OVERCURRENT PROTECTION ELEMENT

Abstract

Provided is an overcurrent protection element comprising: a core material comprising a top surface, a bottom surface opposite the top surface, a first side surface and a second side surface both located between the top and bottom surfaces, and a first end surface and a second end surface both located between the top and bottom surfaces. A first conductive layer is formed on the top surface of the core material, and a second conductive layer is formed on the bottom surface of the core material. An encapsulation layer covers the first conductive layer, the second conductive layer, and at least one of the side surfaces. A first terminal electrode is electrically connected to the first conductive layer, and a second terminal electrode is electrically connected to the second conductive layer. The overcurrent protection element has excellent electric conductivity, fast response, and sufficient self-protection during soldering process and in use.

Claims

1. An overcurrent protection element, comprising: a core material comprising a top surface, a bottom surface opposite the top surface, a first side surface and a second side surface both located between the top surface and the bottom surface, and a first end surface and a second end surface both located between the top surface and the bottom surface; a first conductive layer formed on the top surface of the core material; a second conductive layer formed on the bottom surface of the core material; an encapsulation layer covering the first conductive layer, the second conductive layer, and at least one of the first side surface and the second side surface; a first terminal electrode electrically connected to the first conductive layer; and a second terminal electrode electrically connected to the second conductive layer.

2. The overcurrent protection element as claimed in claim 1, wherein the encapsulation layer is a continuous encapsulation structure, and the first conductive layer, the second conductive layer, the first side surface, and the second side surface are encapsulated by the encapsulation layer in an annular manner.

3. The overcurrent protection element as claimed in claim 1, wherein the encapsulation layer comprises a first encapsulation layer, a second encapsulation layer, a third encapsulation layer, and a fourth encapsulation layer, respectively covering the first conductive layer, the second conductive layer, the first side surface, and the second side surface, there are a seam between the first encapsulation layer and the third encapsulation layer, a seam between the first encapsulation layer and the fourth encapsulation layer, a seam between the second encapsulation layer and the third encapsulation layer, and a seam between the second encapsulation layer and the fourth encapsulation layer.

4. The overcurrent protection element as claimed in claim 1, wherein the encapsulation layer comprises a first encapsulation layer, a second encapsulation layer, a third encapsulation layer, and a fourth encapsulation layer, respectively covering the first conductive layer, the second conductive layer, the first side surface, and the second side surface, wherein the first encapsulation layer is connected with the third encapsulation layer and the fourth encapsulation layer to form a continuous encapsulation structure, and there are a seam between the second encapsulation layer and the third encapsulation layer and a seam between the second encapsulation layer and the fourth encapsulation layer.

5. The overcurrent protection element as claimed in claim 1, wherein the encapsulation layer comprises a first encapsulation layer, a second encapsulation layer, a third encapsulation layer, and a fourth encapsulation layer, respectively covering the first conductive layer, the second conductive layer, the first side surface, and the second side surface, wherein the second encapsulation layer is connected with the third encapsulation layer and the fourth encapsulation layer to form a continuous encapsulation structure, and there are a seam between the first encapsulation layer and the third encapsulation layer and a seam between the first encapsulation layer and the fourth encapsulation layer.

6. The overcurrent protection element as claimed in claim 1, wherein the first conductive layer and the second conductive layer each comprise a metal foil, a metal coating, or a metal plating.

7. The overcurrent protection element as claimed in claim 6, wherein the first conductive layer and the second conductive layer each comprise a nickel-plated copper foil.

8. The overcurrent protection element as claimed in claim 1, wherein the overcurrent protection element comprises multiple insulation parts, wherein one of the insulation parts is embedded in the first conductive layer and located 0 mm to 10 mm from the second end surface, and the other insulation part is embedded in the second conductive layer and located 0 mm to 10 mm from the first end surface.

9. The overcurrent protection element as claimed in claim 1, wherein the overcurrent protection element comprises a first insulation film and a second insulation film, the first insulation film is formed on the first conductive layer, and the second insulation film is formed on the second conductive layer.

