Multi-color temperature and multi-channel EMC bracket structure

Abstract

A multi-color temperature and multi-channel EMC bracket structure comprises a metal substrate with more than three pads arranged on a periphery thereof as multi-block electrodes. A cup-shaped insulating resin dam is located on the metal substrate. Part of the pad is located inside the insulating resin dam and another part of the pad is located outside the insulating resin dam. At least one white resin partition is arranged inside the insulating resin dam to divide the metal substrate into multiple areas for arranging different LED chip circuits respectively. The LED chip circuit comprising a plurality of LED chips. The spaces inside the cup-shaped insulating resin dam with respective to different LED chip circuits are encapsulated by fluorescent layers respectively, and the fluorescent layer is located on the LED chip. The present invention can be controlled in regions to achieve the effect of different color temperature.

Claims

1. A multi-color temperature and multi-channel epoxy molding compound (EMC) bracket structure, comprising: a metal substrate; more than three pads, arranged on a periphery of the metal substrate, wherein the pads are used as multi-block electrodes of the metal substrate; a cup-shaped insulating resin dam, located on the metal substrate, wherein part of the pad is located inside the insulating resin dam, and another part of the pad is located outside the insulating resin dam; at least one white resin partition, arranged inside the insulating resin dam to divide the metal substrate into multiple areas; multiple LED chip circuits, wherein one LED chip circuit is arranged in each of the multiple areas and each of the multiple LED chip circuits comprises at least two LED chips wired in series, with the first one and the last one of the LED chips in the series each connected to a different one of the more than three pads; wherein each of the multiple LED chip circuits is associated with a different color temperature; and wherein spaces inside the cup-shaped insulating resin dam with respective to the LED chip circuits are encapsulated by fluorescent layers respectively, and the fluorescent layer is located on the LED chip.

2. The multi-color temperature and multi-channel EMC bracket structure according to claim 1, wherein a number of the pads is four, and the four pads are located at four corners of the metal substrate, and among the four pads, two pads on a side of a separated island are used as multi-block negative electrodes, and the remaining two pads are used as multi-block positive electrodes.

3. The multi-color temperature and multi-channel EMC bracket structure according to claim 1, wherein two white resin partitions are arranged inside the insulating resin dam, to divide the metal substrate into three areas for arranging different LED chip circuits.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) FIG. 1 is a schematic diagram showing the structure of the present invention.

(2) FIG. 2 is a structural schematic diagram of a rear side showing the metal substrate integrated with the pad in accordance with the present invention.

(3) FIG. 3 is a structural schematic diagram in accordance with a first embodiment of the present invention with the fluorescent layer and the LED chip circuit being skipped.

(4) FIG. 4 is a schematic cross-sectional view of the first embodiment of the present invention.

(5) FIG. 5 is a schematic diagram of the structure in accordance with a second embodiment of the present invention with the fluorescent layer and the LED chip circuit being skipped.

(6) FIG. 6 is a schematic cross-sectional view of the second embodiment of the present invention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

(7) These and other features, aspects and advantages of the present invention will become better understood with regard to the following description, appended claims, and accompanying drawings.

(8) Please refer to FIG. 1 to FIG. 4, a multi-color temperature and multi-channel EMC bracket structure is provided in accordance with the first embodiment of the present invention. The multi-color temperature and multi-channel EMC bracket structure comprises a metal substrate 1. More than three pads 2 are arranged on a periphery of the metal substrate 1. The pads 2 serves as multi-block electrodes of the metal substrate 1. The metal substrate 1 is provided with a cup-shaped insulating resin dam 3. Part of the pad 2 is located inside the insulating resin dam 3, and another part of the pad 2 is located outside the insulating resin dam 3. There has at least one white resin partition 4 arranged inside the insulating resin dam 3, and the white resin partition 4 has the metal substrate 1 divided into a plurality of areas 11. Different LED chip circuits 5 are arranged in different areas 11 respectively. The LED chip circuit 5 comprises a plurality of LED chips 51. The first one and the last one of the multiple LED chips 51 are connected to two of the three pads 2, that is, the pads are used as the negative electrode and the positive electrode of multi-block electrodes. Each area can be equipped with different LED chip circuits. The adjacent two of the multiple LED chips 51 are connected by using golden wire 52. The spaces inside the cup-shaped insulating resin dam with respective to different LED chip circuits 5 are encapsulated with fluorescent layers 6 respectively, and the fluorescent layer 6 is located on the LED chip. In this way, the EMC bracket structure is not limited to provide the illumination with two color temperatures, multiple color temperatures may coexist in the EMC bracket structure as long as the positive and negative electrodes can be electrically separated. In this way, the multi-color temperature LED chip circuits may not increase the size of the overall product.

(9) Please refer to FIG. 5 and FIG. 6, in accordance with the second embodiment of the present invention, a number of the pad 2 is four, and the four pads are located at the four corners of the metal substrate. Among the four pads, two pads on the same side of the separated island are used as the multi-block negative electrodes, and the remaining two pads are used as the multi-block positive electrodes. The four pad design would be more applicable in actual practice.

(10) In addition, the insulating resin dam 3 is provided with two white resin partitions 4 arranged inside. The white resin partitions 4 divide the metal substrate into three regions 11, and the three regions 11 are provided with different LED chip circuit. Thereby, three color temperatures may coexist in one EMC bracket structure.

(11) In short, the present invention features a thermoelectric separation type bracket, with more than three pads arranged in the periphery of the metal substrate, at least one white resin partition arranged on the metal substrate and inside the cup-shaped insulating resin dam to have the metal substrate divided into multiple areas for locating different LED chip circuits. The circuits are connected through the pads served as multi-block negative electrode and positive electrode, so that color temperature can be set in each area independently without increasing the size of the overall product. In addition, the technology of multi-block color temperature control increases product diversity and application markets.

(12) Although the present invention has been described in considerable detail with reference to certain preferred embodiments thereof, the disclosure is not for limiting the scope of the invention. Persons having ordinary skill in the art may make various modifications and changes without departing from the scope. Therefore, the scope of the appended claims should not be limited to the description of the preferred embodiments described above.