Method for producing a micromechanical device having a damper structure

Abstract

A method for producing a micromechanical device having a damper structure. The method includes: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side in order to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix.

Claims

1. A method for producing a micromechanical device having a damper structure, the method comprising: (A) providing a micromechanical wafer having a rear side; (B) applying a liquid damper material onto the rear side; (C) pressing a matrix against the rear side to form at least one damper structure in the damper material; (D) curing the damper material; and (E) removing the matrix; wherein prior to the step (B), liquid damper material is applied to the matrix, whereupon steps (B) and (C) are carried out simultaneously by placing and pressing the matrix against the rear side.

2. The method of claim 1, wherein the matrix is covered or coated with a release agent or is made from a release agent which is easily separable from the damper material.

3. The method of claim 1, wherein in step (B), the damper material is applied in structured form by dispensing, or screen printing or stencil printing.

4. The method of claim 1, wherein in step (D), the curing of the damper material is induced by baking, and/or by UV radiation.

5. The method of claim 1, wherein after step (E), the micromechanical wafer is singularized into individual chips in a step (F).

6. The method of claim 1, wherein the matrix is covered or coated with a release agent or is made from a release agent which is easily separable from the damper material, and wherein in step (B), the damper material is applied in structured form by dispensing, or screen printing or stencil printing.

7. The method of claim 6, wherein in step (D), the curing of the damper material is induced by baking, and/or by UV radiation.

8. The method of claim 6, wherein after step (E), the micromechanical wafer is singularized into individual chips in a step (F).

9. The method of claim 6, wherein in step (D), the curing of the damper material is induced by baking, and/or by UV radiation, and wherein after step (E), the micromechanical wafer is singularized into individual chips in a step (F).

10. The method of claim 1, wherein in step (D), the curing of the damper material is induced by baking, and/or by UV radiation, and wherein after step (E), the micromechanical wafer is singularized into individual chips in a step (F).

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 schematically illustrates, in the form of a flow diagram, a method according to an example embodiment of the present invention for the production of a micromechanical device having damper structures.

(2) FIGS. 2a through 2c schematically illustrate the method according to the present invention in a first exemplary embodiment of a micromechanical device.

(3) FIGS. 3a through 3c schematically illustrate the method according to the present invention in a second exemplary embodiment of a micromechanical device.

(4) FIGS. 4a through 4d schematically illustrate the method according to the present invention in a third exemplary embodiment of a micromechanical device.

(5) FIG. 5 shows a top view of possible damper structures that are able to be produced according to an example embodiment of the present invention.

(6) FIG. 6 shows a micromechanical chip having a damper structure in accordance with an example embodiment of the present invention.

DETAILED DESCRIPTION OF EXAMPLE EMBODIMENT

(7) First, a micromechanical wafer, in particular a sensor wafer, is produced in the usual manner and encapsulated by a cap wafer. Prior to singularizing the wafers into individual sensors (usually by sawing), the production of the damper structures is carried out directly at the wafer level. For example, the damper structures may be made from a curing silicon or PDMS (e.g., Dow Corning Sylguard 184®), for example. It is mixed according to the manufacturer specifications, degassed and then applied in the required quantity to the rear side of the wafer, e.g., by dispensing, with the option of already prestructuring the damper structure so that not as much material has to be displaced during a following molding process. The damper material may also be applied by screen printing/stencil printing. Here, too, the structure could be prestructured in order not to displace too much material. In addition, the damper material can also be applied by throwing, in particular when the material has a thin, highly liquid consistency. Next, a stencil/damper mold for molding the damper structures for all sensor chips is pressed onto the wafer (or rolled on from the side, if flexible). Attention must be paid to the precise positioning of this matrix. The silicon is then cured (e.g., by an adapted temperature profile in the case of Sylguard 184). The stencil/damper mold is then able to be pulled off. It may be advantageous in this context if the stencil is flexible and can be rolled back.

(8) In an advantageous manner, the stencil/damper mold is treated with a release agent or coated with a corresponding layer or is made directly from a material that is easily separable again from the damper material (such as PTFE). Ideally, the stencil/damper mold may advantageously be used for another molding process on a further wafer, possibly after a cleaning process or a further treatment with a release agent. The rear side of the wafer, which is to be permanently connected to the damper material, may also be pretreated, e.g., by a brief O2 plasma or a plasma polymerization of adhesive layers.

(9) It may be advantageous (but often not necessary) for the rear side of the wafer on which the damper structures are molded/applied to be structured as well in order to offer better anchoring to the material of the dampers during the molding process and to produce an even more robust connection between the sensor chip and the damper.

