MICROFABRICATION TECHNIQUE FOR STRUCTURING NON-PLANAR ELECTROMAGNETIC WAVEGUIDES

Abstract

A method for manufacturing a multifunctional electromagnetic waveguide from a tapered optical fiber is provided. The method involves mounting the optical fiber on a roto-translational handling apparatus, forming a first mask on a tapered section of the optical fiber to define a shape of an optical window, forming a first metal layer around the tapered section leaving a lateral edge of the first mask uncovered, removing the first mask by chemical etching to uncover the optical window, depositing a first transparent layer around the tapered section, depositing a second metal layer around the first transparent layer, forming a second mask that defines a shape of a conductive track, removing the second metal layer by chemical etching, and removing the second mask by chemical etching to uncover the conductive track.

Claims

1. A method for manufacturing a multifunctional electromagnetic waveguide from a tapered optical fiber, the method comprising: mounting the optical fiber on a handling apparatus which may be actuated to translationally move the optical fiber along at least one translation axis and rotate the optical fiber about a longitudinal axis thereof, submerging a tapered section of the optical fiber in a photoresist and subjecting the photoresist to two-photon polymerization to form a first mask defining a shape of at least one optical window, subjecting the masked tapered section to a plurality of directional flows of metal material to form a first metal layer around the tapered section, leaving at least one lateral edge of the first mask uncovered, removing the first mask by chemical etching in such a way to uncover said at least one optical window, depositing a transparent, conformal first layer around the tapered section, said transparent, conformal first layer being made of insulating material, depositing a second metal layer around the insulating transparent, conformal first layer, submerging the tapered section in the photoresist and subjecting the photoresist to two-photon polymerization to form, at the tapered section, a second mask defining a shape of at least one conductive track, removing, by chemical etching, the second metal layer where the second metal layer is not covered by the second mask, and removing the second mask by chemical etching in such a way to uncover said at least one conductive track.

2. The method of claim 1, further comprising depositing a transparent, conformal second layer around the tapered section, said transparent, conformal second layer being made of polymer or semiconductor material.

3. The method of claim 2, further comprising forming at least one recess at least one measurement pad of said at least one conductive track, and depositing a third metal layer in said at least one recess.

4. The method of claim 1, further comprising mounting the multifunctional electromagnetic waveguide on a printed circuit interface, said printed circuit interface comprising a first seat configured to receive the multifunctional electromagnetic waveguide, a second seat aligned with the first seat and configured to receive an optical cable connected to the multifunctional electromagnetic waveguide, and at least one conductive track comprising a distal connection pad facing the first seat and configured to be welded to a relevant connection pad of said at least one conductive track of the multifunctional electromagnetic waveguide.

5. The method of claim 1, wherein, during the two-photon polymerization, the optical fiber is rotated around its longitudinal axis by the handling apparatus.

Description

[0023] Further features and advantages of the method according to the invention will be presented in the following detailed description, which refers to the accompanying drawings, provided solely by way of non-limiting example, in which:

[0024] FIG. 1 shows: A-a schematic view of a tapered optical fiber covered with metal, Bthe course of the radius of curvature of the tapered section r(y) along the direction of the axis of the fiber;

[0025] FIG. 2a is a schematic view of an optoelectronic device that may be produced using the method according to the invention;

[0026] FIGS. 2b and 2c are enlarged views of details respectively denoted by IIb and IIc in FIG. 2a;

[0027] FIG. 3 shows the steps of a method for manufacturing a waveguide according to the invention;

[0028] FIG. 4a-4c show different examples of a printed circuit interface for the waveguide in FIG. 3;

[0029] FIG. 5 shows images of prototypes obtained using the method according to the invention;

[0030] FIG. 6 shows images of test results relating to certain manufacturing steps of the method according to the invention.

[0031] A method for producing an optoelectronic device based on tapered optical fibers, in particular an optoelectronic neural interface, will now be described. A device of this kind is described, for example, in WO 2015/008233 A1 and WO 2018/167685 A1, from the same applicant.

[0032] An example of this device is shown in FIG. 2, and essentially comprises two parts: a micro-structured implantable probe, which is denoted by reference sign 10 and comprises electrodes 11 for electrically recording the neural activity and optical windows 12 for allowing light to be emitted and collected in the cerebral tissue with depth resolution, and a printed circuit interface 20 which is used as an interface between the non-planar electronics on the probe 10 and a planar printed circuit board 30.

[0033] The probe 10 is substantially an electromagnetic waveguide comprising a tapered optical fiber. FIG. 2b shows the tapering at the tip of the waveguide/optical fiber, which tapering is denoted by 13.

[0034] The fiber (and therefore the optical windows 12) receive and transmit light from/to external systems via a ferrule connection 31, while the signal collected by the electrodes 11 is sent to an external amplifier via a connector 32 on the planar board 30. Alternatively (as will be described below), the printed circuit interface 20 may be configured to send the signal collected by the electrodes 11 to an external amplifier via a connector integrated on the printed circuit interface 20, without the need for a planar board 20.