10. The overcurrent protection element as claimed in claim 9, wherein the overcurrent protection element comprises a third conductive layer and a fourth conductive layer, the third conductive layer is formed on a surface of the first insulation film, extends between the first terminal electrode and the first end surface, and continuously extends to a surface of the second insulation film, and the fourth conductive layer is formed on the surface of the second insulation film, extends between the second terminal electrode and the second end surface, and continuously extends to the surface of the first insulation film.

11. The overcurrent protection element as claimed in claim 1, wherein the first terminal electrode and the second terminal electrode are L-shaped, the first terminal electrode extends from the first end surface to part of the bottom surface of the core material, and the second terminal electrode extends from the second end surface to part of the bottom surface of the core material.

12. The overcurrent protection element as claimed in claim 1, wherein the first terminal electrode and the second terminal electrode are U-shaped and extend from the first end surface and the second end surface to part of the top surface and part of the bottom surface of the core material.

13. The overcurrent protection element as claimed in claim 1, wherein the first terminal electrode and the second terminal electrode each comprise a copper layer, a nickel layer, a tin layer, or any combinations thereof.

14. The overcurrent protection element as claimed in claim 1, wherein the encapsulation layer includes polyimide, preimpregnated materials, solder mask, silicone resin, fluorine resin, epoxy resin, polyolefin, or any combinations thereof.

15. The overcurrent protection element as claimed in claim 9, wherein the first insulation film and the second insulation film each comprise polyimide, preimpregnated materials, solder mask, silicone resin, fluorine resin, epoxy resin, polyolefin, or any combinations thereof.

16. The overcurrent protection element as claimed in claim 1, wherein the core material comprises a combination of an upper core material layer and a lower core material layer.

Description

BRIEF DESCRIPTION OF THE DRAWING(S)

[0030] FIG. 1 is a stereogram of an overcurrent protection element of the instant disclosure.

[0031] FIG. 2A is a cross-sectional view of the overcurrent protection element having a first structure of an encapsulation layer.

[0032] FIG. 2B is a cross-sectional view of a first structure across line 2B-2B in FIG. 2A.

[0033] FIG. 3A is a cross-sectional view of the overcurrent protection element having a second structure of an encapsulation layer.

[0034] FIG. 3B is a cross-sectional view of a second structure across line 3B-3B in FIG. 3A.

[0035] FIG. 4A is a cross-sectional view of the overcurrent protection element having a third structure of an encapsulation layer.

[0036] FIG. 4B is a cross-sectional view of a third structure across line 4B-4B in FIG. 4A.

[0037] FIG. 5A is a cross-sectional view of the overcurrent protection element having a fourth structure of an encapsulation layer.

[0038] FIG. 5B is a cross-sectional view of a fourth structure across line 5B-5B in FIG. 5A.

[0039] FIG. 6 is a cross-sectional view across line 6-6 in FIG. 2A.

[0040] FIG. 7 is a schematic diagram of the overcurrent protection element of the instant disclosure comprising an overlapping structure.

[0041] FIG. 8 is a schematic diagram of an overcurrent protection element of the instant disclosure comprising a third conductive layer and a fourth conductive layer.

[0042] FIG. 9 is a schematic diagram of L-shaped terminal electrodes of the overcurrent protection element of the instant disclosure.

[0043] FIG. 10 is a schematic diagram of a core material of an overcurrent protection element of the instant disclosure having a combined structure.

[0044] FIG. 11 is a cross-sectional view of an encapsulation condition of Comparative Example 1 and 2.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0045] Hereinafter, figures and preferred embodiments are combined for further elaborations. These figures are all simplified schematic diagrams that are used as examples to explain the basic structure of the instant disclosure, and therefore only display the relevant constitutions of the instant disclosure.

