ELECTROCHEMICAL DEPOSITION SYSTEM FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE

Abstract

The invention relates to an electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate, a module for chemical and/or electrolytic surface treatment of a substrate in a process fluid, a use of the electrochemical deposition system or the module for chemical and/or electrolytic surface treatment for a metal deposition application and a manufacturing method for an electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate. The electrochemical deposition system comprises an anode, an anode enclosure, and a single electrolyte. The anode enclosure extends at least partially around the anode. The anode enclosure comprises a membrane. The anode and the anode enclosure are arranged in the single electrolyte. The single electrolyte is the only electrolyte of the electrochemical deposition system.

Claims

1. An electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate, comprising: an anode, an anode enclosure, and a single electrolyte, wherein the anode enclosure at least partially extends around the anode, wherein the anode enclosure comprises a membrane, wherein the anode and the anode enclosure are arranged in the single electrolyte, and wherein the single electrolyte is the only electrolyte of the electrochemical deposition system.

2. The electrochemical deposition system according to claim 1, wherein the anode is inert.

3. The electrochemical deposition system according to claim 1, wherein the anode enclosure is arranged as a flow divider around the anode to direct gas formed during deposition away from the substrate to be treated.

4. The electrochemical deposition system according to claim 1, wherein the membrane tilted relative to the surface of the anode.

5. The electrochemical deposition system according to claim 1, wherein the anode enclosure comprises a cover element arranged in an opening of the anode enclosure, which reduces a diameter of the opening of the anode enclosure.

6. The electrochemical deposition system according to claim 1, wherein the membrane is a bi-directional liquid permeable membrane.

7. The electrochemical deposition system according to claim 6, wherein the bi-directional liquid permeable membrane is non-ionic specific.

8. The electrochemical deposition system according to claim 6, wherein the bi-directional liquid permeable membrane is made of polypropylene.

9. A module for chemical and/or electrolytic surface treatment of a substrate in a process fluid, comprising: the electrochemical deposition system according claim 1, and a distribution body, wherein the distribution body is arranged in an electrolyte of the electrochemical deposition system and comprises a plurality of openings.

10. The module according to claim 9, wherein the distribution body is a diffusor plate configured to distribute a field of electrical current relative to the substrate.

11. The module according to claim 9, wherein the distribution body is a high speed plate configured to distribute a flow of the electrolyte relative to the substrate and to distribute a field of electrical current relative to the substrate.

12. A method of chemical and/or electrolytic surface treatment comprising metal deposition application with the electrochemical deposition system of claim 1.

13. The method according to claim 12, wherein the metal deposition application is a copper deposition application.

14. The method according to claim 12, wherein the metal deposition application is a dual damascene deposition application.

15. A manufacturing method for an electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate, comprising the following steps: providing an anode, arranging an anode enclosure at least partially around the anode, and arranging the anode and the anode enclosure in a single electrolyte, wherein the anode enclosure comprises a membrane, and wherein the single electrolyte is the only electrolyte of the electrochemical deposition method.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Exemplary embodiments of the invention will be described in the following with reference to the accompanying drawing:

[0044] FIG. 1 shows schematically and exemplarily an embodiment of an electrochemical deposition system and module for a chemical and/or electrolytic surface treatment of a substrate according to the invention.

[0045] FIG. 2 shows schematically and exemplarily an embodiment of a manufacturing method for an electrochemical deposition system for a chemical and/or electrolytic surface treatment of a substrate.

DETAILED DESCRIPTION OF EMBODIMENTS

[0046] FIG. 1 shows schematically and exemplarily an embodiment of an electrochemical deposition system 10 for a chemical and/or electrolytic surface treatment of a substrate 20 according to the invention. The substrate 20 is held in a substrate holder. The electrochemical deposition system 10 comprises an anode 11, an anode enclosure 12, and a single electrolyte 13. The electrochemical deposition system 10 is suitable for an electrochemical deposition of copper, in particular copper damascene deposition and copper dual damascene deposition.

[0047] The anode 11, the anode enclosure 12, and the single electrolyte 13 are arranged in an electrochemical deposition tank 24 or a process chamber. The walls of the tank 24 comprise electrolyte passages 17 for the electrolyte 13, a gas passage 18 for gas ventilation and a passage for an electrical connection 21 for the anode 11. The tank 24 is covered or closed by a distribution body 30 and the substrate 20 in the substrate holder. The distribution body 30 comprises one or a plurality of openings 21. The tank 24 comprises a recirculation line 25 for the liquid flow from the distribution body 30.

[0048] The electrolyte 13 is a liquid providing the function of an electrolyte 13. The electrolyte 13 is the only electrolyte 13 of the electrochemical deposition system 10 and the electrochemical deposition system 10 comprises only one circulation system for the electrolyte 13. The anode 11, the anode enclosure 12 and its membrane 14 are immersed in the electrolyte 13.

[0049] The anode 11 is a solid body providing the function of an anode 11. The anode 11 is preferably inert, but can also be a non-inert, reactive or active anode.

