Electrical apparatus comprising a power semiconductor module and at least one capacitor

Abstract

An electrical apparatus is provided with a power semiconductor module, at least one capacitor, a circuit carrier, and a first heat sink. The power semiconductor module and the circuit carrier are arranged on the first heat sink. The electrical apparatus comprises a second heat sink arranged on the power semiconductor module and connected to the first heat sink.

Claims

1. An electrical device comprising: a first heat sink; a circuit carrier arranged on the first heat sink; a second heat sink connected to the first heat sink; a power semiconductor module positioned between the first heat sink and the second heat sink; and at least one capacitor, the second heat sink positioned between the at least one capacitor and the first heat sink, wherein the at least one capacitor has contact pins which pass through recesses of the second heat sink and are connected to the power semiconductor module.

2. The electrical device according to claim 1, wherein the capacitor is arranged on the second heat sink.

3. The electrical device according to claim 1, wherein the second heat sink has at least one side wall which is preferably arranged substantially perpendicularly to the first heat sink.

4. The electrical device according to claim 3, wherein the at least one side wall is in contact with the power semiconductor module.

5. The electrical device according to claim 3, wherein the at least one side wall rests on the first heat sink.

6. The electrical device according to claim 3, wherein the at least one side wall has a collar which rests on the first heat sink.

7. The electrical device according to claim 6, wherein the collar is attached to the first heat sink.

8. The electrical device according to claim 1, wherein the capacitor is a stack-up capacitor or a stacked capacitor.

9. An electrical device comprising: a first heat sink having a first area; a circuit carrier arranged on the first heat sink; a power semiconductor module arranged on the first heat sink; a second heat sink having a second area disposed on the power semiconductor module and connected to the first heat sink; and at least one capacitor disposed on the second heat sink, wherein the second area is less than the first area, and wherein the at least one capacitor has contact pins which pass through recesses of the second heat sink and are connected to the power semiconductor module.

10. The electrical device of claim 9, wherein the second area is less than half of the first area.

11. The electrical device of claim 9, wherein the first heat sink has a first mass and the second heat sink has a second mass, the second mass being less than the first mass.

12. The electrical device of claim 11, wherein the second mass is less than half of the first mass.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

(1) Reference is now made more particularly to the drawings, which illustrate the best presently known mode of carrying out the invention and wherein similar reference characters indicate the same parts throughout the views.

(2) FIG. 1 is a simplified top view of an electrical device according to the invention.

(3) FIG. 2 is a simplified perspective view of the electrical device.

(4) FIG. 3 is a first simplified perspective exploded view of the electrical device.

(5) FIG. 4 a second simplified perspective exploded view of the electrical device.

DETAILED DESCRIPTION OF THE DRAWINGS

(6) The simplified representation of the invention of the electrical device in the figures shows a first heat sink 1. The first heat sink 1 is an aluminium plate.

(7) A circuit carrier, preferably a printed circuit board 2, is mounted on the first heat sink. Printed circuit board 2 contains printed conductors and various components which are not shown or not all shown. Shown are, for example, chokes 3. The circuit carrier covers one side of the heat sink almost completely. Only in one corner is a surface left out. A power semiconductor module 4 is arranged in this area, which is connected to the printed conductors and/or components on the printed circuit board 2 via contact pins.

(8) The power semiconductor module 4 has a housing in which several power semiconductor components are accommodated.

(9) On the power semiconductor module 4, a collar 53 on two sides surrounding a second heat sink 5 is provided. This comprises a plate 51, which rests on the top side of the power semiconductor module 4. Two side walls 52 of the second heat sink 5 are attached to the outer walls of the power semi-conductor module 4. At the ends of the two side walls 52 collar 53 are foreseen. The second heat sink 5 is firmly connected to the first heat sink 1 with screws 6, which are guided through the collar 53. In addition, the second heat sink 5 is firmly connected to the power semiconductor module 4 with screws 7.

(10) A capacitor 8 is arranged above the second heat sink 5. It is a capacitor module with several capacitors which can be connected to the power semiconductor module via contact pins 81. The contact pins 81 project through recesses in the plate 51 of the second heat sink 5 and are inserted into sockets or receptacles of the power semiconductor module 4. The contact pins 81 are electrically contacted and fixed in the sockets or receptacles, whereby the capacitor 8 is fastened in whole.

REFERENCE CHARACTER LIST

(11) 1 first heat sink 2 printed circuit board 3 chokes 4 power semiconductor module 5 second heat sink 51 plate 52 side walls 53 collar 6 screws 7 screws 8 capacitor 81 contact pins