Electronic-device seal structure and electromagnetic relay using said electronic-device seal structure
10153114 ยท 2018-12-11
Assignee
Inventors
- Kazuhiro Tsutsui (Kumamoto, JP)
- Masahiro KINOSHITA (Tokyo, JP)
- Ayaka Miyake (Kikuchi, JP)
- Jun Sasaki (Yamaga, JP)
- Keisuke Tsuji (Kusatsu, JP)
Cpc classification
H01H49/00
ELECTRICITY
International classification
Abstract
An electronic-device seal structure includes a base, a case which covers an upper surface of the base and has an opening at a surface thereof, and a pair of terminals attached to the base. A first clearance sealed with a sealing material is provided between the base and the case, and a second clearance is provided between the pair of terminals attached to an end surface of the base to face each other.
Claims
1. An electronic-device seal structure, comprising: a base; a case which covers an upper surface of the base and has an opening at a surface thereof; and a terminal, which is attached to the base, having a body and a pair of terminal parts at one end of the body, wherein a seal is formed between the base and the case, a clearance is provided between the pair of terminal parts disposed on an end surface of the base to face each other and is surrounded by the pair of terminal parts, the body of the terminal, and the case, clearance forming portions, which form the clearance and are provided on bases of the pair of terminal parts to face each other, a dimension from the body of each of the pair of terminal parts to an inner surface of the case is not smaller than 0.16 mm and not larger than 0.25 mm, the clearance between the clearance forming portions is not larger than 2.0 mm, and a longitudinal dimension of a facing portion of each of the clearance forming portions is not larger than 2.1 mm, and the seal is formed by a material having a viscosity of 39000 to 48000 mPa.Math.s in a range of 255 C.
2. The electronic-device seal structure as claimed in claim 1, wherein each of the pair of terminal parts is a laminate configured by folding and superimposing a plate-like member.
3. The electronic-device seal structure as claimed in claim 1, wherein the clearance between the pair of terminal parts is not larger than 0.5 mm.
4. The electronic-device seal structure as claimed in claim 1, wherein the electronic-device seal structure further comprises tapered portions, provided at facing edges of the pair of terminal parts.
5. The electronic-device seal structure as claimed in claim 4, wherein an angle of each of the tapered portions is not smaller than 20.
6. An electromagnetic relay, comprising: an electronic-device seal structure claimed in claim 1.
7. An electronic-device seal structure, comprising: a base; a case which covers an upper surface of the base and has an opening at a surface thereof; and a pair of terminals attached to the base, wherein a first clearance sealed with a sealing material is provided between the base and the case, a second clearance is provided between the pair of terminals disposed on an end surface of the base to face each other, clearance forming portions, which form the second clearance and are provided on bases of the pair of terminals to face each other, a dimension from a body of each of the pair of terminals to an inner surface of the case is not smaller than 0.16 mm and not larger than 0.25 mm, the second clearance between the clearance forming portions is not larger than 2.0 mm, and a longitudinal dimension of a facing portion of each of the clearance forming portions is not larger than 2.1 mm, and the sealing material has a viscosity of 39000 to 48000 mPa.Math.s in a range of 255 C.
8. The electronic-device seal structure as claimed in claim 7, wherein each of the pair of terminals is a laminate configured by folding and superimposing a plate-like member.
9. The electronic-device seal structure as claimed in claim 7, wherein the second clearance between the pair of terminals is not larger than 0.5 mm.
10. An electronic-device seal structure, comprising: a base; a case which covers an upper surface of the base and has an opening at a surface thereof; and a terminal, which is attached to the base, having a body and a pair of terminal parts at one end of the body, wherein a sealing material is disposed between the base and the case, sealing the case and the base together, a clearance is provided between the pair of terminal parts disposed on an end surface of the base to face each other and is surrounded by the pair of terminal parts, the body of the terminal, and the case, the clearance is disposed on the body of the terminal, clearance forming portions, which form the clearance and are provided on bases of the pair of terminal parts to face each other, a dimension from the body of each of the pair of terminal parts to an inner surface of the case is not smaller than 0.16 mm and not larger than 0.25 mm, the clearance between the clearance forming portions is not larger than 2.0 mm, and a longitudinal dimension of a facing portion of each of the clearance forming portions is not larger than 2.1 mm, and the sealing material has a viscosity of 39000 to 48000 mPa s in a range of 255 C.