[0050] The anode enclosure 12 is a housing, which receives the anode 11 and extends around the anode 11. The anode enclosure 12 is a cup-shaped container surrounding the anode 11 by sidewalls, a bottom wall and an opening on top of the container opposite to the bottom wall.

[0051] The anode enclosure 12 comprises a channel for providing an electrical connection 21 for the anode 11, electrolyte channels 22 for supplying the electrolyte 13 into the anode enclosure 12, and a vent channel 23 to discharge e.g. gas bubbles. The vent channel 23 can be directed downwards (as shown in FIG. 1), but may also be directed upwards or in any other direction.

[0052] The anode enclosure 12 comprises a cover element 16, which reduces a diameter of the opening. The cover element 16 comprises a vent line 19 to discharge e.g. gas bubbles, etc. The vent line 19 of the cover element may lead to the vent channel 23 of the anode enclosure 12 and the gas passage 18 of the deposition tank 24. The opening on top of the cup-shaped container is covered by the membrane 14.

[0053] The anode enclosure 12 comprises a membrane 14. The membrane 14 is a selective barrier, which allows some parts (small molecules, ions, other small particles, etc.) to pass through, but stops others. The membrane 14 is a non-ionic specific bi-directional liquid permeable membrane. This means that the membrane 14 is here permeable for the electrolyte 13, but impermeable for gas bubbles. The membrane 14 is made of a polypropylene.

[0054] The anode enclosure 12 and the membrane 14 form a flow divider, which directs gas formed during deposition away from the substrate 20 to be treated. The flow divider thereby copes with a formation of gas bubbles at the anode 11 during plating, which would otherwise lead to bubble defects on a substrate surface. The flow divider redirects the gas bubbles to the vent line 19 leading the gas bubbles outside the anode enclosure 12 and outside the deposition tank 24 without causing defects on the substrate 20.

[0055] The surface of the membrane 14 is tilted relative to the surface of the anode 11. The tilt is implemented by fixing the membrane 14 to the cover element 16, while the sidewalls of the anode enclosure 12 having different heights leading to the sidewalls of the cover element 16 being at different heights. The membrane 14 lies on top of the cover element 16.

[0056] FIG. 1 also shows schematically and exemplarily an embodiment of a module 100 for chemical and/or electrolytic surface treatment of a substrate 20 in a process fluid. The module 100 comprises the electrochemical deposition system 10 as described above and the distribution body 30. The distribution body 30 is arranged in the electrolyte 13 of the electrochemical deposition system 10 and comprises a plurality of openings 31. The distribution body 30 is a high speed plate, which distributes a flow of the electrolyte 13 and a field of electrical current relative to the substrate 20.

[0057] The electrolyte 13 (marked by arrows) enters the tank 24 through electrolyte passages 17, flows through electrolyte channels 22 in the anode enclosure 12, and flows by the anode 11. A part of the electrolyte 13 flows into the vent line 19 in the cover element 16, then into the vent channel 23 in the anode enclosure 12, and then leaves the anode enclosure 12 at an outlet of the gas passage 18. Another part of the electrolyte 13 flows through the membrane 14 and through the openings 31 of the distribution body 30 to the substrate 20 and then leaves the tank 24 at an outlet of the recirculation line 25. Gas bubbles (marked by dots) may be formed at the anode 11 and flow from the anode 11 into the vent line 19 in the cover element 16, then into the vent channel 23 in the anode enclosure 12, and then leaves the anode enclosure 12 at an outlet of the gas passage 18 instead of harming the substrate 20.

[0058] FIG. 2 shows schematically and exemplarily an embodiment of a manufacturing method for an electrochemical deposition system 10 for a chemical and/or electrolytic surface treatment of a substrate 20. The manufacturing method comprises the following steps, not necessarily in this order:

[0059] In step S1, providing an anode 11.

[0060] In step S2, arranging an anode enclosure 12 at least partially around the anode 11.

[0061] In step S3, arranging the anode 11 and the anode enclosure 12 in a single electrolyte 13.

[0062] The anode enclosure 12 comprises a membrane 14 and the single electrolyte 13 is the only electrolyte of the electrochemical deposition method.

[0063] It has to be noted that embodiments of the invention are described with reference to different subject matters. In particular, some embodiments are described with reference to method type claims whereas other embodiments are described with reference to the device type claims. However, a person skilled in the art will gather from the above and the following description that, unless otherwise notified, in addition to any combination of features belonging to one type of subject matter also any combination between features relating to different subject matters is considered to be disclosed with this application. However, all features can be combined providing synergetic effects that are more than the simple summation of the features.

[0064] While the invention has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative or exemplary and not restrictive. The invention is not limited to the disclosed embodiments. Other variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing a claimed invention, from a study of the drawings, the disclosure, and the dependent claims.

[0065] In the claims, the word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. A single processor or other unit may fulfil the functions of several items re-cited in the claims. The mere fact that certain measures are re-cited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage. Any reference signs in the claims should not be construed as limiting the scope.