[0035] The optical windows 12 are used to distribute and/or collect light onto/from the tissue, while the electrodes 11 are used to detect nearby electric fields that are linked to cellular activity. Both of these are manufactured along and around the tapered section 13 using a multi-stage method shown in FIG. 3, which allows them to be produced despite the small and non-constant radius of curvature r(y), which may fall below 1 ?m.

[0036] The method starts by mounting a tapered optical fiber 1 on a roto-translational handling apparatus RT which may be actuated to translationally move the optical fiber along at least one translation axis, preferably along three orthogonal axes x, y and z, and rotate the optical fiber 1 about a longitudinal axis thereof, which in the example coincides with the y-axis. The angle of rotation is denoted by 0 (FIG. 3(i)). By means of the apparatus RT, the tapered fiber 1 is submerged in a negative photoresist droplet D supported by a substrate S. The tapered section 13 of the fiber is then subjected to a two-photon polymerization (2PP) process; one or more fs-pulsed (femtosecond-pulsed) focused beams FB are scanned on the tapered section 13 (by controlling the movement of the tapered section by means of the apparatus RT) in order to form a polymer mask 41. The 2PP makes it possible to obtain a polymerization spot which has dimensions in the xy (d.sub.xy) plane and along the z (d.sub.z) direction below the diffraction limits, and therefore a smaller radius of curvature r(y) at the section in which the polymerization is carried out (i.e. d.sub.xy<<r(y) e d.sub.z<<r(y)). Quantitatively, for a given dry and de, the minimum value of r(y) that may accommodate the mask formed using the 2PP process may be evaluated by solving the following equation:

[00001]$\begin{array}{cc}\left(\sqrt{r^2\left(y\right)+\frac{d_{\mathrm{xy}}^2}{4}}-r\left(y\right)\right)\cos \left({\tan }^{-1}\frac{d_{\mathrm{xy}}}{2r\left(y\right)}\right)=\frac{d_z}{4}.& \left(1\right)\end{array}$

[0037] This condition, together with the possibility of roto-translating the fiber 1 and scanning more beams, makes it possible to address the non-planarity of the tapered surface 13 and ensures good adhesion of the polymer structure 41 after the photoresist has been developed (FIG. 3(ii)).

[0038] The fiber is then placed in the chamber of a system for the directional evaporation of metals (for example an electron beam evaporator) and exposed to a plurality of different directional flows of metal (in the example, three flows DF), so as to cover the tapered section 13 with a first metal layer 42, while leaving the lateral edge of the mask 41 uncovered (FIG. 3(iii)). This is achieved by carrying out a plurality of different evaporations at different ? angles, for example three different, separate evaporations at angles ?1 and ?2 which are equal to approximately 120?, but these values depend on the height and the shape of the structure(s) to be produced. The aspect ratio of the polymer mask 41 is generally greater than 1, in order to reduce the quantity of material deposited on the lateral surfaces of the mask (for example, for a square pattern of 15 ?m?15 ?m, the height may be ?20 ?m).

[0039] With regard to the shape of the polymer mask 41, it is possible to produce square, rectangular or circular patterns, and, by properly controlling the laser focusing equipment, the shape may be freely defined while taking the limits of equation (1) into account.

[0040] Following the chemical removal of the photoresist mask 41, one or more optical windows 12 are obtained on the tapered section 13 (FIG. 3(iv)), which windows are formed through the first metal layer 42.

[0041] A transparent and conformal insulating layer 43 is then deposited, by means of chemical vapor deposition (for example of parylene-c) or electron beam evaporation (for example of silicon dioxide), as shown schematically in FIG. 3(v).

[0042] A second metal layer 44 is then deposited all around the fiber (FIG. 3(vi)), which second layer is used as a substrate for the electrical tracks.

[0043] The device is re-inserted into the photoresist droplet D and the 2PP is used to define a new photoresist mask 51 on the tapered surface 13, so as to define the geometry of one or more electrode contacts (FIG. 3(vii)). The method makes it possible to obtain masks of which the dimensions may vary from a few microns to centimeters.

[0044] The fiber is subjected to another development step (FIG. 3(viii)) and to subsequent wet etching in order to transfer the geometry of the photoresist to the metal layer 44 (FIG. 3(ix)). The photoresist is chemically removed (FIG. 3(x)), thus revealing the metal paths formed by measurement pads 11a (the shape of which may be circular or round, with dimensions that vary from a few micrometers to a few millimeters), connection pads 11b (dimensions from a few tens of micrometers to a few mm) and electrical tracks 11c (representative lengths from a few mm to a few cm, with transverse dimensions typically between a few microns and approximately 20 ?m). The measurement pads 11a define the points at which the signal is detected by direct exposure to the electrolyte, while the connection pads 11b are used, in combination with the printed circuit interface 20, to interface the electrodes 11a, b, c with the planar printed circuit board 30.