[0046] FIG. 1 depicts an exterior appearance of an overcurrent protection element, wherein an encapsulation 4, a first terminal electrode 5, and a second terminal electrode 6 are shown from the exterior appearance. In the following expressions, the length direction indicates the direction between two ends, the width direction indicates the direction between two sides, and the thickness direction indicates the direction between the top and the bottom. As shown in FIGS. 2A to 5A, and 8 to 10, the interior structures of the overcurrent protection element each comprises a core material 1, a first conductive layer 2, a second conductive layer 3, the encapsulation layer 4, the first terminal electrode 5, the second terminal electrode 6, a first insulation film 7, and a second insulation film 8. The core material 1 comprises a top surface, a bottom surface opposite the top surface, a first side surface and a second side surface both located between the top surface and the bottom surface, and a first end surface and a second end surface both located between the top surface and the bottom surface. The core material 1 is a rectangular body made of a polymer material and conductive materials dispersed in the polymer material. Specifically, the polymer material may be polytetrafluoroethene, tetrafluoroethylene-hexafluoropropylene copolymer, polytrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, polyethylene, chlorinated polyethylene, oxidized polyethylene, polyvinyl chloride, butadiene-acrylonitrile copolymer, acrylonitrile-butadiene-styrene copolymer, polystyrene, polycarbonate, polyamide, polyimide, polyethylene terephthalate, polybutylene terephthalate, polyphenylene ether, polyphenylene sulfide, polyoxymethylene, phenolic resin, maleic anhydride grafted polyethylene, polypropylene, polyvinylidene fluoride, epoxy resin, ethylene-vinyl acetate copolymer, polymethyl methacrylate, ethylene-acrylic acid copolymer, or a mixture of any two or more of the abovementioned materials. The conductive material may be carbon black, metal carbide, metal, or a mixture of any two or more of the abovementioned materials.

[0047] As in FIGS. 2A to 5A, the first conductive layer 2 is formed on the top surface of the core material 1 and extends to the first end surface of the core material 1. The second conductive layer 3 is formed on the bottom surface of the core material 1 and extends to the second end surface of the core material 1. The two conductive layers may not extend to each end surface as well.

[0048] The encapsulation layer 4 covers the first conductive layer 2, the second conductive layer 3, and at least one of the foresaid side surfaces (the first and second side surfaces). The encapsulation layer 4 has four different encapsulation structures as follows.

[0049] The first structure is shown in FIGS. 2A and 2B, i.e., the encapsulation layer 4 is a continuous encapsulation structure, and the first conductive layer 2, the second conductive layer 3, the first side surface, and the second side surface are encapsulated in an annular manner.

[0050] The second structure is shown in FIGS. 3A and 3B, i.e., the encapsulation layer 4 comprises a first encapsulation layer 41, a second encapsulation layer 42 opposite the first encapsulation layer 41, a third encapsulation layer 43, and a fourth encapsulation layer 44 opposite the third encapsulation layer 43, respectively covering the first conductive layer 2, the second conductive layer 3, the first side surface, and the second side surface. The first encapsulation layer 41, the second encapsulation layer 42, the third encapsulation layer 43, and the fourth encapsulation layer 44 are joined together. There are a seam between the first encapsulation layer 41 and the third encapsulation layer 43, a seam between the first encapsulation layer 41 and the fourth encapsulation layer 44, a seam between the second encapsulation layer 42 and the third encapsulation layer 43, and a seam between the second encapsulation layer 42 and the fourth encapsulation layer 44.

[0051] The third structure is shown in FIGS. 4A and 4B, i.e., the encapsulation layer 4 comprises a first encapsulation layer 41, a second encapsulation layer 42 opposite the first encapsulation layer 41, a third encapsulation layer 43, and a fourth encapsulation layer 44 opposite the third encapsulation layer 43, respectively covering the first conductive layer 2, the second conductive layer 3, the first side surface, and the second side surface, wherein the first encapsulation layer 41 is connected with the third encapsulation layer 43 and the fourth encapsulation layer 44 to form a continuous encapsulation structure, and the second encapsulation layer 42 is joined with the third encapsulation layer 43 and the fourth encapsulation layer 44. There are a seam between the second encapsulation layer 42 and the third encapsulation layer 43 and a seam between the second encapsulation layer 42 and the fourth encapsulation layer 44.

