METHOD FOR PRODUCING STORAGE MODULE AND STORAGE MODULE
20240283072 ยท 2024-08-22
Assignee
Inventors
Cpc classification
H01M10/0585
ELECTRICITY
Y02E60/10
GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
H01M50/244
ELECTRICITY
H01M50/26
ELECTRICITY
International classification
H01M50/244
ELECTRICITY
H01M50/26
ELECTRICITY
Abstract
A main object of the present disclosure is to provide a method for producing a storage module with excellent sealability. The present disclosure achieves the object by providing the method including: a preparing step of preparing a layered body, in which a plurality of electrode sheet that includes: an electrode including a current collector and an active material layer; and a frame body made of a resin arranged along an outer periphery of the electrode, is layered in a first direction; an arranging step of arranging a pair of restraining member of which heat conductivity is 1 W/m.Math.K or less, in a position overlapping with the frame body in the layered body when viewed from the first direction; and a heating step of heating the frame body in the layered body and the pair of restraining member while applying a restraining pressure to the layered body by the pair of restraining member, and thereby welding the frame body adjacent to each other in the first direction to form a seal part.
Claims
1. A method for producing a storage module, the method comprising: a preparing step of preparing a layered body, in which a plurality of electrode sheet that includes: an electrode including a current collector and an active material layer; and a frame body made of a resin arranged along an outer periphery of the electrode, is layered in a first direction; an arranging step of arranging a pair of restraining member of which heat conductivity is 1 W/m.Math.K or less, in a position overlapping with the frame body in the layered body when viewed from the first direction; and a heating step of heating the frame body in the layered body and the pair of restraining member while applying a restraining pressure to the layered body by the pair of restraining member, and thereby welding the frame body adjacent to each other in the first direction to form a seal part.
2. The method for producing a storage module according to claim 1, wherein a heat resistant temperature of the restraining member is 200? C. or more.
3. The method for producing a storage module according to claim 1, wherein the heat conductivity of the restraining member is 0.1 W/m.Math.K or less.
4. The method for producing a storage module according to claim 1, wherein a material of the restraining member is an inorganic material.
5. The method for producing a storage module according to claim 1, wherein a material of the restraining member is a resin.
6. The method for producing a storage module according to claim 1, wherein, in the heating step, the seal part in the layered body and the pair of restraining member are heated by a radiation superheater.
7. The method for producing a storage module according to claim 6, wherein the radiation superheater is an infrared lamp heater.
8. The method for producing a storage module according to claim 1, wherein a shape of the layered body viewed from the first direction is a square, and a length of each side configuring the square is 30 cm or more.
9. A storage module comprising: an electrode body in which a plurality of electrode including a current collector and an active material layer is layered in a first direction; and a seal part made of a resin arranged along an outer periphery of the electrode body, wherein in a second direction orthogonal to the first direction, when A designates a length of the seal part extending from a side surface of the seal part to the electrode side, A.sub.1 designates a length of the seal part in one end of the seal part in the first direction, A.sub.2 designates a length of the seal part in the other end of the seal part in the first direction, and A.sub.3 designates a length of the seal part in a center of the seal part in the first direction, the A.sub.1 and the A.sub.2 are larger than the A.sub.3.
Description
BRIEF DESCRIPTION OF DRAWINGS
[0031]
[0032]
[0033]
[0034]
[0035]
[0036]
[0037]
[0038]
DESCRIPTION OF EMBODIMENTS
[0039] The embodiments in the present disclosure will be hereinafter explained in details with reference to drawings. Each drawing described as below is a schematic view, and the size and the shape of each portion are appropriately exaggerated in order to be understood easily. Furthermore, in the present description, upon expressing an embodiment of arranging one member with respect to the other member, when it is expressed simply on or below, both of when the other member is directly arranged on or below the one member so as to contact with each other, and when the other member is arranged above or below the one member interposing an additional member, can be included unless otherwise described.
A. Method for Producing Storage Module
[0040]
[0041] As shown in
[0042] As shown in
[0043] In the present disclosure, by using the restraining member with low heat conductivity and heating the frame body and the restraining member, a storage module with excellent sealability is obtained. As described above, on the occasion of heating the side surface of the layered body in which a plurality of electrode sheet is layered, it is presumed that a restraining pressure is applied to the layered body using a pair of restraining member in order to minimize the thickness of the layered body as thin as possible from the view point of volume energy density. By applying the restraining pressure to the layered body, the frame body adjacent to each other in the first direction is crushed, and thus the thickness of the layered body can be reduced.
