end of the power amplifier.

Description

BRIEF DESCRIPTION OF DRAWINGS

(1) To describe technical solutions in embodiments of the present invention or in the prior art more clearly, the following briefly describes the accompanying drawings for describing the embodiments or the prior art. The accompanying drawings corresponding to the described embodiments of the present invention in the following description show merely some embodiments of the present invention, and a person of ordinary skill in the art may still derive other drawings from these accompanying drawings without creative efforts.

(2) FIG. 1 is a schematic structural diagram of a drop-in power amplifier in the prior art;

(3) FIG. 2 is a schematic diagram of a power tube connection structure of a power amplifier according to an embodiment of the present invention; and

(4) FIG. 3 is a schematic structural diagram of a substrate in a power tube connection structure of a power amplifier according to an embodiment of the present invention.

DESCRIPTION OF EMBODIMENTS

(5) The following clearly describes technical solutions in embodiments of the present invention with reference to the accompanying drawings. The described embodiments are merely some but not all of the embodiments of the present invention. All other embodiments obtained by a person of ordinary skill in the art based on the described embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

(6) In the descriptions of the present invention, it should be understood that, position or location relationships indicated by the terms center, upper, lower, ahead, behind, left, right, perpendicular, horizontal, top, bottom, inner, outer, and the like are exemplary position or location relationships based on the accompanying drawings, and are merely intended for ease of describing the present invention and simplification of description, instead of indicating or implying that the apparatuses or components referred to need to be provided in a particular position or be constructed and operated in a particular position, and therefore, shall not be understood as limitations applicable to all embodiments of the present invention.

(7) The terms first and second are merely intended for a purpose of description, and shall not be understood as an indication or implication of relative importance or an implicit indication of a quantity of indicated technical features. Therefore, a feature modified by first or second may explicitly or implicitly include one or more such features. In the descriptions of the present invention, unless otherwise indicated, the meaning of multiple is two or more.

(8) Referring to FIG. 2, FIG. 2 shows a power tube connection structure of a power amplifier according to an exemplary embodiment of the present invention. The power tube connection structure of a power amplifier includes a substrate 1, a printed circuit board 2 covering an upper surface of the substrate 1, and a power tube 3. A through groove 21 allowing the power tube 3 to pass through is cut into the printed circuit board 2. A mounting groove 11 is cut into the upper surface of the substrate 1 at a location that is corresponding to the through groove 21. One end of the power tube 3 extends through the through groove 21, and is welded onto a bottom face of the mounting groove 11. The end of the power tube 3 that extends into the mounting groove 11 abuts onto a side wall of the mounting groove 11 that is close to an output end of the power amplifier. A solder flux escape channel 12 is made into the side wall of the mounting groove 11 that is close to the output end of the power amplifier.

(9) According to the power tube connection structure of a power amplifier provided in this embodiment of the present invention, a solder flux escape channel 12 is made into a side wall of a mounting groove 11 that is close to an output end of the power amplifier. During welding, gas solder flux can flow out of the power amplifier through the solder flux escape channel 12, preventing a solder void from forming at the bottom of a power tube 3.

(10) In an embodiment of the present invention, the solder flux escape channel 12 is a first opening made into the side wall of the mounting groove 11 that is close to the output end of the power amplifier. For the convenience of discharge of gas solder flux, there is a gap (not shown in the figure) left between an outer wall of the power tube 3 and an inner wall of the through groove 21 in the printed circuit board 2. Gas solder flux flows into the first opening from the bottom of the power tube 3, flows from the bottom up in the first opening and flows out from the top of the first opening, and is discharged out of the power amplifier through the gap left between the outer wall of the power tube 3 and the inner wall of the through groove 21 in the printed circuit board 2. This is convenient for discharge of the gas solder flux.

(11) In another embodiment of the present invention, referring to FIG. 2, the solder flux escape channel 12 is a first opening made into the side wall of the mounting groove 11 that is close to the output end of the power amplifier. There is no gap left between an outer wall of the power tube 3 and an inner wall of the through groove 21 in the printed circuit board 2, but a second opening 22 is made into the printed circuit board 2 at a location that is corresponding to the first opening. In this case, gas solder flux flows sequentially from the bottom up through the first opening and the second opening 22, and is discharged out of the power amplifier from the top of the second opening 22.

(12) Referring to FIG. 2, the power tube 3 usually includes a pin 31 laid over an upper surface of the printed circuit board 2, while the pin 31 blocks discharge of gas solder flux to a degree. In order that the gas solder flux is discharged more smoothly, a through hole 311 is made into the pin 31 at a location that is corresponding to the first opening. In this way, the blocking effect of the pin 31 on the gas solder flux is reduced, and therefore, discharge of the gas solder flux is smoother.

(13) To reduce difficulty of processing, the first opening is a semi-circular opening perpendicular to the bottom face of the mounting groove 11. For the substrate 1, a semi-circular chamfer is usually processed by using a milling technology, and therefore, the semi-circular opening may be processed by using the same technology. This reduces processing steps and therefore reduces the difficulty of processing.

(14) Referring to FIG. 3, to make it convenient to push the power tube 3 toward a side of the mounting groove 11 that is close to the output end of the power amplifier, a side push hole 13 perpendicular to the bottom face of the mounting groove 11 is made into a side wall of the mounting groove 11 that is close to an input end. A cylindrical pin may be inserted into the side push hole 13. As the cylindrical pin is inserted, the cylindrical pin may squeeze an edge of the power tube 3, so that the power tube 3 moves toward the side of the mounting groove 11 that is close to the output end of the power amplifier, until there is no gap left between the output end of the power amplifier and the side wall of the mounting groove 11 that is close to the output end of the power amplifier.

(15) Different materials are used for the substrate 1 and the power tube 3 whose thermal expansion rates also vary greatly. As a result, tearing is likely to occur during welding, damaging the materials. Therefore, as shown in FIG. 3, multiple protruding supports 14 are laid in one plane on the bottom face of the mounting groove 11. A height difference between the protruding supports 14 and the bottom face of the mounting groove 11 is 0.1-0.2 mm. The protruding supports 14 provide support for the power tube 3, making room for distortion buffer between the substrate 1 and the power tube 3. This reduces the occurrence of tearing.

(16) To improve welding precision between the substrate 1 and the power tube 3, there are four protruding supports 14. Two protruding supports 14 are laid close to the output end of the power amplifier. The rest two protruding supports 14 are laid close to an input end of the power amplifier. In this way, the power tube 3 and the substrate 1 are parallel to each other, and solder is more evenly fed during welding. Therefore, the welding precision between the substrate 1 and the power tube 3 is improved.

(17) An embodiment of the present invention further provides a power amplifier, including the power tube connection structure of a power amplifier according to any one of the foregoing embodiments.

(18) According to the power amplifier provided in this embodiment of the present invention, a solder flux escape channel 12 is made into a side wall of a mounting groove 11 that is close to an output end of the power amplifier. During welding, gas solder flux can flow out of the power amplifier through the solder flux escape channel 12, preventing a solder void from forming at the bottom of a power tube 3.

(19) Other components and the like of the power amplifier in this embodiment of the present invention are well known to a person skilled in the art, and details are not described herein.

(20) The foregoing descriptions are merely specific implementation manners of the present invention, but are not intended to limit the protection scope of the present invention. Any variation or replacement readily figured out by a person skilled in the art within the technical scope disclosed in the present invention shall fall within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims. Additionally, statements made herein characterizing the invention refer to an embodiment of the invention and not necessarily all embodiments.