[0052] The fourth structure is shown in FIGS. 5A and 5B, i.e., the encapsulation layer comprises a first encapsulation layer 41, a second encapsulation layer 42 opposite the first encapsulation layer 41, a third encapsulation layer 43, and a fourth encapsulation layer 44 opposite the third encapsulation layer 43, respectively covering the first conductive layer 2, the second conductive layer 3, the first side, and the second side, and the second encapsulation layer 42 is connected with the third encapsulation layer 43 and the fourth encapsulation layer 44 to form a continuous encapsulation structure, and the first encapsulation layer 41 is joined with the third encapsulation layer 43 and the fourth encapsulation layer 44. There are a seam between the first encapsulation layer 41 and the third encapsulation layer 43 and a seam between the first encapsulation layer 41 and the fourth encapsulation layer 44.

[0053] The abovementioned joint configurations may be the connection forms illustrated in FIGS. 3B to 5B, and the overlapping form as illustrated in FIG. 7. FIG. 7 shows an overlapping form obtained from the variation based on FIG. 5B. The overlapping form comprises a continuous encapsulation structure formed by connecting the second encapsulation layer 42 with the third encapsulation layer 43 and the fourth encapsulation layer 44. The first encapsulation layer 41, the second encapsulation layer 42, the third encapsulation layer 43, and the fourth encapsulation layer 44 respectively cover the first conductive layer 2, the second conductive layer 3, the first side, and the second side. The continuous encapsulation structure overlaps parts of the first encapsulation layer 41 and extends from a part of the surface of the first encapsulation layer 41 to another part of the surface of the first encapsulation layer 41. That is, there are overlapping parts between the first encapsulation layer 41 and the third encapsulation layer 43 and between the first encapsulation layer 41 and the fourth encapsulation layer 44.

[0054] As shown in FIGS. 2A to 5A, the first terminal electrode 5 is formed on the first end surface and electrically connected to the first conductive layer 2. The second terminal electrode 6 is formed on the second end surface and electrically connected to the second conductive layer 3.

[0055] The first conductive layer 2 and the second conductive layer 3 each comprise a metal foil, a metal coating, or a metal plating. The first conductive layer 2 and the second conductive layer 3 each may be a copper foil, an electroplating film, a metal plating, or a metal printing film, wherein, the copper foil may be selected as a nickel-plated copper foil.

[0056] The first insulation film 7 is formed on the first conductive layer 2, and the second insulation film 8 is formed on the second conductive layer 3.

[0057] After patterning the first conductive layer 2 and the second conductive layer 3, the core material 1 is partially uncovered.

[0058] Still as shown in FIGS. 2A to 5A, the overcurrent protection element comprises multiple insulation parts, wherein one of the insulation parts is embedded in the first conductive layer 2, and the distance h1, which is the distance between its side near to the second end surface and the second end surface, ranges from 0 mm to 10 mm, and the other insulation part is embedded in the second conductive layer 3, and the distance h2, which is the distance between its side near to the first end surface and the first end surface, ranges from 0 mm to 10 mm. As shown in FIGS. 2A to 5A, the insulation film 7 and the one of the insulation parts embedded in the first conductive layer 2 may be formed in a continuous structure, i.e., an integral structure, and the insulation film 8 and the other insulation part embedded in the second conductive layer 3 may be formed in a continuous structure, i.e., an integral structure. Preferably, the h1 and the h2 are each 1 mm to 5 mm. The cross-sectional view of one of the insulation parts along the width direction of the overcurrent protection element is shown in FIG. 6, and the core material 1, the second conductive layer 3, the encapsulation layer 4, the second terminal electrode 6, the first insulation film 7, and the second insulation film 8 are labeled in FIG. 6. The width of the insulation part itself is 0.05 mm to 5 mm.