11. The electronic-device seal structure as claimed in claim 10, wherein each of the pair of terminal parts is a laminate configured by folding and superimposing a plate-like member.
12. The electronic-device seal structure as claimed in claim 10, wherein the clearance between the pair of terminal parts is not larger than 0.5 mm.
Description
BRIEF DESCRIPTION OF DRAWINGS
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
DESCRIPTION OF EMBODIMENTS
(12) Hereinafter, an electromagnetic relay according to one embodiment of the present invention will be described in accordance with the attached drawings.
(13) As shown in
(14) As shown in
(15) As shown in
(16) As shown in
(17) As shown in
(18) The movable terminal parts 41, 41 are formed by folding plate springs at 180 and crimping them by a press (so-called hemming bending), and are disposed at one end of the body 40a so as to face each other with a predetermined interval. In the bases of the movable terminal parts 41, 41, there are provided clearance forming portions 41a, 41a formed by bending and crimping the plate springs onto the body 40a. A clearance 46 (second clearance) is defined by the clearance forming portions 41a, 41a on the body 40a. Further, tapered portions 44, 44 are respectively provided at the facing upper end edges of the clearance forming portions 41a, 41a.
(19) As shown in
(20) As shown in
(21) Next, a procedure of assembling the electromagnetic relay will be described.
(22) First, the coil 23 is wound around the trunk of the spool 22 with the coil terminals 21, 21 pressed to the base 10. Then, lead wires of this coil 23 are bound and soldered to the coil terminals 21, 21.
(23) Next, an iron core is inserted into the trunk of the spool 22, and this iron core is swaged and fixed to the horizontal portion of the yoke 24 assembled to the base 10, to be formed into one piece.
(24) Subsequently, the movable contact terminal 40 is swaged and fixed to the vertical portion 24a of the yoke 24, and the normally-open fixed contact terminal 50 and the normally-closed fixed contact part 60 are fixed to the base 10. At this time, the movable iron piece 45 is rotatably supported by the upper end of the yoke 24, and the movable contact 43 faces the normally-open fixed contact 53 and the normally-closed fixed contact 63 so as to alternately contact with/separate from the normally-open fixed contact 53 and alternately contact with/separate from the normally-closed fixed contact 63.
(25) Finally, the case 30 is fitted to the base 10, and thereafter, curable resin is poured as the sealing material 100 into a recess 70 formed of the bottom surface of the base 10 and the opening edge of the case 30 (see
(26) Here, the sealing material 100 is preferably curable resin with a viscosity from 39000 to 48000 mPa.Math.s, measured in the range of normal temperature (255 C.) in conformity to JIS K-6833 Section 6.3.
(27) This is because, when curable resin with a viscosity of less than 39000 mPa.Math.s at normal temperature is used, the curable resin does not stay in the recess 70, but flows to the deep inside of the case 30. When curable resin with a viscosity of more than 48000 mPa.Math.s at normal temperature is used, the curable resin cannot sufficiently fill a clearance (first clearance) between the base 10 and the case 30, and cannot ensure the sealing properties inside the case 30.
(28) Note that examples of the curable resin include thermosetting resin, ultraviolet curable resin, and anaerobic curable resin.
(29) Further, when the foregoing curable resin is to be used as the sealing material 100, at the time of fitting of the case 30 to the base 10, it is preferable to provide a clearance with a dimension H0 (shown in
(30) This is because, when the dimension H0 of the clearance between the side surface of the base 10 and the inner surface of the case 30 is smaller than 0.01 mm, capillarity action might occur to cause the curable resin to flow to the inside of the case 30. When the dimension H0 of the clearance between the side surface of the base 10 and the inner surface of the case 30 is larger than 0.10 mm, it becomes difficult to control the inflow of the curable resin to the inside of the case 30.
(31) Note that the dimension H0 of the clearance is a dimension of the clearance between the inner surface of the case 30 and the outer surface of the base 10 in the state of being fitted with the electromagnet unit 20, the movable contact terminal 40, the normally-open fixed contact terminal 50, and the normally-closed fixed contact part 60. Hence, a dimensional tolerance of the clearance between the outer surface of the base 10 and the inner surface of the case 30 may be set within a range of not smaller than 0.01 mm and not larger than 0.10 mm.