[0044] For example, when the material of the restraining member is a metal material, since the metal material has high heat conductivity, when the side surface of the layered body is heated, a part of the heat applied to the side surface of the layered body is conducted to the restraining member side, and sealability tends to be insufficient. Here, as shown in
[0045] In contrast, in the present disclosure, the restraining member with low heat conductivity is used and the frame body and the restraining member are heated. Thereby, a part of the heat applied to the side surface of the layered body is prevented from conducting to the restraining member side, and a storage module with excellent sealability is obtained. Also, by adjusting heating conditions (such as by increasing the heating temperature and heating time), a part of the heat applied to the side surface of the restraining member can be conducted to the layered body side. Thereby, as shown in
1. Preparing Step
[0046] The preparing step in the present disclosure is a step of preparing a layered body, in which a plurality of electrode sheet that includes: an electrode including a current collector and an active material layer; and a frame body made of a resin arranged along an outer periphery of the electrode, is layered in a first direction.
(1) Electrode Sheet
[0047] The electrode sheet includes: an electrode including a current collector and an active material layer; and a frame body made of a resin arranged along an outer periphery of the electrode. The electrode includes at least a current collector, and an active material layer formed on one surface of the current collector. The active material layer may be a cathode active material layer and may be an anode active material layer. Also, the electrode may include an active material layer respectively on both surfaces of the current collector.
[0048] As shown in
[0049] As shown in
[0050] As shown in
(2) Layered Body
[0051] As shown in
[0052] In
[0053] There are no particular limitations on the shape (shape in a plan view) of the layered body when viewed from the first direction, and examples thereof may include a square shape such as a foursquare shape and a rectangular shape. For example, the shape of the layered body L in a plan view shown in
[0054] As shown in
[0055] There are no particular limitations on the method for producing the layered body. As shown in
2. Arranging Step
[0056] The arranging step in the present disclosure is a step of arranging a pair of restraining member of which heat conductivity is 1 W/m.Math.K or less, in a position overlapping with the frame body in the layered body, in the first direction. In specific, as shown in
[0057] The heat conductivity of the restraining member is, usually 1 W/m.Math.K or less, may be 0.5 W/m.Math.K less, may be 0.3 W/m.Math.K or less, and may be 0.1 W/m.Math.K or less. For example, when the material of the restraining member is a metal, the heat conductivity is larger than 1 W/m.Math.K. For example, the heat conductivity of the stainless steel is 16 W/m.Math.K, and the heat conductivity of aluminum is 236 W/m.Math.K.
[0058] The heat conductivity of the restraining member may be lower than the heat conductivity of the frame body made of a resin. For example, when the frame body is made of polyethylene, the heat conductivity of the frame body is, for example, 0.33 W/m.Math.K (low density PE) to 0.52 W/m.Math.K (high density PE).
[0059] The heat resistant temperature of the restraining member is usually higher than the melting point of the frame body made of a resin. Also, the heat resistant temperature of the restraining member is higher than the heating temperature in the heating step described later. When the heat resistant temperature of the restraining member is lower than the melting point of the frame body made of a resin, or the heating temperature in the heating step, sufficient heating cannot be performed. The heat resistant temperature of the restraining member refers to a temperature with which the burnout of the restraining member is not caused. In other words, it is a temperature with which the restraining member can maintain its restraining function. For example, when the material of the restraining member is an inorganic material, its melting point can be taken as the heat resistant temperature. Also, for example, when the material of the restraining member is a resin, its deflection temperature under load can be taken as the heat resistant temperature.
[0060] The heat resistant temperature of the restraining member is, for example, 200? C. or more, may be 250? C. or more, and may be 350? C. or more. When the heat resistant temperature of the restraining member is high, the frame body can be sufficiently heated. Also, there are no particular limitations on the upper limit of the heat resistant temperature of the restraining member.
[0061] Examples of the material for the restraining member may include an inorganic material and a resin. Examples of the inorganic material may include ceramic such as alumina and silica, glass, plaster, brick, calcium silicate, and concrete. Also, examples of the resin may include a polyphenylene sulfide (PPS) based resin, a polyether ether ketone (PEEK) based resin, a polytetrafluoroethylene (PTFE) based resin, a polyamide imide (PAI) based resin, a polyimide (PI) based resin, a polyether sulfone (PES) based resin, a polyether nitrile (PEN) based resin, a polybenzimidazole (PBI) based resin, a polyether imide (PEI) based resin, and a polyarylate (PAR) based resin.