[0059] As shown in FIG. 8, the overcurrent protective component comprises a third conductive layer 9 and a fourth conductive layer 10. The third conductive layer 9 is formed on a surface of the first insulation film 7, extends between the first terminal electrode 5 and the first end surface, and continuously extends to the surface of the second insulation film 8. The fourth conductive layer 10 is formed on a surface of the second insulation film 8, extends between the second terminal electrode 6 and the second end surface, and continuously extends to the surface of the first insulation film 7. The third conductive layer 9 and the fourth conductive layer 10 are approximately U-shaped. The third conductive layer 9 and the fourth conductive layer 10 each may be electroplated copper layers. The electroplated layers can achieve an excellent contact conductivity and are each presented in one-piece. Therefore, the third conductive layer 9 and the fourth conductive layer 10 are conductive layers between the first terminal electrode 5 and the core material 1 and between the second terminal electrode 6 and the core material 1, which are installed for the purpose of improving conductivity and the contact reliability between the terminal electrodes and the other U-shaped conductive elements.

[0060] The terminal electrodes can have different structures as shown in FIGS. 2A to 5A, where the first terminal electrode 5 and the second terminal electrode 6 are U-shaped. The first terminal electrode 5 extends from the first end surface to part of the top surface and part of the bottom surface of the core material 1, and the second terminal electrode 6 extends from the second end surface to part of the top surface and part of the bottom surface of the core material 1.

[0061] The terminal electrodes can also have another structure as shown in FIG. 9, where the first terminal electrode 5 and the second terminal electrode 6 are L-shaped. The first terminal electrode 5 extends from the first end surface to part of the bottom surface of the core material 1, and the second terminal electrode 6 extends from the second end surface to part of the bottom surface of the core material 1.

[0062] The first terminal electrode 5 and the second terminal electrode 6 each can be a copper layer, a nickel layer, a tin layer, a combination of any two of the above, or a combination of the three.

[0063] The encapsulation layer 4 may be polyimide, preimpregnated materials, solder mask, silicone resin, fluorine resin, epoxy resin, polyolefin, or a combination of any two or more of the above.

[0064] The first insulation film 7 and the second insulation film 8 each can be polyimide, preimpregnated material, solder mask, silicone resin, fluorine resin, epoxy resin, polyolefin, or a combination of any two or more of the above.

[0065] To accomplish various electrical properties of the thermistor, the core material may comprise a combination of an upper core material layer 11 and a lower core material layer 12. As shown in FIG. 10, there are an upper first conductive layer 21 and a lower first conductive layer 22 on the upper and lower surfaces adjacent to the upper core material layer 11, and there are an upper second conductive layer 31 and a lower second conductive layer 32 on the upper and lower surfaces adjacent to the lower core material layer 12. The first insulation film 7 covers the upper first conductive layer 21, the second insulation film 8 covers the lower second conductive layer 32, and a third insulation film I separates the lower first conductive layer 22 and the upper second conductive layer 31. The upper core material layer 11 and the lower core material layer 12 are arranged in parallel between the first terminal electrode 5 and the second terminal electrode 6. The upper surface of the upper core material layer 11 and the lower surface of the lower core material layer 12 are electrically connected to the first terminal electrode 5, and the lower surface of the upper core material layer 11 and the upper surface of the lower core material layer 12 are electrically connected to the second terminal electrode 6. The positions of the insulation parts of the conductive layers depend on the requirement of the electrical connection, which is, if the upper and lower insulation parts are on the same end, then the two intermediate insulation parts are on the opposite end; further, the upper core material layer 11 and the lower core material layer 12 are using different polymer materials and/or conductive materials

