Connecting structure

Abstract

A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.

Claims

1. A connecting structure, comprising: insulation base, wherein the insulation base is a hollowed annular plate and comprises a first surface, a second surface, and a lateral surface connecting the first surface and the second surface, first grooves are defined on the first surface, second grooves are defined on the second surface, and third grooves are defined on the lateral surface, each of the third grooves connects one of the first grooves and one of the second grooves; first pads deposited in the first grooves; second pads deposited in the second grooves; wiring portions deposited in the third grooves, wherein each of the wiring portions connects one of the first pads and one of the second pads; a conductive ink layer coated on the first pads and the second pads; and a protective ink layer coated on the wiring portions and the insulating base except for the first pads and the second pads; and wherein the first grooves and the second grooves are both stepped grooves.

2. The connecting structure of claim 1, wherein the first grooves and the second grooves have a same shape; a transverse cross-sectional shape of each of the first grooves and the second grooves is hexagonal, circular, rectangular, a cross shape, or a window shape.

3. The connecting structure of claim 1, wherein in the transverse cross-section, a diameter of each first groove is decreased in a direction from the first surface to the second surface, and a diameter of each second groove is decreased in a direction from the second surface to the first surface.

4. The connecting structure of claim 1, wherein a distance between adjacent ones of the first grooves or adjacent ones of the second grooves ranges from 0.35 mm to 0.50 mm.

5. The connecting structure of claim 1, wherein a height of the first pad is less than or equal to a depth of the first groove, and a height of the second pad is less than or equal to a depth of the second groove.

6. The connecting structure of claim 3, wherein a height of the first pad is less than or equal to a depth of the first groove, and a height of the second pad is less than or equal to a depth of the second groove.

7. The connecting structure of claim 4, wherein a height of the first pad is less than or equal to a depth of the first groove, and a height of the second pad is less than or equal to a depth of the second groove.

8. The connecting structure of claim 1, wherein the first pad and the second pad are made of silver and copper.

9. The connecting structure of claim 1, wherein a thickness of the conductive ink layer ranges from 5 μm to 10 μm.

10. The connecting structure of claim 1, wherein a solder paste layer is printed on the conductive ink layer, the first circuit board and the second circuit board are respectively connected to the first pads and the second pads by the solder paste layer.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Implementations of the present technology will now be described, by way of embodiments, with reference to the attached figures.

(2) FIG. 1 is a flowchart of a method for connecting stacked circuit boards according to an embodiment.

(3) FIG. 2 shows an isometric view of an insulation base used in the method for connecting stacked circuit boards of FIG. 1.

(4) FIG. 3A and FIG. 3B respectively show a cross sectional view of part and a plan view of the insulation base in FIG. 2 after laser processing.

(5) FIG. 4 shows a cross sectional view of part of the insulation base in FIG. 3A after being plated.

(6) FIG. 5A to FIG. 5E show plan views of first and second pads in FIG. 4.

(7) FIG. 6 shows a cross sectional view of part of a connecting structure according to an embodiment.

(8) FIG. 7 shows a view of a side of the connecting structure in FIG. 6 for connecting the first circuit board and the second circuit board.

DETAILED DESCRIPTION

(9) It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures, and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.

(10) The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series, and the like.

(11) FIG. 1 shows a flowchart of a method for connecting stacked circuit boards 100 in accordance with an embodiment. The method is provided by way of embodiment, as there are a variety of ways to carry out the method 100. The method 100 described below can be carried out using the configurations shown in FIGS. 2-7, for example, and various elements of these figures are referenced in explaining the method 100. Each block shown in FIG. 1 represents one or more processes, methods, or subroutines, carried out in the method. Furthermore, the shown order of blocks is illustrative only and the order of the blocks can change. Additional blocks can be added or fewer blocks may be utilized, without departing from this disclosure. The example method can begin at block S101.

(12) At block S101, referring to FIG. 2, an insulation base 10 is provided. The insulation base 10 is a hollowed annular plate. The insulation base 10 includes a first surface 11, a second surface 12, and a lateral surface 13 connecting the first surface 11 and the second surface 12.

(13) In an embodiment, the insulation base 10 is rectangular. A thickness of the insulating base 10 is about 1.6 mm.

(14) At block S102, as shown in FIG. 3A and FIG. 3B, the insulating base 10 is laser processed. First grooves 14 are defined on the first surface 11, second grooves 15 are defined on the second surface 12, and third grooves 16 are defined on the lateral surface 13. Each of the third grooves 16 connects one of the first grooves 14 and one of the second grooves 15, the first grooves 14 and the second grooves 15 are both stepped grooves.

(15) Specifically, ends of each of the third grooves 16 extends to the first surface 11 and to the second surface 12 to provide communication between the first groove 14 and the second groove 15.

(16) The first groove 14 and the second groove 15 have the same shape. A transverse cross-sectional shape of the first groove 14 and the second groove 15 may be hexagonal, circular (including an ellipse), rectangular, a cross shape, or a window shape, as shown in FIGS. 5A-5E. In an embodiment, a transverse cross-sectional shape of each of the first grooves 14 and the second grooves 15 is circular.

(17) In the transverse cross-section, a diameter of each first groove 14 is decreased in a direction from the first surface 11 to the second surface 12, and a diameter of each second groove 15 is decreased in a direction from the second surface 12 to the first surface 11. A distance between adjacent first grooves 14 or adjacent second grooves 15 ranges from 0.35 mm to 0.50 mm.