[0045] The system is then insulated using a second transparent, conformal layer 52 made of polymer or semiconductor material, which layer also acts as a sealing encapsulation for the device in order to allow it to function in ambient liquids.

[0046] By means of single-photon or two-photon laser ablation, or by means of focused ion beam (FIB) abrasion (FIG. 3(xi)), a recess is 53 then formed in the second transparent layer 52 at the measurement pads 11a (FIG. 3(xii)). Then, by means of focused ion beam deposition or electrochemical deposition, a third metal layer 54 is deposited only in the recess 53 (FIG. 3(xiii)), with the aim of regulating the final impedance of the electrode to values in the range from 0.2 M? a 2 M?.

[0047] Between steps (x) and (xi), i.e. before the second transparent layer 52 is formed, the fiber 1 is removed from the handling apparatus RT and mounted on the printed circuit interface 20 which is specifically designed to interface the electrodes 11a, b, c to the planar board 30 for connection to an external amplification system. FIGS. 4a and 4b show two embodiments for the interface 20, each of which comprises a first seat 201 which is configured to receive the electromagnetic waveguide 10, and a second seat 202 which is aligned with the first seat 201 and configured to receive an optical cable 100 connected to the electromagnetic waveguide 10 (cf. also FIG. 2c). The interface 20 also comprises at least two conductive tracks 203, each of which comprises a distal connection pad 204 which faces the first seat 201 and is configured to be welded to a relevant connection pad 11b of one of the electrodes 11 of the electromagnetic waveguide 10, and a proximal connection pad 205 which is configured to be welded to a relevant contact of the planar board 30. FIG. 4a shows an example (similar to that in FIG. 2c) where the distal connection pads 204 are formed on an upper face of the interface 20 (shown at the top in FIG. 4a), and the proximal connection pads 205 are formed on a lower face of the interface 20 (shown at the bottom in FIG. 4a). The conductive tracks 203 which connect the distal connection pads 204 to the proximal connection pads 205 are formed through the thickness of the interface 20, as may be seen in FIG. 2c. FIG. 4b instead shows an example where the distal connection pads 204, proximal connection pads 205 and conductive tracks 203 are formed on the same face of the interface 20. As in the example in FIG. 2a-c, the printed circuit interface 20 is used to allow the electromagnetic waveguide 10 to be connected to a planar board 30, which is in turn responsible for connection to external amplifiers. FIG. 4c shows an alternative example where the printed circuit interface, again denoted by reference sign 20, acts as an independent interface with standard external systems, without the need for a planar board (the two images shown are views of the interface as seen from different directions). The example interface in FIG. 4c therefore has an integrated connector 32 for connection to external systems. In this case, the distal connection pads are directly connected to the connector 32.

[0048] Preliminary results from the manufacturing method described above are shown in FIG. 5. Frame A shows a microscope image which shows a detail on an electrode obtained using the described method, and a graph relating to the action potentials recorded in vivo, in the cerebral tissue of a mouse, from three different cells. Frame B shows microscope images (at different magnifications) which show multiple electrodes formed on the same tip, which electrodes are composed of measurement pads, conductive tracks and connection pads. Frame C is a microscope image which shows polymer structures formed all around the tapered section, in order to demonstrate the suitability of the described approach for being used over the entire tapered surface. Frame D shows a photograph of a printed circuit interface produced using polymer materials, with a tapered and structured fiber mounted thereon and connected to an optical cable. This configuration corresponds to that in FIG. 4a, and may be welded to a planar board in order to interface with conventional amplifiers.

[0049] FIG. 6 shows preliminary results relating to the crucial steps of the manufacturing method described above, i.e. the formation of the polymer masks and the transfer of their geometry onto the non-planar tapered surface. The three images at the top are microscope images which show a detail of the tip at the end of three different steps for forming a measurement pad, in particular: [0050] image at the top left: after the development of the photoresist (step (viii)) [0051] image at the top center: after the chemical etching to remove the non-masked metal (step (ix)) [0052] image at the top right: after the removal of the photoresist (step (x)).

[0053] The three images at the bottom are microscope images of a conductive track formed on the tip, at different scales of magnification.

Bibliographical References

[0054] [1] Spagnolo, B et al. Integrated tapered fibertrode for simultaneous control and readout of neural activity over small brain volumes with reduced light-induced artefacts, Bioarxiv https://doi.org/10.1101/2020.07.31.226795 (2020) [0055] [2] Pisano, F et al. Focused ion beam nanomachining of tapered optical fibers for patterned light delivery. Microelectron. Eng. 145, 41-49 (2018) [0056] [3] Rizzo, A et al. Laser micromachining of tapered optical fibers for spatially selective control of neural activity. Microelectron. Eng. (2018) doi:10.1016/j.mee.2018.02.010. [0057] [4] Balena, A et al. Two-photon fluorescence-assisted laser ablation of non-planar metal surfaces: fabrication of optical apertures on tapered fibers for optical neural interfaces. Opt. Express 28, 15, 21368-21381 (2020).