(10) One possible alternative would also be the insertion of the entire wafer or a large part of the wafer (such as a quarter or one-sixth) in an injection molding system and the application of the damper structures on the underside by injection molding of a corresponding silicon that features the desired Shore hardness. In the process it must be ensured that the electrical contact surfaces for the later bonding are not contaminated and that the occurring thermal and mechanical loading during the injection molding process does not damage the wafer. The method then includes the following steps: Providing a micromechanical wafer having a rear side; Introducing the wafer into an injection molding tool for molding at least one damper structure in the damper material; Injecting a liquid damper material into the mold and onto the rear side; Curing the damper material; Opening the mold and removing the wafer with the connected damper structure.

(11) FIG. 1 schematically illustrates, in the form of a flow diagram, a method according to an example embodiment of the present invention for producing a micromechanical device having damper structures. The method according to the example embodiment of the present invention includes at least the following steps: (A) Providing a micromechanical wafer having a rear side; (B) Applying a liquid damper material onto the rear side; (C) Pressing a matrix against the rear side in order to mold at least one damper structure in the damper material; (D) Curing the damper material; (E) Removing the matrix.

(12) A wafer also includes wafer pieces. It may be advantageous to divide the wafer into wafer pieces prior to its supply, e.g., to divide it into quarters. This may be advantageous particularly in the case of large wafers. The wafer pieces are often easier to handle. A wafer piece always still has a number of micromechanical structures for a considerable number of chips. A wafer piece takes up more than one-tenth of the surface of the wafer. The curing of the damper material is able to be achieved by heating (heat/baking) or also by UV radiation (UV-curing damper material). A UV-transparent matrix would be required in the latter case. After the matrix has been removed, the wafer or the wafer piece with the connected damper structures is able to be singularized in order to form individual chips such as by sawing.

(13) FIGS. 2a through 2c schematically illustrate the method of the present invention in a first exemplary embodiment of a micromechanical device. Shown in schematically simplified form is the molding process. FIG. 2a shows a micromechanical wafer 100, which is a sensor wafer in this case, which includes a cap 110. Micromechanical wafer 100 is provided with a rear side 120 pointing up. A liquid damper material 200 is applied at least regionally and evenly onto the rear side, for instance by dispensing. Next, a matrix 300, a damper master mold, is pressed against the rear side in the direction of the arrow. Air or gases is/are released and the negative form of the matrix is filled with the damper material. FIG. 2b shows micromechanical wafer 100 against whose rear side 120 matrix 300 is resting. The matrix has thereby molded damper material 200 into a damper structure 210. The composite is now heated and the damper material, which is silicon in this instance, hardens. The matrix is then removed. FIG. 2c shows micromechanical wafer 100 having damper structures 210 on the rear side. The damper structures are positively connected to the sensor wafer. The waver including the damper structures is now able to be singularized, i.e. into capped sensor chips provided with damper structures on the underside.

(14) FIGS. 3a through 3c schematically illustrate the method according to the present invention in a second exemplary embodiment of a micromechanical device. FIG. 3a shows micromechanical wafer 100, which is provided with a rear side 120 pointing up. Prestructured damper material 200, which is silicon in this instance, is already situated on the rear side and has been applied in structured form by dispensing, or by screen or stencil printing. FIG. 3b shows micromechanical wafer 100 against whose rear side 120 matrix 300 is pressed. The matrix has thereby completely molded structured damper material 200 into a damper structure 210. The composite is now heated and the damper material hardens. The matrix is then removed. FIG. 3c shows micromechanical wafer 100 provided with damper structures 210 on the rear side.

(15) FIGS. 4a through 4d schematically show the method according to the present invention in a third exemplary embodiment of a micromechanical device. FIG. 4a shows matrix 300, which in this exemplary embodiment is provided lying on its back. Damper material 200 is dispensed or raked into depressions of the matrix, as illustrated in FIG. 4b. FIG. 4c shows how micromechanical wafer 100, which is a sensor in this case, is placed by its rear side on matrix 300 and pressed down. Air escapes, possibly under a vacuum, and the molds are filled with the damper material. Heating then takes place and the damper material, which is made of silicon here, cures. The matrix is then removed and the damper structures are positively connected to the sensor wafer, as illustrated in FIG. 4d. The entire structure is now able to be singularized into capped sensor chips including damper structures on the underside.

(16) By way of example, FIG. 5 shows a top view of possible damper structures that are able to be produced according to the present invention. Shown is a non-exhaustive selection of possible damper structures 210 on a chip 400 in each case.

(17) FIG. 6 shows a micromechanical chip having a damper structure. Illustrated in transparent form is a chip 400. Situated underneath is damper structure 210, which is made up of an optional damper plate 212 and, in this case, six individual dampers 214. Damper plate 212 and dampers 214 have been produced in a single working step in the described method according to the present invention.

LIST OF REFERENCE NUMERALS

(18) 100 micromechanical wafer 110 cap 120 rear side 140 front side 200 damper material 210 damper structure 212 damper plate 214 damper 300 matrix 400 chip