(32) Subsequently, the seal structure of the movable contact terminal 40 will be described using
(33) As shown in
(34) In the movable contact terminal 40, the clearance 46 is defined between the movable terminal parts 41, 41. In this clearance 46, a dimension H1 (shown in
(35) When the foregoing curable resin is used as the sealing material 100 and the movable contact terminal 40 is formed of the plate spring with a thickness of 0.15 mm such that a longitudinal dimension L (shown in
(36) On the other hand, when the dimension W of the clearance 46 is larger than 2.0 mm, it becomes difficult to control the inflow of the curable resin to the inside of the case 30.
(37) Further, providing the tapered portions 44, 44 at the upper end edges of the clearance forming portions 41a of the movable contact terminal 40 can reliably reduce the inflow of the sealing material 100 to the inside of the case 30.
(38) Note that the angles (tapered angles) of the tapered portions 44, 44 are preferably not smaller than 20. Setting the tapered angle to not smaller than 20 can reliably reduce the inflow of the sealing material 100 to the inside of the case 30.
(39) In the electromagnetic relay, the clearance forming portion 41a is provided in each of the movable terminal parts 41, 41, but this is not restrictive. If possible, the clearance forming portion 41a may be provided in the fixed terminal part or the coil terminal, for example.
(40) Note that forming the clearance forming portion so as to prevent formation of the clearance 46 can reduce an amount of inflow of the sealing material 100 to the inside of the case 30. However, when such a movable contact terminal is to be manufactured, it is necessary to process the plate spring such that the plate spring can cover the clearance between the clearance forming portions on the body at the time of hemming bending, thus making a feed pitch of the plate spring large to cause deterioration in cutting layout efficiency.
(41) In contrast, in the above electromagnetic relay, since the clearance 46 is defined between the clearance forming portions 41a, 41a, it is possible to make small the width dimension of the plate spring for forming each of the movable terminal parts 41, 41, while reducing the amount of inflow of the sealing material 100 to the inside of the case 30. Hence, it is possible to improve the cutting layout efficiency while reducing the feed pitch of the plate spring, and thereby to enhance the productivity of the electromagnetic relay.
Working Example 1
Working Example 1-1
(42) As shown in
(43) (Measurement Conditions) Measurement was performed at an ambient temperature of 255 C. As the curable resin, there was used epoxy resin with a viscosity of 39000 to 48000 mPa.Math.s at an ambient temperature in the range of 255 C. As the plate spring 110, a thin stainless steel plate was used. After pouring of the curable resin, the curable resin was allowed to stand for one hour or longer, and an inflow distance rL1 was measured.
(44) (Result)
(45) As a result of the measurement, the inflow distance rL1 of the curable resin was 2.1 mm.
Comparative Example 1
(46) An inflow distance rL0 of the curable resin was measured in similar conditions to those in Working Example 1-1 except that the clearance between the plate springs 110, 110 was set to W0=0.5 mm.
(47) (Result)
(48) As a result of the measurement, the inflow distance rL0 of the curable resin was 1.7 mm.
(49) (Consideration)
(50) From the results of Working Example 1-1 and Comparative Example 1, it was found that narrowing the clearance between the plate springs 110, 110 from W1=2.0 mm to W0=0.5 mm leads to a decrease in value of the inflow distance rL of the curable resin.
Working Example 1-2
(51) An inflow distance rL2 of the curable resin was measured in similar conditions to those in Working Example 1-1 except that the clearance between the plate springs 110, 110 was set to W2=4.0 min.
(52) (Result)
(53) As a result of the measurement, the inflow distance rL2 of the curable resin was 6.5 mm.
(54) (Consideration)
(55) From the results of Working Example 1-2 and Comparative Example 1, it was found that widening the clearance between the plate springs 110, 110 from W0=0.5 mm to W2=4.0 mm leads to an increase in value of the inflow distance rL of the curable resin.
Working Example 2
Working Example 2-1
(56) As shown in
(57) (Measurement Conditions) Measurement was performed at an ambient temperature of 255 C. As the curable resin, there was used epoxy resin with a viscosity of 39000 to 48000 mPa.Math.s at an ambient temperature in the range of 255 C. As the plate spring 110, a thin stainless steel plate was used. After pouring of the curable resin, the curable resin was allowed to stand for one hour or longer, and an inflow distance rL1 was measured.
(58) (Result)
(59) As a result of the measurement, the inflow distance rL1 of the curable resin was 1.8 mm.