(18) At block S103, as shown in FIG. 4, the insulating base 10 is plated. Metal is deposited in the first groove 14 to form first pads 17. Metal is deposited in the second grooves 15 to form second pads 18. Metal is deposited in the third grooves 16 to form wiring portions 19. Each of the wiring portions 19 connects one of the first pads 17 to one of the second pads 18.

(19) A height of the first pad 17 and a height of the second pad 18 are less than or equal to the respective depths of the first groove 14 and the second groove 15. Preferably, the heights of the first pad 17 and the second pad 18 are less than the respective depths of the first groove 14 and the second groove 15 to facilitate subsequent brushing of pastes. The first pad 17 and the second pad 18 may be made of different metals or alloys which have different resistance values, such as silver and copper.

(20) At block S104, as shown in FIG. 6, a conductive ink layer 20 is coated on the first pads 17 and the second pads 18, and a protective ink layer 30 is coated on the wiring portions 19 and the insulating base 10 except for the first pads 17 and the second pads 18. At this point, the connecting structure 70 is completed.

(21) A thickness of the conductive ink layer 20 ranges from 5 μm to 10 μm. Because of the good adsorption force of the conductive ink layer 20, conductive inks are applied to the pad areas that need to be in contact with circuit boards, which improves the bonding force of the lines and also avoids line corrosion. At the same time, solder resist inks are applied to the insulating base 10 except for the pad areas, to protect the circuit.

(22) At block S105, as shown in FIG. 7, a first circuit board 40 and a second circuit board 50 are provided, and the first circuit board 40 and the second circuit board 50 are attached on the first pads 17 and the second pads 18 respectively.

(23) Specifically, the connection between the first circuit board 40 and the first pads 17 (the second circuit board 50 and the second pads 18) may be made through a solder paste or an anisotropic conductive film. In an embodiment, before attaching the first circuit board 40 and the second circuit board 50, a solder paste layer 60 is printed on the conductive ink layer 20, the first circuit board 40 and the second circuit board 50 are connected to the first pads 17 and the second pads 18 by the solder paste layer 60.

(24) The method as disclosed replaces drilling or electroplating process with a laser processing process to simplify the manufacturing process of the circuit board connection and reduce the cost. The first grooves 14 and the second grooves 15 are step-shaped, enhancing the bonding between the pads and the insulating base 10.

(25) Referring to FIGS. 2-6, the connecting structure 70 of the embodiment includes an insulation base 10, a plurality of first pads 17, a plurality of second pads 18, a plurality of wiring portions 19, a conductive ink layer 20, and a protective ink layer 30. The first pads 17, the second pads 18, and the wiring portions 19 are formed on the insulation base 10. The conductive ink layer 20 is coated on the first pads 17 and the second pads 18. The protective ink layer 30 is coated on the wiring portions 19 and the insulating base 10 except for the first pads 17 and the second pads 18.

(26) The insulation base 10 is a hollowed annular plate. The insulation base 10 includes a first surface 11, a second surface 12, and a lateral surface 13 connecting the first surface 11 and the second surface 12. In an embodiment, the insulation base 10 is rectangular. A thickness of the insulating base 10 is about 1.6 mm.

(27) First grooves 14 are defined on the first surface 11, second grooves 15 are defined on the second surface 12, and third grooves 16 are defined on the lateral surface 13. Each of the third grooves 116 connects one of the first grooves 14 and one of the second grooves 15, the first grooves 14 and the second grooves 15 are both stepped grooves.

(28) Specifically, each of the third grooves 16 extends to the first surface 11 and the second surface 12 to connect one of the first grooves 14 to one of the second grooves 15.

(29) The first grooves 14 and the second grooves 15 have the same shape. A transverse cross-sectional shape of the first groove 14 and the second groove 15 may be hexagonal, circular (including an ellipse), rectangular, a cross shape, or a window shape, as shown in FIGS. 5A-5E. In an embodiment, a transverse cross-sectional shape of each of the first grooves 14 and the second grooves 15 is circular.

(30) In the transverse cross-section, a diameter of each first groove 14 is decreased in a direction from the first surface 11 to the second surface 12, and a diameter of each second groove 15 is decreased in a direction from the second surface 12 to the first surface 11. A distance between adjacent first grooves 14 or adjacent second grooves 15 ranges from 0.35 mm to 0.50 mm.

(31) The first pad 17 and the second pad 18 deposited in the first groove 14 and the second groove 15 are made of metal materials having different resistance values, such as silver and copper.

(32) A height of the first pad 17 and a height of the second pad 18 are less than or equal to the respective depths of the first groove 14 and the second groove 15. Preferably, the heights of the first pad 17 and the second pad 18 are respectively less than the respective depths of the first groove 14 and the second groove 15 to facilitate subsequent brushing of pastes.

(33) A thickness of the conductive ink layer 20 ranges from 5 μm to 10 μm. Because of the good adsorption force of the conductive ink layer 20, conductive inks are applied to the pad areas that need to be in contact with circuit boards, which improves the bonding force of the lines and also avoids line corrosion. At the same time, solder resist inks are applied to the insulating base 10 except for the pad areas, to protect the circuit.

(34) The embodiments shown and described above are only examples. Many details are often found in the art. Therefore, many such details are neither shown nor described. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the details, including in matters of shape, size, and arrangement of the parts within the principles of the present disclosure, up to and including the full extent established by the broad general meaning of the terms used in the claims. It will therefore be appreciated that the embodiments described above may be modified within the scope of the claims.