3. Heating Step
[0062] The heating step in the present disclosure is a step of heating the frame body in the layered body and the pair of restraining member while applying a restraining pressure to the layered body by the pair of restraining member, and thereby welding the frame body adjacent to each other in the first direction to form a seal part.
[0063] The restraining pressure to be applied to the layered body by the restraining member is not particularly limited, and for example, it is 1 kPa or more and 30 MPa or less, and may be 0.1 MPa or more and 10 MPa or less. Also, the restraining pressure can be adjusted by, for example, a clamp connected to the pair of restraining member.
[0064] In the heating step, the frame body in the layered body and the pair of restraining member are heated to weld the frame bodies adjacent to each other in the first direction. In other words, not only the frame body but also the restraining member is heated. From the view point of inhibiting the burnout of the restraining member, conventionally, the frame body was heated while avoiding the restraining member. In contrast, in the present disclosure, by using the restraining member with high heat resistant temperature, not only the frame body but also the restraining member is heated. When viewed from the second direction orthogonal to the first direction, Q.sub.1 designates a calorific value to be applied to a unit area of the frame body, and Q.sub.2 designates a calorific value to be applied to a unit area of the restraining member, the rate of Q.sub.2 with respect to Q.sub.1, which is Q.sub.2/Q.sub.1 is, for example, 0.3 or more, may be 0.5 or more, may be 0.7 or more, and may be 0.9 or more.
[0065] In the present disclosure, typically, heating is performed to the side surface (surface extending to the first direction) of the frame body, and the frame bodies adjacent to each other in the first direction are welded to form a seal part. The heating temperature is appropriately selected according to the material of the frame body, but for example, it is 120? C. or more and 300? C. or less, and may be 150? C. or more and 250? C. or less. Heating is performed by, for example, using a radiation superheater such as an infrared lamp heater. For example, as shown in
[0066] As shown in
[0067] As shown in
[0068] The rate of the A.sub.1 with respect to the A.sub.3, which is A.sub.1/A.sub.3 is, for example, 1.05 or more, may be 1.2 or more, and may be 1.5 or more. Similarly, the rate of the A.sub.2 with respect to the A.sub.3, which is A.sub.2/A.sub.3 is, for example, 1.05 or more, may be 1.2 or more, and may be 1.5 or more. Also, as shown in
4. Other Steps
[0069] As shown in
[0070] The method for producing the storage module in the present disclosure may include a liquid electrolyte supplying step of supplying a liquid electrolyte inside the layered body via the penetration hole after the above described penetration hole forming step. There are no particular limitations on the method for supplying the liquid electrolyte, and conventionally known method may be used.
[0071] The method for producing the storage module in the present disclosure may include a sealing step of sealing the penetration hole after the above described liquid electrolyte supplying step. There are no particular limitations on the method for sealing the penetration hole, and examples thereof may include a method of sealing the penetration hole with a film.
5. Storage Module
[0072] Specific examples of the storage module in the present disclosure may include a secondary battery (such as a lithium ion secondary battery) and an electric double layered capacitor. Also, examples of the applications of the storage module may include a power source for vehicles such as hybrid electric vehicles (HEV), plug-in hybrid electric vehicles (PHEV), battery electric vehicles (BEV), gasoline-fueled automobiles and diesel powered automobiles. In particular, it is preferably used as a power source for driving hybrid electric vehicles (HEV), plug-in hybrid electric vehicles (PHEV), and battery electric vehicles (BEV). Also, the storage module in the present disclosure may be used as a power source for moving bodies other than vehicles (such as rail road transportation, vessel and airplane), and may be used as a power source for electronic products such as information processing equipment.
B. Storage Module
[0073]
[0074] According to the present disclosure, the A.sub.1 and the A.sub.2 are larger than the A.sub.3, and thus the storage module may have excellent sealability and durability. The storage module in the present disclosure is in the same contents as those described in A. Method for producing storage module above; thus, the descriptions herein are omitted.
[0075] The present disclosure is not limited to the embodiments. The embodiments are exemplification, and any other variations are intended to be included in the technical scope of the present disclosure if they have substantially the same constitution as the technical idea described in the claims of the present disclosure and have similar operation and effect thereto.
REFERENCE SINGS LIST
[0076] 1 current collector
[0077] 2 cathode active material layer
[0078] 3 anode active material layer
[0079] 4 separator
[0080] 5 frame body
[0081] 10 electrode body
[0082] 20 restraining member
[0083] 30 radiation superheater
[0084] 100 storage module