[0066] The material of the encapsulation layer 4 may be the same as the polymer material of the core material 1. In another embodiment, for example, the polymer material of the core material 1 is polyvinylidene fluoride, and the material of the encapsulation layer 4 is fluorine resin, so as to make the side of the encapsulation layer 4 fused well with the side of the core material 1. Two Comparative Examples and two Examples with different compositions of the core materials and encapsulation conditions are provided to compare the effect of a thermistor resisting the environmental impact. The encapsulation conditions of Comparative Example 1 (CE1) and Comparative Example 2 (CE2) are both encapsulation layers covering the first conductive layer and the second conductive layer without covering any side surfaces, as shown in FIG. 11, wherein the core material 1, the first conductive layer 2, the second conductive layer 3, the first insulation film 7, the second insulation film 8, the encapsulation layer 41 covering the first insulation film 7, and the encapsulation layer 42 covering the second insulation film 8 are presented. The encapsulation conditions of Example 1 (E1) and Example 2 (E2) are both encapsulation layers covering the first conductive layer, the second conductive layer, the first side surface, and the second side surface, and the encapsulation structures of both E1 and E2 are the same as in FIG. 4A and FIG. 4B. The materials used in Comparative Examples 1 and 2 and Examples 1 and 2 are shown in Table 1.

TABLE-US-00001 TABLE 1 the composition of the core materials of the two Examples and the two Comparative Examples. CE1 E1 CE2 E2 Polyvinylidene 60% 60% fluoride High density 56% 56% polyethylene Carbon black 30% 30% 40% 40% Polytetrafluoroethene 6% 6% powder TAIC crosslinking 2% 2% 2% 2% agent (Triallyl isocyanurate) Calcium carbonate 2% 2% 2% 2%

TABLE-US-00002 TABLE 2 results of the double 85 test CE1 E1 CE2 E2 R0 (m?) 146.3 144.7 74.5 77.9 R1 (m?) 270.7 169.3 156.5 98.2 R1/R0 1.85 1.17 2.1 1.26

[0067] In Table 2, R0 represents the initial resistance of the overcurrent protection element at room temperature, and R1 represents the resistance of the overcurrent protection element which is maintained for over 1000 hours under 85% humidity and 85? C. R0/R1 represents the variation rate of the double 85 test. A smaller variation rate indicates better endurance ability to extreme environment impact.

[0068] According to Table 2, without encapsulating any sides of the overcurrent protection element, Comparative Examples 1 and 2 have a worse endurance under an extreme environment than Examples 1 and 2. The overcurrent protection element of the instant disclosure is capable of providing sufficient self-protection and excellent reliability to extreme environment impact.

[0069] Some further explanations of the design principles of the instant disclosure are provided as follows.

[0070] Since the instant disclosure aims to overcome the resulting drawbacks when cutting a large block of material and yet to retain some process during the production of the large block material, insulation parts are installed on and embedded in the first and second conductive layers respectively. In the instant disclosure, there remains a small part of the conductive layers between the insulation parts and the neighboring end surfaces. This is because if the insulation part is established after the conductive layer has been fully applied, some locational deviations would be present in the disconnected insulation parts. The design ensures that the adjacent end surfaces of the neighboring overcurrent protection element has exposed conductive layers with an easy creation of the insulation part after the cutting process and that the electrodes and the conductive layers can perform sufficient electrical connection during electrode coating.

[0071] For clarity, the thickness in the figures is enlarged, and the thicknesses of the first and second conductive layers are relatively thinner. The first and second insulation films are thin layers solidified by a composite of fiber fabric and insulating resin. The insulation films are thermally compressed onto the conductive layers, such that the insulation films can be embedded into the conductive layers to form the insulation parts, as shown in FIGS. 2A to 5A.

[0072] The above description is merely some specific embodiments of the instant disclosure. The various examples shall not limit the essential content of the instant disclosure. A person having ordinary skill in the art, after reading the specification, can make modifications or variations of the specific embodiments as abovementioned without departing from the essence and scope of the instant disclosure.