Comparative Example 2
(60) An inflow distance rL0 of the curable resin was measured in similar conditions to those in Working Example 2-1 except that no tapered portion was provided.
(61) (Result)
(62) As a result of the measurement, the inflow distance rL0 of the curable resin was 1.9 mm.
(63) (Consideration)
(64) From the results of Working Example 2-1 and Comparative Example 2, it was found that providing the tapered portions leads to a decrease in value of the inflow distance rL of the curable resin.
Working Example 2-2
(65) An inflow distance rL2 of the curable resin was measured in similar conditions to those in Working Example 2-1 except that the tapered portion was formed with dimensions of X=0.35 mm and Y=0.3 mm (a tapered angle of about 60).
(66) (Result)
(67) As a result of the measurement, the inflow distance rL2 of the curable resin was 1.7 mm.
(68) (Consideration)
(69) From the results of Working Example 2-2 and Comparative Example 2, it was found that increasing the angle of the tapered portion leads to a decrease in value of the inflow distance rL of the curable resin.
Working Example 3
(70) The flow of the curable resin was observed after filling of the recess of the electromagnetic relay shown in
(71) (Measurement Conditions) The electromagnetic relay with the configuration shown in
(72) (Measurement Method) After filling of the recess of the electromagnetic relay with the curable resin, the curable resin was allowed to stand. The curable resin that flows into the clearance between the movable terminal parts was then photographed every one minute until 30 minutes elapsed from the filling with the curable resin. Next, the electromagnetic relay was put into a thermostatic oven at 50 C., and the curable resin that flows into the clearance between the clearance forming portions was photographed every five minutes until 250 minutes elapsed from the filling with the curable resin. The electromagnetic relay was taken out from the thermostatic oven every five minutes, for performing the photographing.
(73) (Result)
(74) As a result of the observation, at normal temperature, the inflow of the curable resin was stopped in about 15 minutes, and became immobilized (see
Comparative Example 3
(75) The flow of the curable resin was observed after filling of the recess of the electromagnetic relay with the curable resin until curing of the curable resin in similar conditions to those in Working Example 3 except that a movable contact terminal having a shape with a closed clearance between the clearance forming portions was used (see
(76) (Result)
(77) As a result of the observation, at normal temperature, the inflow of the curable resin was stopped in about 15 minutes, and became immobilized (see
(78) (Consideration)
(79) From the results of Working Example 3 and Comparative Example 3, it was found that the inflow of the curable resin to the inside of the case can be reduced even without completely closing the clearance between the movable terminal parts.
(80) It was found from Working Example 1 and Working Example 3 above that, when the epoxy resin with a viscosity of 39000 to 48000 mPa.Math.s at an ambient temperature in the range of 255 C. was used as the curable resin and the movable contact terminal was formed of a plate spring with a thickness of 0.15 mm such that the height dimension L of the clearance forming portion 41a was 2.1 mm (the dimension H1 of the clearance between the base and the body of the clearance forming portion was in the range of not smaller than 0.16 mm and not larger than 0.26 mm), it is possible to reduce the inflow distance rL of the curable resin that flows from the clearance between the clearance forming portions to the inside of the case to not longer than 2.1 mm by setting the dimension of the clearance to W=2.0 mm. Further, it was found from Working Example 2 that providing the tapered portion at each of the facing edges of the movable contact part and increasing the tapered angle of this tapered portion can lead to reduction in the inflow distance rL of the curable resin that flows from the clearance between the clearance forming portions to the inside of the case.
INDUSTRIAL APPLICABILITY
(81) The seal structure according to the present invention is not restricted to the foregoing electromagnetic relay, but is also applicable to any electronic devices such as a switch and a sensor.
REFERENCE SIGNS LIST
(82) 10 base 11 notch 20 electromagnet unit 21 coil terminal 22 spool 22a flange 23 coil 24 yoke 24a vertical portion 30 case 40 movable contact terminal 40a body 41 movable terminal part 41a clearance forming portion 42 movable contact piece 43 movable contact 44 tapered portion 45 movable iron piece 46 clearance 50 normally-open fixed contact terminal 51 fixed terminal 52 horizontal portion 53 normally-open fixed contact 60 normally-closed fixed contact part 62 horizontal portion 63 normally-closed fixed contact 70 recess 100 sealing material 110 thickness gauge